MASW-002102-13580 [TE]

HMIC™ Silicon PIN Diode Switches with Integrated Bias Network; HMIC ?硅PIN二极管开关,带有偏置网络
MASW-002102-13580
型号: MASW-002102-13580
厂家: TE CONNECTIVITY    TE CONNECTIVITY
描述:

HMIC™ Silicon PIN Diode Switches with Integrated Bias Network
HMIC ?硅PIN二极管开关,带有偏置网络

二极管 开关
文件: 总7页 (文件大小:146K)
中文:  中文翻译
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MASW-002102-13580  
MASW-003102-13590  
HMIC™ Silicon PIN Diode Switches  
with Integrated Bias Network  
RoHS Compliant  
M/A-COM Products  
Rev. V3  
Features  
MASW-002102-13580  
 Broad Bandwidth Specified up to 18 GHz  
 Usable up to 26 GHz  
 Integrated Bias Network  
 Low Insertion Loss / High Isolation  
 Rugged,  
 Fully Monolithic  
 Glass Encapsulate Construction  
Description  
The MASW-002102-13580 and MASW-003102-13590  
devices are SP2T and SP3T broad band switches with  
integrated bias networks utilizing M/A-COM's HMICTM  
(Heterolithic Microwave Integrated Circuit) process,  
US Patent 5,268,310. This process allows the  
incorporation of silicon pedestals that form series and  
shunt diodes or vias by imbedding them in low loss, low  
dispersion glass. By using small spacing between  
elements, this combination of silicon and glass gives  
HMIC devices low loss and high isolation performance  
with exceptional repeatability through low millimeter  
frequencies. Large bond pads facilitate the use of low  
inductance ribbon bonds, while gold backside  
metallization allows for manual or automatic chip  
bonding via 80/20 - Au/Sn, 62/36/2 - Sn/Pb/Ag solders  
or electrically conductive silver epoxy.  
MASW-003102-13590  
Parameter  
Absolute Maximum  
-65oC to +125oC  
-65oC to +150oC  
+175oC  
Operating Temperature  
Storage Temperature  
Junction Temperature  
Applied Reverse Voltage  
50V  
RF Incident Power  
Bias Current +25°C  
+33dBm C.W.  
±20mA  
Max. operating conditions for a combination  
of RF power, D.C. bias and temperature:  
+33dBm CW @ 15mA (per diode) @+85°C  
Yellow areas denote wire bond pads  
1
ADVANCED: Data Sheets contain information regarding a product MA-COM Technical Solutions is  
considering for development. Performance is based on target specifications, simulated results, and/  
or prototype measurements. Commitment to develop is not guaranteed.  
PRELIMINARY: Data Sheets contain information regarding a product MA-COM Technical Solutions  
has under development. Performance is based on engineering tests. Specifications are typical.  
Mechanical outline has been fixed. Engineering samples and/or test data may be available. Commit-  
ment to produce in volume is not guaranteed.  
North America Tel: 800.366.2266 / Fax: 978.366.2266  
Europe Tel: 44.1908.574.200 / Fax: 44.1908.574.300  
Asia/Pacific Tel: 81.44.844.8296 / Fax: 81.44.844.8298  
Visit www.macom.com for additional data sheets and product information.  
MA-COM Technical Solutions and its affiliates reserve the right to make changes to the  
product(s) or information contained herein without notice.  
MASW-002102-13580  
MASW-003102-13590  
HMIC™ Silicon PIN Diode Switches  
with Integrated Bias Network  
RoHS Compliant  
M/A-COM Products  
Rev. V3  
MASW-002102-13580 (SPDT)  
Electrical Specifications @ TAMB = +25oC, 20mA Bias current  
Parameter  
Frequency  
Minimum  
Nominal  
Maximum  
Units  
2 GHz  
6 GHz  
12 GHz  
18 GHz  
2 GHz  
6 GHz  
12 GHz  
18 GHz  
2 GHz  
6 GHz  
1.5  
0.70  
0.90  
1.2  
60  
1.8  
1.0  
1.2  
1.8  
dB  
dB  
dB  
dB  
dB  
dB  
dB  
dB  
dB  
dB  
Insertion Loss  
55  
47  
40  
36  
50  
Isolation  
45  
40  
14  
15  
Input Return  
Loss  
12 GHz  
18 GHz  
-
15  
13.0  
50  
dB  
dB  
ns  
Switching Speed1  
MASW-003102-13590 (SP3T)  
Electrical Specifications @ TAMB = +25oC, 20mA Bias current  
Parameter  
Frequency  
Minimum  
Nominal  
Maximum  
Units  
2 GHz  
6 GHz  
12 GHz  
18 GHz  
2 GHz  
6 GHz  
12 GHz  
18 GHz  
2 GHz  
6 GHz  
12 GHz  
18 GHz  
-
1.6  
0.8  
1.0  
1.3  
59  
50  
45  
40  
14  
15  
16  
14  
50  
2.0  
1.1  
1.3  
1.9  
dB  
dB  
dB  
dB  
dB  
dB  
dB  
dB  
dB  
dB  
dB  
dB  
ns  
Insertion Loss  
54  
47  
40  
36  
Isolation  
Input Return Loss  
Switching Speed1  
Note:  
1. Typical switching speed measured from 10% to 90% of detected RF signal driven by TTL compatible drivers using RC  
output spiking network, R = 50 – 200, C = 390 – 560pF.  
