MASW-003103-1364_V2 [TE]
HMICTM Silicon PIN Diode SP3T Switch; HMICTM硅PIN二极管开关SP3T
| 型号： | MASW-003103-1364_V2 |
| 厂家： | 
TE CONNECTIVITY |
| 描述： | HMICTM Silicon PIN Diode SP3T Switch |
| 文件： | 总8页 (文件大小：315K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
MASW-003103-1364
HMICTM Silicon PIN Diode SP3T Switch
50 MHz - 20 GHz
Rev. V2
Features
Specified from 50 MHz to 20 GHz
Usable up to 26 GHz
Low Insertion Loss
High Isolation
Low Parasitic Capacitance and Inductance
RoHS Compliant Surmount™ Package
Rugged, Fully Monolithic
Glass Encapsulated Construction
Up to +38 dBm C.W. Power Handling1 @ +25°C
Silicon Nitride Passivation
Polymer Scratch Protection
Functional Schematic
J3
Description
The MASW-003103-1364 is
a
Surmount™
broadband monolithic SP3T switch using series and
shunt connected silicon PIN diodes. This part is
designed for use as a moderate signal, high
performance switch in applications up to 20 GHz.
J2
J4
This Surface Mount
chipscale configuration is
optimized for broadband performance with minimal
associated parasitics usually associated with hybrid
MIC designs incorporating beam lead and PIN
diodes that require chip and wire assembly.
J1
The MASW-003103-1364 is fabricated using M/A-
COM Tech’s patented HMIC™ (Heterolithic
Microwave Integrated Circuit) process, US Patent
5,268,310. This process allows the incorporation of
silicon pedestals that form series and shunt diodes
or vias by imbedding them in low loss, low
dispersion glass. By using small spacing between
elements, this combination of silicon and glass gives
HMIC devices low loss and high isolation
performance through low millimeter frequencies.
Pin Configuration 2
Pin
Function
J1
J2
J3
J4
RFC
RF1
RF2
RF3
2. The exposed pad centered on the chip bottom must be con-
Selective backside metalization is applied producing
a Surface Mount device. The topside is fully
encapsulated with silicon nitride and has an
additional polymer layer for scratch and impact
Ordering Information
Part Number
Package
protection.
These protective coatings prevent
damage to the junction and the anode airbridge
during handling and assembly.
MASW-003103-13640G
MASW-003103-13645P
MASW-003103-13640P
MASW-003103-001SMB
50 piece gel pack
500 piece reel
3000 piece reel
Sample Test Board
1. Power Handling Testing performed @ 2GHz
1
ADVANCED: Data Sheets contain information regarding a product M/A-COM Technology Solutions
is considering for development. Performance is based on target specifications, simulated results,
and/or prototype measurements. Commitment to develop is not guaranteed.
PRELIMINARY: Data Sheets contain information regarding a product M/A-COM Technology
Solutions has under development. Performance is based on engineering tests. Specifications are
typical. Mechanical outline has been fixed. Engineering samples and/or test data may be available.
Commitment to produce in volume is not guaranteed.
• North America Tel: 800.366.2266 • Europe Tel: +353.21.244.6400
• India Tel: +91.80.43537383 • China Tel: +86.21.2407.1588
Visit www.macomtech.com for additional data sheets and product information.
M/A-COM Technology Solutions Inc. and its affiliates reserve the right to make
changes to the product(s) or information contained herein without notice.
MASW-003103-1364
HMICTM Silicon PIN Diode SP3T Switch
50 MHz - 20 GHz
Rev. V2
Electrical Specifications: TA = 25°C, PIN = 0 dBm, Z0 = 50 Ω, 20mA/-10V
Parameter
Frequency
Units Min.
Typ.
Max.
6 GHz
13 GHz
20 GHz
—
—
—
0.50
0.8
1.2
0.6
1.1
1.4
Insertion Loss
dB
dB
dB
6 GHz
13 GHz
20 GHz
50
37
25
54
40
31
—
—
—
Isolation
6 GHz
13 GHz
20 GHz
19
14
14
25
22
21
—
—
—
Input Return Loss
6 GHz
13 GHz
20 GHz
—
—
—
57
42
30
—
—
—
Output to Output Isolation
dB
Switching Speed3
Voltage Rating4
—
—
ns
V
—
—
20
—
—
80
Input 0.1dB Compression Point
2 GHz
dBm
—
36
—
3. Typical Switching Speed measured fro 10% to 90 % of detected RF signal driven by TTL compatible drivers.
4. Maximum reverse leakage current in either the shunt or series PIN diodes shall be 0.5 uA maximum @ -80 volts.
Absolute Maximum Ratings 5,6
Parameter
Absolute Maximum
-65 °C to +125 °C
-65 °C to +150 °C
+175 °C
Handling Procedures
Please observe the following precautions to avoid
damage:
Operating Temperature
Storage Temperature
Junction Temperature
Static Sensitivity
Applied Reverse Voltage
RF CW Incident Power
Bias Current +25°C
|-80 V|
These devices are rated at Class 1A Human Body.
