BQ4847Y [TI]

RTC Module With CPU Supervisor; RTC模块, CPU监控电路
BQ4847Y
型号: BQ4847Y
厂家: TEXAS INSTRUMENTS    TEXAS INSTRUMENTS
描述:

RTC Module With CPU Supervisor
RTC模块, CPU监控电路

监控
文件: 总6页 (文件大小:247K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
bq4847/bq4847Y  
RTC Module With CPU Supervisor  
tolerance to allow for power supply  
General Description  
Features  
and processor stabilization.  
Real-Time Clock counts seconds  
The bq4847 Real-Time Clock Mod-  
Th e bq4847 a ls o h a s a bu ilt -in  
ule is a low-power microprocessor  
through years in BCD format  
watchdog timer to monitor processor  
peripheral that integrates a time-  
Integrated battery and crystal  
operation. If the microprocessor does  
of-day clock, a 100-year calendar, a  
not toggle the watchdog input (WDI)  
CPU supervisor, a battery, and a crys-  
On-chip battery-backup switch-  
over circuit with nonvolatile con-  
trol for an external SRAM  
within the programmed time-out,  
tal in a 28-pin DIP module. The part  
the bq4847 asserts WDO and RST.  
is ideal for fax machines, copiers, in-  
WD I u n con n e ct e d d is a b le s t h e  
dustrial control systems, point-of-sale  
watchdog timer.  
130mAh battery capacity  
terminals, data loggers, and comput-  
ers.  
The bq4847 can generate other in-  
±1 minute per month clock accu-  
terrupts based on a clock alarm con-  
Th e bq4847 con t a in s a n in t er n a l  
racy  
dition or a periodic setting. The  
battery and crystal. Through the use  
Less than 500nA of clock opera-  
alarm interrupt can be set to occur  
of the conditional chip enable output  
tion current in backup mode  
from once per second to once per  
(CEOUT) and battery voltage output  
month. The alarm can be made ac-  
(VOUT) pin s, t h e bq4847 can write-  
Microprocessor reset valid to  
tive in the battery-backup mode to  
protect and make n on vola t ile a n  
VCC = VSS  
serve as a system wake-up call. For  
ext er n a l SRAM. Th e ba cku p cell  
interrupts at a rate beyond once per  
p ower s t h e r ea l-t im e clock a n d  
I n d ep en d en t wa t ch d og t im er  
with a programmable time-out  
period  
second, the periodic interrupt can be  
programmed with periods of 30.5µs  
to 500ms.  
m a in t a in s SRAM in for m a t ion in  
the absence of system voltage.  
Power-fail interrupt warning  
T h e  
b q 4 8 4 7  
con t a i n s  
a
t em per a t u r e-com pen sa t ed r efer-  
ence and comparator circuit that  
monitors the status of its voltage  
su pply. Wh en a n ou t -of-t oler a n ce  
condition is detected, the bq4847  
gen er a t es a n in t er r u pt wa r n in g  
a n d su bsequ en t ly a m icr opr oces-  
sor r eset . Th e r eset st a ys a ct ive  
for 200m s a ft er VCC r ises wit h in  
Programmable clock alarm inter-  
r u pt a ct ive in ba t t er y-ba cku p  
mode  
Caution:  
Take care to avoid inadvertent dis-  
charge through VOUT and CEOUT  
after battery isolation has been  
broken.  
Programmable periodic interrupt  
Battery-low warning  
Pin Connections  
Pin Names  
A0–A3  
Clock/Control address  
inputs  
NC  
No connect  
V
28  
1
V
OUT  
NC  
NC  
CC  
WE  
27  
26  
2
3
VOUT  
INT  
Back-up battery output  
Interrupt output  
Microprocessor reset  
Watchdog input  
Watchdog output  
+5V supply  
CE  
CE  
NC  
IN  
DQ0–DQ7 Data inputs/outputs  
4
WDO  
INT  
25  
24  
23  
22  
21  
20  
19  
18  
17  
16  
15  
OUT  
5
WE  
OE  
Write enable  
RST  
6
WDI  
OE  
CS  
RST  
WDI  
WDO  
VCC  
VSS  
A
3
7
Output enable  
Chip select input  
A
A
A
8
9
2
1
0
NC  
10  
11  
12  
13  
14  
DQ  
7
DQ  
DQ  
DQ  
DQ  
CS  
DQ  
0
1
2
6
DQ  
DQ  
5
4
3
CEIN  
External RAM chip  
enable  
V
SS  
Ground  
CEOUT  
Conditional RAM chip  
enable  
28-Pin DIP Module  
PN484701.eps  
Sept. 1996  
1
bq4847/bq4847Y  
room temperature. For a complete description of fea-  
tures, operating conditions, electrical characteristics,  
bus timing, and pin descriptions, see the bq4845 data  
sheet. Valid part types for ordering are bq4847MT (5%)  
and bq4847YMT (10%).  
Functional Description  
Figure 1 is a block diagram of the bq4847. The bq4847 is  
functionally equivalent to the bq4845 except that the bat-  
tery (20, 24) and crystal (2, 3) pins are not accessible. The  
pins are connected internally to a coin cell and quartz  
crystal. The coin cell provides 130mAh of capacity. It is in-  
ternally isolated from VOUT and CEOUT until the initial  
application of VCC. Once VCC rises above VPFD, this isola-  
tion is broken, and the backup cell provides power to  
VOUT and CEOUT for the external SRAM. The real-time  
clock keeps time to within one minute per month at  
Figure 2 illustrates the address map for the bq4847. Ta-  
ble 1 is a map of the bq4847 registers, and Table 2 de-  
scribes the register bits.  
Figure 1. Block Diagram  
