DLPA100PT [TI]

DLP® driver for DLP660TE (0.66 4K UHD) DMD | DLP | 48 | 0 to 75;
DLPA100PT
型号: DLPA100PT
厂家: TEXAS INSTRUMENTS    TEXAS INSTRUMENTS
描述:

DLP® driver for DLP660TE (0.66 4K UHD) DMD | DLP | 48 | 0 to 75

文件: 总27页 (文件大小:1212K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
Support &  
Community  
Product  
Folder  
Order  
Now  
Tools &  
Software  
Technical  
Documents  
DLPA100  
ZHCSFY9 FEBRUARY 2017  
DLPA100 电源管理和电机驱动器  
1 特性  
3 说明  
1
3.3V 开关稳压器 - 逻辑电源  
DLPA100 是一款专用电源管理和电机控制驱动器,适  
用于 DLP®4K UHD TRP 显示芯片组。DLPA100 与  
DLP660TE 数字微镜器件和 DLPC4422 显示控制器共  
同构成芯片组。这款解决方案非常适合需要高分辨率、  
高亮度和系统简易性的显示系统。为了确保操作可靠  
性,DLP660TE DMD DLPC4422 显示控制器必须  
始终与 DLPA100 电源管理和电机驱动器件搭配使用。  
具有使能功能的 5V 开关稳压器 - 模拟电路电源  
1.0V 3.3V 可调节开关稳压器 - 内核电源  
具有使能功能的可调节线性稳压器 - 锁相环 (PLL)  
电源  
具有使能功能的可调节线性稳压器控制 - 模拟电源  
2.5V 开关稳压器数字电源  
电源序列控制  
器件信息(1)  
电源监控电路  
器件型号  
DLPA100  
封装  
PT (48)  
封装尺寸(标称值)  
适用于高侧驱动的集成电荷泵  
三个风扇驱动器  
0.276mm x 0.276mm  
(1) 要了解所有可用封装,请见数据表末尾的可订购产品附录。  
热关断电路  
串行通信接口  
1. 典型应用图  
三相反电动势 (BEMF) 电动机驱动器/控制器  
电机电源开关稳压器  
2 应用  
4K 超高清 (UHD) 显示屏  
激光电视 (TV)  
数字标牌  
投影映射  
1
An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,  
intellectual property matters and other important disclaimers. PRODUCTION DATA.  
English Data Sheet: DLPS082  
 
 
 