Proper ESD control techniques should be used
when handling these devices.
38dBm CW @ 2GHz, +25°C
33dBm CW @ 20GHz,+25°C
± 50 mA
Max Operating Conditions for combination RF
Pwr, DC Bias, & Temp: 33dBm CW @ 20mA per
Diode @ +85ºC @ 2GHz
5. Exceeding any one or combination of these limits may cause
permanent damage to this device.
6. M/A-COM Tech does not recommend sustained operation
near these survivability limits.
2
ADVANCED: Data Sheets contain information regarding a product M/A-COM Technology Solutions
is considering for development. Performance is based on target specifications, simulated results,
and/or prototype measurements. Commitment to develop is not guaranteed.
PRELIMINARY: Data Sheets contain information regarding a product M/A-COM Technology
Solutions has under development. Performance is based on engineering tests. Specifications are
typical. Mechanical outline has been fixed. Engineering samples and/or test data may be available.
Commitment to produce in volume is not guaranteed.
• North America Tel: 800.366.2266 • Europe Tel: +353.21.244.6400
• India Tel: +91.80.43537383
• China Tel: +86.21.2407.1588
Visit www.macomtech.com for additional data sheets and product information.
M/A-COM Technology Solutions Inc. and its affiliates reserve the right to make
changes to the product(s) or information contained herein without notice.
MASW-003103-1364
HMICTM Silicon PIN Diode SP3T Switch
50 MHz - 20 GHz
Rev. V2
Typical Performance Curves
Insertion Loss @ 20m A, -10V
Isolation @ 20m A, -10V
RF Input to R F O utputs (J1 to J2, J3, J4)
RF Input to RF O utputs (J1 to J2, J3, J4)
0.0
0
-20
-40
-60
-80
J1 TO J2
J1 TO J3
J1 TO J4
J1 TO J2
J1 TO J3
J1 TO J4
-0.5
-1.0
-1.5
-2.0
0
0
0
5
10
15
20
25
30
30
30
0
5
10
15
20
25
30
Frequency (GHz)
Frequency (GHz)
Input Return Loss @ 20m A, -10V
Output Return Loss @ 20m A, -10V
RF Input to R F O utputs (J1 to J2, J3, J4)
RF Input to RF O utputs (J1 to J2, J3, J4)
0
-10
-20
-30
-40
0
-10
-20
-30
-40
J1 TO J2
J1 TO J3
J1 TO J4
J1 TO J2
J1 TO J3
J1 TO J4
5
10
15
20
25
0
5
10
15
20
25
30
Frequency (GHz)
Frequency (GHz)
O utput to Output Isolation @ 20m A, -10V
J2 to J3 and J3 to J4
MASW-003103-1364 Maximum Input Power Curve
Baseplate Temperature fixed @ 25degC
0
-20
-40
-60
-80
12
10
8
J2 TO J3
J3 TO J4
2GHz, 5.8W
6
10GHz, 2.75W
4
2
20GHz, 2W
0
0
0.2
0.4
0.6
0.8
1
1.2
1.4
1.6
5
10
15
20
25
Insertion Loss (dB)
Frequency (GHz)
3
ADVANCED: Data Sheets contain information regarding a product M/A-COM Technology Solutions
is considering for development. Performance is based on target specifications, simulated results,
and/or prototype measurements. Commitment to develop is not guaranteed.
PRELIMINARY: Data Sheets contain information regarding a product M/A-COM Technology
Solutions has under development. Performance is based on engineering tests. Specifications are
typical. Mechanical outline has been fixed. Engineering samples and/or test data may be available.
Commitment to produce in volume is not guaranteed.
• North America Tel: 800.366.2266 • Europe Tel: +353.21.244.6400
• India Tel: +91.80.43537383 • China Tel: +86.21.2407.1588
Visit www.macomtech.com for additional data sheets and product information.
M/A-COM Technology Solutions Inc. and its affiliates reserve the right to make
changes to the product(s) or information contained herein without notice.
MASW-003103-1364
HMICTM Silicon PIN Diode SP3T Switch
50 MHz - 20 GHz
Rev. V2
Bias Control
Optimal operation of the MASW-003103-1364 is achieved by simultaneous application of negative DC voltage
and current to the low loss switching arm J2, J3, or J4, and positive DC voltage and current to the remaining
switching arms as shown in the applications circuit below. DC return is achieved via R2 on the J1/RF Com Path.
