DLPA100PT [TI]
DLP® driver for DLP660TE (0.66 4K UHD) DMD | DLP | 48 | 0 to 75;型号: | DLPA100PT |
厂家: | TEXAS INSTRUMENTS |
描述: | DLP® driver for DLP660TE (0.66 4K UHD) DMD | DLP | 48 | 0 to 75 |
文件: | 总27页 (文件大小:1212K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
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DLPA100
ZHCSFY9 –FEBRUARY 2017
DLPA100 电源管理和电机驱动器
1 特性
3 说明
1
•
•
•
•
3.3V 开关稳压器 - 逻辑电源
DLPA100 是一款专用电源管理和电机控制驱动器,适
用于 DLP®4K UHD TRP 显示芯片组。DLPA100 与
DLP660TE 数字微镜器件和 DLPC4422 显示控制器共
同构成芯片组。这款解决方案非常适合需要高分辨率、
高亮度和系统简易性的显示系统。为了确保操作可靠
性,DLP660TE DMD 和 DLPC4422 显示控制器必须
始终与 DLPA100 电源管理和电机驱动器件搭配使用。
具有使能功能的 5V 开关稳压器 - 模拟电路电源
1.0V 至 3.3V 可调节开关稳压器 - 内核电源
具有使能功能的可调节线性稳压器 - 锁相环 (PLL)
电源
•
•
•
•
•
•
•
•
•
•
具有使能功能的可调节线性稳压器控制 - 模拟电源
2.5V 开关稳压器数字电源
电源序列控制
器件信息(1)
电源监控电路
器件型号
DLPA100
封装
PT (48)
封装尺寸(标称值)
适用于高侧驱动的集成电荷泵
三个风扇驱动器
0.276mm x 0.276mm
(1) 要了解所有可用封装,请见数据表末尾的可订购产品附录。
热关断电路
串行通信接口
图 1. 典型应用图
三相反电动势 (BEMF) 电动机驱动器/控制器
电机电源开关稳压器
2 应用
•
•
•
•
4K 超高清 (UHD) 显示屏
激光电视 (TV)
数字标牌
投影映射
1
An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,
intellectual property matters and other important disclaimers. PRODUCTION DATA.
English Data Sheet: DLPS082
DLPA100
ZHCSFY9 –FEBRUARY 2017
www.ti.com.cn
目录
1
2
3
4
5
6
特性.......................................................................... 1
8
9
Application and Implementation ........................ 17
8.1 Application Information............................................ 17
8.2 Typical Application ................................................. 17
Power Supply Recommendations...................... 19
应用.......................................................................... 1
说明.......................................................................... 1
修订历史记录 ........................................................... 3
Pin Configuration and Functions......................... 4
Specifications......................................................... 7
6.1 Absolute Maximum Ratings ...................................... 7
6.2 Storage Conditions.................................................... 7
6.3 ESD Ratings ............................................................ 7
6.4 Recommended Operating Conditions....................... 7
6.5 Thermal Information.................................................. 7
6.6 Electrical Characteristics........................................... 8
Detailed Description ............................................ 11
7.1 Overview ................................................................. 11
7.2 Functional Block Diagram ....................................... 11
7.3 Feature Description................................................. 12
7.4 Device Functional Modes........................................ 16
10 Layout................................................................... 20
10.1 Layout Guidelines ................................................. 20
10.2 Grounding Guidelines ........................................... 20
10.3 Thermal Guidelines............................................... 22
10.4 Motor Control Guidelines ...................................... 22
10.5 Layout Example .................................................... 23
11 器件和文档支持 ..................................................... 24
11.1 器件标记................................................................ 24
11.2 文档支持 ............................................................... 24
11.3 社区资源................................................................ 24
11.4 商标....................................................................... 24
11.5 静电放电警告......................................................... 24
11.6 Glossary................................................................ 24
12 机械、封装和可订购信息....................................... 25
7
2
版权 © 2017, Texas Instruments Incorporated
DLPA100
www.ti.com.cn
ZHCSFY9 –FEBRUARY 2017
4 修订历史记录
日期
修订版本
注释
*
首次发布。
Copyright © 2017, Texas Instruments Incorporated
3
DLPA100
ZHCSFY9 –FEBRUARY 2017
www.ti.com.cn
5 Pin Configuration and Functions
( PT package)
(48 pin QFP)
Top View
4
Copyright © 2017, Texas Instruments Incorporated
DLPA100
www.ti.com.cn
ZHCSFY9 –FEBRUARY 2017
Pin Functions
PIN
I/O
DESCRIPTION
NAME
DOUT
CLK
NO.