DLPA100  
ZHCSFY9 FEBRUARY 2017  
www.ti.com.cn  
目录  
1
2
3
4
5
6
特性.......................................................................... 1  
8
9
Application and Implementation ........................ 17  
8.1 Application Information............................................ 17  
8.2 Typical Application ................................................. 17  
Power Supply Recommendations...................... 19  
应用.......................................................................... 1  
说明.......................................................................... 1  
修订历史记录 ........................................................... 3  
Pin Configuration and Functions......................... 4  
Specifications......................................................... 7  
6.1 Absolute Maximum Ratings ...................................... 7  
6.2 Storage Conditions.................................................... 7  
6.3 ESD Ratings ............................................................ 7  
6.4 Recommended Operating Conditions....................... 7  
6.5 Thermal Information.................................................. 7  
6.6 Electrical Characteristics........................................... 8  
Detailed Description ............................................ 11  
7.1 Overview ................................................................. 11  
7.2 Functional Block Diagram ....................................... 11  
7.3 Feature Description................................................. 12  
7.4 Device Functional Modes........................................ 16  
10 Layout................................................................... 20  
10.1 Layout Guidelines ................................................. 20  
10.2 Grounding Guidelines ........................................... 20  
10.3 Thermal Guidelines............................................... 22  
10.4 Motor Control Guidelines ...................................... 22  
10.5 Layout Example .................................................... 23  
11 器件和文档支持 ..................................................... 24  
11.1 器件标记................................................................ 24  
11.2 文档支持 ............................................................... 24  
11.3 社区资源................................................................ 24  
11.4 ....................................................................... 24  
11.5 静电放电警告......................................................... 24  
11.6 Glossary................................................................ 24  
12 机械、封装和可订购信息....................................... 25  
7
2
版权 © 2017, Texas Instruments Incorporated  
DLPA100  
www.ti.com.cn  
ZHCSFY9 FEBRUARY 2017  
4 修订历史记录  
日期  
修订版本  
注释  
*
首次发布。  
Copyright © 2017, Texas Instruments Incorporated  
3
DLPA100  
ZHCSFY9 FEBRUARY 2017  
www.ti.com.cn  
5 Pin Configuration and Functions  
( PT package)  
(48 pin QFP)  
Top View  
4
Copyright © 2017, Texas Instruments Incorporated  
DLPA100  
www.ti.com.cn  
ZHCSFY9 FEBRUARY 2017  
Pin Functions  
PIN  
I/O  
DESCRIPTION  
NAME  
DOUT  
CLK  
NO.  
1
Output  
Input  
Data Out for Serial Port  
2
Clock for Serial Port  
DIN  
3
Input  
Data In for Serial Port  
Chip Select for Serial Port  
Motor Speed Indication  
CSZ  
4
Input  
TACH  
OSC  
5
Output  
Input  
6
Master Osc for Digital Timing – 2 MHz typical  
Ground  
GND  
7
Ground  
Input  
GMIN  
VBB  
8
Motor Gm Input  
9
Power  
Output  
Input  
VBB Load Supply  
VMSW  
VM  
10  
11  
12  
13  
14  
15  
16  
17  
18  
19  
20  
21  
22  
23  
24  
25  
26  
27  
28  
29  
30  
31  
32  
33  
34  
35  
36  
37  
38  
39  
40  
41  
42  
43  
44  
45  
46  
Motor Supply Switching Node  
Motor Supply INPUT/FB  
Motor Phase A  
OUTA  
CTAP  
SENSE  
OUTB  
OUTC  
CP2  
Output  
Input/Output Motor Centertap  
Input  
Output  
Output  
Power  
Power  
Ground  
Power  
Power  
Power  
Output  
Motor Current Sensing  
Motor Phase B  
Motor Phase C  
Charge Pump  
CP1  
Charge Pump  
GND  
Ground  
VREG  
VCP  
Internal Bias Regulator Terminal  
Charge Pump Reservoir Capacitor Terminal  
VBB Load Supply  
VBB  
LX5  
5V Regulator Switching Node  
V5  
Power Input 5V Feedback and Logic Supply Input  
Power Output Adjustable Core Regulator Switching Node  
Power Output Gate Drive for Core Regulator  
LXC  
GDC  
ISENK  
ISEN  
VLIN1  
FBC  
Input  
Input  
Kelvin Sense for Core Regulator  
Current Sense for Core Regulator  
Power Output VLIN1 Linear Regulator Output  
Power Input Adjustable Core Switching Regulator Feedback Node  
Power Input VLIN1 Adjustable Feedback Node  
Power Input VLIN2 Adjustable Feedback Node  
Power Output VLIN2 Linear Gate Drive Output  
FB1  
FB2  
GD2  
POSENSE  
PWRGOOD  
PMDINTZ  
VBB  
Output  
Output  
Output  
Power  
Output  
Output  
Output  
Power On Reset Output  
Power Good Output  
Interrupt Flag  
Motor Supply Terminal  
Fan 3 Switching Node Output  
Fan 2 Switching Node Output  
Fan 1 Switching Node Output  
F3SW  
F2SW  
F1SW  
LX25  
VBB  
Power Output 2.5V Regulator Switching Node  
Power VBB Load Supply  
Power Output 3.3V Regulator Switching Node  
Ground Ground  
LX33  
GND  
V3P3  
V2P5  
Power Input 3.3V Feedback  
Power Input 2.5V Feedback  
Copyright © 2017, Texas Instruments Incorporated  
5
DLPA100  
ZHCSFY9 FEBRUARY 2017  
www.ti.com.cn  
Pin Functions (continued)  
PIN  
I/O  
DESCRIPTION  
NAME  
TRIM  
NO.  
47  
Power  
Input  
Trim Pin (must be tied to VREG)  
Forced Reset  
RESETZ  
48  
6
Copyright © 2017, Texas Instruments Incorporated  
DLPA100  
www.ti.com.cn  
ZHCSFY9 FEBRUARY 2017  
6 Specifications  
6.1 Absolute Maximum Ratings  