2
ADVANCED: Data Sheets contain information regarding a product MA-COM Technical Solutions is  
North America Tel: 800.366.2266 / Fax: 978.366.2266  
considering for development. Performance is based on target specifications, simulated results, and/  
or prototype measurements. Commitment to develop is not guaranteed.  
PRELIMINARY: Data Sheets contain information regarding a product MA-COM Technical Solutions  
has under development. Performance is based on engineering tests. Specifications are typical.  
Europe Tel: 44.1908.574.200 / Fax: 44.1908.574.300  
Asia/Pacific Tel: 81.44.844.8296 / Fax: 81.44.844.8298  
Visit www.macom.com for additional data sheets and product information.  
Mechanical outline has been fixed. Engineering samples and/or test data may be available. Commit-  
ment to produce in volume is not guaranteed.  
MA-COM Technical Solutions and its affiliates reserve the right to make changes to the  
product(s) or information contained herein without notice.  
MASW-002102-13580  
MASW-003102-13590  
HMIC™ Silicon PIN Diode Switches  
with Integrated Bias Network  
RoHS Compliant  
M/A-COM Products  
Rev. V3  
Typical RF Performance at TA = +25°C, 20mA Bias Current  
ISOLATION vs FREQUENCY  
MASW-002102-13580  
ISOLATION vs FREQUENCY  
MASW -003102-13590  
0
-10  
-20  
-30  
-40  
-50  
-60  
-70  
0
-10  
-20  
-30  
-40  
-50  
-60  
-70  
0
2
4
6
8
10 12 14 16 18 20 22 24 26  
0
2
4
6
8
10 12 14 16 18 20 22 24 26  
FREQUENCY, GHz  
FREQUENCY, GHz  
INSERTION LOSS vs FREQUENCY  
MASW-002102-13580  
INSERTION LOSS vs FREQUENCY  
MASW-003102-13590  
2
0
2
0
-2  
-4  
-6  
-8  
-2  
-4  
-6  
-8  
0
2
4
6
8 10 12 14 16 18 20 22 24 26  
0
2
4
6
8 10 12 14 16 18 20 22 24 26  
FREQUENCY, GHz  
FREQUENCY, GHz  
RETURN LOSS vs FREQUENCY  
MASW-003102-13590  
0
-5  
-10  
-15  
-20  
-25  
-30  
-35  
-40  
0
2
4
6
8 10 12 14 16 18 20 22 24 26  
FREQUENCY, GHz  
3
ADVANCED: Data Sheets contain information regarding a product MA-COM Technical Solutions is  
considering for development. Performance is based on target specifications, simulated results, and/  
or prototype measurements. Commitment to develop is not guaranteed.  
PRELIMINARY: Data Sheets contain information regarding a product MA-COM Technical Solutions  
has under development. Performance is based on engineering tests. Specifications are typical.  
Mechanical outline has been fixed. Engineering samples and/or test data may be available. Commit-  
ment to produce in volume is not guaranteed.  
North America Tel: 800.366.2266 / Fax: 978.366.2266  
Europe Tel: 44.1908.574.200 / Fax: 44.1908.574.300  
Asia/Pacific Tel: 81.44.844.8296 / Fax: 81.44.844.8298  
Visit www.macom.com for additional data sheets and product information.  
MA-COM Technical Solutions and its affiliates reserve the right to make changes to the  
product(s) or information contained herein without notice.  
MASW-002102-13580  
MASW-003102-13590  
HMIC™ Silicon PIN Diode Switches  
with Integrated Bias Network  
RoHS Compliant  
M/A-COM Products  
Rev. V3  
MASW-002102-13580 Junction Temperature vs. Incident Power at 8 GHz  
140  
120  
100  
80  
5 mA  
Series Diode_5mA  
Series Diode_10mA  
Series Diode_20mA  
Series Diode_40mA  
10 mA  
20  
60  
40 mA  
40  
20  
10.00  
15.00  
20.00  
25.00  
30.00  
35.00  
C.W. Incident Power ( dBm )  
MASW-002102-13580 Compression Power vs. Incident Power at 8 GHz  
0.80  
0.70  
0.60  
0.50  
0.40  
0.30  
0.20  
0.10  
Series Diode_5mA  
Series Diode_10mA  
Series Diode_20mA  
Series Diode_40mA  
5 mA  
10 mA  
2 0 mA  
4 0 mA  
0.00  
10.00  
15.00  
20.00  
25.00  
30.00  
35.00  
C.W. Incident Power ( dBm )  
Note:  
The PIN diodes in the MASW-002102-13580 and the MASW-003102-13590 have the same electrical  
characteristics and will have similar performance.  
