STPS5045SG-TR [STMICROELECTRONICS]
45 V, 50 A Power Schottky Rectifier;
| 型号： | STPS5045SG-TR |
| 厂家： | 
ST |
| 描述： | 45 V, 50 A Power Schottky Rectifier |
| 文件： | 总7页 (文件大小：160K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
STPS5045S
Power Schottky rectifier
Datasheet − production data
Features
A
K
A
■ Low forward voltage drop
■ Very small conduction losses
■ Negligible switching losses
■ Extremely fast switching
■ Low thermal resistance
K
■ 200 °C maximum junction temperature
■ Avalanche rated
A
A
D2PAK
STPS5045SG-TR
Description
This device is a dual center tap Schottky rectifier
suited for switch mode power supply and high
frequency DC to DC converters.
j
Table 1.
Device summary
Symbol
IF(AV)
VRRM
Value
2
Packaged in D PAK, this device is especially
intended for use in low voltage, high frequency
inverters, freewheeling and polarity protection
applications. Also ideal for PV cell-bypass diode
for junction and smart junction boxes.
50 A
45 V
Tj (max)
VF(max)
200 °C
0.48 V
June 2012
Doc ID022861 Rev 1
1/7
This is information on a product in full production.
www.st.com
7
Characteristics
STPS5045S
1
Characteristics
Table 2.
Symbol
Absolute ratings (limiting values at 25 °C unless otherwise specified)
Parameter
Value
Unit
VRRM Repetitive peak reverse voltage
IF(RMS) Forward rms current
IF(AV) Average forward current δ = 0.5
IFSM Surge non repetitive forward current tp = 10 ms sinusoidal
PARM Repetitive peak avalanche power tp = 10 µs Tj = 125 °C
Tstg Storage temperature range
45
90
V
A
Tc = 135 °C
50
A
600
A
1200
-65 to +175
+200
+175
W
°C
°C
°C
Maximum operating junction temperature in DC forward mode(2)
Tj(1)
Maximum operating junction temperature
1
dPtot
dTj
<
1.
condition to avoid thermal runaway for a diode on its own heatsink
Rth(j-a)
2. Maximum operating junction temperature only in DC forward mode
Table 3.
Symbol
Thermal resistance
Parameter
Value
Unit
Rth(j-c) Junction to case
1.0
°C/W
Table 4.
Symbol
Static electrical characteristics
Parameter Test conditions
Min.
Typ.
Max.
Unit
Tj = 25 °C
Reverse leakage current Tj = 75 °C
VR = VRRM
VR = 20 V
0.090
0.7
0.36
1.9
(1)
IR
mA
Tj = 125 °C VR = VRRM
65
185
0.61
0.56
Tj = 25 °C
IF = 50 A
Tj = 125 °C
0.55
0.48
0.22
0.28
(2)
VF
Forward voltage drop
V
IF = 10 A
Tj = 200 °C
IF =20 A
1. Pulse test: tp = 5 ms, δ < 2%
2. Pulse test: tp = 380 µs, δ < 2%
To evaluate the conduction losses use the following equation:
2
P = 0.38 x I
+ 0.0036 I
F(AV)
F (RMS)
2/7
Doc ID022861 Rev 1
STPS5045S
Figure 1.
Characteristics
Average forward power dissipation Figure 2.
versus average forward current
Average forward current versus
ambient temperature
(δ = 0.5)
I
(A)
F(AV)
P
(W)
F(AV)
60
50
40
30
20
10
0
45
40
35
30
25
20
15
10
5
δ = 0.1 δ = 0.2
δ = 0.5
Rth(j-a)=Rth(j-c)
δ = 0.05
δ = 1
T
T
I
(A)
T
(°C)
amb
F(AV)
tp
tp
=t /T
p
=tp/T
δ
δ
0
0
10
20
30
40
50
60
70
0
25
50
75
100
125
150
175
Figure 3.
Normalized avalanche power
derating versus pulse duration
Figure 4.
Relative variation of thermal
impedance junction to case versus
pulse duration
P
ARM
(t )
p
(10µs)
ARM
Z
/R
th(j-c) th(j-c)
P
1.0
0.9
0.8
0.7
0.6
0.5
0.4
0.3
0.2
0.1
0.0
1
0.1
0.01
Single pulse
t (s)
p
t (µs)
p
0.001
1.E-05
1.E-04
1.E-03
1.E-02
1.E-01
1.E+00
1
10
100
1000
Doc ID022861 Rev 1
3/7
Characteristics
STPS5045S
Figure 5.
Reverse leakage current versus
Figure 6.
Junction capacitance versus
reverse voltage applied
(typical values)
reverse voltage applied
(typical values)
C(pF)
I (mA)
R
1.E+03
1.E+02
1.E+01
1.E+00
1.E-01
1.E-02
1.E-03
10000
1000
100
F=1MHz
Vosc =30mVRMS
T=150°C
j
T=25°C
j
T=125°C
j
T=100°C
j
T=75°C
j
T=50°C
j
T=25°C
j
V (V)
R
V (V)
R
0
5
10
15
20
25
30
35
40
45
1
10
100
Figure 7.
Forward voltage drop versus
forward current
Figure 8.
