STP9NK60ZFP [STMICROELECTRONICS]
N-CHANNEL 600V - 0.85ohm - 7A TO-220/FP/D2PAK/I2PAK Zener-Protected SuperMESH⑩Power MOSFET; N沟道600V - 0.85ohm - 7A TO- 220 / FP / D2PAK / I2PAK齐纳保护SuperMESH⑩Power MOSFET型号: | STP9NK60ZFP |
厂家: | ST |
描述: | N-CHANNEL 600V - 0.85ohm - 7A TO-220/FP/D2PAK/I2PAK Zener-Protected SuperMESH⑩Power MOSFET |
文件: | 总13页 (文件大小:583K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
STP9NK60Z - STP9NK60ZFP
STB9NK60Z - STB9NK60Z-1
N-CHANNEL 600V - 0.85Ω - 7A TO-220/FP/D2PAK/I2PAK
Zener-Protected SuperMESH™Power MOSFET
TYPE
V
DSS
R
I
D
Pw
DS(on)
< 0.95 Ω
< 0.95 Ω
< 0.95 Ω
< 0.95 Ω
STP9NK60Z
STP9NK60ZFP
STB9NK60Z
STB9NK60Z-1
600 V
600 V
600 V
600 V
7 A
7 A
7 A
7 A
125 W
30 W
125 W
125 W
3
2
1
■ TYPICAL R (on) = 0.85 Ω
DS
TO-220
TO-220FP
■ EXTREMELY HIGH dv/dt CAPABILITY
■ IMPROVED ESD CAPABILITY
■ 100% AVALANCHE RATED
■ GATE CHARGE MINIMIZED
■ VERY LOW INTRINSIC CAPACITANCES
■ VERY GOOD MANUFACTURING
REPEATIBILITY
3
1
3
2
1
2
2
I PAK
D PAK
DESCRIPTION
INTERNAL SCHEMATIC DIAGRAM
The SuperMESH™ series is obtained through an
extreme optimization of ST’s well established strip-
based PowerMESH™ layout. In addition to pushing
on-resistance significantly down, special care is tak-
en to ensure a very good dv/dt capability for the
most demanding applications. Such series comple-
ments ST full range of high voltage MOSFETs in-
cluding revolutionary MDmesh™ products.
APPLICATIONS
■ HIGH CURRENT, HIGH SPEED SWITCHING
■ IDEAL FOR OFF-LINE POWER SUPPLIES,
ADAPTORS AND PFC
ORDERING INFORMATION
SALES TYPE
STP9NK60Z
STP9NK60ZFP
STB9NK60Z
MARKING
P9NK60Z
PACKAGE
TO-220
PACKAGING
TUBE
P9NK60ZFP
B9NK60Z
TO-220FP
TUBE
2
TUBE
D PAK
2
STB9NK60ZT4
STB9NK60Z-1
B9NK60Z
TAPE & REEL
TUBE
D PAK
2
B9NK60Z-1
I PAK
June 2002
1/13
STP9NK60Z / STP9NK60ZFP / STB9NK60Z / STB9NK60Z-1
ABSOLUTE MAXIMUM RATINGS
Symbol
Parameter
Value
Unit
TO-220 /
2
TO-220FP
2
D PAK / I PAK
V
Drain-source Voltage (V = 0)
600
600
± 30
V
V
DS
GS
V
Drain-gate Voltage (R = 20 kΩ)
DGR
GS
V
GS
Gate- source Voltage
V
I
Drain Current (continuous) at T = 25°C
7
4.4
28
125
1
7 (*)
4.4 (*)
28 (*)
30
A
D
C
I
Drain Current (continuous) at T = 100°C
A
D
C
I
( )
Drain Current (pulsed)
A
DM
P
Total Dissipation at T = 25°C
W
TOT
C
Derating Factor
0.24
W/°C
V
V
Gate source ESD(HBM-C=100pF, R=1.5KΩ)
Peak Diode Recovery voltage slope
Insulation Withstand Voltage (DC)
4000
4.5
ESD(G-S)
dv/dt (1)
V/ns
V
V
-
2500
ISO
T
T
stg
Operating Junction Temperature
Storage Temperature
°C
°C
j
-55 to 150
-55 to 150
( ) Pulse width limited by safe operating area
(1) ISD ≤7A, di/dt ≤200 µA, VDD ≤ V
, T ≤ T
(BR)DSS
j JMAX.
