STB12NM50T4 [STMICROELECTRONICS]

N-CHANNEL 500V - 0.3W - 12A TO-220/TO-220FP/I PAK MDmesh]Power MOSFET; N沟道500V - 0.3W - 12A TO- 220 / TO- 220FP / I PAK的MDmesh ]功率MOSFET
STB12NM50T4
型号: STB12NM50T4
厂家: ST    ST
描述:

N-CHANNEL 500V - 0.3W - 12A TO-220/TO-220FP/I PAK MDmesh]Power MOSFET
N沟道500V - 0.3W - 12A TO- 220 / TO- 220FP / I PAK的MDmesh ]功率MOSFET

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STP12NM50 - STP12NM50FP  
STB12NM50 - STB12NM50-1  
N-CHANNEL 550V @ Tj -0.30- 12A TO-220/FP/D²/I²PAK  
max  
Zener-Protected SuperMESH™MOSFET  
Table 1: General Features  
Figure 1: Package  
TYPE  
V
DSS  
R
I
D
DS(on)  
(@Tj  
)
max  
STB12NM50  
STB12NM50-1  
STP12NM50  
STP12NM50FP  
550 V  
550 V  
550 V  
550 V  
< 0.35  
< 0.35 Ω  
< 0.35 Ω  
< 0.35 Ω  
12 A  
12 A  
12 A  
12 A  
3
3
2
2
1
1
TYPICAL R (on) = 0.30  
DS  
TO-220FP  
TO-220  
HIGH dv/dt AND AVALANCHE CAPABILITIES  
LOW INPUT CAPACITANCE AND GATE  
CHARGE  
100% AVALANCHE TESTED  
LOW GATE INPUT RESISTANCE  
TIGHT PROCESS CONTROL AND HIGH  
MANUFACTURING YIELDS  
3
1
3
2
1
2
2
D PAK  
I PAK  
Figure 2: Internal Schematic Diagram  
DESCRIPTION  
The MDmesh™ is a new revolutionary MOSFET  
technology that associates the Multiple Drain pro-  
cess with the Company’s PowerMESH™ horizon-  
tal layout. The resulting product has an  
outstanding low on-resistance, impressively high  
dv/dt and excellent avalanche characteristics. The  
adoption of the Company’s proprietary strip tech-  
nique yields overall dynamic performance that is  
significantly better than that of similar competi-  
tion’s products.  
APPLICATIONS  
The MDmesh™ family is very suitable for increas-  
ing power density of high voltage converters allow-  
ing system miniaturization and higher efficiencies.  
Table 2: Order Codes  
SALES TYPE  
STB12NM50T4  
STB12NM50-1  
STP12NM50  
MARKING  
B12NM50  
B12NM50  
P12NM50  
P12NM50FP  
PACKAGE  
D²PAK  
PACKAGING  
TAPE & REEL  
TUBE  
I²PAK  
TO-220  
TO-220FP  
TUBE  
STP12NM50FP  
TUBE  
Rev. 2  
March 2005  
1/14  
STP12NM50 - STP12NM50FP - STB12NM50 - STB12NM50-1  
Table 3: Absolute Maximum ratings  
Symbol  
Parameter  
Value  
Unit  
STB12NM50  
STB12NM50  
STP12NM50  
STP12NM50FP  
V
Gate- source Voltage  
± 30  
V
A
GS  
I
Drain Current (continuous) at T = 25°C  
12  
7.5  
48  
12 (*)  
7.5 (*)  
48 (*)  
35  
D
C
I
Drain Current (continuous) at T = 100°C  
A
D
C
I
( )  
Drain Current (pulsed)  
A
DM  
P
TOT  
Total Dissipation at T = 25°C  
160  
1.28  
--  
W
C
Derating Factor  
0.28  
W/°C  
V
V
ISO  
Insulation Winthstand Voltage (DC)  
Peak Diode Recovery voltage slope  
2500  
dv/dt (1)  
15  
V/ns  
T
T
stg  
Operating Junction Temperature  
Storage Temperature  
-65 to 150  
-65 to 150  
°C  
°C  
j
( ) Pulse width limited by safe operating area  
(1) I 12A, di/dt 400A/µs, V V , T T  
JMAX.  
