STP22NE10L [STMICROELECTRONICS]

N - CHANNEL 100V - 0.07 ohm - 22A TO-220 STripFET POWER MOSFET; N - CHANNEL 100V - 0.07欧姆 - 22A TO- 220的STripFET功率MOSFET
STP22NE10L
型号: STP22NE10L
厂家: ST    ST
描述:

N - CHANNEL 100V - 0.07 ohm - 22A TO-220 STripFET POWER MOSFET
N - CHANNEL 100V - 0.07欧姆 - 22A TO- 220的STripFET功率MOSFET

晶体 晶体管 功率场效应晶体管 开关 脉冲 局域网
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STP22NE10L  
N - CHANNEL 100V - 0.07 - 22A TO-220  
STripFET POWER MOSFET  
TYPE  
VDSS  
RDS(on)  
ID  
STP22NE10L  
100 V  
< 0.085 Ω  
22 A  
TYPICAL RDS(on) = 0.07 Ω  
LOW THRESHOLD DRIVE  
LOGIC LEVEL DEVICE  
DESCRIPTION  
This Power MOSFET is the latest developmentof  
STMicroelectronics unique ”Single Feature  
Size ” strip-based process. The resulting  
transistor shows extremely high packing density  
for low on-resistance, rugged avalanche  
characteristics and less critical alignment steps  
3
2
1
TO-220  
therefore  
a
remarkable  
manufacturing  
reproducibility.  
APPLICATIONS  
INTERNAL SCHEMATIC DIAGRAM  
HIGH CURRENT, HIGH SPEED SWITCHING  
SOLENOID AND RELAY DRIVERS  
MOTOR CONTROL, AUDIO AMPLIFIERS  
DC-DC & DC-AC CONVERTERS  
ABSOLUTE MAXIMUM RATINGS  
Symbol  
VDS  
VDGR  
VGS  
ID  
Parameter  
Value  
100  
Unit  
Drain-source Voltage (VGS = 0)  
Drain- gate Voltage (RGS = 20 k)  
Gate-source Voltage  
V
V
100  
± 20  
22  
V
o
Drain Current (continuous) at Tc = 25 C  
A
o
ID  
Drain Current (continuous) at Tc = 100 C  
14  
A
IDM  
(
Drain Current (pulsed)  
88  
A
)  
o
Ptot  
Total Dissipation at Tc = 25 C  
90  
W
Derating Factor  
0.6  
W/oC  
mJ  
oC  
oC  
EAS(1) Single Pulse Avalanche Energy  
250  
Tstg  
Tj  
Storage Temperature  
-65 to 175  
Max. Operating Junction Temperature  
() Pulse width limitedby safe operating area  
175  
( 1) starting Tj = 25 oC, ID =22A , VDD = 50V  
1/8  
November 1999  
STP22NE10L  
THERMAL DATA  
Rthj-case Thermal Resistance Junction-case  
Rthj-amb Thermal Resistance Junction-ambient  
Max  
Max  
1.67  
62.5  
300  
oC/W  
oC/W  
oC  
Tl  
Maximum Lead Temperature For Soldering Purpose  
(Tcase = 25 oC unless otherwisespecified)  
ELECTRICAL CHARACTERISTICS  
OFF  
Symbol  
Parameter  
Test Conditions  
ID = 250 µA VGS = 0  
Min.  
Typ.  
Max.  
Unit  
V(BR)DSS Drain-source  
100  
V
Breakdown Voltage  
Zero Gate Voltage  
Drain Current (VGS = 0) VDS = Max Rating  
IDSS  
IGSS  
VDS = Max Rating  
1
10  
µA  
A
µ
o
Tc =125 C  
Gate-body Leakage  
Current (VDS = 0)  
VGS = ± 20 V  
± 100  
nA  
ON (  
)
Symbol  
VGS(th)  
Parameter  
Test Conditions  
Min.  
Typ.  
Max.  
Unit  
Gate Threshold Voltage VDS = VGS ID = 250 µA  
1
1.6  
2.5  
V
RDS(on)  
Static Drain-source On VGS = 10 V  
Resistance VGS = 5 V  
ID = 15 A  
ID = 15 A  
0.07  
0.085  
0.085  
0.1  
ID(on)  
On State Drain Current VDS > ID(on) x RDS(on)max  
VGS = 10 V  
22  
A
DYNAMIC  
Symbol  
Parameter  
Forward  
Test Conditions  
VDS > ID(on) x RDS(on)max ID =15 A  
Min.  
Typ.  
Max.  
Unit  
gfs ( )  
19  
S
Transconductance  
Ciss  
Coss  
Crss  
Input Capacitance  
Output Capacitance  
Reverse Transfer  
Capacitance  
VDS = 25 V f = 1 MHz VGS = 0  
1750  
165  
45  
pF  
pF  
pF  
2/8  
STP22NE10L  
ELECTRICAL CHARACTERISTICS  
(continued)  
SWITCHING ON  
Symbol  
Parameter  
Test Conditions  
Min.  
Min.  
Min.  
Typ.  
Max.  
Unit  
td(on)  
tr  
Turn-on Delay Time  
Rise Time  
VDD = 50 V  
RG = 4.7  
ID = 8 A  
VGS = 4.5 V  
40  
80  
ns  
ns  
(Resistive Load, see fig. 3)  
Qg  
Qgs  
Qgd  
Total Gate Charge  
Gate-Source Charge  
Gate-Drain Charge  
VDD = 80 V ID = 16 A VGS = 10 V  
