MAAM37000_V7 [TE]
Low Noise GaAs MMIC Amplifier; 低噪声砷化镓MMIC放大器器
| 型号： | MAAM37000_V7 |
| 厂家： | 
TE CONNECTIVITY |
| 描述： | Low Noise GaAs MMIC Amplifier |
| 文件： | 总4页 (文件大小：243K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
MAAM37000
Low Noise GaAs MMIC Amplifier
3.5 - 7.0 GHz
Rev. V7
Features
Die
•
•
•
•
Noise Figure: 1.8 dB Typical
Gain: 17 dB Typical
Single Bias Supply
DC Decoupled RF Input and Output
Description
The MAAM37000 die is a wide-band, low noise,
MMIC amplifier. It includes two integrated gain
stages and employs series inductive feedback to
obtain excellent noise figure and a good 50 Ω, input
and output impedance match over the entire
frequency band. The MAAM37000 operates from a
single +4 V supply.
The MAAM37000 performs well as a low noise
amplifier in receive applications and as a driver or
buffer amplifier where high gain, excellent linearity
and low power consumption are important. Because
of its wide bandwidth, the MAAM37000 can be used
in numerous commercial and government system
applications, such as TVRO, VSAT, missile
Schematic
guidance, and radar.
The MAAM37000 is
manufactured in-house using a reliable, 0.5-micron,
GaAs MESFET process. This product is 100% RF
tested to ensure compliance to performance
specifications.
Ordering Information
Part Number
Package
Absolute Maximum Ratings 1
MAAM37000
DIE
Parameter
Voltage
Absolute Maximum
+7 V
Input Power
+20 dBm
Operating Temperature
Storage Temperature
-55°C to +125°C
-65°C to +150°C
1. Exceeding any one or combination of these limits may cause
permanent damage to this device.
1
ADVANCED: Data Sheets contain information regarding a product M/A-COM Technology Solutions
is considering for development. Performance is based on target specifications, simulated results,
and/or prototype measurements. Commitment to develop is not guaranteed.
PRELIMINARY: Data Sheets contain information regarding a product M/A-COM Technology
Solutions has under development. Performance is based on engineering tests. Specifications are
typical. Mechanical outline has been fixed. Engineering samples and/or test data may be available.
Commitment to produce in volume is not guaranteed.
• North America Tel: 800.366.2266 • Europe Tel: +353.21.244.6400
• India Tel: +91.80.43537383
• China Tel: +86.21.2407.1588
Visit www.macomtech.com for additional data sheets and product information.
M/A-COM Technology Solutions Inc. and its affiliates reserve the right to make
changes to the product(s) or information contained herein without notice.
MAAM37000
Low Noise GaAs MMIC Amplifier
3.5 - 7.0 GHz
Rev. V7
Electrical Specifications: TA = 25°C, Z0 = 50 Ω, VDD = +4 VDC, IDD = 75 mA Typ, 100 mA
Parameter
Gain 2
Units
Min
Typ.
17.0
± 0.8
1.8
Max
dB
15.0
—
Gain Flatness
Noise Figure 2
dB
dB
—
2.8
Input VSWR
Output VSWR
Ratio
Ratio
—
—
1.5:1
1.5:1
—
—
Output Power at 1 dB Gain Compression
Third Order Intercept
Reverse Isolation
dBm
dBm
dB
—
—
—
—
14
24
35
85
—
—
—
—
Rth
°C/W
2. 100% on-wafer tested.
Typical Performance Curves
Gain
Noise Figure
20
6
+25 C
5
4
3
2
1
0
-55 C
+85 C
18
16
14
+25 C
-55 C
+85 C
12
10
2
3
4
5
6
7
8
2
3
4
5
6
7
8
Frequency (GHz)
Frequency (GHz)
VSWR
6
5
4
3
2
1
0
INPUT
OUTPUT
2
3
4
5
6
7
8
Frequency (GHz)
2
ADVANCED: Data Sheets contain information regarding a product M/A-COM Technology Solutions
is considering for development. Performance is based on target specifications, simulated results,
and/or prototype measurements. Commitment to develop is not guaranteed.
PRELIMINARY: Data Sheets contain information regarding a product M/A-COM Technology
Solutions has under development. Performance is based on engineering tests. Specifications are
typical. Mechanical outline has been fixed. Engineering samples and/or test data may be available.
Commitment to produce in volume is not guaranteed.
• North America Tel: 800.366.2266 • Europe Tel: +353.21.244.6400
• India Tel: +91.80.43537383 • China Tel: +86.21.2407.1588
Visit www.macomtech.com for additional data sheets and product information.
