STTH110UFY [STMICROELECTRONICS]

Automotive 1000 V, 1 A Ultrafast Diode;
STTH110UFY
型号: STTH110UFY
厂家: ST    ST
描述:

Automotive 1000 V, 1 A Ultrafast Diode

高压
文件: 总6页 (文件大小:79K)
中文:  中文翻译
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STTH110  
High voltage ultrafast rectifier  
Features  
Low forward voltage drop  
High reliability  
High surge current capability  
Soft switching for reduced EMI disturbances  
Planar technology  
A
A
K
K
Description  
SMA  
DO-41  
STTH110  
(JEDEC DO-214AC)  
STTH110A  
The STTH110, which is using ST ultrafast high  
voltage planar technology, is specially suited for  
free-wheeling, clamping, snubbering,  
demagnetization in power supplies and other  
power switching applications.  
Table 1.  
Device summary  
Symbol  
Value  
IF(AV)  
VRRM  
1 A  
1000 V  
175 °C  
1.42 V  
Tj (max)  
VF(max)  
October 2009  
Doc ID 9344 Rev 2  
1/6  
www.st.com  
6
Characteristics  
STTH110  
1
Characteristics  
Table 2.  
Symbol  
Absolute ratings (limiting values)  
Parameter  
Value  
Unit  
VRRM Repetitive peak reverse voltage  
V(RMS) Voltage rms  
1000  
700  
1
V
V
SMA  
DO-41  
TL = 110 °C δ = 0.5  
TL = 125 °C δ = 0.5  
SMA  
IF(AV) Average forward current  
A
A
1
18  
20  
Forward Surge current  
t = 8.3 ms  
IFSM  
DO-41  
Tstg  
Tj  
Storage temperature range  
-50 to + 175  
175  
°C  
°C  
Maximum operating junction temperature  
Table 3.  
Symbol  
Thermal resistance  
Parameter  
Value  
Unit  
SMA  
30  
45  
Rth(j-l) Junction to lead  
Lead length = 10 mm  
Lead length = 10 mm  
DO-41  
DO-41  
°C/W  
Rth(j-a) Junction to ambient  
110  
Table 4.  
Symbol  
Static Electrical Characteristics  
Parameter  
Tests conditions  
Min.  
Typ.  
Max.  
Unit  
Tj = 25 °C  
Tj = 125 °C  
Tj = 25 °C  
10  
50  
Reverse leakage  
current  
IR  
VR = 1000 V  
IF = 1 A  
µA  
1.7  
1.42  
VF  
Forward voltage drop  
V
Tj = 125 °C  
0.98  
To evaluate the conduction losses use the following equation:  
2
P = 1.20 x IF(AV) + 0.225 IF (RMS)  
Table 5.  
Symbol  
Dynamic electrical characteristics  
Parameter  
Tests conditions  
Min.  
Typ.  
Max.  
Unit  
IF = 0.5, A  
Irr = 0.25 A,  
IR = 1 A  
Reverse  
recovery time  
trr  
Tj = 25 °C  
75  
ns  
Forward  
recovery time  
IF = 1 A,  
tfr  
300  
18  
ns  
V
dIF/dt = 50 A/ms  
VFR = 1.1 x  
VFmax  
Tj = 25 °C  
Forward  
recovery voltage  
VFP  
2/6  
Doc ID 9344 Rev 2  
STTH110  
Figure 1.  
Characteristics  
Conduction losses versus average Figure 2.  
current  
Forward voltage drop versus  
forward current  
I
(A)  
P(W)  
FM  
100.0  
10.0  
1.0  
1.8  
δ = 0.2  
δ = 0.1  
δ = 0.5  
1.6  
1.4  
1.2  
1.0  
0.8  
0.6  
0.4  
0.2  
0.0  
δ = 0.05  
Tj=150°C  
(maximum values)  
δ = 1  
Tj=150°C  
(typical values)  
Tj=25°C  
(maximum values)  
T
I
(A)  
F(AV)  
V
(V)  
FM  
tp  
1.1  
=tp/T  
1.0  
δ
0.1  
0.0  
0.1  
0.2  
0.3  
0.4  
0.5  
0.6  
0.7  
0.8  
0.9  
1.2  
0.0  
0.5  
1.0  
1.5  
2.0  
2.5  
3.0  
3.5  
4.0  
4.5  
Figure 3.  
Relative variation of thermal  
Figure 4.  
Relative variation of thermal  