1
Output
Input
Data Out for Serial Port
2
Clock for Serial Port
DIN
3
Input
Data In for Serial Port
Chip Select for Serial Port
Motor Speed Indication
CSZ
4
Input
TACH
OSC
5
Output
Input
6
Master Osc for Digital Timing – 2 MHz typical
Ground
GND
7
Ground
Input
GMIN
VBB
8
Motor Gm Input
9
Power
Output
Input
VBB Load Supply
VMSW
VM
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
29
30
31
32
33
34
35
36
37
38
39
40
41
42
43
44
45
46
Motor Supply Switching Node
Motor Supply INPUT/FB
Motor Phase A
OUTA
CTAP
SENSE
OUTB
OUTC
CP2
Output
Input/Output Motor Centertap
Input
Output
Output
Power
Power
Ground
Power
Power
Power
Output
Motor Current Sensing
Motor Phase B
Motor Phase C
Charge Pump
CP1
Charge Pump
GND
Ground
VREG
VCP
Internal Bias Regulator Terminal
Charge Pump Reservoir Capacitor Terminal
VBB Load Supply
VBB
LX5
5V Regulator Switching Node
V5
Power Input 5V Feedback and Logic Supply Input
Power Output Adjustable Core Regulator Switching Node
Power Output Gate Drive for Core Regulator
LXC
GDC
ISENK
ISEN
VLIN1
FBC
Input
Input
Kelvin Sense for Core Regulator
Current Sense for Core Regulator
Power Output VLIN1 Linear Regulator Output
Power Input Adjustable Core Switching Regulator Feedback Node
Power Input VLIN1 Adjustable Feedback Node
Power Input VLIN2 Adjustable Feedback Node
Power Output VLIN2 Linear Gate Drive Output
FB1
FB2
GD2
POSENSE
PWRGOOD
PMDINTZ
VBB
Output
Output
Output
Power
Output
Output
Output
Power On Reset Output
Power Good Output
Interrupt Flag
Motor Supply Terminal
Fan 3 Switching Node Output
Fan 2 Switching Node Output
Fan 1 Switching Node Output
F3SW
F2SW
F1SW
LX25
VBB
Power Output 2.5V Regulator Switching Node
Power VBB Load Supply
Power Output 3.3V Regulator Switching Node
Ground Ground
LX33
GND
V3P3
V2P5
Power Input 3.3V Feedback
Power Input 2.5V Feedback
Copyright © 2017, Texas Instruments Incorporated
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DLPA100
ZHCSFY9 –FEBRUARY 2017
www.ti.com.cn
Pin Functions (continued)
PIN
I/O
DESCRIPTION
NAME
TRIM
NO.
47
Power
Input
Trim Pin (must be tied to VREG)
Forced Reset
RESETZ
48
6
Copyright © 2017, Texas Instruments Incorporated
DLPA100
www.ti.com.cn
ZHCSFY9 –FEBRUARY 2017
6 Specifications
6.1 Absolute Maximum Ratings
over operating free-air temperature range (unless otherwise noted)(1)
PARAMETER
MIN
MAX
UNIT
V
VBB
tramp
Vx
Load Supply Voltage
15
Time to ramp from 0V to VBB
200
-1
µs
V
LX33, LXC, LX5, OUTA, OUTB, OUTC
Vin
Logic Inputs (RESETZ, CLK, DIN, CSZ, OSC)
Open Drain Logic Outputs (PWRGOOD, DOUT, POSENSE, PMDINTZ, TACH)
-0.3
7
7
V
Vout
V
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended
Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
6.2 Storage Conditions
MIN
MAX
UNIT
Tstg
Storage temperature
-55
150
°C
6.3 ESD Ratings
VALUE
UNIT
Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1)
±2000
V(ESD)
Electrostatic discharge
V
Charged-device model (CDM), per JEDEC specification JESD22-
C101(2)
±1000
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.
6.4 Recommended Operating Conditions
over operating free-air temperature range (unless otherwise noted)
MIN
NOM
MAX
15
UNIT
V
VBB
Ta
Load supply voltage
Operational ambient temperature
Maximum Operational junction temperature
0
75
°C
Tj
150
°C
6.5 Thermal Information
DLPA100
THERMAL METRIC(1)
LQFP
48 PINS
23
UNIT
RθJA
Junction-to-ambient thermal resistance
°C/W
°C/W
RθJC(top)
Junction-to-case (top) thermal resistance
2
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application
report.