Truth Table  
VCC  
CS  
VIH  
VIL  
VIL  
VIL  
X
OE  
X
WE  
X
CEOUT  
CEIN  
CEIN  
CEIN  
CEIN  
VOH  
VOUT  
VOUT1  
VOUT1  
VOUT1  
VOUT1  
VOUT1  
VOUT2  
Mode  
Deselect  
Write  
DQ  
Power  
Standby  
Active  
< VCC (max.)  
High Z  
DIN  
X
VIL  
VIH  
VIH  
X
> VCC (min.)  
VIL  
VIH  
X
Read  
DOUT  
High Z  
High Z  
Active  
Read  
Active  
< VPFD (min.) > VSO  
Deselect  
Deselect  
CMOS standby  
X
X
X
VOHB  
High Z Battery-backup mode  
VSO  
Sept. 1996  
2
bq4847/bq4847Y  
MT: 28-Pin T-Type Module  
(
)
28-Pin MT T-Type Module  
Inches  
Millimeters  
Dimension  
Min.  
0.360  
0.015  
0.015  
0.008  
1.520  
0.710  
0.590  
0.090  
0.110  
0.100  
Max.  
0.390  
-
Min.  
Max.  
9.91  
-
A
A1  
B
C
D
E
9.14  
0.38  
0.022  
0.013  
1.535  
0.740  
0.620  
0.110  
0.130  
0.120  
0.38  
0.56  
0.33  
38.99  
18.80  
15.75  
2.79  
3.30  
3.05  
0.20  
38.61  
18.03  
14.99  
2.29  
e
G
L
2.79  
S
2.54  
Ordering Information  
bq4847  
- MT  
Pa ck a ge Op tion :  
MT = 28-pin T-type Module  
Volta ge Toler a n ce:  
Blank = 5%  
Y = 10%  
Device:  
bq4847 Real-Time Clock Module With CPU Supervisor  
Sept. 1996  
3
PACKAGE OPTION ADDENDUM  
www.ti.com  
9-Oct-2007  
PACKAGING INFORMATION  
Orderable Device  
BQ4847MT  
Status (1)  
ACTIVE  
ACTIVE  
Package Package  
Pins Package Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3)  
Qty  
Type  
Drawing  
DIP MOD  
ULE  
MT  
28  
1
Pb-Free  
(RoHS)  
CU SN  
N / A for Pkg Type  
BQ4847YMT  
DIP MOD  
ULE  
MT  
28  
1
Pb-Free  
(RoHS)  
CU SN  
N / A for Pkg Type  
(1) The marketing status values are defined as follows:  
ACTIVE: Product device recommended for new designs.  
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.  
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in  
a new design.  
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.  
OBSOLETE: TI has discontinued the production of the device.  
(2)  
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check  
http://www.ti.com/productcontent for the latest availability information and additional product content details.  
TBD: The Pb-Free/Green conversion plan has not been defined.  
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements  
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered  
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.  
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and  
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS  
compatible) as defined above.  
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame  
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)  
(3)  
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder  
temperature.  
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is  
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the  
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take  
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on  
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited  
information may not be available for release.  
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI  
to Customer on an annual basis.  
Addendum-Page 1  
MECHANICAL DATA  
MPDI064 – MAY 2001  
MT (R-PDIP-T**)  
PLASTIC DUAL-IN-LINE  
28 PINS SHOWN  
Inches  
Max.  
Millimeters  
Min.  
9.14  
Max.  
Dimension  
Min.  
0.360  
0.015  
0.015  
0.008  
1.320  
1.520  
0.710  
0.590  
0.090  
0.110  
0.100  
0.390  
A
9.91  
A1  
B
0.38  
0.022  
0.56  
0.33  
0.38  
0.20  
C
0.013  
1.335  
1.535  
0.740  
D/24 PIN  
D/28 PIN  
33.53  
38.61  
18.03  
33.91  
38.99  
18.80  
16.00  
2.79  
E
e
D
14.99  
2.29  
0.630  
0.110  
G
L
3.30  
2.79  
2.54  
0.130  
0.120  
S
3.05  
E
A1  
A
C
B
L
S
G
e
4201978/A 03/01  
NOTES: A. All linear dimensions are in inches (mm).  
B. This drawing is subject to change without notice.  
1
POST OFFICE BOX 655303 DALLAS, TEXAS 75265  
POST OFFICE BOX 1443 HOUSTON, TEXAS 77251–1443  
IMPORTANT NOTICE  
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements,  
improvements, and other changes to its products and services at any time and to discontinue any product or service without notice.  
Customers should obtain the latest relevant information before placing orders and should verify that such information is current and  
complete. All products are sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment.  
TI warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with TI’s  
standard warranty. Testing and other quality control techniques are used to the extent TI deems necessary to support this  
warranty. Except where mandated by government requirements, testing of all parameters of each product is not necessarily  
performed.  
TI assumes no liability for applications assistance or customer product design. Customers are responsible for their products and  
