STPS5H100BY-TR [STMICROELECTRONICS]
Automotive high voltage power Schottky rectifier; 汽车高电压功率肖特基整流器
| 型号： | STPS5H100BY-TR |
| 厂家： | 
ST |
| 描述： | Automotive high voltage power Schottky rectifier |
| 文件： | 总7页 (文件大小：90K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
STPS5H100-Y
Automotive high voltage power Schottky rectifier
Features
■ Negligible switching losses
K
■ High junction temperature capability
■ Low leakage current
■ Good trade off between leakage current and
A
forward voltage drop
NC
DPAK
■ Avalanche specification
■ AEC-Q101 qualified
STPS5H100BY
Description
This high voltage Schottky barrier rectifier is
packaged in DPAK, and designed for high
frequency miniature switched mode power
supplies such as adaptators and on board DC to
DC converters for automotive applications.
Table 1.
Device summary
Symbol
IF(AV)
VRRM
Value
5 A
100 V
175 °C
0.61 V
Tj (max)
VF(max)
November 2011
Doc ID 17744 Rev 1
1/7
www.st.com
7
Characteristics
STPS5H100-Y
1
Characteristics
Table 2.
Symbol
Absolute ratings (limiting values)
Parameter
Value
Unit
VRRM Repetitive peak reverse voltage
100
V
A
IF(RMS) Forward rms current
IF(AV) Average forward current
10
Tc = 165 °C, δ = 0.5
tp =10 ms sinusoidal
tp = 2 µs, F = 1 KHz
tp = 100 µs square
tp = 1 µs Tj = 25 °C
5
A
IFSM
IRRM
IRSM
Surge non repetitive forward current
75
1
A
Repetitive peak reverse current
A
Non repetitive peak reverse current
2
A
PARM Repetitive peak avalanche power
7200
W
°C
°C
V/µs
Tstg
Tj
Storage temperature range
Operating junction temperature(1)
-65 to + 175
-40 to +175
10000
dV/dt Critical rate of rise of reverse voltage
1
dPtot
dTj
<
1.
condition to avoid thermal runaway for a diode on its own heatsink
Rth(j-a)
Table 3.
Symbol
Thermal resistance
Parameter
Value
Unit
Rth(j-c) Junction to case
2.5
°C/W
Table 4.
Symbol
Static electrical characteristics
Parameter
Test conditions
Min.
Typ.
Max.
Unit
Tj = 25 °C
Tj = 125 °C
Tj = 25 °C
Tj = 125 °C
Tj = 25 °C
Tj = 125 °C
3.5
4.5
µA
Reverse leakage
current
(1)
IR
VR = VRRM
1.3
mA
0.73
0.61
0.85
0.71
IF = 5 A
0.57
0.66
(2)
VF
Forward voltage drop
V
IF = 10 A
1. Pulse test: tp = 5 ms, δ < 2%
2. Pulse test: tp = 380 µs, δ < 2%
To evaluate the conduction losses use the following equation:
2
P = 0.51 x I
+ 0.02I
F(AV)
F (RMS)
2/7
Doc ID 17744 Rev 1
STPS5H100-Y
Characteristics
Figure 1.
Average forward power dissipation Figure 2.
Average forward current versus
versus average forward current
ambient temperature (δ = 0.5)
IF(av)(A)
PF(av)(W)
6
5
4
3
2
1
0
4.0
3.5
3.0
2.5
2.0
1.5
1.0
0.5
0.0
δ = 0.2
Rth(j-a)=Rth(j-c)
δ = 0.5
δ = 0.1
δ = 0.05
δ = 1
Rth(j-a)=80°C/W
T
T
tp
=tp/T
δ
tp
=tp/T
IF(av) (A)
δ
Tamb(°C)
0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 6.0
0
20
40
60
80 100 120 140 160 180
Figure 3.
Normalized avalanche power
derating versus pulse duration
Figure 4.