Copyright © 2017, Texas Instruments Incorporated
7
DLPA100
ZHCSFY9 –FEBRUARY 2017
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6.6 Electrical Characteristics
over operating free-air temperature range (unless otherwise noted)
PARAMETER
Supply Current
TEST CONDITIONS
MIN
TYP
MAX
UNIT
IBB1
IBB2
Motors and fans off
26
mA
All Regulators Operating, I_load= 0
mA
Supply Current
Supply Current
36
mA
A
x3 fans = 100% mode @ 200 mA
load, VM = 100% mode @ 200 mA
IBB3
2.7
CONTROL LOGIC
VIL
Logic Input Voltage
(RESETZ, CLK, DIN, CSZ,
OSC)
0.8
V
V
VIH
2.0
IIL
VIN = 5
VIN = 0
-20
-20
<1.0
20
20
µA
µA
Logic Input Current
IIH
<-1.0
Open Drain Logic Outputs
(PWRGOOD, DOUT,
POSENSE,PMDINTZ,
TACH)
Vlow
I = 4 mA
0.4
1
V
Logic Output Leakage
Current
Iout
V = 3.3 V
µA
CHARGE PUMP
VCP
Output Voltage
Relative to VBB
7.25
5.5
V
V
VCPuvlo
VCP Undervoltage
SWITCHING REGULATORS
Average Voltage, I_out = 0 mA to
1.6 A
V5
Output Voltage V5
4.75
5
5.25
V
Rds5
Icl5
Buck Switch Rdson
Buck Switch Current Limit
Switching Frequency
Soft Start
Tj = 25°C
150
3.4
500
5
mΩ
A
2.8
450
3
4.0
525
7
Fsw
tss
kHz
ms
Average Voltage, I_out = 0 mA to
1.6 A
V33
Output Voltage V3P3
3.168
3.3
3.432
V
Rds33
Icl33
Fsw
Buck Switch Rdson
Buck Switch Current Limit
Switching Frequency
Soft Start
Tj = 25°C
300
2.8
500
5
mΩ
A
2.4
450
3
3.4
525
7
kHz
ms
tss
Output Voltage VCORE
Range
Vcore
1.0
3.3
V
Average Voltage, I_out = 200 mA to
3.7 A, using 0.5% tolerance
feedback resistors
Vc1
Output Voltage VCORE
Output Voltage VCORE
-4.0
4.0
V
Average Voltage, I_out = 0 mA to
200 mA, using 0.5% tolerance
feedback resistors
Vc2
-4.0
4.8
6.0
6.5
V
Iclc
Buck Switch Current Limit
Gate Drive Rise Time
Isense Resistor = 100 mΩ
5.5
40
A
Cl = 500 pF, Vgs = 7 V (10% to
90%)
TRISE
ns
Cl = 500 pF, Vgs = 0 V (90% to
10%)
TFALL
Gate Drive Fall Time
40
ns
Fsw
tss
Switching Frequency
Soft Start
450
3
500
5
525
7
kHz
ms
Average Voltage, I_out = 0 mA to
1.2 A
V25
Output Voltage V2P5
2.4
2.5
2.6
V
Rds5
Icl5
Buck Switch Rdson
Tj = 25°C
300
2.1
mΩ
Buck Switch Current Limit
1.7
2.5
A
8
Copyright © 2017, Texas Instruments Incorporated
DLPA100
www.ti.com.cn
ZHCSFY9 –FEBRUARY 2017
Electrical Characteristics (continued)
over operating free-air temperature range (unless otherwise noted)
PARAMETER
Switching Frequency
Soft Start
TEST CONDITIONS
MIN
450
3
TYP
500
5
MAX
525
7
UNIT
kHz
ms
Fsw
tss
LINEAR REGULATORS
Output Voltage
VLIN1 Range
1.0
3.3
3%
V
Average voltage relative to target, I
_load =2 mA to 75 mA, using 0.5%
tolerance feedback resistors
Vout
Output Voltage VLIN1
-3%
ILIM
RR
VLIN1 Current Limit
Ripple rejection
100
60
150
mA
dB
f = 120 Hz, Cout = 10 µF
Feedback Input Bias
Current
IFB
tss
-400
3
-100
5
100
7
nA
ms
Soft Start
VLIN2 External
FET Supply
Voltage
1.7
1.0
5.5
3.3
3%
V
V
Output Voltage
VLIN2 Range
Average voltage relative to target, I
_load = 10 mA to 1.2 mA, using
0.5% tolerance feedback resistors
Vout
Output Voltage VLIN1
Ripple rejection
-3%
RR
IFB
f = 120 Hz, Cout = 10 µF
60
-400
3
dB
nA
ms
Feedback Input Bias
Current
-100
5
100
7
tss
Soft Start
FAN CONTROLLERS
Fpwm
PWM switching frequency
PWM switching frequency
Controlled by DLPC4422 Software
Controlled by DLPC4422 Software
100
24
kHz
Hz
ns
Fpwm
Duty Cycle LSB
Rds
500
875
Rdson Buck Switch
I = 200 mA
1
Ω
Current Limit
550
mA
Current Limit
Blanking
Controlled by DLPC4422 Software
20
µs
COLOR WHEEL SWITCHING REGULATOR SUPPLY
Average Voltage, I_out = 0 mA to
VM
Output Voltage
maximum programmed load current.