over operating free-air temperature range (unless otherwise noted)(1)  
PARAMETER  
MIN  
MAX  
UNIT  
V
VBB  
tramp  
Vx  
Load Supply Voltage  
15  
Time to ramp from 0V to VBB  
200  
-1  
µs  
V
LX33, LXC, LX5, OUTA, OUTB, OUTC  
Vin  
Logic Inputs (RESETZ, CLK, DIN, CSZ, OSC)  
Open Drain Logic Outputs (PWRGOOD, DOUT, POSENSE, PMDINTZ, TACH)  
-0.3  
7
7
V
Vout  
V
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings  
only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended  
Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.  
6.2 Storage Conditions  
MIN  
MAX  
UNIT  
Tstg  
Storage temperature  
-55  
150  
°C  
6.3 ESD Ratings  
VALUE  
UNIT  
Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1)  
±2000  
V(ESD)  
Electrostatic discharge  
V
Charged-device model (CDM), per JEDEC specification JESD22-  
C101(2)  
±1000  
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.  
(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.  
6.4 Recommended Operating Conditions  
over operating free-air temperature range (unless otherwise noted)  
MIN  
NOM  
MAX  
15  
UNIT  
V
VBB  
Ta  
Load supply voltage  
Operational ambient temperature  
Maximum Operational junction temperature  
0
75  
°C  
Tj  
150  
°C  
6.5 Thermal Information  
DLPA100  
THERMAL METRIC(1)  
LQFP  
48 PINS  
23  
UNIT  
RθJA  
Junction-to-ambient thermal resistance  
°C/W  
°C/W  
RθJC(top)  
Junction-to-case (top) thermal resistance  
2
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application  
report.  
Copyright © 2017, Texas Instruments Incorporated  
7
DLPA100  
ZHCSFY9 FEBRUARY 2017  
www.ti.com.cn  
6.6 Electrical Characteristics  
over operating free-air temperature range (unless otherwise noted)  
PARAMETER  
Supply Current  
TEST CONDITIONS  
MIN  
TYP  
MAX  
UNIT  
IBB1  
IBB2  
Motors and fans off  
26  
mA  
All Regulators Operating, I_load= 0  
mA  
Supply Current  
Supply Current  
36  
mA  
A
x3 fans = 100% mode @ 200 mA  
load, VM = 100% mode @ 200 mA  
IBB3  
2.7  
CONTROL LOGIC  
VIL  
Logic Input Voltage  
(RESETZ, CLK, DIN, CSZ,  
OSC)  
0.8  
V
V
VIH  
2.0  
IIL  
VIN = 5  
VIN = 0  
-20  
-20  
<1.0  
20  
20  
µA  
µA  
Logic Input Current  
IIH  
<-1.0  
Open Drain Logic Outputs  
(PWRGOOD, DOUT,  
POSENSE,PMDINTZ,  
TACH)  
Vlow  
I = 4 mA  
0.4  
1
V
Logic Output Leakage  
Current  
Iout  
V = 3.3 V  
µA  
CHARGE PUMP  
VCP  
Output Voltage  
Relative to VBB  
7.25  
5.5  
V
V
VCPuvlo  
VCP Undervoltage  
SWITCHING REGULATORS  
Average Voltage, I_out = 0 mA to  
1.6 A  
V5  
Output Voltage V5  
4.75  
5
5.25  
V
Rds5  
Icl5  
Buck Switch Rdson  
Buck Switch Current Limit  
Switching Frequency  
Soft Start  
Tj = 25°C  
150  
3.4  
500  
5
mΩ  
A
2.8  
450  
3
4.0  
525  
7
Fsw  
tss  
kHz  
ms  
Average Voltage, I_out = 0 mA to  
1.6 A  
V33  
Output Voltage V3P3  
3.168  
3.3  
3.432  
V
Rds33  
Icl33  
Fsw  
Buck Switch Rdson  
Buck Switch Current Limit  
Switching Frequency  
Soft Start  
Tj = 25°C  
300  
2.8  
500  
5
mΩ  
A
2.4  
450  
3
3.4  
525  
7
kHz  
ms  
tss  
Output Voltage VCORE  
Range  
Vcore  
1.0  
3.3  
V
Average Voltage, I_out = 200 mA to  
3.7 A, using 0.5% tolerance  
feedback resistors  
Vc1  
Output Voltage VCORE  
Output Voltage VCORE  
-4.0  
4.0  
V
Average Voltage, I_out = 0 mA to  
200 mA, using 0.5% tolerance  
feedback resistors  
Vc2  
-4.0  
4.8  
6.0  
6.5  
V
Iclc  
Buck Switch Current Limit  
Gate Drive Rise Time  
Isense Resistor = 100 mΩ  
5.5  
40  
A
Cl = 500 pF, Vgs = 7 V (10% to  
90%)  
TRISE  
ns  
Cl = 500 pF, Vgs = 0 V (90% to  
10%)  
TFALL  
Gate Drive Fall Time  
40  
ns  
Fsw  
tss  
Switching Frequency  
Soft Start  
450  
3
500  
5
525  
7
kHz  
ms  
Average Voltage, I_out = 0 mA to  
1.2 A  
V25  
Output Voltage V2P5  
2.4  
2.5  
2.6  
V
Rds5  
Icl5  
Buck Switch Rdson  
Tj = 25°C  
300  
2.1  
mΩ  
Buck Switch Current Limit  
1.7  
2.5  
A
8
Copyright © 2017, Texas Instruments Incorporated  
DLPA100  
www.ti.com.cn  
ZHCSFY9 FEBRUARY 2017  
Electrical Characteristics (continued)  
over operating free-air temperature range (unless otherwise noted)  
PARAMETER  
Switching Frequency  
Soft Start  
TEST CONDITIONS  
MIN  
450  
3
TYP  
500  
5
MAX  
525  
7
UNIT  
kHz  
ms  
Fsw  
tss  
LINEAR REGULATORS  
Output Voltage  
VLIN1 Range  
1.0  
3.3  
3%  
V
Average voltage relative to target, I  
_load =2 mA to 75 mA, using 0.5%  
tolerance feedback resistors  
Vout  
Output Voltage VLIN1  
-3%  
ILIM  
RR  
VLIN1 Current Limit  
Ripple rejection  
100  
60  
150  
mA  
dB  
f = 120 Hz, Cout = 10 µF  
Feedback Input Bias  
Current  
IFB  
tss  
-400  
3
-100  
5
100  
7
nA  
ms  
Soft Start  
VLIN2 External  
FET Supply  
Voltage  
1.7  
1.0  
5.5  
3.3  
3%  
V
V
Output Voltage  
VLIN2 Range  
Average voltage relative to target, I  
_load = 10 mA to 1.2 mA, using  
0.5% tolerance feedback resistors  
Vout  
Output Voltage VLIN1  
Ripple rejection  
-3%  
RR  
IFB  
f = 120 Hz, Cout = 10 µF  
60  
-400  
3
dB  
nA  
ms  
Feedback Input Bias  
Current  
-100  
5
100  
7
tss  
Soft Start  
FAN CONTROLLERS  
Fpwm  
PWM switching frequency  
PWM switching frequency  
Controlled by DLPC4422 Software  
Controlled by DLPC4422 Software  
100  
24  
kHz  
Hz  
ns  
Fpwm  
Duty Cycle LSB  
Rds  
500  
875  
Rdson Buck Switch  
I = 200 mA  
1
Ω
Current Limit  
550  
mA  
Current Limit  
Blanking  
Controlled by DLPC4422 Software  
20  
µs  
COLOR WHEEL SWITCHING REGULATOR SUPPLY  
Average Voltage, I_out = 0 mA to  
VM  
Output Voltage  
maximum programmed load current.  
Buck inductor = 33 µH  
-5%  
5%  
Rds  
Icl  
Buck Switch Rdson  
Buck Switch Current Limit  
Fixed off-time  
Tj = 25°C  
500  
0%  
1.33  
4.7  
mΩ  
relative to target programmed value  
VM >6 V  
-20%  