SD  
DD  
(BR)DSS  
j
(*) Limited only by maximum temperature allowed  
Table 4: Thermal Data  
TO-220/ D²PAK /  
I²PAK  
TO-220FP  
Rthj-case  
Rthj-amb  
Thermal Resistance Junction-case Max  
0.78  
3.57  
°C/W  
°C/W  
°C  
Thermal Resistance Junction-ambient Max  
Maximum Lead Temperature For Soldering Purpose  
62.5  
300  
T
l
Table 5: Avalanche Characteristics  
Symbol  
Parameter  
Max Value  
Unit  
I
AR  
Avalanche Current, Repetitive or Not-Repetitive  
6
A
(pulse width limited by T max)  
j
E
AS  
Single Pulse Avalanche Energy  
400  
mJ  
(starting T = 25 °C, I = I , V = 50 V)  
j
D
AR  
DD  
ELECTRICAL CHARACTERISTICS (T  
=25°C UNLESS OTHERWISE SPECIFIED)  
CASE  
Table 6: On /Off  
Symbol  
Parameter  
Test Conditions  
Min.  
Typ.  
Max.  
Unit  
V
Drain-source Breakdown  
Voltage  
I
D
= 250 µA, V  
= 0  
500  
V
(BR)DSS  
GS  
I
Zero Gate Voltage  
V
V
= Max Rating  
= Max Rating, T = 125°C  
1
10  
µA  
µA  
DSS  
DS  
DS  
Drain Current (V = 0)  
GS  
C
I
Gate-body Leakage  
V
= ± 30 V  
± 100  
nA  
GSS  
GS  
Current (V = 0)  
DS  
V
V
V
= V , I = 50 µA  
3
5
V
Gate Threshold Voltage  
4
GS(th)  
DS  
GS  
GS  
D
R
Static Drain-source On  
Resistance  
= 10 V, I = 6 A  
0.30  
0.35  
DS(on  
D
2/14  
STP12NM50 - STP12NM50FP - STB12NM50 - STB12NM50-1  
ELECTRICAL CHARACTERISTICS (CONTINUED)  
Table 7: Dynamic  
Symbol  
Parameter  
Test Conditions  
= 15 V , I = 6 A  
Min.  
Typ.  
Max.  
Unit  
g
fs  
(1)  
Forward Transconductance  
V
V
5.5  
S
DS  
D
C
Input Capacitance  
Output Capacitance  
Reverse Transfer  
Capacitance  
= 25 V, f = 1 MHz, V = 0  
1000  
180  
25  
pF  
pF  
pF  
iss  
DS  
GS  
C
oss  
C
rss  
C
(3) Equivalent Output  
V
V
= 0 V, V = 0 to 400 V  
90  
pF  
OSS eq  
.
GS  
DS  
Capacitance  
t
Turn-on Delay Time  
Rise Time  
= 250 V, I = 6 A,  
20  
10  
ns  
ns  
d(on)  
DD  
D
t
r
R = 4.7 Ω, V = 10 V  
G GS  
(see Figure 17)  
Q
V
V
= 400 V, I = 12 A,  
= 10 V  
28  
8
18  
39  
nC  
nC  
nC  
Total Gate Charge  
Gate-Source Charge  
Gate-Drain Charge  
g
DD  
D
Q
gs  
gd  
GS  
Q
(see Figure 20)  
Rg  
Gate Input Resistance  
f = 1MHz Gate DC Bias = 0  
Test Signal Level = 20mV  
Open Drain  
1.6  
Table 8: Source Drain Diode  
Symbol  
Parameter  
Test Conditions  
Min.  
Typ.  
Max.  
Unit  
I
12  
48  
A
A
Source-drain Current  
Source-drain Current (pulsed)  
SD  
(2)  
I
SDM  
V
(1)  
I
I
= 12 A, V  
= 0  
GS  
Forward On Voltage  
1.5  
V
SD  
SD  
t
rr  
= 12 A, di/dt = 100 A/µs  
= 100V  
Reverse Recovery Time  
Reverse Recovery Charge  
Reverse Recovery Current  
270  
2.23  
16.5  
ns  
µC  
A
SD  
Q
V
DD  
(see Figure 18)  
rr  
I
RRM  
t
Q
I
V
= 12 A, di/dt = 100 A/µs  
Reverse Recovery Time  
Reverse Recovery Charge  
Reverse Recovery Current  
340  
3
18  
ns  
µC  
A
rr  
SD  
= 100V, T = 150°C  
rr  
DD  
j
I
(see Figure 18)  
RRM  
(1) Pulsed: Pulse duration = 300 µs, duty cycle 1.5 %.  
(2) Pulse width limited by safe operating area.  
(3) C  
is defined as a constant equivalent capacitance giving the same charging time as C when V increases from 0 to 80% V  
.