Buck inductor = 33 µH
-5%
5%
Rds
Icl
Buck Switch Rdson
Buck Switch Current Limit
Fixed off-time
Tj = 25°C
500
0%
1.33
4.7
mΩ
relative to target programmed value
VM >6 V
-20%
20%
Toff
Toff
Toff
tss
µs
µs
µs
Fixed off-time
2.6 V < VM <4.0 V
VM < 1.5 V
Fixed off-time
17
Soft Start
COLOR WHEEL MOTOR DRIVER
Pdm
Rdson
Rdson
Im
Power Dissipation
Source Driver Rdson
Sink Driver
1.0
600
700
1.4
W
mΩ
mΩ
A
I = 1 A
I = 1 A
400
500
Drive Current
Ib
Brake Current
2.5
A
Copyright © 2017, Texas Instruments Incorporated
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DLPA100
ZHCSFY9 –FEBRUARY 2017
www.ti.com.cn
Electrical Characteristics (continued)
over operating free-air temperature range (unless otherwise noted)
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
UNIT
For brake current to change from
maximum value (2.5 A) to the
maximum drive current (1.4 A)
Tb
Brake Period
800
ms
Controlled by DLPC4422 Software
Controlled by DLPC4422 Software
125
250
0.5
20
Kgm
Vos
Gm Constant
Offset
V
mV
MHz
ns
Bemf Comp Hysteresis
OSC (Motor Oscillator)
OSC High Period
OSC Low Period
Vctap = 1.5 V to 6 V
5
35
5
Fosc
Th
100
100
TI
ns
MOTOR CHARACTERISTICS
Rload
#
Load Resistance
Phase to Phase
1.5
4
15
16
Ω
Poles
rpm
rpm
µs
Poles
12
7200
7200
Poles = 12 or 16
Poles = 4 or 8
2880
2880
11160
14880
1736
Speed
Commutation Period -
(60/[Speed(rpm) × 3 ×
#Poles])
4-Pole at 2880 rpm
16-Pole at 11160 rpm
112
µs
4-Pole at 14880 rpm
8-Pole at 14880 rpm
12-Pole at 11160 rpm
16-Pole at 11160 rpm
112
56
µs
µs
µs
µs
Time Constant - Phase to
Phase inductance divided
by Phase-to-Phase
resistance
L/R
50
37
10
Copyright © 2017, Texas Instruments Incorporated
DLPA100
www.ti.com.cn
ZHCSFY9 –FEBRUARY 2017
7 Detailed Description
7.1 Overview
The DLPA100 is a power management and motor driver IC optimized for DLP video and data display systems
and meant for use in either embedded or accessory projector applications. DLPA100 is part of the chipset
comprising of the DLP660TE DMD and DLPC4422 controller.
7.2 Functional Block Diagram
Copyright © 2017, Texas Instruments Incorporated
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ZHCSFY9 –FEBRUARY 2017
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7.3 Feature Description
7.3.1 Power Up Sequencing
Once the VBB voltage reaches the VBBuvsd threshold (specification defined in Shutdown), the VCORE channel
soft-starts within a period of 5 ms typical (tss). Once this period is completed and the VCOREuvlo has been
reached, the V3P3 and V2P5 rails soft-start, ramping up ratiometrically. Once each of the three rails are above
their respective undervoltage lockout levels (VCOREuvlo, V3P3uvlo, V2P5uvlo), the POSENSE flag will go high after
a period of 150 ms typical (Tpor) and also, the VLIN1, VLIN2, V5 and VM rails soft-start, ramping up
ratiometrically. Note that VLIN1, VLIN2, V5 and VM can be individually disabled via the serial port, although
VLIN1 and VLIN2 require V5 to be present.
The PWRGOOD flag will go high once the POSENSE is high and the VBB voltage is above the undervoltage
lockout threshold VBBuvlo
.
Figure 2. Power Up Sequencing Timing Diagram
12
Copyright © 2017, Texas Instruments Incorporated
DLPA100
www.ti.com.cn
ZHCSFY9 –FEBRUARY 2017
Feature Description (continued)
7.3.2 Power Down Sequencing
If VBB drops below the undervoltage level (VBBuvlo), the PWRGOOD will flag. If VBB drops below the
undervoltage level (VBBuvsd), all the switcher and linear channels will turn off and the output rails will be supplied
by the output filter capacitors. The duration between VBBuvlo and VBBuvsd allows sufficient ‘hold up’ time to ‘park’
the DMD mirrors. Although the regulators can supply rated current down to VBBuvsd, they can only provide this
power for a maximum of 0.5 ms.
If either of the rails: VCORE or V3P3 or V2P5 drop below their respective undervoltage levels, the POSENSE
and PWRGOOD will flag immediately.
Figure 3. Power Down Sequencing Timing Diagram
7.3.3 Shutdown
In the event of a fault either due to excessive junction temperature, or low voltage on VCP, or low voltage on
VREG, or low VBB voltage, each switcher and linear channel is disabled.
A low VBB voltage, VBBuvsd in this case, shuts down the DLPA100, protecting it from excessive power
dissipation. An undervoltage power monitoring flag, PWRGOOD is also provided, to indicate when the VBB
voltage is operating in and out of normal operating range.
7.3.3.1 Thermal
An overtemperature monitor provides a warning when the junction temperature reaches 130°C. The DLPA100 is
protected from excessive temperatures by an internal circuit that will shut the device down immediately the
junction temperature reaches 165°C. As soon as the temperature drops below the hysteresis level, the regulators
will start-up again under soft-start control, assuming all other conditions are met (VCP, VBB etc.).