20%  
Toff  
Toff  
Toff  
tss  
µs  
µs  
µs  
Fixed off-time  
2.6 V < VM <4.0 V  
VM < 1.5 V  
Fixed off-time  
17  
Soft Start  
COLOR WHEEL MOTOR DRIVER  
Pdm  
Rdson  
Rdson  
Im  
Power Dissipation  
Source Driver Rdson  
Sink Driver  
1.0  
600  
700  
1.4  
W
mΩ  
mΩ  
A
I = 1 A  
I = 1 A  
400  
500  
Drive Current  
Ib  
Brake Current  
2.5  
A
Copyright © 2017, Texas Instruments Incorporated  
9
DLPA100  
ZHCSFY9 FEBRUARY 2017  
www.ti.com.cn  
Electrical Characteristics (continued)  
over operating free-air temperature range (unless otherwise noted)  
PARAMETER  
TEST CONDITIONS  
MIN  
TYP  
MAX  
UNIT  
For brake current to change from  
maximum value (2.5 A) to the  
maximum drive current (1.4 A)  
Tb  
Brake Period  
800  
ms  
Controlled by DLPC4422 Software  
Controlled by DLPC4422 Software  
125  
250  
0.5  
20  
Kgm  
Vos  
Gm Constant  
Offset  
V
mV  
MHz  
ns  
Bemf Comp Hysteresis  
OSC (Motor Oscillator)  
OSC High Period  
OSC Low Period  
Vctap = 1.5 V to 6 V  
5
35  
5
Fosc  
Th  
100  
100  
TI  
ns  
MOTOR CHARACTERISTICS  
Rload  
#
Load Resistance  
Phase to Phase  
1.5  
4
15  
16  
Ω
Poles  
rpm  
rpm  
µs  
Poles  
12  
7200  
7200  
Poles = 12 or 16  
Poles = 4 or 8  
2880  
2880  
11160  
14880  
1736  
Speed  
Commutation Period -  
(60/[Speed(rpm) × 3 ×  
#Poles])  
4-Pole at 2880 rpm  
16-Pole at 11160 rpm  
112  
µs  
4-Pole at 14880 rpm  
8-Pole at 14880 rpm  
12-Pole at 11160 rpm  
16-Pole at 11160 rpm  
112  
56  
µs  
µs  
µs  
µs  
Time Constant - Phase to  
Phase inductance divided  
by Phase-to-Phase  
resistance  
L/R  
50  
37  
10  
Copyright © 2017, Texas Instruments Incorporated  
DLPA100  
www.ti.com.cn  
ZHCSFY9 FEBRUARY 2017  
7 Detailed Description  
7.1 Overview  
The DLPA100 is a power management and motor driver IC optimized for DLP video and data display systems  
and meant for use in either embedded or accessory projector applications. DLPA100 is part of the chipset  
comprising of the DLP660TE DMD and DLPC4422 controller.  
7.2 Functional Block Diagram  
Copyright © 2017, Texas Instruments Incorporated  
11  
DLPA100  
ZHCSFY9 FEBRUARY 2017  
www.ti.com.cn  
7.3 Feature Description  
7.3.1 Power Up Sequencing  
Once the VBB voltage reaches the VBBuvsd threshold (specification defined in Shutdown), the VCORE channel  
soft-starts within a period of 5 ms typical (tss). Once this period is completed and the VCOREuvlo has been  
reached, the V3P3 and V2P5 rails soft-start, ramping up ratiometrically. Once each of the three rails are above  
their respective undervoltage lockout levels (VCOREuvlo, V3P3uvlo, V2P5uvlo), the POSENSE flag will go high after  
a period of 150 ms typical (Tpor) and also, the VLIN1, VLIN2, V5 and VM rails soft-start, ramping up  
ratiometrically. Note that VLIN1, VLIN2, V5 and VM can be individually disabled via the serial port, although  
VLIN1 and VLIN2 require V5 to be present.  
The PWRGOOD flag will go high once the POSENSE is high and the VBB voltage is above the undervoltage  
lockout threshold VBBuvlo  
.
Figure 2. Power Up Sequencing Timing Diagram  
12  
Copyright © 2017, Texas Instruments Incorporated  
DLPA100  
www.ti.com.cn  
ZHCSFY9 FEBRUARY 2017  
Feature Description (continued)  
7.3.2 Power Down Sequencing  
If VBB drops below the undervoltage level (VBBuvlo), the PWRGOOD will flag. If VBB drops below the  
undervoltage level (VBBuvsd), all the switcher and linear channels will turn off and the output rails will be supplied  
by the output filter capacitors. The duration between VBBuvlo and VBBuvsd allows sufficient ‘hold up’ time to ‘park’  
the DMD mirrors. Although the regulators can supply rated current down to VBBuvsd, they can only provide this  
power for a maximum of 0.5 ms.  
If either of the rails: VCORE or V3P3 or V2P5 drop below their respective undervoltage levels, the POSENSE  
and PWRGOOD will flag immediately.  
Figure 3. Power Down Sequencing Timing Diagram  
7.3.3 Shutdown  
In the event of a fault either due to excessive junction temperature, or low voltage on VCP, or low voltage on  
VREG, or low VBB voltage, each switcher and linear channel is disabled.  
A low VBB voltage, VBBuvsd in this case, shuts down the DLPA100, protecting it from excessive power  
dissipation. An undervoltage power monitoring flag, PWRGOOD is also provided, to indicate when the VBB  
voltage is operating in and out of normal operating range.  
7.3.3.1 Thermal  
An overtemperature monitor provides a warning when the junction temperature reaches 130°C. The DLPA100 is  
protected from excessive temperatures by an internal circuit that will shut the device down immediately the  
junction temperature reaches 165°C. As soon as the temperature drops below the hysteresis level, the regulators  
will start-up again under soft-start control, assuming all other conditions are met (VCP, VBB etc.).  
7.3.4 System Reset  
The DLPA100 device can be reset by using the RESETZ input. This feature can be used during start-up  
conditions to reset the serial port registers to a known set of states. It can also be used during power-down  
conditions to disable certain features before complete shutdown occurs. The DLPC4422 display controller  
software controls which functions are reset to the power on reset (POR) state when RESETZ is initiated.  
MSKFAN: Masks the reset of the 3 fan drivers (POR state = disabled, PWM=0%).  
MSKREG: Masks the reset of linear regulators VLIN1 & VLIN2, and 5V switcher (POR state = enabled).  
MSKMOT: Masks the reset of the motor controller configuration registers (POR state = 0).  
MSKMOTE: Masks the reset of the motor controller output enable bit (POR state = disabled).  
Copyright © 2017, Texas Instruments Incorporated  
13  
 
