MA4AGP907_2 [TE]
AlGaAs Flip Chip PIN Diodes; AlGaAs构成倒装芯片PIN二极管
| 型号： | MA4AGP907_2 |
| 厂家： | 
TE CONNECTIVITY |
| 描述： | AlGaAs Flip Chip PIN Diodes |
| 文件： | 总6页 (文件大小：123K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
MA4AGP907
MA4AGFCP910
AlGaAs Flip Chip PIN Diodes
V4
Features
Chip Dimensions
MA4AGP907 and MA4AGFCP910
♦
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♦
♦
♦
♦
♦
♦
Low Series Resistance
Ultra Low Capacitance
Millimeter Wave Switching & Cutoff Frequency
2 Nanosecond Switching Speed
Can be Driven by a Buffered TTL
Silicon Nitride Passivation
Polyimide Scratch Protection
RoHS Compliant
Description
M/A-COM Technology Solutions MA4AGP907 and
MA4AGFCP910 are Aluminum Gallium Arsenide
(AlGaAs) flip-chip PIN diodes. These devices are
fabricated on OMCVD epitaxial wafers using a process
optimized for high device uniformity and exceptionally
low parasitics. The end result is a diode with an
extremely low RC product, (0.1ps) and 2-3nS
switching characteristics. They are fully passivated
with silicon nitride and have an added polymer layer
for scratch protection. The protective coating prevents
damage to the junction and the anode air-bridge
during handling and assembly.
Notes:
1. Gold Pads 14µM thick.
Applications
The ultra low capacitance of the MA4AGP907 and
MA4AGFCP910 make them ideal for RF switch and
phase shifter applications through millimeter wave
frequencies. The diodes are designed for use in
pulsed or CW applications, where single digit nS
switching speed is required. The low capacitance of
these diodes make them ideal for use in microwave
multi-throw switch assemblies, where the series
capacitance of each “off” port adversely loads the input
and affects VSWR.
2. Yellow areas indicate ohmic gold mounting pads.
3. Dimensions A thru F are identical for both devices
INCHES
MM
DIM
MIN.
MAX.
MIN.
MAX.
A
0.0260
0.0270
0.6604
0.6858
B
C
D
0.0135
0.0065
0.0043
0.0145
0.0075
0.0053
0.3429
0.1651
0.1092
0.3683
0.1905
0.1346
E
F
0.0068
0.0182
0.0073
0.0192
0.1727
0.4623
0.1854
0.4877
Absolute Maximum Ratings TAMB = +25°C
(unless otherwise specified)
Parameter
Absolute Maximum
MA4AGP907 -50V
MA4AGFCP910 -75V
Reverse Voltage
Operating Temperature
Storage Temperature
Junction Temperature
Dissipated Power (RF & DC )
C.W. Incident Power
-55°C to +125°C
-55°C to +150°C
+175°C
50mW
+23 dBm
Mounting Temperature
+280°C for 10 seconds
1
ADVANCED: Data Sheets contain information regarding a product M/A-COM is considering for
development. Performance is based on target specifications, simulated results, and/or prototype
measurements. Commitment to develop is not guaranteed.
PRELIMINARY: Data Sheets contain information regarding a product M/A-COM has under
development. Performance is based on engineering tests. Specifications are typical. Mechanical
outline has been fixed. Engineering samples and/or test data may be available. Commitment to
produce in volume is not guaranteed.
• North America Tel: 800.366.2266 / Fax: 978.366.2266
• Europe Tel: 44.1908.574.200 / Fax: 44.1908.574.300
• Asia/Pacific Tel: 81.44.844.8296 / Fax: 81.44.844.8298
Visit www.macom.com for additional data sheets and product information.
M/A-COM Inc. and its affiliates reserve the right to make changes to the product(s) or
information contained herein without notice.
MA4AGP907
MA4AGFCP910
AlGaAs Flip Chip PIN Diodes
V4
Electrical Specifications @ TAMB = +25°C
MA4AGP907 MA4AGFCP910
Parameter
Symbol
Conditions
Units
Typ.
Max.
Typ.
Max.
MA4AGP907 -5V,1MHz
Total Capacitance
CT
pF
0.025 0.030 0.018 0.021
0.020 —— 0.018 0.021
MA4AGFCP910 -10V,1MHz
Total Capacitance 1
Series Resistance
Series Resistance 2
CT
RS
RS
-5V, 10GHz
+10mA, 1MHz
+10mA, 10GHz
pF
Ω
5.2
4.2
7.0
——
5.2
——
6.0
Ω
——
Forward Voltage
VF
+10mA
V
1.33
——
1.45
10
1.33
——
1.45
10
MA4AGP907 V = -50V
R
Reverse Leakage Current 3
μA
IR
MA4AGFCP910 V = -75V
R
TRISE
TFALL
Switching Speed 4
Carrier Lifetime
10GHz
nS
nS
2
——
——
2
4
——
——
TL
IF = 10mA / IREV = 6mA
——
Notes:
1) Capacitance is determined by measuring the isolation of a single series diode in a 50Ω transmission
line at 10GHz.