7.3.4 System Reset
The DLPA100 device can be reset by using the RESETZ input. This feature can be used during start-up
conditions to reset the serial port registers to a known set of states. It can also be used during power-down
conditions to disable certain features before complete shutdown occurs. The DLPC4422 display controller
software controls which functions are reset to the power on reset (POR) state when RESETZ is initiated.
•
•
•
•
MSKFAN: Masks the reset of the 3 fan drivers (POR state = disabled, PWM=0%).
MSKREG: Masks the reset of linear regulators VLIN1 & VLIN2, and 5V switcher (POR state = enabled).
MSKMOT: Masks the reset of the motor controller configuration registers (POR state = 0).
MSKMOTE: Masks the reset of the motor controller output enable bit (POR state = disabled).
Copyright © 2017, Texas Instruments Incorporated
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ZHCSFY9 –FEBRUARY 2017
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Feature Description (continued)
7.3.5 Interrupt Logic
PMDINTZ is an active low open drain output that will be asserted if the DLPA100 goes into thermal shutdown at
165°C. The open drain output is held low by using the DLPA100 internal regulator even though the rest of the
DLPA100 device is shut down. This internal regulator only depends on 12 V being operational to allow retention
of the data in the latched status registers if any of the supplies are lost. PMDINTZ is primarily used as an
interrupt to the DLP controller but can also be used to drive an LED overtemp indicator on the projector.
The thermal warning signal (TWARN) can also trigger an interrupt if enabled. Over-current events for the three
DLP controller supplies can also cause PMDINTZ to go low. The DLP controller processor can clear or set
PMDINTZ by writing to the latches that capture the interrupts. The DLP controller can also mask any of the
interrupts (except TSD) via the enable interrupt register.
The raw status register can be read back in real time to monitor the fault condition. If the faults are present for a
valid time, they will be latched into the latched status register.
7.3.6 Serial Communications Port
The Serial communications port (SCP) is a full duplex, synchronous, character-oriented byte port that allows
exchange of data between the DLP controller (master) and the DLPA100.
Table 1. Serial Communications Port Signal Definitions
SIGNAL
I/O
FROM/TO
TYPE
DESCRIPTION
SCP bus master to
slave
SCP bus serial transfer clock. The host processor (master)
generates this clock.
SCPK
I
LVTTL compatible
SCP bus access enable (low true). When high, slave will
reset to idle state, and SCPDO output will tri-state. Pulling
SCPENZ low initiates a read or write access. SCPENZ must
remain low for an entire read/write access, and must be
pulled high after the last data cycle. To abort a read or write
cycle, pull SCPENZ high at any point.
SCP bus master to
slave
SCPENZ
I
LVTTL compatible
SCP bus master to
slave
SCP bus serial data input. Data bits are valid and must be
clocked in on the falling edge of SCPCK.
SCPDI
I
LVTTL compatible
SCP bus slave to
master
LVTTL open drain w/tri- SCP bus serial data output. Data bits must clocked out on the
state rising edge of SCPCK.
SCPDO
O
Table 2. Serial Interface Timing Requirements
SYMBOL
CHARACTERISTICS
TEST CONDITIONS
MIN
NOM
MAX
UNIT
A
Setup CSZ low to CLK
Reference to rising edge of CLK
360
ns
Nominally 1 CLK cycle rising edge to
rising edge
B
C
Byte to Byte Delay
1.9
µs
Setup DIN to CSZ High
CLK Frequency
Last byte to slave disable
360
0
ns
kHz
µs
526
D
E
F
CLK Period
1.9
300
300
300
2
CLK High or Low Time
DIN Set-Up Time
ns
Reference to falling edge of CLK
Reference from falling edge of CLK
Reference from rising edge of CLK
ns
G
H
DIN Hold Time
ns
DOUT Propogation Delay
CLK Filter (pulse reject)
300
ns
200
ns
14
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DLPA100
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ZHCSFY9 –FEBRUARY 2017
Figure 4. Serial Communications Port Timing Diagram
7.3.7 Switching Regulators
The DLPA100 has four fixed frequency current mode control buck regulators that are used to provide power to
integrated circuits in the system. The V5 regulator is used to power control functions in the DLPA100, as well as
power the VLIN1 and VLIN2 linear regulators.
The regulators require external fly back diodes, inductors and filter capacitors. Due to the high currents in the
VCORE regulator, an external FET and sense resistor are required. The regulators will operate in both
continuous and discontinuous mode. An internal blanking circuit will be used to filter out transients due to the
reverse recovery of the external clamp diode.
7.3.7.1 Output Voltage - VOUT
All of the switchers apart from VCORE are regulated with respect to a 1.2 V reference (VFB). As the Core
Regulator (VCORE) output voltage is adjustable from 1.0 V to 3.3 V the internal reference for this output is 0.8 V.