Normalized avalanche power
derating versus junction
temperature
PARM(t )
p
PARM(1µs)
PARM(Tj)
PARM(25 °C)
1.2
1
1
0.1
0.8
0.6
0.4
0.2
0
0.01
Tj(°C)
tp(µs)
1000
0.001
0.01
0.1
1
10
100
15
25
50
75
100
125
Figure 5.
Non repetitive surge peak forward Figure 6.
current versus overload duration
(maximum values)
Relative variation of thermal
impedance junction to case versus
pulse duration
IM(A)
Zth(j-c)/Rth(j-c)
120
110
100
90
80
70
60
50
40
30
1.0
0.8
0.6
0.4
0.2
0.0
δ = 0.5
Tc=50°C
δ = 0.2
δ = 0.1
Tc=75°C
T
IM
Tc=125°C
Single pulse
20
10
t
t(s)
tp(s)
δ=0.5
tp
=tp/T
δ
0
1E-3
1E-2
1E-1
1E+0
1E-3
1E-2
1E-1
1E+0
Doc ID 17744 Rev 1
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Characteristics
STPS5H100-Y
Figure 7.
Reverse leakage current versus
Figure 8.
Junction capacitance versus
reverse voltage applied
reverse voltage applied
(typical values)
IR(µA)
C(pF)
5E+3
1E+3
1000
100
10
F=1MHz
Tj=25°C
Tj=125°C
1E+2
1E+1
1E+0
1E-1
1E-2
Tj=25°C
VR(V)
VR(V)
1
10
100
0
10 20 30 40 50 60 70 80 90 100
Figure 9.
Forward voltage drop versus
Figure 10. Thermal resistance junction to
forward current (maximum values)
ambient versus copper surface
under tab
IFM(A)
Rth(j-a) (°C/W)
100
90
80
70
60
50
40
30
20
10
0
50.0
10.0
Epoxy printed circuit board, copper thickness: 35 µm
Tj=125°C
Tj=25°C
1.0
S(Cu) (cm²)
16 18 20
VFM(V)
0.1
0
2
4
6
8
10
12
14
0.0
0.2
0.4
0.6
0.8
1.0
1.2
1.4
1.6
4/7
Doc ID 17744 Rev 1
STPS5H100-Y
Package information
2
Package information
●
●
Epoxy meets UL94, V0
Cooling method: by conduction (C)
In order to meet environmental requirements, ST offers these devices in different grades of
®
®
ECOPACK packages, depending on their level of environmental compliance. ECOPACK
specifications, grade definitions and product status are available at: www.st.com.
®
ECOPACK is an ST trademark.
Figure 11. DPAK dimensions
Dimensions
Ref
Millimeters
Inches
Min. Max.
Min.
Max.
E
A
A1
A2
B
2.20
0.90
0.03
0.64
5.20
0.45
0.48
6.00
6.40
4.40
9.35
2.40
1.10
0.23
0.90
5.40
0.60
0.60
6.20
6.60
4.60
10.10
0.086
0.035
0.001
0.025
0.204
0.017
0.018
0.236
0.251
0.173
0.368
0.094
0.043
0.009
0.035
0.212
0.023
0.023
0.244
0.259
0.181
0.397
A
B2
C2
L2
B2
C
D
R
H
L4
C2
D
A1
R
B
G
C
E
G
A2
0.60 MIN.
H
L2
L4
V2
0.80 typ.
0.031 typ.
V2
0.60
0°
1.00
8°
0.023
0°
0.039
8°
Figure 12. Footprint dimensions (in millimeters)
1.6
6.7
3
3
2.3
6.7
2.3
1.6
Doc ID 17744 Rev 1
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Ordering information
STPS5H100-Y
3
Ordering information
Table 5.
Ordering information
Order code
Marking
Package
Weight Base qty Delivery mode
STPS5H100BY-TR
S5H100Y
DPAK
0.30 g
2500
Tape and reel
4
Revision history
Table 6.
Date
07-Nov-2011
Document revision history
Revision
Changes
1
Initial release.
6/7
Doc ID 17744 Rev 1
STPS5H100-Y
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