STPS5H100B-1 [STMICROELECTRONICS]

HIGH VOLTAGE POWER SCHOTTKY RECTIFIER; 高压功率肖特基整流器
STPS5H100B-1
型号: STPS5H100B-1
厂家: ST    ST
描述:

HIGH VOLTAGE POWER SCHOTTKY RECTIFIER
高压功率肖特基整流器

整流二极管 高压 高电压电源
文件: 总5页 (文件大小:71K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
STPS5H100B/-1  
®
HIGH VOLTAGE POWER SCHOTTKY RECTIFIER  
MAIN PRODUCT CHARACTERISTICS  
K
IF(AV)  
VRRM  
5 A  
100 V  
175 °C  
0.61 V  
Tj (max)  
VF (max)  
A
NC  
DPAK  
STPS5H100B  
FEATURES AND BENEFITS  
NEGLIGIBLE SWITCHING LOSSES  
HIGH JUNCTION TEMPERATURE CAPABILITY  
LOW LEAKAGE CURRENT  
K
GOOD TRADE OFF BETWEEN LEAKAGE  
CURRENT AND FORWARD VOLTAGE DROP  
AVALANCHE RATED  
DESCRIPTION  
A
Schottky barrier rectifier designed for high fre-  
quency miniature Switched Mode Power Sup-  
plies such as adaptators and on board DC to  
DC converters.  
K
NC  
IPAK  
STPS5H100B-1  
ABSOLUTE RATINGS  
Symbol  
(limiting values)  
Parameter  
Value  
100  
10  
5
Unit  
V
VRRM  
Repetitive peak reverse voltage  
IF(RMS) RMS forward current  
A
δ
IF(AV)  
IFSM  
IRRM  
IRSM  
Tstg  
Average forward current  
Tc = 165°C  
= 0.5  
A
Surge non repetitive forward current  
Repetitive peak reverse current  
Non repetitive peak reverse current  
Storage temperature range  
tp = 10 ms sinusoidal  
75  
1
A
µ
tp = 2 s square F = 1kHz  
A
µ
tp = 100 s square  
2
A
- 65 to + 175 °C  
Tj  
Maximum operating junction temperature *  
Critical rate of rise of reverse voltage  
175  
°C  
µ
V/ s  
dV/dt  
10000  
dPtot  
dTj  
1
<
* :  
thermal runaway condition for a diode on its own heatsink  
Rth(ja)  
July 1999 - Ed: 4B  
1/5  
STPS5H100B/-1  
THERMAL RESISTANCES  
Symbol  
Parameter  
Value  
Unit  
Rth (j-c) Junction to case  
2.5  
°C/W  
STATIC ELECTRICAL CHARACTERISTICS  
Symbol  
Parameter  
Tests Conditions  
Min. Typ. Max.  
Unit  
°
µ
A
IR *  
Reverse leakage current  
Tj = 25 C  
VR = VRRM  
3.5  
°
Tj = 125 C  
1.3  
4.5  
mA  
V
°
VF **  
Forward voltage drop  
Tj = 25 C  
IF = 5 A  
0.73  
0.61  
0.85  
0.71  
°
0.57  
0.66  
Tj = 125 C  
IF = 5 A  
°
Tj = 25 C  
IF = 10 A  
IF = 10 A  
°
Tj = 125 C  
Pulse test : * tp = 5 ms, δ < 2%  
** tp = 380 µs, δ < 2%  
To evaluate the maximum conduction losses use the following equation :  
2
P = 0.51 x IF(AV) + 0.02 x IF (RMS)  
Fig. 1:  
average forward current.  
Fig. 2:  
Average forward current versus ambient  
Average forward power dissipation versus  
δ
temperature ( =0.5).  
IF(av)(A)  
PF(av)(W)  
6
4.0  
δ = 0.2  
Rth(j-a)=Rth(j-c)  
δ = 0.5  
δ = 0.1  
3.5  
5
4
δ = 0.05  
3.0  
2.5  
2.0  
1.5  
1.0  
0.5  
δ = 1  
Rth(j-a)=80°C/W  
3
2
1
0
T
T
tp  
=tp/T  
δ
tp  
=tp/T  
IF(av) (A)  
δ
Tamb(°C)  
80 100 120 140 160 180  
0.0  
0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 6.0  
0
20  
40  
60  
2/5  
STPS5H100B/-1  
Fig. 3:  
Fig. 4:  
Relative variation of thermal impedance  
junction to case versus pulse duration.  
Non repetitive surge peak forward current  
versus overload duration (maximum values).  
IM(A)  
Zth(j-c)/Rth(j-c)  
120  
110  
100  
90  
1.0  
0.8  
80  
δ = 0.5  
0.6  
70  
60  
50  
40  
30  
20  
10  
0
Tc=50°C  
δ = 0.2  
0.4  
Tc=75°C  
δ = 0.1  
T
IM  
Tc=125°C  
0.2  
Single pulse  
t
t(s)  
tp(s)  
δ
=0.5  
tp  
=tp/T  
δ
0.0  
1E-3  
1E-2  
1E-1  
1E+0  
1E-3  
1E-2  
1E-1  
1E+0  
Fig. 6:  
Junction capacitance versus reverse  
Fig. 5:  
voltage applied.  
Reverse leakage current versus reverse  