2) Series resistance is determined by measuring the insertion loss of a single series diode in a 50Ω
transmission line at 10GHz.
3) The max rated VR( Reverse Voltage ) is sourced and the resultant reverse leakage current, Ir, is
measured to be <10μA
4) Switching speed is measured between 10% and 90% or 90% to 10% RF voltage for a single series
mounted diode. Driver delay is not included.
2
ADVANCED: Data Sheets contain information regarding a product M/A-COM is considering for
• North America Tel: 800.366.2266 / Fax: 978.366.2266
development. Performance is based on target specifications, simulated results, and/or prototype
measurements. Commitment to develop is not guaranteed.
PRELIMINARY: Data Sheets contain information regarding a product M/A-COM has under
development. Performance is based on engineering tests. Specifications are typical. Mechanical
• Europe Tel: 44.1908.574.200 / Fax: 44.1908.574.300
• Asia/Pacific Tel: 81.44.844.8296 / Fax: 81.44.844.8298
Visit www.macom.com for additional data sheets and product information.
outline has been fixed. Engineering samples and/or test data may be available. Commitment to
produce in volume is not guaranteed.
M/A-COM Inc. and its affiliates reserve the right to make changes to the product(s) or
information contained herein without notice.
MA4AGP907
MA4AGFCP910
AlGaAs Flip Chip PIN Diodes
V4
Typical RF Performance @ TAMB = +25°C
MA4AGP907
Typical Insertion Loss vs. Frequency
Frequency (GHz)
MA4AGFCP910
Typical Insertion Loss vs. Frequency
0.0
-0.2
.4
-0.6
-0.8
5mA
10mA
15mA
15 mA
10 mA
5 mA
2
10
18
26
34
42
50
Fr
e
q
u
e
n
c
y
(GHz)
3
ADVANCED: Data Sheets contain information regarding a product M/A-COM is considering for
development. Performance is based on target specifications, simulated results, and/or prototype
measurements. Commitment to develop is not guaranteed.
PRELIMINARY: Data Sheets contain information regarding a product M/A-COM has under
development. Performance is based on engineering tests. Specifications are typical. Mechanical
outline has been fixed. Engineering samples and/or test data may be available. Commitment to
produce in volume is not guaranteed.
• North America Tel: 800.366.2266 / Fax: 978.366.2266
• Europe Tel: 44.1908.574.200 / Fax: 44.1908.574.300
• Asia/Pacific Tel: 81.44.844.8296 / Fax: 81.44.844.8298
Visit www.macom.com for additional data sheets and product information.
M/A-COM Inc. and its affiliates reserve the right to make changes to the product(s) or
information contained herein without notice.
MA4AGP907
MA4AGFCP910
AlGaAs Flip Chip PIN Diodes
V4
Typical RF Performance @ TAMB = +25°C
MA4AGP907
Typical return Loss vs. Frequency ( Either Port )
R. Loss @5mA
R. Loss @15mA
R. Loss @50mA
-20.0
-22.0
-24.0
-26.0
-28.0
-30.0
-32.0
-34.0
-36.0
-38.0
-40.0
Frequency (GHz)
MA4AGFCP910
Typical Return Loss vs. Frequency ( Either Port Direction )
0
5mA
10mA
15mA
-5
-10
-15
-20
-25
-30
-35
15 mA
10 mA
5 mA
2
10
18
26
34
42
50
Frequency (GHz)
4
ADVANCED: Data Sheets contain information regarding a product M/A-COM is considering for
development. Performance is based on target specifications, simulated results, and/or prototype
measurements. Commitment to develop is not guaranteed.
PRELIMINARY: Data Sheets contain information regarding a product M/A-COM has under
development. Performance is based on engineering tests. Specifications are typical. Mechanical
outline has been fixed. Engineering samples and/or test data may be available. Commitment to
produce in volume is not guaranteed.
• North America Tel: 800.366.2266 / Fax: 978.366.2266
• Europe Tel: 44.1908.574.200 / Fax: 44.1908.574.300
• Asia/Pacific Tel: 81.44.844.8296 / Fax: 81.44.844.8298
Frequency (Hz)
Visit www.macom.com for additional data sheets and product information.