(*) Limited only by maximum temperature allowed
THERMAL DATA
TO-220
TO-
220FP
2
D PAK
2
I PAK
Rthj-case
Rthj-pcb
Rthj-amb
Thermal Resistance Junction-case Max
1
4.16
°C/W
°C/W
Thermal Resistance Junction-pcb Max
(When mounted on minimum Footprint)
30
Thermal Resistance Junction-ambient Max
62.5
300
°C/W
°C
T
Maximum Lead Temperature For Soldering Purpose
l
AVALANCHE CHARACTERISTICS
Symbol
Parameter
Max Value
Unit
I
AR
Avalanche Current, Repetitive or Not-Repetitive
7
A
(pulse width limited by T max)
j
E
Single Pulse Avalanche Energy
235
mJ
AS
(starting T = 25 °C, I = I , V = 50 V)
j
D
AR
DD
GATE-SOURCE ZENER DIODE
Symbol
BV
Parameter
Test Conditions
Igs=± 1mA (Open Drain)
Min.
30
Typ.
Max.
Unit
Gate-Source Breakdown
Voltage
V
GSO
PROTECTION FEATURES OF GATE-TO-SOURCE ZENER DIODES
The built-in back-to-back Zener diodes have specifically been designed to enhance not only the device’s
ESD capability, but also to make them safely absorb possible voltage transients that may occasionally be
applied from gate to souce. In this respect the Zener voltage is appropriate to achieve an efficient and cost-
effective intervention to protect the device’s integrity. These integrated Zener diodes thus avoid the usage
of external components.
2/13
STP9NK60Z / STP9NK60ZFP / STB9NK60Z / STB9NK60Z-1
ELECTRICAL CHARACTERISTICS (TCASE =25°C UNLESS OTHERWISE SPECIFIED)
ON/OFF
Symbol
Parameter
Drain-source
Test Conditions
Min.
Typ.
Max.
Unit
V
I
D
= 1 mA, V = 0
600
V
(BR)DSS
GS
Breakdown Voltage
I
Zero Gate Voltage
V
V
= Max Rating
= Max Rating, T = 125 °C
1
50
µA
µA
DSS
DS
Drain Current (V = 0)
GS
DS
C
I
Gate-body Leakage
V
GS
= ± 20V
±10
µA
GSS
Current (V = 0)
DS
V
R
V
V
= V , I = 100µA
Gate Threshold Voltage
3
3.75
0.85
4.5
V
GS(th)
DS
GS
D
Static Drain-source On
Resistance
= 10V, I = 3.5 A
0.95
Ω
DS(on)
GS
D
DYNAMIC
Symbol
Parameter
Test Conditions
Min.
Typ.
Max.
Unit
g
fs
(1)
Forward Transconductance
V
DS
= 15 V I = 3.5 A
5.3
S
, D
C
Input Capacitance
Output Capacitance
Reverse Transfer
Capacitance
V
DS
= 25V, f = 1 MHz, V = 0
1110
135
30
pF
pF
pF
iss
GS
C
oss
C
rss
C
(3) Equivalent Output
Capacitance
V
GS
= 0V, V = 0V to 480 V
72
pF
oss eq.
DS
SWITCHING ON
Symbol
Parameter
Test Conditions
Min.
Typ.
Max.
Unit
t
Turn-on Delay Time
Rise Time
V
= 300 V, I = 3.5 A
19
17
ns
ns
d(on)
DD
D
t
r
R = 4.7Ω V = 10 V
G GS
(Resistive Load see, Figure 3)
Q
Q
Q
V
V
= 480 V, I = 7 A,
= 10V
53
Total Gate Charge
Gate-Source Charge
Gate-Drain Charge
38
7
21
nC
nC
nC
g
DD
D
gs
gd
GS
SWITCHING OFF
Symbol
Parameter
Test Conditions
Min.
Typ.
Max.
Unit
t
Turn-off Delay Time
Fall Time
V
= 300 V, I = 3.5 A
43
15
ns
ns
d(off)
DD
D
t
f
R = 4.7Ω V = 10 V
G GS
(Resistive Load see, Figure 3)
V
R
= 300 V, I = 7 A,
t
Off-voltage Rise Time
Fall Time
Cross-over Time
11
8
20
ns
ns
ns
r(Voff)
DD
D
t
f
= 4.7Ω, V = 10V
G
GS
t
c
(Inductive Load see, Figure 5)
SOURCE DRAIN DIODE
Symbol
Parameter
Test Conditions
Min.