In the low loss state, the series diode must be forward biased with current and the shunt diode reverse biased
with voltage. In the isolation arms, the shunt diode is forward biased with current and the series diode is reverse
biased with voltage.
Driver Connections
Condition of
RF Output
Condition of
RF Output
Condition of
RF Output
Control Level (DC Currents and Voltages)
B2
B3
B4
J1-J2
J1-J3
J1-J4
-15V 7 at -20mA
6V at +20mA
6V at +20mA
+20mA
6V at +20mA
Low Loss
Isolation
Isolation
Isolation
Low Loss
Isolation
Isolation
Isolation
Low Loss
-15V 7 at -20mA
6V at +20mA
6V at +20mA
-15V 7 at -20mA
7. The voltage applied to the off arm can vary as long as 20mA is applied through the shunt diode on the off arm.
Application Circuit 8,9,10,11,12
Example:
J1 to J2→ Low Loss
R1 = 250Ω
R2 = 450Ω
B2 = -15V
B3, B4 = 6V
Notes:
8. Assume Vf ~ 1V at 20mA
9. R1 = 5V / 0.02A = 250Ω; R2 = 9V / 0.02A = 450Ω
10. PR1 = 0.02A x 0.02A x 250 = 0.1 W
11. PR2 = 0.02A x 0.02A x 450 = 0.18 W
12. Inductors are bias RF chokes. The operating band width of a broad-band PIN diode switch is often dependent on the bias compo-
nents, particularly the RF bias chokes. It is suggested that the frequency response be checked with all the bias components attached
before installing the PIN diode.
4
ADVANCED: Data Sheets contain information regarding a product M/A-COM Technology Solutions
is considering for development. Performance is based on target specifications, simulated results,
and/or prototype measurements. Commitment to develop is not guaranteed.
PRELIMINARY: Data Sheets contain information regarding a product M/A-COM Technology
Solutions has under development. Performance is based on engineering tests. Specifications are
typical. Mechanical outline has been fixed. Engineering samples and/or test data may be available.
Commitment to produce in volume is not guaranteed.
• North America Tel: 800.366.2266 • Europe Tel: +353.21.244.6400
• India Tel: +91.80.43537383 • China Tel: +86.21.2407.1588
Visit www.macomtech.com for additional data sheets and product information.
M/A-COM Technology Solutions Inc. and its affiliates reserve the right to make
changes to the product(s) or information contained herein without notice.
MASW-003103-1364
HMICTM Silicon PIN Diode SP3T Switch
50 MHz - 20 GHz
Rev. V2
Outline Drawing Footprint
Top View
Side View
Backside View
125
2065
1960
200
680
J3
200
200
J4
J2
285 200
J1
200 200 200
680
Units in µm
Ground radius is 200um centered
on the I/O Pad.
MASW-003103-1364
Inches
DIM
mm
MIN
MAX
MIN
MAX
Width
Length
0.06417
0.08031
0.06614
0.08228
1.630
2.040
1.680
2.090
Thickness
0.00394
0.00591
0.100
0.150
5
ADVANCED: Data Sheets contain information regarding a product M/A-COM Technology Solutions
is considering for development. Performance is based on target specifications, simulated results,
and/or prototype measurements. Commitment to develop is not guaranteed.
PRELIMINARY: Data Sheets contain information regarding a product M/A-COM Technology
Solutions has under development. Performance is based on engineering tests. Specifications are
typical. Mechanical outline has been fixed. Engineering samples and/or test data may be available.
Commitment to produce in volume is not guaranteed.
• North America Tel: 800.366.2266 • Europe Tel: +353.21.244.6400
• India Tel: +91.80.43537383 • China Tel: +86.21.2407.1588
Visit www.macomtech.com for additional data sheets and product information.
M/A-COM Technology Solutions Inc. and its affiliates reserve the right to make
changes to the product(s) or information contained herein without notice.
MASW-003103-1364
HMICTM Silicon PIN Diode SP3T Switch
50 MHz - 20 GHz
Rev. V2
Handling Procedures
Attachment to a circuit board is made simple through the use of standard surface mount technology. Mounting
pads are conveniently located on the bottom surface of these devices and are removed from the active junction
locations. These devices are well suited for solder attachment onto hard and soft substrates. The use of
80Au/20Sn, or RoHS compliant solders is recommended. For applications where the average power is ≤ 1W,
conductive silver epoxy may also be used. Cure per manufacturers recommended time and temperature. Typi-
cally 1 hour at 150°C.