impedance junction ambient versus  
pulse duration (DO-41)  
impedance junction ambient versus  
pulse duration (epoxy FR4) (SMA)  
Z
/R  
Z
/R  
th(j-c) th(j-c)  
th(j-c) th(j-c)  
1.0  
0.9  
0.8  
0.7  
0.6  
0.5  
0.4  
0.3  
0.2  
0.1  
0.0  
1.0  
0.9  
0.8  
0.7  
0.6  
0.5  
0.4  
0.3  
0.2  
0.1  
0.0  
epoxy FR4, leads = 10 mm  
δ = 0.5  
δ = 0.5  
δ = 0.2  
δ = 0.1  
δ = 0.2  
T
T
δ = 0.1  
Single pulse  
Single pulse  
t (s)  
p
t (s)  
p
tp  
1.E+03  
tp  
1.E+03  
=tp/T  
=tp/T  
δ
δ
1.E-01  
1.E+00  
1.E+01  
1.E+02  
1.E-01  
1.E+00  
1.E+01  
1.E+02  
Figure 5.  
Thermal resistance junction to  
Figure 6.  
Thermal resistance junction to  
ambient versus copper surface  
under each lead (DO-41)  
ambient versus copper surface  
under each lead (SMA).  
R
(°C/W)  
th(j-a)  
R
(°C/W)  
th(j-a)  
120  
110  
100  
90  
80  
70  
60  
50  
40  
30  
20  
10  
0
140  
130  
120  
110  
100  
90  
epoxy printed circuit board FR4, copper thickness: 35 µm  
epoxy printed circuit board FR4, copper thickness: 35 µm  
80  
70  
60  
50  
40  
30  
20  
10  
S(cm²)  
S(cm²)  
0
0
1
2
3
4
5
6
7
8
9
10  
0.0  
0.5  
1.0  
1.5  
2.0  
2.5  
3.0  
3.5  
4.0  
4.5  
5.0  
Doc ID 9344 Rev 2  
3/6  
Package information  
STTH110  
2
Package information  
Epoxy meets UL 94, V0  
Band indicates cathode  
Bending method (DO-41): see Application note AN1471  
In order to meet environmental requirements, ST offers these devices in different grades of  
®
®
ECOPACK packages, depending on their level of environmental compliance. ECOPACK  
specifications, grade definitions and product status are available at: www.st.com.  
®
ECOPACK is an ST trademark.  
Table 6.  
SMA dimensions  
Dimensions  
Millimeters  
Min. Max.  
Ref.  
Inches  
Min. Max.  
E1  
D
A1  
A2  
b
1.90  
0.05  
1.25  
0.15  
2.25  
4.80  
3.95  
0.75  
2.45  
0.20  
1.65  
0.40  
2.90  
5.35  
4.60  
1.50  
0.075  
0.002  
0.049  
0.006  
0.089  
0.189  
0.156  
0.030  
0.094  
0.008  
0.065  
0.016  
0.114  
0.211  
0.181  
0.059  
E
c
D
A1  
E
C
A2  
L
b
E1  
L
Figure 7.  
Footprint (dimensions in mm)  
2.63  
1.4  
1.4  
1.64  
5.43  
Table 7.  
DO-41 (plastic) package dimensions  
Ref.  
Dimensions  
Millimeters  
Inches  
Min.  
Max.  
Min.  
Max.  
ØD  
ØB  
A
B
C
4.07  
2.04  
25.4  
5.20  
2.71  
0.160  
0.080  
1
0.205  
0.107  
C
A
C
D
0.71  
0.86  
0.028  
0.034  
4/6  
Doc ID 9344 Rev 2  
STTH110  
Ordering information  
3
Ordering information  
Table 8.  
Order code  
STTH110  
Ordering information  
Marking  
Package  
Weight  
Base qty Delivery mode  
STTH110  
H10  
DO-41  
SMA  
0.34 g  
0.068 g  
0.34 g  
2000  
5000  
5000  
Ammopack  
Tape and reel  
Tape and reel  
STTH110A  
STTH110RL  
STTH110  
DO-41  
4
Revision history  
Table 9.  
Date  
Document revision history  
Revision  
Changes  
Jan-2003  
1
2
Last update.  
Updated table 7 package dimensions.  
30-Sept-2009  
Doc ID 9344 Rev 2  
5/6  
STTH110  
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6/6  
Doc ID 9344 Rev 2  

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