Vout = VFB × (1 + R1/R2)
(1)
7.3.7.2 Adjustable Linear Regulator - VLIN1
This low dropout type regulator features current limit for a shorted load. It includes an integrated n-channel pass
element and can work with either ceramic or electrolytic output capacitors. The output can range between 1.0 V
and 3.3 V. The output voltage of the adjustable regulator is set by:
VLIN1 = VFB × (1+R1/R2) + (IFB × R2)
where
•
VFB= 0.8 V
(2)
7.3.7.3 Adjustable Linear Regulator Control - VLIN2
An additional linear regulator is implemented with external n-channel pass element. The output can range
between 1.0 V and 3.3 V. The output voltage of the adjustable regulator is set by:
VLIN2 = VFB × (1+R3/R4) + (IFB × R4)
where
•
VFB= 0.8 V
(3)
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7.3.8 Fan Controllers
The DLPA100 has three outputs available to be used as the switching node for either voltage mode step down
switcher or ‘direct drive’ schemes. The output voltage is determined by a PWM value programmed using the
DLPC4422 display controller software. The switching frequency for each output can be programmed using the
DLPC4422 display controller software for either 100 kHz for applications requiring a step-down switcher, or 24
Hz in applications that can utilize a direct drive scheme. The drivers in the ‘direct drive’ scheme are connected to
the corresponding fans via a series resistor.
The default condition at start-up will be separate control of each fan control channel and 100kHz switching
frequency.
7.3.9 Color Wheel Motor Driver
The driver system is a three phase BEMF sensing motor controller and driver. Commutation is controlled by a
proprietary BEMF sensing technique. It eliminates many external passive components and provides flexibility by
allowing various timing parameters to be programmed via the serial port.
7.3.9.1 Color Wheel Motor Driver Power Dissipation
The maximum allowable power dissipation on motor driver is specified in the color wheel motor driver table.
Motor driver power dissipation can be calculated as follows:
Pdm = [VM – (KE × Sm) – Ispd × Rpp] × Ispd
where
•
•
•
•
•
•
Pdm = Power dissipation of motor driver
VM = Programmed output voltage of the motor supply
KE = Motor voltage constant in Volts/(rad/sec)
Sm = Motor speed in rad/sec
Ispd = Motor current at Sm speed
Rpp = Phase-to-phase motor resistance
(4)
7.3.10 Color Wheel Switching Regulator Supply
A fixed off time switching regulator is included to manage power dissipation for driving color wheels. For highly
resistive motors requiring a low running current, Irun < 75 mA, using this regulator may not be required, in which
case VM should be connected directly to VBB and the external inductor, capacitor & Schottky diode do not need
to be fitted.
7.4 Device Functional Modes
DLPA100 device functional modes are controlled by the DLPC4422 display controller. See the DLPC4422
display controller datasheet or contact a TI applications engineer.
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8 Application and Implementation
NOTE
Information in the following applications sections is not part of the TI component
specification, and TI does not warrant its accuracy or completeness. TI’s customers are
responsible for determining suitability of components for their purposes. Customers should
validate and test their design implementation to confirm system functionality.
8.1 Application Information
Texas Instruments DLP technology is a micro-electro-mechanical systems (MEMS) technology that modulates
light using a digital micromirror device (DMD). DMDs vary in resolution and size and can contain over 8 million
micromirrors. Each micromirror of a DMD can represent either one or more pixels on the display and is
independently controlled, synchronized with color sequential illumination, to create stunning images on any
surface. DLP technology enables a wide variety of display products worldwide, from tiny projection modules
embedded in smartphones to high powered digital cinema projectors, and emerging display products such as
digital signage and laser TV.
In display applications using the DLP660TE DMD the DLPA100 provides all needed analog functions including
the analog power supplies and the color wheel motor driver to provide a robust and efficient display solution.
8.2 Typical Application
When the DLPA100 power management device is combined with two display controllers (DLPC4422), an FPGA,
and other electrical, optical and mechanical components the chipset enables bright, affordable, full 4K UHD
display solutions. The DLPA100 power management and motor driver provides power supply sequencing and
controls the color wheel motors, laser and LED currents as required by the application. A typical 4K UHD system
application is shown in Figure 5.
Figure 5. Typical 4K UHD Projector Application
8.2.1 Design Requirements
At the high level, DLP660TE DMD systems will include an illumination source, a light engine, electronic
components, and software. The designer must first choose an illumination source and design the optical engine
taking into consideration the relationship between the optics and the illumination source. The designer must then
understand the electronic components of a DLP660TE DMD system. A display projector is created by using a
DLP chipset comprised of DLP660TE DMD, DLPC4422 controller and DLPA100 power and motor driver. The
DLPC4422 does the digital image processing, the DLPA100 provides the needed analog functions for the
projector, and the DMD is the display device for producing the projected image.
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Typical Application (continued)
8.2.2 Detailed Design Procedure
For connecting together the DLPC4422 digital display controller, the DLP660TE DMD, and the DLPA100, see the
reference design schematic. Layout guidelines should be followed to achieve a reliable projector. To complete
the DLP system an optical module or light engine is required that contains the DLP660TE DMD, associated
illumination sources, optical elements, and necessary mechanical components.