24  
55  
11  
31  
nC  
nC  
nC  
SWITCHING OFF  
Symbol  
Parameter  
Test Conditions  
Typ.  
Max.  
Unit  
td(off)  
tf  
Turn-off Delay Time  
Fall Time  
VDD = 50 V  
ID = 8 A  
45  
12  
ns  
ns  
RG = 4.7 Ω  
VGS = 4.5 V  
(Resistive Load, see fig. 3)  
td(off)  
tf  
tc  
Off-voltage Rise Time  
Fall Time  
Cross-over Time  
Vclamp = 80 V  
RG = 4.7 Ω  
ID = 16 A  
VGS = 4.5 V  
12  
17  
35  
ns  
ns  
ns  
(Inductive Load, see fig. 5)  
SOURCE DRAIN DIODE  
Symbol  
Parameter  
Test Conditions  
Typ.  
Max.  
Unit  
ISD  
ISDM ( )  
Source-drain Current  
Source-drain Current  
(pulsed)  
22  
88  
A
A
VSD ( ) Forward On Voltage  
ISD = 16 A VGS = 0  
1.5  
V
trr  
Reverse Recovery  
Time  
Reverse Recovery  
Charge  
Reverse Recovery  
Current  
ISD = 16 A  
VDD = 40 V  
(see test circuit, fig. 5)  
di/dt = 100 A/ s  
100  
300  
6
ns  
µ
Tj = 150 oC  
Qrr  
nC  
A
IRRM  
( ) Pulsed: Pulse duration = 300 µs, duty cycle 1.5 %  
( ) Pulse width limited by safe operating area  
Safe Operating Area  
Thermal Impedance  
3/8  
STP22NE10L  
Output Characteristics  
Transfer Characteristics  
Transconductance  
Static Drain-source On Resistance  
Gate Charge vs Gate-sourceVoltage  
CapacitanceVariations  
4/8  
STP22NE10L  
Normalized Gate ThresholdVoltage vs  
Temperature  
Normalized On Resistance vs Temperature  
Source-drainDiode Forward Characteristics  
5/8  
STP22NE10L  
Fig. 1  
: Unclamped Inductive Load Test Circuit  
Fig. 2  
: Unclamped Inductive Waveform  
Fig. 3: Switching Times Test Circuits For  
Fig. 4: Gate Charge test Circuit  
Resistive Load  
Fig. 5  
: Test Circuit For Inductive Load Switching  
And Diode Recovery Times  
6/8  
STP22NE10L  
TO-220 MECHANICAL DATA  
mm  
inch  
TYP.  
DIM.  
MIN.  
4.40  
1.23  
2.40  
TYP.  
MAX.  
4.60  
1.32  
2.72  
MIN.  
0.173  
0.048  
0.094  
MAX.  
0.181  
0.051  
0.107  
A
C
D
D1  
E
1.27  
0.050  
0.49  
0.61  
1.14  
1.14  
4.95  
2.4  
0.70  
0.88  
1.70  
1.70  
5.15  
2.7  
0.019  
0.024  
0.044  
0.044  
0.194  
0.094  
0.393  
0.027  
0.034  
0.067  
0.067  
0.203  
0.106  
0.409  
F
F1  
F2  
G
G1  
H2  
L2  
L4  
L5  
L6  
L7  
L9  
DIA.  
10.0  
10.40  
16.4  
0.645  
13.0  
2.65  
15.25  
6.2  
14.0  
2.95  
15.75  
6.6  
0.511  
0.104  
0.600  
0.244  
0.137  
0.147  
0.551  
0.116  
0.620  
0.260  
0.154  
0.151  
3.5  
3.93  
3.85  
3.75  
L2  
Dia.  
L5  
L9  
L7  
L6  
L4  
P011C  
7/8  
STP22NE10L  
Information furnished is believed to be accurate and reliable. However, STMicroelectronics assumes no responsibility for the consequences  
of use of such information nor for any infringement of patents or other rights of third parites which may result from its use. No license is  
granted by implication or otherwise under any patent or patent rights of STMicroelectronics. Specificationmentioned in this publication are  
subject tochange without notice. This publication supersedes and replaces all informaiton previouslysupplied. STMicroelectronics products  
are not authorized for use as critical components in life support devices or systemswithout express written approval of STMicroelectronics.  
The ST logo is a trademark of STMicroelectronics  
1999 STMicroelectronics – Printed in Italy – All Rights Reserved  
STMicroelectronics GROUP OF COMPANIES  
Australia - Brazil - China - Finland - France - Germany - Hong Kong - India - Italy - Japan - Malaysia - Malta - Morocco -  
Singapore - Spain - Sweden - Switzerland - United Kingdom - U.S.A.  
http://www.st.com  
.
8/8  

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