DLPA100  
ZHCSFY9 FEBRUARY 2017  
www.ti.com.cn  
Feature Description (continued)  
7.3.5 Interrupt Logic  
PMDINTZ is an active low open drain output that will be asserted if the DLPA100 goes into thermal shutdown at  
165°C. The open drain output is held low by using the DLPA100 internal regulator even though the rest of the  
DLPA100 device is shut down. This internal regulator only depends on 12 V being operational to allow retention  
of the data in the latched status registers if any of the supplies are lost. PMDINTZ is primarily used as an  
interrupt to the DLP controller but can also be used to drive an LED overtemp indicator on the projector.  
The thermal warning signal (TWARN) can also trigger an interrupt if enabled. Over-current events for the three  
DLP controller supplies can also cause PMDINTZ to go low. The DLP controller processor can clear or set  
PMDINTZ by writing to the latches that capture the interrupts. The DLP controller can also mask any of the  
interrupts (except TSD) via the enable interrupt register.  
The raw status register can be read back in real time to monitor the fault condition. If the faults are present for a  
valid time, they will be latched into the latched status register.  
7.3.6 Serial Communications Port  
The Serial communications port (SCP) is a full duplex, synchronous, character-oriented byte port that allows  
exchange of data between the DLP controller (master) and the DLPA100.  
Table 1. Serial Communications Port Signal Definitions  
SIGNAL  
I/O  
FROM/TO  
TYPE  
DESCRIPTION  
SCP bus master to  
slave  
SCP bus serial transfer clock. The host processor (master)  
generates this clock.  
SCPK  
I
LVTTL compatible  
SCP bus access enable (low true). When high, slave will  
reset to idle state, and SCPDO output will tri-state. Pulling  
SCPENZ low initiates a read or write access. SCPENZ must  
remain low for an entire read/write access, and must be  
pulled high after the last data cycle. To abort a read or write  
cycle, pull SCPENZ high at any point.  
SCP bus master to  
slave  
SCPENZ  
I
LVTTL compatible  
SCP bus master to  
slave  
SCP bus serial data input. Data bits are valid and must be  
clocked in on the falling edge of SCPCK.  
SCPDI  
I
LVTTL compatible  
SCP bus slave to  
master  
LVTTL open drain w/tri- SCP bus serial data output. Data bits must clocked out on the  
state rising edge of SCPCK.  
SCPDO  
O
Table 2. Serial Interface Timing Requirements  
SYMBOL  
CHARACTERISTICS  
TEST CONDITIONS  
MIN  
NOM  
MAX  
UNIT  
A
Setup CSZ low to CLK  
Reference to rising edge of CLK  
360  
ns  
Nominally 1 CLK cycle rising edge to  
rising edge  
B
C
Byte to Byte Delay  
1.9  
µs  
Setup DIN to CSZ High  
CLK Frequency  
Last byte to slave disable  
360  
0
ns  
kHz  
µs  
526  
D
E
F
CLK Period  
1.9  
300  
300  
300  
2
CLK High or Low Time  
DIN Set-Up Time  
ns  
Reference to falling edge of CLK  
Reference from falling edge of CLK  
Reference from rising edge of CLK  
ns  
G
H
DIN Hold Time  
ns  
DOUT Propogation Delay  
CLK Filter (pulse reject)  
300  
ns  
200  
ns  
14  
Copyright © 2017, Texas Instruments Incorporated  
DLPA100  
www.ti.com.cn  
ZHCSFY9 FEBRUARY 2017  
Figure 4. Serial Communications Port Timing Diagram  
7.3.7 Switching Regulators  
The DLPA100 has four fixed frequency current mode control buck regulators that are used to provide power to  
integrated circuits in the system. The V5 regulator is used to power control functions in the DLPA100, as well as  
power the VLIN1 and VLIN2 linear regulators.  
The regulators require external fly back diodes, inductors and filter capacitors. Due to the high currents in the  
VCORE regulator, an external FET and sense resistor are required. The regulators will operate in both  
continuous and discontinuous mode. An internal blanking circuit will be used to filter out transients due to the  
reverse recovery of the external clamp diode.  
7.3.7.1 Output Voltage - VOUT  
All of the switchers apart from VCORE are regulated with respect to a 1.2 V reference (VFB). As the Core  
Regulator (VCORE) output voltage is adjustable from 1.0 V to 3.3 V the internal reference for this output is 0.8 V.  
Vout = VFB × (1 + R1/R2)  
(1)  
7.3.7.2 Adjustable Linear Regulator - VLIN1  
This low dropout type regulator features current limit for a shorted load. It includes an integrated n-channel pass  
element and can work with either ceramic or electrolytic output capacitors. The output can range between 1.0 V  
and 3.3 V. The output voltage of the adjustable regulator is set by:  
VLIN1 = VFB × (1+R1/R2) + (IFB × R2)  
where  
VFB= 0.8 V  
(2)  
7.3.7.3 Adjustable Linear Regulator Control - VLIN2  
An additional linear regulator is implemented with external n-channel pass element. The output can range  
between 1.0 V and 3.3 V. The output voltage of the adjustable regulator is set by:  
VLIN2 = VFB × (1+R3/R4) + (IFB × R4)  
where  
VFB= 0.8 V  
(3)  
Copyright © 2017, Texas Instruments Incorporated  
15  
DLPA100  
ZHCSFY9 FEBRUARY 2017  
www.ti.com.cn  
7.3.8 Fan Controllers  
The DLPA100 has three outputs available to be used as the switching node for either voltage mode step down  
switcher or ‘direct drive’ schemes. The output voltage is determined by a PWM value programmed using the  
DLPC4422 display controller software. The switching frequency for each output can be programmed using the  
DLPC4422 display controller software for either 100 kHz for applications requiring a step-down switcher, or 24  
Hz in applications that can utilize a direct drive scheme. The drivers in the ‘direct drive’ scheme are connected to  
the corresponding fans via a series resistor.  
The default condition at start-up will be separate control of each fan control channel and 100kHz switching  
frequency.  
7.3.9 Color Wheel Motor Driver  
The driver system is a three phase BEMF sensing motor controller and driver. Commutation is controlled by a  
proprietary BEMF sensing technique. It eliminates many external passive components and provides flexibility by  
allowing various timing parameters to be programmed via the serial port.  
7.3.9.1 Color Wheel Motor Driver Power Dissipation  
The maximum allowable power dissipation on motor driver is specified in the color wheel motor driver table.  
Motor driver power dissipation can be calculated as follows:  
Pdm = [VM – (KE × Sm) – Ispd × Rpp] × Ispd  
where  
Pdm = Power dissipation of motor driver  
VM = Programmed output voltage of the motor supply  
KE = Motor voltage constant in Volts/(rad/sec)  
Sm = Motor speed in rad/sec  
Ispd = Motor current at Sm speed  
Rpp = Phase-to-phase motor resistance  
(4)  
7.3.10 Color Wheel Switching Regulator Supply  
A fixed off time switching regulator is included to manage power dissipation for driving color wheels. For highly  
resistive motors requiring a low running current, Irun < 75 mA, using this regulator may not be required, in which  
case VM should be connected directly to VBB and the external inductor, capacitor & Schottky diode do not need  
to be fitted.  
7.4 Device Functional Modes  
DLPA100 device functional modes are controlled by the DLPC4422 display controller. See the DLPC4422  
display controller datasheet or contact a TI applications engineer.  
16  
Copyright © 2017, Texas Instruments Incorporated  
DLPA100  
www.ti.com.cn  
ZHCSFY9 FEBRUARY 2017  
8 Application and Implementation  
NOTE  
Information in the following applications sections is not part of the TI component  
specification, and TI does not warrant its accuracy or completeness. TI’s customers are  
responsible for determining suitability of components for their purposes. Customers should  
validate and test their design implementation to confirm system functionality.  
8.1 Application Information  
Texas Instruments DLP technology is a micro-electro-mechanical systems (MEMS) technology that modulates  
light using a digital micromirror device (DMD). DMDs vary in resolution and size and can contain over 8 million  
micromirrors. Each micromirror of a DMD can represent either one or more pixels on the display and is  
independently controlled, synchronized with color sequential illumination, to create stunning images on any  
surface. DLP technology enables a wide variety of display products worldwide, from tiny projection modules  
embedded in smartphones to high powered digital cinema projectors, and emerging display products such as  
digital signage and laser TV.  
In display applications using the DLP660TE DMD the DLPA100 provides all needed analog functions including  
the analog power supplies and the color wheel motor driver to provide a robust and efficient display solution.  
8.2 Typical Application  
When the DLPA100 power management device is combined with two display controllers (DLPC4422), an FPGA,  
and other electrical, optical and mechanical components the chipset enables bright, affordable, full 4K UHD  
display solutions. The DLPA100 power management and motor driver provides power supply sequencing and  
controls the color wheel motors, laser and LED currents as required by the application. A typical 4K UHD system  
application is shown in Figure 5.  
Figure 5. Typical 4K UHD Projector Application  
8.2.1 Design Requirements  
At the high level, DLP660TE DMD systems will include an illumination source, a light engine, electronic  
components, and software. The designer must first choose an illumination source and design the optical engine  
taking into consideration the relationship between the optics and the illumination source. The designer must then  
understand the electronic components of a DLP660TE DMD system. A display projector is created by using a  
DLP chipset comprised of DLP660TE DMD, DLPC4422 controller and DLPA100 power and motor driver. The  
DLPC4422 does the digital image processing, the DLPA100 provides the needed analog functions for the  
projector, and the DMD is the display device for producing the projected image.  
Copyright © 2017, Texas Instruments Incorporated  
17  
 