DSS  
oss eq.  
oss  
DS  
3/14  
STP12NM50 - STP12NM50FP - STB12NM50 - STB12NM50-1  
Figure 3: Safe Operating Area For TO-220/  
D²PAK/I²PAK  
Figure 6: Thermal Impedance TO-220/D²PAK/  
I²PAK  
Figure 4: Safe Operating Area For TO-220FP  
Figure 7: Thermal Impedance For TO-220FP  
Figure 5: Output Characteristics  
Figure 8: Transfer Characteristics  
4/14  
STP12NM50 - STP12NM50FP - STB12NM50 - STB12NM50-1  
Figure 12: Static Drain-Source On Resistance  
Figure 9: Transconductance  
Figure 10: Gate Charge vs Gate-source Voltage  
Figure 13: Capacitance Variations  
Figure 11: Normalized Gate Threshold Voltage  
vs Temperature  
Figure 14: Normalized On Resistance vs Tem-  
perature  
5/14  
STP12NM50 - STP12NM50FP - STB12NM50 - STB12NM50-1  
Figure 15: Source-Drain Forward Characteris-  
tics  
6/14  
STP12NM50 - STP12NM50FP - STB12NM50 - STB12NM50-1  
Figure 16: Unclamped Inductive Load Test Cir-  
Figure 19: Unclamped Inductive Wafeform  
cuit  
Figure 17: Switching Times Test Circuit For  
Resistive Load  
Figure 20: Gate Charge Test Circuit  
Figure 18: Test Circuit For Inductive Load  
Switching and Diode Recovery Times  
7/14  
STP12NM50 - STP12NM50FP - STB12NM50 - STB12NM50-1  
TO-220 MECHANICAL DATA  
mm.  
inch  
TYP.  
DIM.  
MIN.  
4.40  
0.61  
1.15  
0.49  
15.25  
10  
TYP  
MAX.  
4.60  
0.88  
1.70  
0.70  
15.75  
10.40  
2.70  
5.15  
1.32  
6.60  
2.72  
14  
MIN.  
0.173  
0.024  
0.045  
0.019  
0.60  
MAX.  
0.181  
0.034  
0.066  
0.027  
0.620  
0.409  
0.106  
0.202  
0.052  
0.256  
0.107  
0.551  
0.154  
A
b
b1  
c
D
E
0.393  
0.094  
0.194  
0.048  
0.244  
0.094  
0.511  
0.137  
e
2.40  
4.95  
1.23  
6.20  
2.40  
13  
e1  
F
H1  
J1  
L
L1  
L20  
L30  
øP  
Q
3.50  
3.93  
16.40  
28.90  
0.645  
1.137  
3.75  
2.65  
3.85  
2.95  
0.147  
0.104  
0.151  
0.116  
8/14  
STP12NM50 - STP12NM50FP - STB12NM50 - STB12NM50-1  
TO-220FP MECHANICAL DATA  
mm.  
TYP  
inch  
TYP.  
DIM.  
MIN.  
4.4  
MAX.  
4.6  
2.7  
2.75  
0.7  
1
MIN.  
0.173  
0.098  
0.098  
0.017  
0.030  
0.045  
0.045  
0.195  
0.094  
0.393  
MAX.  
0.181  
0.106  
0.108  
0.027  
0.039  
0.067  
0.067  
0.204  
0.106  
0.409  
A
B
2.5  
D
2.5  
E
0.45  
0.75  
1.15  
1.15  
4.95  
2.4  
F
F1  
F2  
G
1.7  
1.7  
5.2  
2.7  
10.4  
G1  
H
10  
L2  
L3  
L4  
L5  
L6  
L7  
Ø
16  
0.630  
28.6  
9.8  
2.9  
15.9  
9
30.6  
10.6  
3.6  
1.126  
.0385  
0.114  
0.626  
0.354  
0.118  
1.204  
0.417  
0.141  
0.645  
0.366  
0.126  
16.4  
9.3  
3
3.2  
L3  
L6  
L7  
1 2  
L4  
3
L5  
L2  
9/14  
STP12NM50 - STP12NM50FP - STB12NM50 - STB12NM50-1  
D2PAK MECHANICAL DATA  
mm.  
inch  
TYP.  
DIM.  
MIN.  
4.4  
TYP  
MAX.  
4.6  
MIN.  
0.173  
0.098  
0.001  
0.027  
0.044  
0.017  
0.048  
0.352  
MAX.  