Typ.
Max.
Unit
I
7
28
A
A
Source-drain Current
Source-drain Current (pulsed)
SD
(2)
I
SDM
V
(1)
I
I
= 7 A, V = 0
Forward On Voltage
1.6
V
SD
SD
GS
t
= 7 A, di/dt = 100A/µs
= 30V, T = 150°C
rr
Reverse Recovery Time
Reverse Recovery Charge
Reverse Recovery Current
SD
480
3.5
14.5
ns
µC
A
Q
V
DD
rr
RRM
j
I
(see test circuit, Figure 5)
Note: 1. Pulsed: Pulse duration = 300 µs, duty cycle 1.5 %.
2. Pulse width limited by safe operating area.
3. C
V
is defined as a constant equivalent capacitance giving the same charging time as C
when V increases from 0 to 80%
oss eq.
oss
DS
.
DSS
3/13
STP9NK60Z / STP9NK60ZFP / STB9NK60Z / STB9NK60Z-1
Safe Operating Area For TO-220/D2PAK/I2PAK
Safe Operating Area For TO-220FP
Thermal Impedance For TO-220/D2PAK/I2PAK
Thermal Impedance For TO-220FP
Output Characteristics
Transfer Characteristics
4/13
STP9NK60Z / STP9NK60ZFP / STB9NK60Z / STB9NK60Z-1
Static Drain-source On Resistance
Transconductance
Gate Charge vs Gate-source Voltage
Capacitance Variations
Normalized Gate Threshold Voltage vs Temp.
Normalized On Resistance vs Temperature
5/13
STP9NK60Z / STP9NK60ZFP / STB9NK60Z / STB9NK60Z-1
Source-drain Diode Forward Characteristics
Normalized BVDSS vs Temperature
Maximum Avalanche Energy vs Temperature
6/13
STP9NK60Z / STP9NK60ZFP / STB9NK60Z / STB9NK60Z-1
Fig. 1: Unclamped Inductive Load Test Circuit
Fig. 2: Unclamped Inductive Waveform
Fig. 3: Switching Times Test Circuit For
Fig. 4: Gate Charge test Circuit
Resistive Load
Fig. 5: Test Circuit For Inductive Load Switching
And Diode Recovery Times
7/13
STP9NK60Z / STP9NK60ZFP / STB9NK60Z / STB9NK60Z-1
TO-220 MECHANICAL DATA
mm
inch
TYP.
DIM.
MIN.
4.40
1.23
2.40
TYP.
MAX.
4.60
1.32
2.72
MIN.
0.173
0.048
0.094
MAX.
0.181
0.051
0.107
A
C
D
D1
E
1.27
0.050
0.49
0.61
1.14
1.14
4.95
2.4
0.70
0.88
1.70
1.70
5.15
2.7
0.019
0.024
0.044
0.044
0.194
0.094
0.393
0.027
0.034
0.067
0.067
0.203
0.106
0.409
F
F1
F2
G
G1
H2
L2
L4
L5
L6
L7
L9
DIA.
10.0
10.40
16.4
0.645
13.0
2.65
15.25
6.2
14.0
2.95
15.75
6.6
0.511
0.104
0.600
0.244
0.137
0.147
0.551
0.116
0.620
0.260
0.154
0.151
3.5
3.93
3.85
3.75
L2
Dia.
L5
L9
L7
L6
L4
P011C
8/13
STP9NK60Z / STP9NK60ZFP / STB9NK60Z / STB9NK60Z-1
TO-220FP MECHANICAL DATA
mm.
TYP
inch
TYP.
DIM.
MIN.
4.4
MAX.
4.6
2.7
2.75
0.7
1
MIN.
0.173
0.098
0.098
0.017
0.030
0.045
0.045
0.195
0.094
0.393
MAX.