8.2.3 Application Curves
Figure 6. Luminance vs. Current
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9 Power Supply Recommendations
The DLPA100 is designed to operate from a 12-V input voltage supply or battery. To avoid insufficient supply
current due to line drop, ringing due to trace inductance at the VIN terminal, or supply peak current limitations,
additional bulk capacitance may be required. If ringing occurs an electrolytic or tantalum type capacitor may be
needed for damping. The amount of bulk capacitance required should be evaluated such that the input voltage
can remain in specification long enough for a proper fast shutdown to occur as shown in Figure 3. The shutdown
begins when the input voltage drops below the programmable UVLO threshold, such as when the external power
supply or battery supply is suddenly removed from the system.
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10 Layout
10.1 Layout Guidelines
The 12-V supply, VBB, should be provided on a separate plane, or portion of a shared power distribution plane.
Each ceramic filter capacitor should be placed as close as possible to each VBB terminal: pins 9, 22, 37 and 42.
The additional reservoir capacitor should also be placed as close as possible to the VBB terminals. The ground
for VBB should be routed directly to the DLPA100 thermal pad connection.
The PWB traces used on the switching regulators should be as short and wide as possible. The electrical loops
formed between the VBB filter capacitors, input switch (LX pins), inductor, output capacitor and the diode should
be as small as possible.
An adjacent layer ground region covering the entire switching node should be provided for the pins: LXC (pin 25),
LX5 (pin 23), LX33 (pin 43), LX25 (pin 41), and VMSW (pin10). Each of the switching nodes and all associated
components should be located as near the DLPA100 device as possible.
Avoid routing any noise sensitive signals near the DLPA100 device switching nodes and associated ground
regions. The sensitive pins on the DLPA100 device consist of pins 1, 2, 3, 4, 5, 6, 8, and 48. If sensitive signals
must be routed across the switching loops, use subdivided planes and/or multiple ground planes to avoid
interference. Use of shielded inductors on the switching regulator circuits will minimize the possibility of crosstalk
and interference.
High current paths should have an adequate number of vias to minimize resistance and inductance. Placement
and routing priority should be given to the higher current circuits. For example, the VCORE supply should take
precedence over a fan PWM output. The following is the order of precedence from highest to lowest:
1. VCORE
2. V5
3. V3P3
4. V2P5
5. VM
6. VLIN2
7. VLIN1
8. FAN1, FAN2, FAN3
Suitable kelvin connections should be provided for the regulator feedback pins: FBC (pin 30), V2P5 (pin 46),
V3P3 (pin 45), V5 (pin 24), FB1 (pin 31) & FB2 (pin 32) and for sense pins: SENSE (pin 14), ISEN (pin 28) &
ISENK (pin 27). Also note that the external feedback networks used for the VCORE and VLIN1 regulators should
also deploy kelvin connections. The feedback pin traces FBC, FB1, FB2 are most prone to interference and
should be located near the DLPA100 device.
10.2 Grounding Guidelines
Ground pin 19 is isolated internally to the DLPA100 from pins 7 and 44. All three ground pins should be tied
together on the PWB at the DLPA100 thermal pad connection. Depending on the application there are three
grounding approaches for board layout:
1. Completely isolated ground regions for the DLPA100 subcircuits.
2. Single isolated ground region for the collective DLPA100 circuit.
3. Non-isolated common ground region for the entire board.
The most favorable approach should be carefully considered for the specific application.
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Grounding Guidelines (continued)
10.2.1 Completely Isolated Ground Regions
In this case, the PWB has an isolated ground layer around the DLPA100 circuit which serves as a “noisy” ground
for the motor driver, switchers, and linear regulators. This plane can be subdivided into isolated sections around
each switcher, linear regulator and motor block to minimize the possibility of noise crosstalk between the
regulator circuits. See Figure 7. Each isolated section should be connected in a “star” configuration at the
DLPA100 thermal pad position. An additional “quiet” solid ground plane should be provided on a separate layer
for reference to the sensitive blocks of the DLPA100 device and other sensitive external circuitry. The sensitive
pins on the DLPA100 device are pins 1, 2, 3, 4, 5, 6, 8, and 48. The quiet ground plane should connect to the
DLPA100 device with the array of thermal vias.
Figure 7. Noisy Ground Layer
Figure 8. PWB Planes
10.2.2 Single Isolated Ground Region
In this case, the PWB has a single isolated ground layer around the DLPA100 circuit. This ground layer serves
as a “noisy” ground for the switchers, linear regulators, and motor driver. An additional “quiet” solid ground plane
should be provided on a separate layer for reference to the sensitive blocks of the DLPA100 and other sensitive
external circuitry. Connect the “quiet” and “noisy” ground planes at the DLPA100 thermal pad array of vias.
10.2.3 Non-isolated Common Ground Region
In this case, the PWB has a solid non-isolated common ground layer for the entire board. In this configuration,
use particular care during component placement and separate the noisy portions of the DLPA100 circuit from
other sensitive signals on the board. The ground plane should connect to the DLPA100 with the array of thermal
vias.