applications using TI components. To minimize the risks associated with customer products and applications, customers should  
provide adequate design and operating safeguards.  
TI does not warrant or represent that any license, either express or implied, is granted under any TI patent right, copyright, mask  
work right, or other TI intellectual property right relating to any combination, machine, or process in which TI products or services  
are used. Information published by TI regarding third-party products or services does not constitute a license from TI to use such  
products or services or a warranty or endorsement thereof. Use of such information may require a license from a third party under  
the patents or other intellectual property of the third party, or a license from TI under the patents or other intellectual property of TI.  
Reproduction of TI information in TI data books or data sheets is permissible only if reproduction is without alteration and is  
accompanied by all associated warranties, conditions, limitations, and notices. Reproduction of this information with alteration is an  
unfair and deceptive business practice. TI is not responsible or liable for such altered documentation. Information of third parties  
may be subject to additional restrictions.  
Resale of TI products or services with statements different from or beyond the parameters stated by TI for that product or service  
voids all express and any implied warranties for the associated TI product or service and is an unfair and deceptive business  
practice. TI is not responsible or liable for any such statements.  
TI products are not authorized for use in safety-critical applications (such as life support) where a failure of the TI product would  
reasonably be expected to cause severe personal injury or death, unless officers of the parties have executed an agreement  
specifically governing such use. Buyers represent that they have all necessary expertise in the safety and regulatory ramifications  
of their applications, and acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related  
requirements concerning their products and any use of TI products in such safety-critical applications, notwithstanding any  
applications-related information or support that may be provided by TI. Further, Buyers must fully indemnify TI and its  
representatives against any damages arising out of the use of TI products in such safety-critical applications.  
TI products are neither designed nor intended for use in military/aerospace applications or environments unless the TI products are  
specifically designated by TI as military-grade or "enhanced plastic." Only products designated by TI as military-grade meet military  
specifications. Buyers acknowledge and agree that any such use of TI products which TI has not designated as military-grade is  
solely at the Buyer's risk, and that they are solely responsible for compliance with all legal and regulatory requirements in  
connection with such use.  
TI products are neither designed nor intended for use in automotive applications or environments unless the specific TI products  
are designated by TI as compliant with ISO/TS 16949 requirements. Buyers acknowledge and agree that, if they use any  
non-designated products in automotive applications, TI will not be responsible for any failure to meet such requirements.  
Following are URLs where you can obtain information on other Texas Instruments products and application solutions:  
Products  
Amplifiers  
Data Converters  
DSP  
Applications  
Audio  
amplifier.ti.com  
dataconverter.ti.com  
dsp.ti.com  
www.ti.com/audio  
Automotive  
Broadband  
Digital Control  
Military  
www.ti.com/automotive  
www.ti.com/broadband  
www.ti.com/digitalcontrol  
www.ti.com/military  
Interface  
interface.ti.com  
logic.ti.com  
Logic  
Power Mgmt  
Microcontrollers  
RFID  
power.ti.com  
Optical Networking  
Security  
www.ti.com/opticalnetwork  
www.ti.com/security  
www.ti.com/telephony  
www.ti.com/video  
microcontroller.ti.com  
www.ti-rfid.com  
www.ti.com/lpw  
Telephony  
Low Power  
Wireless  
Video & Imaging  
Wireless  
www.ti.com/wireless  
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265  
Copyright © 2007, Texas Instruments Incorporated  

相关型号:

BQ4847Y-MT

RTC Module With CPU Supervisor
TI

BQ4847YMT

RTC Module With CPU Supervisor
TI

BQ4847_07

RTC Module With CPU Supervisor
TI

BQ4850Y

RTC Module With 512Kx8 NVSRAM
TI

BQ4850YMA-85

RTC Module With 512Kx8 NVSRAM
TI

BQ4850Y_13

RTC Module With 512Kx8 NVSRAM
TI

BQ4852Y

RTC Module With 512Kx8 NVSRAM
TI

BQ4852YMC-85

RTC Module With 512Kx8 NVSRAM
TI

BQ48S1.5-30A

DC to DC Converter
ETC

BQ48S1.5-30R

DC to DC Converter
ETC

BQ48S1.5-30T

DC to DC Converter
ETC

BQ48S1.8-36A

DC to DC Converter
ETC