M/A-COM Inc. and its affiliates reserve the right to make changes to the product(s) or
information contained herein without notice.
MA4AGP907
MA4AGFCP910
AlGaAs Flip Chip PIN Diodes
V4
Typical RF Performance @ TAMB = +25°C
MA4AGP907
Typical Isolation vs. Frequency
Isolation @ -10V
Isolation @ 0V
Isolation @ -1V
-5.0
-10.0
-15.0
-20.0
-25.0
-30.0
-35.0
Frequency (GHz)
MA4AGFCP910
Typical Isolation vs Frequency
0
-5
10
15
20
25
-30
-35
0V
5V
2
10
18
26
Frequency (GHz)
34
42
50
5
ADVANCED: Data Sheets contain information regarding a product M/A-COM is considering for
development. Performance is based on target specifications, simulated results, and/or prototype
measurements. Commitment to develop is not guaranteed.
PRELIMINARY: Data Sheets contain information regarding a product M/A-COM has under
development. Performance is based on engineering tests. Specifications are typical. Mechanical
outline has been fixed. Engineering samples and/or test data may be available. Commitment to
produce in volume is not guaranteed.
• North America Tel: 800.366.2266 / Fax: 978.366.2266
• Europe Tel: 44.1908.574.200 / Fax: 44.1908.574.300
• Asia/Pacific Tel: 81.44.844.8296 / Fax: 81.44.844.8298
Visit www.macom.com for additional data sheets and product information.
M/A-COM Inc. and its affiliates reserve the right to make changes to the product(s) or
information contained herein without notice.
MA4AGP907
MA4AGFCP910
AlGaAs Flip Chip PIN Diodes
V4
Device Installation Guidelines
Cleanliness
These devices should be handled in a clean environment. The chips are resistant to solvents and may
cleaned using approved industry standard practices.
Static Sensitivity
Aluminum Gallium Arsenide PIN diodes are ESD sensitive and can be damaged by static electricity. Proper
ESD techniques should be used when handling these devices. These devices are rated Class 0, ( 0-199V )
per HBM MIL-STD-883, method 3015.7 [C = 100pF ±10%, R = 1.5kW ±1%]. Even though tested die pass
50V ESD, they must be handled in a static-free environment.
General Handling
The devices have a polymer layer which provides scratch protection for the junction area and the anode air
bridge. Die can be handled with plastic tweezers or picked and placed with a #27 tip vacuum pencil.
Assembly Requirements using Electrically Conductive Silver Epoxy and Solder
These chips are designed to be inserted onto hard or soft substrates with the junction side down. They should be
mounted onto silk-screened circuits using electrically conductive silver epoxy, approximately 1-2 mils in thickness
and cured at approximately 90°C to 150°C per manufacturer’s schedule. For extended cure times, > 30 minutes,
temperatures must be below 200°C.
Eutectic Die Attached
Tin rich solders ( >30% Sn by weight ) are not recommended as they will scavenge the gold on the contact
Pads exposing the tungsten metallization beneath and creating a poor solder connection. Indalloy or 80/20,
Au/Sn type solders are acceptable. Maximum soldering temperature must be kept below 280°C for less
than 10 seconds.
Note:
The MA4AGSBP907 which is a solder bumped version of the MA4AGP907, is also available. The datasheet
can be viewed on the M/A-COM website at: http://www.macom.com/DataSheets/MA4AGSBP907.pdf
Circuit Pad Layout
Ordering Information
0.013”
Part Number
MA4AGP907
MADP-001907-13050P Pocket Tape
Packaging
Gel Pack
0.012”
(2) PL
Part Number
Packaging
Gel Pack
0.008”
MA4AGFCP910
(2) PL
MADP-000910-13050P Pocket Tape
6
ADVANCED: Data Sheets contain information regarding a product M/A-COM is considering for
development. Performance is based on target specifications, simulated results, and/or prototype
measurements. Commitment to develop is not guaranteed.
PRELIMINARY: Data Sheets contain information regarding a product M/A-COM has under
development. Performance is based on engineering tests. Specifications are typical. Mechanical
outline has been fixed. Engineering samples and/or test data may be available. Commitment to
produce in volume is not guaranteed.
• North America Tel: 800.366.2266 / Fax: 978.366.2266
• Europe Tel: 44.1908.574.200 / Fax: 44.1908.574.300
• Asia/Pacific Tel: 81.44.844.8296 / Fax: 81.44.844.8298
Visit www.macom.com for additional data sheets and product information.
M/A-COM Inc. and its affiliates reserve the right to make changes to the product(s) or
information contained herein without notice.
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