voltage applied (typical values).  
IR(µA)  
5E+3  
C(pF)  
1000  
F=1MHz  
Tj=25°C  
1E+3  
Tj=125°C  
1E+2  
1E+1  
1E+0  
1E-1  
1E-2  
100  
Tj=25°C  
VR(V)  
VR(V)  
10  
1
10  
100  
0
10 20 30 40 50 60 70 80 90 100  
Fig. 7:  
rent (maximum values).  
Forward voltage drop versus forward cur-  
Fig. 8:  
Thermal resistance junction to ambient  
versus copper surface under tab (Epoxy printed  
µ
circuit board FR4, copper thickness: 35 m)  
(DPAK).  
IFM(A)  
Rth(j-a) (°C/W)  
50.0  
100  
90  
80  
70  
60  
50  
40  
30  
20  
Tj=125°C  
10.0  
Tj=25°C  
1.0  
10  
0
S(Cu) (cm²)  
8 10 12 14 16 18 20  
VFM(V)  
0.8  
0.1  
0
2
4
6
0.0  
0.2  
0.4  
0.6  
1.0  
1.2  
1.4  
1.6  
3/5  
STPS5H100B/-1  
PACKAGE MECHANICAL DATA  
DPAK  
DIMENSIONS  
Millimeters Inches  
Min. Min.  
REF.  
Max  
2.40  
1.10  
0.23  
0.90  
5.40  
0.60  
0.60  
6.20  
6.60  
4.60  
10.10  
Max.  
0.094  
0.043  
0.009  
0.035  
0.212  
0.023  
0.023  
0.244  
0.259  
0.181  
0.397  
A
A1  
A2  
B
2.20  
0.90  
0.03  
0.64  
5.20  
0.45  
0.48  
6.00  
6.40  
4.40  
9.35  
0.086  
0.035  
0.001  
0.025  
0.204  
0.017  
0.018  
0.236  
0.251  
0.173  
0.368  
B2  
C
C2  
D
E
G
H
L2  
L4  
V2  
0.80 typ.  
0.031 typ.  
0.60  
0°  
1.00  
8°  
0.023  
0°  
0.039  
8°  
FOOT PRINT  
(in millimeters)  
6.7  
6.7  
3
3
1.6  
1.6  
2.3 2.3  
4/5  
STPS5H100B/-1  
PACKAGE MECHANICAL DATA  
IPAK  
DIMENSIONS  
Millimeters Inches  
Min. Typ. Max. Min. Typ. Max.  
REF.  
A
A1  
A3  
B
2.2  
0.9  
2.4 0.086  
1.1 0.035  
1.3 0.027  
0.9 0.025  
5.4 0.204  
0.85  
0.094  
0.043  
0.051  
0.035  
0.212  
0.033  
A
0.7  
E
C2  
0.64  
5.2  
B2  
B2  
B3  
B5  
B6  
C
L2  
0.3  
0.035  
D
0.95  
0.037  
0.023  
0.023  
0.244  
0.260  
0.181  
0.641  
0.370  
0.047  
0.45  
0.48  
6
0.6 0.017  
0.6 0.019  
6.2 0.236  
6.6 0.252  
4.6 0.173  
16.3 0.626  
9.4 0.354  
1.2 0.031  
1
C2  
D
H
B3  
L1  
B6  
L
A1  
B
E
6.4  
4.4  
15.9  
9
V1  
G
H
B5  
C
L
G
A3  
L1  
L2  
V1  
0.8  
0.8  
10°  
0.031 0.039  
10°  
Ordering type  
Marking  
S5H100  
S5H100  
S5H100  
Package  
DPAK  
DPAK  
IPAK  
Weight  
0.30g  
0.30g  
0.35g  
Base qty  
75  
Delivery mode  
Tube  
STPS5H100B  
STPS5H100B-TR  
STPS5H100B-1  
2500  
75  
Tape & reel  
Tube  
Epoxy meets UL94,V0  
Information furnished is believed to be accurate and reliable. However, STMicroelectronics assumes no responsibility for the consequences of  
use of such information nor for any infringement of patents or other rights of third parties which may result from its use. No license is granted by  
implication or otherwise under any patent or patent rights of STMicroelectronics. Specifications mentioned in this publication are subject to  
change without notice. This publication supersedes and replaces all information previously supplied.  
STMicroelectronics products are not authorized for use as critical components in life support devices or systems without express written ap-  
proval of STMicroelectronics.  
The ST logo is a registered trademark of STMicroelectronics  
© 1999 STMicroelectronics - Printed in Italy - All rights reserved.  
STMicroelectronics GROUP OF COMPANIES  
Australia - Brazil - China - Finland - France - Germany - Hong Kong - India - Italy - Japan - Malaysia  
Malta - Morocco - Singapore - Spain - Sweden - Switzerland - United Kingdom - U.S.A.  
http://www.st.com  
5/5  

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