DLPA100  
ZHCSFY9 FEBRUARY 2017  
www.ti.com.cn  
Typical Application (continued)  
8.2.2 Detailed Design Procedure  
For connecting together the DLPC4422 digital display controller, the DLP660TE DMD, and the DLPA100, see the  
reference design schematic. Layout guidelines should be followed to achieve a reliable projector. To complete  
the DLP system an optical module or light engine is required that contains the DLP660TE DMD, associated  
illumination sources, optical elements, and necessary mechanical components.  
8.2.3 Application Curves  
Figure 6. Luminance vs. Current  
18  
Copyright © 2017, Texas Instruments Incorporated  
DLPA100  
www.ti.com.cn  
ZHCSFY9 FEBRUARY 2017  
9 Power Supply Recommendations  
The DLPA100 is designed to operate from a 12-V input voltage supply or battery. To avoid insufficient supply  
current due to line drop, ringing due to trace inductance at the VIN terminal, or supply peak current limitations,  
additional bulk capacitance may be required. If ringing occurs an electrolytic or tantalum type capacitor may be  
needed for damping. The amount of bulk capacitance required should be evaluated such that the input voltage  
can remain in specification long enough for a proper fast shutdown to occur as shown in Figure 3. The shutdown  
begins when the input voltage drops below the programmable UVLO threshold, such as when the external power  
supply or battery supply is suddenly removed from the system.  
Copyright © 2017, Texas Instruments Incorporated  
19  
DLPA100  
ZHCSFY9 FEBRUARY 2017  
www.ti.com.cn  
10 Layout  
10.1 Layout Guidelines  
The 12-V supply, VBB, should be provided on a separate plane, or portion of a shared power distribution plane.  
Each ceramic filter capacitor should be placed as close as possible to each VBB terminal: pins 9, 22, 37 and 42.  
The additional reservoir capacitor should also be placed as close as possible to the VBB terminals. The ground  
for VBB should be routed directly to the DLPA100 thermal pad connection.  
The PWB traces used on the switching regulators should be as short and wide as possible. The electrical loops  
formed between the VBB filter capacitors, input switch (LX pins), inductor, output capacitor and the diode should  
be as small as possible.  
An adjacent layer ground region covering the entire switching node should be provided for the pins: LXC (pin 25),  
LX5 (pin 23), LX33 (pin 43), LX25 (pin 41), and VMSW (pin10). Each of the switching nodes and all associated  
components should be located as near the DLPA100 device as possible.  
Avoid routing any noise sensitive signals near the DLPA100 device switching nodes and associated ground  
regions. The sensitive pins on the DLPA100 device consist of pins 1, 2, 3, 4, 5, 6, 8, and 48. If sensitive signals  
must be routed across the switching loops, use subdivided planes and/or multiple ground planes to avoid  
interference. Use of shielded inductors on the switching regulator circuits will minimize the possibility of crosstalk  
and interference.  
High current paths should have an adequate number of vias to minimize resistance and inductance. Placement  
and routing priority should be given to the higher current circuits. For example, the VCORE supply should take  
precedence over a fan PWM output. The following is the order of precedence from highest to lowest:  
1. VCORE  
2. V5  
3. V3P3  
4. V2P5  
5. VM  
6. VLIN2  
7. VLIN1  
8. FAN1, FAN2, FAN3  
Suitable kelvin connections should be provided for the regulator feedback pins: FBC (pin 30), V2P5 (pin 46),  
V3P3 (pin 45), V5 (pin 24), FB1 (pin 31) & FB2 (pin 32) and for sense pins: SENSE (pin 14), ISEN (pin 28) &  
ISENK (pin 27). Also note that the external feedback networks used for the VCORE and VLIN1 regulators should  
also deploy kelvin connections. The feedback pin traces FBC, FB1, FB2 are most prone to interference and  
should be located near the DLPA100 device.  
10.2 Grounding Guidelines  
Ground pin 19 is isolated internally to the DLPA100 from pins 7 and 44. All three ground pins should be tied  
together on the PWB at the DLPA100 thermal pad connection. Depending on the application there are three  
grounding approaches for board layout:  
1. Completely isolated ground regions for the DLPA100 subcircuits.  
2. Single isolated ground region for the collective DLPA100 circuit.  
3. Non-isolated common ground region for the entire board.  
The most favorable approach should be carefully considered for the specific application.  
20  
Copyright © 2017, Texas Instruments Incorporated  
DLPA100  
www.ti.com.cn  
ZHCSFY9 FEBRUARY 2017  
Grounding Guidelines (continued)  
10.2.1 Completely Isolated Ground Regions  
In this case, the PWB has an isolated ground layer around the DLPA100 circuit which serves as a “noisy” ground  
for the motor driver, switchers, and linear regulators. This plane can be subdivided into isolated sections around  
each switcher, linear regulator and motor block to minimize the possibility of noise crosstalk between the  
regulator circuits. See Figure 7. Each isolated section should be connected in a “star” configuration at the  
DLPA100 thermal pad position. An additional “quiet” solid ground plane should be provided on a separate layer  
for reference to the sensitive blocks of the DLPA100 device and other sensitive external circuitry. The sensitive  
pins on the DLPA100 device are pins 1, 2, 3, 4, 5, 6, 8, and 48. The quiet ground plane should connect to the  
DLPA100 device with the array of thermal vias.  
Figure 7. Noisy Ground Layer  
Figure 8. PWB Planes  
10.2.2 Single Isolated Ground Region  
In this case, the PWB has a single isolated ground layer around the DLPA100 circuit. This ground layer serves  
as a “noisy” ground for the switchers, linear regulators, and motor driver. An additional “quiet” solid ground plane  
should be provided on a separate layer for reference to the sensitive blocks of the DLPA100 and other sensitive  
external circuitry. Connect the “quiet” and “noisy” ground planes at the DLPA100 thermal pad array of vias.  
10.2.3 Non-isolated Common Ground Region  
In this case, the PWB has a solid non-isolated common ground layer for the entire board. In this configuration,  
use particular care during component placement and separate the noisy portions of the DLPA100 circuit from  
other sensitive signals on the board. The ground plane should connect to the DLPA100 with the array of thermal  
vias.  
Copyright © 2017, Texas Instruments Incorporated  
21  
 