M/A-COM Technology Solutions Inc. and its affiliates reserve the right to make
changes to the product(s) or information contained herein without notice.
MAAM37000
Low Noise GaAs MMIC Amplifier
3.5 - 7.0 GHz
Rev. V7
Typical Bias Configuration 3,4,5
Outline Drawing
3. Nominal bias is obtained with on-chip resistors by grounding
pads S1b and S2b.
4. Ground pads S1b and S2c for lower second state current.
5. Optional biasing can be obtained with off-chip resistors bonded
from pads S1a and S2a to ground. Adjusting the bias can
customize the performance to suit special requirements.
3
ADVANCED: Data Sheets contain information regarding a product M/A-COM Technology Solutions
is considering for development. Performance is based on target specifications, simulated results,
and/or prototype measurements. Commitment to develop is not guaranteed.
PRELIMINARY: Data Sheets contain information regarding a product M/A-COM Technology
Solutions has under development. Performance is based on engineering tests. Specifications are
typical. Mechanical outline has been fixed. Engineering samples and/or test data may be available.
Commitment to produce in volume is not guaranteed.
• North America Tel: 800.366.2266 • Europe Tel: +353.21.244.6400
• India Tel: +91.80.43537383 • China Tel: +86.21.2407.1588
Visit www.macomtech.com for additional data sheets and product information.
M/A-COM Technology Solutions Inc. and its affiliates reserve the right to make
changes to the product(s) or information contained herein without notice.
MAAM37000
Low Noise GaAs MMIC Amplifier
3.5 - 7.0 GHz
Rev. V7
Handling Procedures
Bonding
Permanent damage to the MAAM37000 may occur
if the following precautions are not adhered to:
A. Ball or wedge bond with 1.0 mil diameter gold
wire of 3.0 mil x 0.5 mil ribbon. Thermosonic
bonding with a nominal stage temperature of
150°C and a ball bonding force of 40 to 50
grams or wedge bonding force of 18 to 22
grams is recommended. Ultrasonic energy and
time should be adjusted to the minimum levels
necessary to achieve reliable bonds.
A. Cleanliness - The MAAM37000 should be han-
dled in a clean environment. DO NOT attempt
to clean assembly after the MAAM37000 is
installed.
B. Static Sensitivity - All die handling equipment
and personnel should comply with DOD-STD-
1686 Class I.
B. Bonds should be started on the die and termi-
nated on the package.
C. Transients - Avoid instrument and power sup-
ply transients while bias is connected to the
MAAM37000. Use shielded signal and bias
cables to minimize inductive pick-up.
C. Bonding pads are 4.0 x 4.0 mils minimum.
D. General Handling - DO NOT touch the surface
of the die.
It is recommended that the
MAAM37000 die be handled along the long
side with a sharp pair of tweezers.
Mounting
The MAAM37000 is back-metallized with Pd/Ni/Au
(100/1, 000/30,000Å) metallization. It can be die-
mounted using Au/Sn eutectic preforms or a ther-
mally and electrically conductive epoxy. The at-
tachment surface should be clean and flat.
Eutectic Die Attach:
A. An 80/20 Au/Sn preform is recommended with
a work surface temperature of approximately
255°C and a tool temperature of 265°C. When
hot 95/5 nitrogen/hydrogen gas is applied, sol-
der temperature should be approximately 290°
C.
B. DO NOT expose the MAAM37000 to a tem-
perature greater than 320°C for more than 20
seconds. No more than 3 seconds of scrub-
bing should be required for attachment.
Epoxy Die Attach:
A. Electrically conductive epoxy is required.
B. Apply a minimum amount of epoxy and place
the MAAM37000 into position. A thin epoxy
fillet should be visible around the perimeter of
the die.
C. Cure epoxy per manufacturer’s recommended
schedule.
4
ADVANCED: Data Sheets contain information regarding a product M/A-COM Technology Solutions
is considering for development. Performance is based on target specifications, simulated results,
and/or prototype measurements. Commitment to develop is not guaranteed.
PRELIMINARY: Data Sheets contain information regarding a product M/A-COM Technology
Solutions has under development. Performance is based on engineering tests. Specifications are
typical. Mechanical outline has been fixed. Engineering samples and/or test data may be available.
Commitment to produce in volume is not guaranteed.
• North America Tel: 800.366.2266 • Europe Tel: +353.21.244.6400
• India Tel: +91.80.43537383
• China Tel: +86.21.2407.1588
Visit www.macomtech.com for additional data sheets and product information.
M/A-COM Technology Solutions Inc. and its affiliates reserve the right to make
changes to the product(s) or information contained herein without notice.
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