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10.3 Thermal Guidelines
The PWB should have a thermal pad underneath the DLPA100 on both the top and bottom layers. The thermal
pad on the top layer should extend to the edge of the terminal pads and include a 4x4 array of thermal vias.
These thermal pads should connect to the internal ground planes via the thermal vias. It is recommended that
the internal ground plane should extend for at least 20 square inches.
Careful consideration should be taken in providing an adequate amount of copper traces around the discrete
Schottky diodes and MOSFET terminals used in the switching and linear converters to ensure proper thermal
management. The thermal impedance (Tj-a) of each component should be calculated to determine the
corresponding amount of copper required. If using an internal plane, it is important to use an array of thermal
vias underneath the device tab or terminal to assist in the transfer of the heat.
10.4 Motor Control Guidelines
The DLPA100 motor control terminals should be filtered with voltage transient suppressing devices for improved
startup reliability and noise immunity. Schottky diodes should be placed cathode to anode between VBB to motor
terminals OUTA (pin 12), OUTB (pin 15), OUTC (pin 16) and CTAP (pin 13). Schottky diodes should also be
placed cathode to anode between motor terminals OUTA (pin 12), OUTB (pin 15), OUTC (pin 16) and CTAP (pin
13) to ground. Series RC snubbers consisting of a capacitor (0.001 μF) in series with a resistor (150 Ω) should
be placed between the motor terminals OUTA (pin12), OUTB (pin 15), and OUTC (pin 16) to CTAP (pin 13).
The value of the motor current sensing resistor on SENSE (pin 14) should be thoroughly evaluated for the
application. Careful consideration should be taken in the amount of current draw during motor startup and
braking with respect to the speed range and speed change timing requirements. It is recommended that the
SENSE (pin 14) voltage does not exceed 450 mV. Most motors from today’s modern technology have relatively
low operating currents but higher start-up currents which make it very difficult to achieve good signal to noise
ratio during operating range and meet the 450 mV maximum on SENSE (pin 14). Most motors have
demonstrated success well below 100 mV steady-state SENSE (pin 14) voltage. As long as good layout and
component selection practices are followed, acceptable signal to noise ratios can be achieved at such low
operating SENSE (pin 14) voltages. The typical SENSE resistor value ranges from 0.47 Ω to 2.2 Ω. A 1.0-Ω
SENSE resistor value is suggested as a good starting point. Typically the steady-state SENSE (pin 14) voltage
with a 1.0-Ω resistor will be near 100 mV.
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10.5 Layout Example
Figure 9. Top Layer
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11 器件和文档支持
11.1 器件标记
图 10. 器件标记
11.2 文档支持
11.2.1 相关文档ꢀ
相关文档如下:
•
•
《DLPC4422 显示控制器数据表》
《DLP660TE DMD 数据表》
11.3 社区资源
The following links connect to TI community resources. Linked contents are provided "AS IS" by the respective
contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of
Use.
TI E2E™ Online Community TI's Engineer-to-Engineer (E2E) Community. Created to foster collaboration
among engineers. At e2e.ti.com, you can ask questions, share knowledge, explore ideas and help
solve problems with fellow engineers.
Design Support TI's Design Support Quickly find helpful E2E forums along with design support tools and
contact information for technical support.
11.4 商标
E2E is a trademark of Texas Instruments.
DLP is a registered trademark of Texas Instruments.
11.5 静电放电警告
ESD 可能会损坏该集成电路。德州仪器 (TI) 建议通过适当的预防措施处理所有集成电路。如果不遵守正确的处理措施和安装程序 , 可
能会损坏集成电路。
ESD 的损坏小至导致微小的性能降级 , 大至整个器件故障。 精密的集成电路可能更容易受到损坏 , 这是因为非常细微的参数更改都可
能会导致器件与其发布的规格不相符。
11.6 Glossary
SLYZ022 — TI Glossary.
This glossary lists and explains terms, acronyms, and definitions.
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12 机械、封装和可订购信息
以下页中包括机械、封装和可订购信息。这些信息是针对指定器件可提供的最新数据。这些数据会在无通知且不对
本文档进行修订的情况下发生改变。欲获得该数据表的浏览器版本,请查阅左侧的导航栏。
版权 © 2017, Texas Instruments Incorporated
25
PACKAGE OPTION ADDENDUM
www.ti.com
17-Mar-2023
PACKAGING INFORMATION
Orderable Device
Status Package Type Package Pins Package
Eco Plan
Lead finish/
Ball material
MSL Peak Temp
Op Temp (°C)
Device Marking
Samples
Drawing
Qty
(1)
(2)
(3)
(4/5)
(6)
DLPA100PT
ACTIVE
48
260
TBD
Call TI
Call TI
0 to 75
Samples
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance
do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may
reference these types of products as "Pb-Free".
RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.
Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based
flame retardants must also meet the <=1000ppm threshold requirement.
(3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6)
Lead finish/Ball material - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead finish/Ball material values may wrap to two
lines if the finish value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 1
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