4
ADVANCED: Data Sheets contain information regarding a product MA-COM Technical Solutions is  
considering for development. Performance is based on target specifications, simulated results, and/  
or prototype measurements. Commitment to develop is not guaranteed.  
PRELIMINARY: Data Sheets contain information regarding a product MA-COM Technical Solutions  
has under development. Performance is based on engineering tests. Specifications are typical.  
Mechanical outline has been fixed. Engineering samples and/or test data may be available. Commit-  
ment to produce in volume is not guaranteed.  
North America Tel: 800.366.2266 / Fax: 978.366.2266  
Europe Tel: 44.1908.574.200 / Fax: 44.1908.574.300  
Asia/Pacific Tel: 81.44.844.8296 / Fax: 81.44.844.8298  
Visit www.macom.com for additional data sheets and product information.  
MA-COM Technical Solutions and its affiliates reserve the right to make changes to the  
product(s) or information contained herein without notice.  
MASW-002102-13580  
MASW-003102-13590  
HMIC™ Silicon PIN Diode Switches  
with Integrated Bias Network  
RoHS Compliant  
M/A-COM Products  
Rev. V3  
Operation of the MASW-002102-13580 and MASW-003102-13590  
Operation of the MASW-002102-13580 and MASW-003102-13590 PIN diode switches is achieved by  
simultaneous application of DC currents to the bias pads. The required levels for the different states are  
shown in the tables below. The on-chip pull-up resistor @ J1, shown in the schematic below, has a value  
of 40- 60and must be taken into consideration when defining drive circuitry.  
Driver Connections MASW-002102-13580  
Driver Connections MASW-003102-13590  
Condition Condition Condition  
Control Level  
Condition  
of  
Condition  
of  
Control Level  
IDC  
of  
of  
of  
IDC  
@
@
RF Output RF Output RF Output  
RF Output  
RF Output  
J5  
J6  
J7  
J1 - J2  
J1 - J3  
J1 - J4  
J4  
J5  
J1 - J2  
Low Loss  
Isolation  
J1 - J3  
Isolation  
Low Loss  
-20mA +20mA +20mA Low Loss Isolation  
Isolation  
-20mA  
+20mA  
+20mA  
-20mA  
+20 mA -20mA +20mA Isolation Low Loss Isolation  
+20mA +20mA -20mA Isolation Isolation Low Loss  
Equivalent Circuit MASW-003102-13590  
Equivalent Circuit MASW-002102-13580  
5
ADVANCED: Data Sheets contain information regarding a product MA-COM Technical Solutions is  
considering for development. Performance is based on target specifications, simulated results, and/  
or prototype measurements. Commitment to develop is not guaranteed.  
PRELIMINARY: Data Sheets contain information regarding a product MA-COM Technical Solutions  
has under development. Performance is based on engineering tests. Specifications are typical.  
Mechanical outline has been fixed. Engineering samples and/or test data may be available. Commit-  
ment to produce in volume is not guaranteed.  
North America Tel: 800.366.2266 / Fax: 978.366.2266  
Europe Tel: 44.1908.574.200 / Fax: 44.1908.574.300  
Asia/Pacific Tel: 81.44.844.8296 / Fax: 81.44.844.8298  
Visit www.macom.com for additional data sheets and product information.  
MA-COM Technical Solutions and its affiliates reserve the right to make changes to the  
product(s) or information contained herein without notice.  
MASW-002102-13580  
MASW-003102-13590  
HMIC™ Silicon PIN Diode Switches  
with Integrated Bias Network  
RoHS Compliant  
M/A-COM Products  
Rev. V3  
Wire/Ribbon and Die Attachment Recommendations  
Wire Bonding  
Thermosonic wedge wire bonding using 0.00025” x 0.003” ribbon or 0.001” diameter gold wire is  
recommended. A heat stage temperature of 150oC and a force of 18 to 22 grams should be used. Ultrasonic  
energy should be adjusted to the minimum required to achieve a good bond. RF bond wires should be kept as  
short and straight as possible.  
Mounting  
The HMIC switches have Ti-Pt-Au back metal. They can be die mounted with a gold-tin eutectic solder  
preform or conductive epoxy. Mounting surface must be clean and flat.  
