STPS5H100B [STMICROELECTRONICS]
HIGH VOLTAGE POWER SCHOTTKY RECTIFIER; 高压功率肖特基整流器型号: | STPS5H100B |
厂家: | ST |
描述: | HIGH VOLTAGE POWER SCHOTTKY RECTIFIER |
文件: | 总5页 (文件大小:71K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
STPS5H100B/-1
®
HIGH VOLTAGE POWER SCHOTTKY RECTIFIER
MAIN PRODUCT CHARACTERISTICS
K
IF(AV)
VRRM
5 A
100 V
175 °C
0.61 V
Tj (max)
VF (max)
A
NC
DPAK
STPS5H100B
FEATURES AND BENEFITS
NEGLIGIBLE SWITCHING LOSSES
HIGH JUNCTION TEMPERATURE CAPABILITY
LOW LEAKAGE CURRENT
K
GOOD TRADE OFF BETWEEN LEAKAGE
CURRENT AND FORWARD VOLTAGE DROP
AVALANCHE RATED
DESCRIPTION
A
Schottky barrier rectifier designed for high fre-
quency miniature Switched Mode Power Sup-
plies such as adaptators and on board DC to
DC converters.
K
NC
IPAK
STPS5H100B-1
ABSOLUTE RATINGS
Symbol
(limiting values)
Parameter
Value
100
10
5
Unit
V
VRRM
Repetitive peak reverse voltage
IF(RMS) RMS forward current
A
δ
IF(AV)
IFSM
IRRM
IRSM
Tstg
Average forward current
Tc = 165°C
= 0.5
A
Surge non repetitive forward current
Repetitive peak reverse current
Non repetitive peak reverse current
Storage temperature range
tp = 10 ms sinusoidal
75
1
A
µ
tp = 2 s square F = 1kHz
A
µ
tp = 100 s square
2
A
- 65 to + 175 °C
Tj
Maximum operating junction temperature *
Critical rate of rise of reverse voltage
175
°C
µ
V/ s
dV/dt
10000
dPtot
dTj
1
<
* :
thermal runaway condition for a diode on its own heatsink
Rth(j−a)
July 1999 - Ed: 4B
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STPS5H100B/-1
THERMAL RESISTANCES
Symbol
Parameter
Value
Unit
Rth (j-c) Junction to case
2.5
°C/W
STATIC ELECTRICAL CHARACTERISTICS
Symbol
Parameter
Tests Conditions
Min. Typ. Max.
Unit
°
µ
A
IR *
Reverse leakage current
Tj = 25 C
VR = VRRM
3.5
°
Tj = 125 C
1.3
4.5
mA
V
°
VF **
Forward voltage drop
Tj = 25 C
IF = 5 A
0.73
0.61
0.85
0.71
°
0.57
0.66
Tj = 125 C
IF = 5 A
°
Tj = 25 C
IF = 10 A
IF = 10 A
°
Tj = 125 C
Pulse test : * tp = 5 ms, δ < 2%
** tp = 380 µs, δ < 2%
To evaluate the maximum conduction losses use the following equation :
2
P = 0.51 x IF(AV) + 0.02 x IF (RMS)
Fig. 1:
average forward current.
Fig. 2:
Average forward current versus ambient
Average forward power dissipation versus
δ
temperature ( =0.5).
IF(av)(A)
PF(av)(W)
6
4.0
δ = 0.2
Rth(j-a)=Rth(j-c)
δ = 0.5
δ = 0.1
3.5
5
4
δ = 0.05
3.0
2.5
2.0
1.5
1.0
0.5
δ = 1
Rth(j-a)=80°C/W
3
2
1
0
T
T
tp
=tp/T
δ
tp
=tp/T
IF(av) (A)
δ
Tamb(°C)
80 100 120 140 160 180
0.0
0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 6.0
0
20
40
60
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STPS5H100B/-1
Fig. 3:
Fig. 4:
Relative variation of thermal impedance
junction to case versus pulse duration.
Non repetitive surge peak forward current
versus overload duration (maximum values).