0.181  
0.106  
0.009  
0.036  
0.067  
0.023  
0.053  
0.368  
A
A1  
A2  
B
2.49  
0.03  
0.7  
2.69  
0.23  
0.93  
1.7  
B2  
C
1.14  
0.45  
1.23  
8.95  
0.6  
C2  
D
1.36  
9.35  
D1  
E
8
0.315  
0.334  
10  
10.4  
0.393  
E1  
G
8.5  
4.88  
15  
5.28  
15.85  
1.4  
0.192  
0.590  
0.050  
0.055  
0.094  
0.208  
0.625  
0.055  
0.068  
0.126  
L
L2  
L3  
M
1.27  
1.4  
1.75  
3.2  
2.4  
R
0.4  
0.015  
V2  
0º  
4º  
3
1
10/14  
STP12NM50 - STP12NM50FP - STB12NM50 - STB12NM50-1  
TO-262 (I2PAK) MECHANICAL DATA  
mm.  
TYP  
inch  
TYP.  
DIM.  
MIN.  
4.40  
2.40  
0.61  
1.14  
0.49  
1.23  
8.95  
2.40  
4.95  
10  
MAX.  
4.60  
2.72  
0.88  
1.70  
0.70  
1.32  
9.35  
2.70  
5.15  
10.40  
14  
MIN.  
0.173  
0.094  
0.024  
0.044  
0.019  
0.048  
0.352  
0.094  
0.194  
0.393  
0.511  
0.137  
0.050  
MAX.  
0.181  
0.107  
0.034  
0.066  
0.027  
0.052  
0.368  
0.106  
0.202  
0.410  
0.551  
0.154  
0.055  
A
A1  
b
b1  
c
c2  
D
e
e1  
E
L
13  
L1  
L2  
3.50  
1.27  
3.93  
1.40  
11/14  
STP12NM50 - STP12NM50FP - STB12NM50 - STB12NM50-1  
2
D PAK FOOTPRINT  
TUBE SHIPMENT (no suffix)*  
TAPE AND REEL SHIPMENT (suffix T4)*  
REEL MECHANICAL DATA  
mm  
MIN. MAX. MIN. MAX.  
330 12.992  
inch  
DIM.  
A
B
C
D
G
N
T
1.5  
12.8  
20.2  
24.4  
100  
0.059  
13.2 0.504 0.520  
0795  
26.4 0.960 1.039  
3.937  
30.4  
1.197  
BASE QTY  
BULK QTY  
1000  
TAPE MECHANICAL DATA  
1000  
mm  
inch  
DIM.  
MIN. MAX. MIN. MAX.  
10.5 10.7 0.413 0.421  
15.7 15.9 0.618 0.626  
A0  
B0  
D
1.5  
1.6 0.059 0.063  
D1  
E
1.59 1.61 0.062 0.063  
1.65 1.85 0.065 0.073  
F
11.4  
4.8  
3.9  
11.9  
1.9  
50  
11.6 0.449 0.456  
5.0 0.189 0.197  
4.1 0.153 0.161  
12.1 0.468 0.476  
2.1 0.075 0.082  
1.574  
K0  
P0  
P1  
P2  
R
T
0.25 0.35 0.0098 0.0137  
23.7 24.3 0.933 0.956  
W
* on sales type  
12/14  
STP12NM50 - STP12NM50FP - STB12NM50 - STB12NM50-1  
Table 9: Revision History  
Date  
Revision  
Description of Changes  
27-Sep-2004  
09-Mar-2005  
1
2
Complete version  
New Stylesheet  
13/14  
STP12NM50 - STP12NM50FP - STB12NM50 - STB12NM50-1  
Information furnished is believed to be accurate and reliable. However, STMicroelectronics assumes no responsibility for the consequences  
of use of such information nor for any infringement of patents or other rights of third parties which may result from its use. No license is granted  
by implication or otherwise under any patent or patent rights of STMicroelectronics. Specifications mentioned in this publication are subject  
to change without notice. This publication supersedes and replaces all information previously supplied. STMicroelectronics products are not  
authorized for use as critical components in life support devices or systems without express written approval of STMicroelectronics.  
The ST logo is a registered trademark of STMicroelectronics  
All other names are the property of their respective owners  
© 2005 STMicroelectronics - All Rights Reserved  
STMicroelectronics group of companies  
Australia - Belgium - Brazil - Canada - China - Czech Republic - Finland - France - Germany - Hong Kong - India - Israel - Italy - Japan -  
Malaysia - Malta - Morocco - Singapore - Spain - Sweden - Switzerland - United Kingdom - United States of America  
14/14  

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