DLPA100  
ZHCSFY9 FEBRUARY 2017  
www.ti.com.cn  
10.3 Thermal Guidelines  
The PWB should have a thermal pad underneath the DLPA100 on both the top and bottom layers. The thermal  
pad on the top layer should extend to the edge of the terminal pads and include a 4x4 array of thermal vias.  
These thermal pads should connect to the internal ground planes via the thermal vias. It is recommended that  
the internal ground plane should extend for at least 20 square inches.  
Careful consideration should be taken in providing an adequate amount of copper traces around the discrete  
Schottky diodes and MOSFET terminals used in the switching and linear converters to ensure proper thermal  
management. The thermal impedance (Tj-a) of each component should be calculated to determine the  
corresponding amount of copper required. If using an internal plane, it is important to use an array of thermal  
vias underneath the device tab or terminal to assist in the transfer of the heat.  
10.4 Motor Control Guidelines  
The DLPA100 motor control terminals should be filtered with voltage transient suppressing devices for improved  
startup reliability and noise immunity. Schottky diodes should be placed cathode to anode between VBB to motor  
terminals OUTA (pin 12), OUTB (pin 15), OUTC (pin 16) and CTAP (pin 13). Schottky diodes should also be  
placed cathode to anode between motor terminals OUTA (pin 12), OUTB (pin 15), OUTC (pin 16) and CTAP (pin  
13) to ground. Series RC snubbers consisting of a capacitor (0.001 μF) in series with a resistor (150 Ω) should  
be placed between the motor terminals OUTA (pin12), OUTB (pin 15), and OUTC (pin 16) to CTAP (pin 13).  
The value of the motor current sensing resistor on SENSE (pin 14) should be thoroughly evaluated for the  
application. Careful consideration should be taken in the amount of current draw during motor startup and  
braking with respect to the speed range and speed change timing requirements. It is recommended that the  
SENSE (pin 14) voltage does not exceed 450 mV. Most motors from today’s modern technology have relatively  
low operating currents but higher start-up currents which make it very difficult to achieve good signal to noise  
ratio during operating range and meet the 450 mV maximum on SENSE (pin 14). Most motors have  
demonstrated success well below 100 mV steady-state SENSE (pin 14) voltage. As long as good layout and  
component selection practices are followed, acceptable signal to noise ratios can be achieved at such low  
operating SENSE (pin 14) voltages. The typical SENSE resistor value ranges from 0.47 Ω to 2.2 Ω. A 1.0-Ω  
SENSE resistor value is suggested as a good starting point. Typically the steady-state SENSE (pin 14) voltage  
with a 1.0-Ω resistor will be near 100 mV.  
22  
版权 © 2017, Texas Instruments Incorporated  
DLPA100  
www.ti.com.cn  
ZHCSFY9 FEBRUARY 2017  
10.5 Layout Example  
Figure 9. Top Layer  
版权 © 2017, Texas Instruments Incorporated  
23  
DLPA100  
ZHCSFY9 FEBRUARY 2017  
www.ti.com.cn  
11 器件和文档支持  
11.1 器件标记  
10. 器件标记  
11.2 文档支持  
11.2.1 相关文档ꢀ  
相关文档如下:  
DLPC4422 显示控制器数据表》  
DLP660TE DMD 数据表》  
11.3 社区资源  
The following links connect to TI community resources. Linked contents are provided "AS IS" by the respective  
contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of  
Use.  
TI E2E™ Online Community TI's Engineer-to-Engineer (E2E) Community. Created to foster collaboration  
among engineers. At e2e.ti.com, you can ask questions, share knowledge, explore ideas and help  
solve problems with fellow engineers.  
Design Support TI's Design Support Quickly find helpful E2E forums along with design support tools and  
contact information for technical support.  
11.4 商标  
E2E is a trademark of Texas Instruments.  
DLP is a registered trademark of Texas Instruments.  
11.5 静电放电警告  
ESD 可能会损坏该集成电路。德州仪器 (TI) 建议通过适当的预防措施处理所有集成电路。如果不遵守正确的处理措施和安装程序 , 可  
能会损坏集成电路。  
ESD 的损坏小至导致微小的性能降级 , 大至整个器件故障。 精密的集成电路可能更容易受到损坏 , 这是因为非常细微的参数更改都可  
能会导致器件与其发布的规格不相符。  
11.6 Glossary  
SLYZ022 TI Glossary.  
This glossary lists and explains terms, acronyms, and definitions.  
24  
版权 © 2017, Texas Instruments Incorporated  
DLPA100  
www.ti.com.cn  
ZHCSFY9 FEBRUARY 2017  
12 机械、封装和可订购信息  
以下页中包括机械、封装和可订购信息。这些信息是针对指定器件可提供的最新数据。这些数据会在无通知且不对  
本文档进行修订的情况下发生改变。欲获得该数据表的浏览器版本,请查阅左侧的导航栏。  
版权 © 2017, Texas Instruments Incorporated  
25  
PACKAGE OPTION ADDENDUM  
www.ti.com  
17-Mar-2023  
PACKAGING INFORMATION  
Orderable Device  
Status Package Type Package Pins Package  
Eco Plan  
Lead finish/  
Ball material  
MSL Peak Temp  
Op Temp (°C)  
Device Marking  
Samples  
Drawing  
Qty  
(1)  
(2)  
(3)  
(4/5)  
(6)  
DLPA100PT  
ACTIVE  
48  
260  
TBD  
Call TI  
Call TI  
0 to 75  
Samples  
(1) The marketing status values are defined as follows:  
ACTIVE: Product device recommended for new designs.  
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.  
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.  
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.  
OBSOLETE: TI has discontinued the production of the device.  
(2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance  
do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may  
reference these types of products as "Pb-Free".  
RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.  
Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based  
flame retardants must also meet the <=1000ppm threshold requirement.  
(3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.  
(4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.  
(5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation  
of the previous line and the two combined represent the entire Device Marking for that device.  
(6)  
Lead finish/Ball material - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead finish/Ball material values may wrap to two  
lines if the finish value exceeds the maximum column width.  
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information  
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and  
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.  
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.  
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.  
Addendum-Page 1  
重要声明和免责声明  
TI“按原样提供技术和可靠性数据(包括数据表)、设计资源(包括参考设计)、应用或其他设计建议、网络工具、安全信息和其他资源,  
不保证没有瑕疵且不做出任何明示或暗示的担保,包括但不限于对适销性、某特定用途方面的适用性或不侵犯任何第三方知识产权的暗示担  
保。  
这些资源可供使用 TI 产品进行设计的熟练开发人员使用。您将自行承担以下全部责任:(1) 针对您的应用选择合适的 TI 产品,(2) 设计、验  
证并测试您的应用,(3) 确保您的应用满足相应标准以及任何其他功能安全、信息安全、监管或其他要求。  
这些资源如有变更,恕不另行通知。TI 授权您仅可将这些资源用于研发本资源所述的 TI 产品的应用。严禁对这些资源进行其他复制或展示。  
您无权使用任何其他 TI 知识产权或任何第三方知识产权。您应全额赔偿因在这些资源的使用中对 TI 及其代表造成的任何索赔、损害、成  
本、损失和债务,TI 对此概不负责。  
TI 提供的产品受 TI 的销售条款ti.com 上其他适用条款/TI 产品随附的其他适用条款的约束。TI 提供这些资源并不会扩展或以其他方式更改  
TI 针对 TI 产品发布的适用的担保或担保免责声明。  
TI 反对并拒绝您可能提出的任何其他或不同的条款。IMPORTANT NOTICE  
邮寄地址:Texas Instruments, Post Office Box 655303, Dallas, Texas 75265  
Copyright © 2023,德州仪器 (TI) 公司  