IM(A)
Zth(j-c)/Rth(j-c)
120
110
100
90
1.0
0.8
80
δ = 0.5
0.6
70
60
50
40
30
20
10
0
Tc=50°C
δ = 0.2
0.4
Tc=75°C
δ = 0.1
T
IM
Tc=125°C
0.2
Single pulse
t
t(s)
tp(s)
δ
=0.5
tp
=tp/T
δ
0.0
1E-3
1E-2
1E-1
1E+0
1E-3
1E-2
1E-1
1E+0
Fig. 6:
Junction capacitance versus reverse
Fig. 5:
voltage applied.
Reverse leakage current versus reverse
voltage applied (typical values).
IR(µA)
5E+3
C(pF)
1000
F=1MHz
Tj=25°C
1E+3
Tj=125°C
1E+2
1E+1
1E+0
1E-1
1E-2
100
Tj=25°C
VR(V)
VR(V)
10
1
10
100
0
10 20 30 40 50 60 70 80 90 100
Fig. 7:
rent (maximum values).
Forward voltage drop versus forward cur-
Fig. 8:
Thermal resistance junction to ambient
versus copper surface under tab (Epoxy printed
µ
circuit board FR4, copper thickness: 35 m)
(DPAK).
IFM(A)
Rth(j-a) (°C/W)
50.0
100
90
80
70
60
50
40
30
20
Tj=125°C
10.0
Tj=25°C
1.0
10
0
S(Cu) (cm²)
8 10 12 14 16 18 20
VFM(V)
0.8
0.1
0
2
4
6
0.0
0.2
0.4
0.6
1.0
1.2
1.4
1.6
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STPS5H100B/-1
PACKAGE MECHANICAL DATA
DPAK
DIMENSIONS
Millimeters Inches
Min. Min.
REF.
Max
2.40
1.10
0.23
0.90
5.40
0.60
0.60
6.20
6.60
4.60
10.10
Max.
0.094
0.043
0.009
0.035
0.212
0.023
0.023
0.244
0.259
0.181
0.397
A
A1
A2
B
2.20
0.90
0.03
0.64
5.20
0.45
0.48
6.00
6.40
4.40
9.35
0.086
0.035
0.001
0.025
0.204
0.017
0.018
0.236
0.251
0.173
0.368
B2
C
C2
D
E
G
H
L2
L4
V2
0.80 typ.
0.031 typ.
0.60
0°
1.00
8°
0.023
0°
0.039
8°
FOOT PRINT
(in millimeters)
6.7
6.7
3
3
1.6
1.6
2.3 2.3
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STPS5H100B/-1
PACKAGE MECHANICAL DATA
IPAK
DIMENSIONS
Millimeters Inches
Min. Typ. Max. Min. Typ. Max.
REF.
A
A1
A3
B
2.2
0.9
2.4 0.086
1.1 0.035
1.3 0.027
0.9 0.025
5.4 0.204
0.85
0.094
0.043
0.051
0.035
0.212
0.033
A
0.7
E
C2
0.64
5.2
B2
B2
B3
B5
B6
C
L2
0.3
0.035
D
0.95
0.037
0.023
0.023
0.244
0.260
0.181
0.641
0.370
0.047
0.45
0.48
6
0.6 0.017
0.6 0.019
6.2 0.236
6.6 0.252
4.6 0.173
16.3 0.626
9.4 0.354
1.2 0.031
1
C2
D
H
B3
L1
B6
L
A1
B
E
6.4
4.4
15.9
9
V1
G
H
B5
C
L
G
A3
L1
L2
V1
0.8
0.8
10°
0.031 0.039
10°
Ordering type
Marking
S5H100
S5H100
S5H100
Package
DPAK
DPAK
IPAK
Weight
0.30g
0.30g
0.35g
Base qty
75
Delivery mode
Tube
STPS5H100B
STPS5H100B-TR
STPS5H100B-1
2500
75
Tape & reel
Tube
Epoxy meets UL94,V0
Information furnished is believed to be accurate and reliable. However, STMicroelectronics assumes no responsibility for the consequences of
use of such information nor for any infringement of patents or other rights of third parties which may result from its use. No license is granted by
implication or otherwise under any patent or patent rights of STMicroelectronics. Specifications mentioned in this publication are subject to
change without notice. This publication supersedes and replaces all information previously supplied.
STMicroelectronics products are not authorized for use as critical components in life support devices or systems without express written ap-
proval of STMicroelectronics.
The ST logo is a registered trademark of STMicroelectronics
© 1999 STMicroelectronics - Printed in Italy - All rights reserved.
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