When soldering these devices to a hard substrate, a solder re-flow method is preferred. A vacuum tip pick-up
tool and a force of 60 to100 grams applied to the top surface of the device while placing the chip is recom-
mended. When soldering to soft substrates, such as Duroid, it is recommended to use a soft solder at the circuit
board to mounting pad interface to minimize stress due to any TCE mismatches that may exist. Position the die
so that its mounting pads are aligned with the circuit board mounting pads. Solder reflow should not be per-
formed by causing heat to flow through the top surface of the die to the back. Since the HMIC glass is transpar-
ent, the edges of the mounting pads can be visually inspected through the die after attachment is completed.
Typical re-flow profiles for Sn60/Pb40 and RoHS compliant solders is provided in Application Note M538 ,
“Surface Mounting Instructions“ and can viewed on the MA-COM Technology Solutions website @
www.macomtech.com
6
ADVANCED: Data Sheets contain information regarding a product M/A-COM Technology Solutions
is considering for development. Performance is based on target specifications, simulated results,
and/or prototype measurements. Commitment to develop is not guaranteed.
PRELIMINARY: Data Sheets contain information regarding a product M/A-COM Technology
Solutions has under development. Performance is based on engineering tests. Specifications are
typical. Mechanical outline has been fixed. Engineering samples and/or test data may be available.
Commitment to produce in volume is not guaranteed.
• North America Tel: 800.366.2266 • Europe Tel: +353.21.244.6400
• India Tel: +91.80.43537383 • China Tel: +86.21.2407.1588
Visit www.macomtech.com for additional data sheets and product information.
M/A-COM Technology Solutions Inc. and its affiliates reserve the right to make
changes to the product(s) or information contained herein without notice.
MASW-003103-1364
HMICTM Silicon PIN Diode SP3T Switch
50 MHz - 20 GHz
Rev. V2
Pocket Tape Information
Carrier Tape Dimensions
.157 ± .004
4.00 ± 0.10
.157 ± .004
4.00 ± 0.10
.079 ± .002
2.00 ± 0.05
.069 ± .004
Ф .059 ± .004 THRU
1.75 ± 0.10
1.5 ±
+.012
+0.30
.138
3.5 ± 0.05
8.00 - 0.10
.093 ± .002
2.36 ± 0.05
Ф 0.035
Ф 0.89
.012 ± .001
0.30 ± 0.03
THRU TYP.
5° MAX.
.012 ± .002
0.30 ± 0.05
POCKET DEPTH
.071 ± .002
1.80 ± 0.05
Chip Orientation in Tape
7
ADVANCED: Data Sheets contain information regarding a product M/A-COM Technology Solutions
is considering for development. Performance is based on target specifications, simulated results,
and/or prototype measurements. Commitment to develop is not guaranteed.
PRELIMINARY: Data Sheets contain information regarding a product M/A-COM Technology
Solutions has under development. Performance is based on engineering tests. Specifications are
typical. Mechanical outline has been fixed. Engineering samples and/or test data may be available.
Commitment to produce in volume is not guaranteed.
• North America Tel: 800.366.2266 • Europe Tel: +353.21.244.6400
• India Tel: +91.80.43537383 • China Tel: +86.21.2407.1588
Visit www.macomtech.com for additional data sheets and product information.
M/A-COM Technology Solutions Inc. and its affiliates reserve the right to make
changes to the product(s) or information contained herein without notice.
MASW-003103-1364
HMICTM Silicon PIN Diode SP3T Switch
50 MHz - 20 GHz
Rev. V2
Reel Information
A
INCHES
MM
DIM
MIN.
MAX.
MIN.
MAX.
A
6.980
7.019
177.3
178.3
B
C
D
.059
.504
.795
.098
.520
.815
1.5
2.5
12.8
20.2
13.2
20.7
N
2.146
.331
—-
2.185
.337
54.5
8.4
55.5
8.55
14.4
W1
W2
.567
—-
8
ADVANCED: Data Sheets contain information regarding a product M/A-COM Technology Solutions
is considering for development. Performance is based on target specifications, simulated results,
and/or prototype measurements. Commitment to develop is not guaranteed.
PRELIMINARY: Data Sheets contain information regarding a product M/A-COM Technology
Solutions has under development. Performance is based on engineering tests. Specifications are
typical. Mechanical outline has been fixed. Engineering samples and/or test data may be available.
Commitment to produce in volume is not guaranteed.
• North America Tel: 800.366.2266 • Europe Tel: +353.21.244.6400
• India Tel: +91.80.43537383 • China Tel: +86.21.2407.1588
Visit www.macomtech.com for additional data sheets and product information.
M/A-COM Technology Solutions Inc. and its affiliates reserve the right to make
changes to the product(s) or information contained herein without notice.
相关型号：
©2020 ICPDF网 联系我们和版权申明