0.181
0.106
0.108
0.027
0.039
0.067
0.067
0.204
0.106
0.409
A
B
2.5
D
2.5
E
0.45
0.75
1.15
1.15
4.95
2.4
F
F1
F2
G
1.5
1.5
5.2
2.7
10.4
G1
H
10
L2
L3
L4
L5
L6
L7
Ø
16
0.630
28.6
9.8
2.9
15.9
9
30.6
10.6
3.6
1.126
.0385
0.114
0.626
0.354
0.118
1.204
0.417
0.141
0.645
0.366
0.126
16.4
9.3
3
3.2
L3
L6
L7
1 2 3
L4
L5
L2
9/13
STP9NK60Z / STP9NK60ZFP / STB9NK60Z / STB9NK60Z-1
D2PAK MECHANICAL DATA
mm.
inch
TYP.
DIM.
MIN.
4.4
TYP
MAX.
4.6
MIN.
0.173
0.098
0.001
0.027
0.044
0.017
0.048
0.352
MAX.
0.181
0.106
0.009
0.036
0.067
0.023
0.053
0.368
A
A1
A2
B
2.49
0.03
0.7
2.69
0.23
0.93
1.7
B2
C
1.14
0.45
1.23
8.95
0.6
C2
D
1.36
9.35
D1
E
8
0.315
0.334
10
10.4
0.393
E1
G
8.5
4.88
15
5.28
15.85
1.4
0.192
0.590
0.050
0.055
0.094
0.208
0.625
0.055
0.068
0.126
L
L2
L3
M
1.27
1.4
1.75
3.2
2.4
R
0.4
0.015
V2
0º
8º
3
10/13
1
STP9NK60Z / STP9NK60ZFP / STB9NK60Z / STB9NK60Z-1
TO-262 (I2PAK) MECHANICAL DATA
mm
inch
TYP.
DIM.
MIN.
4.4
TYP.
MAX.
4.6
MIN.
0.173
0.098
0.027
0.044
0.017
0.048
0.352
0.094
0.393
0.515
0.137
0.050
MAX.
0.181
0.106
0.036
0.067
0.023
0.053
0.368
0.106
0.409
0.531
0.149
0.055
A
A1
B
2.49
0.7
2.69
0.93
1.7
B2
C
1.14
0.45
1.23
8.95
2.4
0.6
C2
D
1.36
9.35
2.7
e
E
10
10.4
13.6
3.78
1.4
L
13.1
3.48
1.27
L1
L2
L1
L2
D
L
P011P5/E
11/13
STP9NK60Z / STP9NK60ZFP / STB9NK60Z / STB9NK60Z-1
D2PAK FOOTPRINT
TUBE SHIPMENT (no suffix)*
TAPE AND REEL SHIPMENT (suffix ”T4”)*
REEL MECHANICAL DATA
mm
MIN. MAX. MIN. MAX.
330 12.992
inch
DIM.
A
B
C
D
G
N
T
1.5
0.059
12.8
20.2
24.4
100
13.2 0.504 0.520
0795
26.4 0.960 1.039
3.937
30.4
1.197
BASE QTY
BULK QTY
1000
TAPE MECHANICAL DATA
1000
mm
inch
DIM.
MIN. MAX. MIN. MAX.
10.5 10.7 0.413 0.421
15.7 15.9 0.618 0.626
A0
B0
D
1.5
1.6 0.059 0.063
D1
E
1.59 1.61 0.062 0.063
1.65 1.85 0.065 0.073
F
11.4
4.8
3.9
11.9
1.9
50
11.6 0.449 0.456
5.0 0.189 0.197
4.1 0.153 0.161
12.1 0.468 0.476
2.1 0.075 0.082
1.574
K0
P0
P1
P2
R
T
0.25 0.35 0.0098 0.0137
23.7 24.3 0.933 0.956
W
* on sales type
12/13
STP9NK60Z / STP9NK60ZFP / STB9NK60Z / STB9NK60Z-1
Information furnished is believed to be accurate and reliable. However, STMicroelectronics assumes no responsibility for the
consequences of use of such information nor for any infringement of patents or other rights of third parties which may result from
its use. No license is granted by implication or otherwise under any patent or patent rights of STMicroelectronics. Specifications
mentioned in this publication are subject to change without notice. This publication supersedes and replaces all information
previously supplied. STMicroelectronics products are not authorized for use as critical components in life support devices or
systems without express written approval of STMicroelectronics.
© The ST logo is a registered trademark of STMicroelectronics
© 2002 STMicroelectronics - Printed in Italy - All Rights Reserved
STMicroelectronics GROUP OF COMPANIES
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Singapore - Spain - Sweden - Switzerland - United Kingdom - United States.
© http://www.st.com
13/13
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