相关型号:

DLPA200

DLP® DLPA200 DMD Micromirror Driver
TI

DLPA2000

DLP® PMIC/LED driver for DLP2010 (0.2 WVGA) DMD
TI

DLPA2000DYFFR

DLP® PMIC/LED driver for DLP2010 (0.2 WVGA) DMD | YFF | 56 | -10 to 85
TI

DLPA2005

DLP® PMIC/LED driver for DLP2010 and DLP2010NIR (0.2 WVGA) DMDs
TI

DLPA2005ERSLR

DLP® PMIC/LED driver for DLP2010 and DLP2010NIR (0.2 WVGA) DMDs | RSL | 48 | -10 to 85
TI

DLPA2005ERSLT

DLP® PMIC/LED driver for DLP2010 and DLP2010NIR (0.2 WVGA) DMDs | RSL | 48 | -10 to 85
TI

DLPA200PFC

DLP® DLPA200 DMD Micromirror Driver
TI

DLPA200PFCT

DLP® DLPA200 DMD Micromirror Driver
TI

DLPA200PFP

DMD Micromirror Driver
TI

DLPA200_1

DLP® DLPA200 DMD Micromirror Driver
TI

DLPA300

DLP® driver  for DLP780NE (0.78 1080p), DLP780TE (0.78 4K UHD), DLP800RE (0.80 WUXGA) DM
TI

DLPA3000

DLP® PMIC/LED driver for DLP3010 (0.3 720p) DMD
TI