Eutectic Die Attachment: An 80/20, gold-tin, eutectic solder preform is recommended with a work surface  
temperature of 255oC and a tool tip temperature of 265oC. When hot gas is applied, the tool tip temperature  
should be 290oC. The chip should not be exposed to temperatures greater than 320oC for more than  
20 seconds. No more than three seconds should be required for attachment. Solders containing tin should not  
be used.  
Epoxy Die Attachment: A minimum amount of epoxy should be used. A thin epoxy fillet should be visible  
around the perimeter of the chip after placement. Cure epoxy per manufacturer’s schedule (typically 125-  
150oC).  
,
MASW-002102-13580 Chip Outline Drawing1 2  
INCHES  
MAX  
MILLIMETERS  
DIM  
MIN  
MIN  
MAX  
1.780  
1.330  
0.150  
0.140  
0.317  
0.760  
0.791  
0.757  
REF.  
REF.  
A
B
C
D
E
F
0.066  
0.048  
0.004  
0.004  
0.012  
0.029  
0.030  
0.029  
0.005  
0.005  
0.070  
0.052  
0.006  
0.006  
0.013  
0.030  
0.031  
0.030  
REF.  
1.680  
1.230  
0.100  
0.090  
0.292  
0.735  
0.766  
0.732  
0.129  
0.129  
G
H
J
K
REF.  
Notes:  
1. Topside and backside metallization is gold, 2.5mm thick typical.  
2. Yellow areas indicate wire bonding pads  
6
ADVANCED: Data Sheets contain information regarding a product MA-COM Technical Solutions is  
considering for development. Performance is based on target specifications, simulated results, and/  
or prototype measurements. Commitment to develop is not guaranteed.  
PRELIMINARY: Data Sheets contain information regarding a product MA-COM Technical Solutions  
has under development. Performance is based on engineering tests. Specifications are typical.  
Mechanical outline has been fixed. Engineering samples and/or test data may be available. Commit-  
ment to produce in volume is not guaranteed.  
North America Tel: 800.366.2266 / Fax: 978.366.2266  
Europe Tel: 44.1908.574.200 / Fax: 44.1908.574.300  
Asia/Pacific Tel: 81.44.844.8296 / Fax: 81.44.844.8298  
Visit www.macom.com for additional data sheets and product information.  
MA-COM Technical Solutions and its affiliates reserve the right to make changes to the  
product(s) or information contained herein without notice.  
MASW-002102-13580  
MASW-003102-13590  
HMIC™ Silicon PIN Diode Switches  
with Integrated Bias Network  
RoHS Compliant  
M/A-COM Products  
Rev. V3  
MASW-003102-13590 Chip Outline Drawing1,2  
INCHES  
DIM  
MILLIMETERS  
MIN  
MAX  
MIN  
1.770  
1.760  
0.100  
0.787  
0.734  
0.140  
0.089  
0.113  
0.859  
1.610  
1.680  
0.1290  
0.1180  
MAX  
1.870  
1.860  
0.150  
0.812  
0.759  
0.190  
0.139  
0.163  
0.909  
1.660  
1.730  
REF.  
REF.  
A
B
C
D
E
F
0.0697  
0.0693  
0.0039  
0.0310  
0.0289  
0.0055  
0.0035  
0.0044  
0.0338  
0.0632  
0.0660  
0.0051  
0.0046  
0,0736  
0.0732  
0.0059  
0.0319  
0.0299  
0.0075  
0.0055  
0.0064  
0.0358  
0.0652  
0.0680  
REF.  
G
H
J
K
L
M
N
REF.  
Notes:  
1. Topside and backside metallization is gold , 2.5mm thick  
typical.  
2. Yellow areas indicate wire bonding pads  
Ordering Information  
Part Number  
Package  
MASW-002102-13580G  
MASW-003102-13590G  
Gel Pack  
Gel Pack  
7
ADVANCED: Data Sheets contain information regarding a product MA-COM Technical Solutions is  
considering for development. Performance is based on target specifications, simulated results, and/  
or prototype measurements. Commitment to develop is not guaranteed.  
PRELIMINARY: Data Sheets contain information regarding a product MA-COM Technical Solutions  
has under development. Performance is based on engineering tests. Specifications are typical.  
Mechanical outline has been fixed. Engineering samples and/or test data may be available. Commit-  
ment to produce in volume is not guaranteed.  
North America Tel: 800.366.2266 / Fax: 978.366.2266  
Europe Tel: 44.1908.574.200 / Fax: 44.1908.574.300  
Asia/Pacific Tel: 81.44.844.8296 / Fax: 81.44.844.8298  
Visit www.macom.com for additional data sheets and product information.  
MA-COM Technical Solutions and its affiliates reserve the right to make changes to the  
product(s) or information contained herein without notice.  

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