Thermal resistance junction to
ambient versus copper surface
under tab
I
(A)
FM
R
(°C/W)
th(j-a)
1000.0
100.0
10.0
1.0
80
70
60
50
40
30
20
10
0
T=125°C
j
(Maximum values)
epoxy printed circuit board FR4, copper thickness = 35 µm, D2PAK
T=125°C
j
(Typical values)
T=200°C
j
(Typical values)
T=25°C
j
(Maximum values)
S(Cu)(cm²)
V
(V)
FM
0.1
0
5
10
15
20
25
30
35
40
0.0
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.8
0.9
1.0
4/7
Doc ID022861 Rev 1
STPS5045S
Package information
2
Package information
■
■
Epoxy meets UL94, V0
Cooling method: by conduction (C)
In order to meet environmental requirements, ST offers these devices in different grades of
®
®
ECOPACK packages, depending on their level of environmental compliance. ECOPACK
specifications, grade definitions and product status are available at: www.st.com.
®
ECOPACK is an ST trademark.
2
Table 5.
D PAK dimensions
Dimensions
Millimeters
Ref
Inches
Min. Max.
Min.
Max.
A
A1
A2
B
4.40
2.49
0.03
0.70
1.14
0.45
1.23
8.95
10.00
4.88
15.00
1.27
1.40
2.40
4.60
2.69
0.23
0.93
1.70
0.60
1.36
9.35
10.40
5.28
15.85
1.40
1.75
3.20
0.173
0.098
0.001
0.027
0.045
0.017
0.048
0.352
0.393
0.192
0.590
0.050
0.055
0.094
0.181
0.106
0.009
0.037
0.067
0.024
0.054
0.368
0.409
0.208
0.624
0.055
0.069
0.126
A
E
C2
L2
D
L
B2
C
L3
A1
C2
D
B2
B
R
C
G
E
A2
G
L
M
*
L2
L3
M
V2
* FLAT ZONE NO LESS THAN 2mm
R
0.40 typ.
0.016 typ.
V2
0°
8°
0°
8°
Figure 9.
Footprint (dimensions in millimeters)
16.90
10.30
5.08
1.30
3.70
8.90
Doc ID022861 Rev 1
5/7
Ordering information
STPS5045S
3
Ordering information
Table 6.
Order code
STPS5045SG-TR
Ordering information
Marking
Package
Weight Base qty Delivery mode
STPS5045SG
D2PAK
1.48 g
1000
Tape and reel
4
Revision history
Table 7.
Date
28-June-2012
Revision history
Revision
Changes
1
First issue.
6/7
Doc ID022861 Rev 1
STPS5045S
Please Read Carefully:
Information in this document is provided solely in connection with ST products. STMicroelectronics NV and its subsidiaries (“ST”) reserve the
right to make changes, corrections, modifications or improvements, to this document, and the products and services described herein at any
time, without notice.
All ST products are sold pursuant to ST’s terms and conditions of sale.
Purchasers are solely responsible for the choice, selection and use of the ST products and services described herein, and ST assumes no
liability whatsoever relating to the choice, selection or use of the ST products and services described herein.
No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted under this document. If any part of this
document refers to any third party products or services it shall not be deemed a license grant by ST for the use of such third party products
or services, or any intellectual property contained therein or considered as a warranty covering the use in any manner whatsoever of such
third party products or services or any intellectual property contained therein.
UNLESS OTHERWISE SET FORTH IN ST’S TERMS AND CONDITIONS OF SALE ST DISCLAIMS ANY EXPRESS OR IMPLIED
WARRANTY WITH RESPECT TO THE USE AND/OR SALE OF ST PRODUCTS INCLUDING WITHOUT LIMITATION IMPLIED
WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE (AND THEIR EQUIVALENTS UNDER THE LAWS
OF ANY JURISDICTION), OR INFRINGEMENT OF ANY PATENT, COPYRIGHT OR OTHER INTELLECTUAL PROPERTY RIGHT.
UNLESS EXPRESSLY APPROVED IN WRITING BY TWO AUTHORIZED ST REPRESENTATIVES, ST PRODUCTS ARE NOT
RECOMMENDED, AUTHORIZED OR WARRANTED FOR USE IN MILITARY, AIR CRAFT, SPACE, LIFE SAVING, OR LIFE SUSTAINING
APPLICATIONS, NOR IN PRODUCTS OR SYSTEMS WHERE FAILURE OR MALFUNCTION MAY RESULT IN PERSONAL INJURY,
DEATH, OR SEVERE PROPERTY OR ENVIRONMENTAL DAMAGE. ST PRODUCTS WHICH ARE NOT SPECIFIED AS "AUTOMOTIVE
GRADE" MAY ONLY BE USED IN AUTOMOTIVE APPLICATIONS AT USER’S OWN RISK.
Resale of ST products with provisions different from the statements and/or technical features set forth in this document shall immediately void
any warranty granted by ST for the ST product or service described herein and shall not create or extend in any manner whatsoever, any
liability of ST.
ST and the ST logo are trademarks or registered trademarks of ST in various countries.
Information in this document supersedes and replaces all information previously supplied.
The ST logo is a registered trademark of STMicroelectronics. All other names are the property of their respective owners.
© 2012 STMicroelectronics - All rights reserved
STMicroelectronics group of companies
Australia - Belgium - Brazil - Canada - China - Czech Republic - Finland - France - Germany - Hong Kong - India - Israel - Italy - Japan -
Malaysia - Malta - Morocco - Philippines - Singapore - Spain - Sweden - Switzerland - United Kingdom - United States of America
www.st.com
Doc ID022861 Rev 1
7/7
相关型号：
©2020 ICPDF网 联系我们和版权申明