SN74AXC1T45-Q1 [TI]
汽车单位双电源总线收发器;型号: | SN74AXC1T45-Q1 |
厂家: | TEXAS INSTRUMENTS |
描述: | 汽车单位双电源总线收发器 总线收发器 |
文件: | 总37页 (文件大小:1855K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
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SN74AXC1T45-Q1
ZHCSK32B –FEBRUARY 2019–REVISED SEPTEMBER 2019
具有可配置电压转换、三态输出且
已通过汽车认证的 SN74AXC1T45-Q1 单比特位双电源总线收发器
1 特性
DIR 引脚决定信号传播的方向。DIR 引脚配置为高电
平时,信号转换由端口 A 流向端口 B。DIR 配置为低
电平时,则由端口 B 流向端口 A。DIR 引脚以 VCCA
为基准,这意味着它的逻辑高电平和逻辑低电平阈值跟
踪 VCCA 电压。
1
•
符合面向汽车 应用的 AEC-Q100
•
完全可配置的双轨设计可允许各个端口在 0.65V 至
3.6V 的电源电压范围内运行
•
•
•
工作温度:–40°C 至 +125°C
无干扰电源定序
该器件完全 适用于 使用 Ioff 电流的局部掉电应用。当
器件掉电时,Ioff 保护电路可确保不从输入/输出或偏置
到特定电压的快速 I/O 获取或向其提供多余电流。
最大静态电流 (ICCA + ICCB) 为 8µA(最高 85°C)
和 14µA(最高 125°C)
•
•
从 1.8V 转换到 3.3V 时,支持高达 500Mbps 的转
换速率
VCC 隔离特性可确保当 VCCA 或 VCCB 低于 100mV
VCC 隔离特性
时,I/O 端口均禁用其输出并进入高阻抗状态。
–
如果任何一个 VCC 输入低于 100mV,则所有
I/O 输出均禁用且处于高阻抗状态
无干扰电源定序使电源轨能以任何顺序打开或关断,从
而提供强大的电源定序性能。
•
•
•
Ioff 支持局部断电模式运行
器件信息(1)
闩锁性能超过 100mA,符合 JESD 78 II 类规范
ESD 保护性能超过 JESD 22 规范要求
器件型号
封装
封装尺寸(标称值)
2.00mm × 1.25mm
1.40mm x 1.00mm
–
–
8000V 人体放电模型
1000V 充电器件模型
SN74AXC1T45QDCKRQ1 SC70 (6)
SN74AXC1T45QDRYRQ1 SON (6)(2)
(1) 如需了解所有可用封装,请参阅数据表末尾的可订购产品附
录。
2 应用
(2) 预览器件
•
•
•
•
ADAS 融合
ADAS 前置摄像头
HEV 电池管理系统
信息娱乐系统音响主机
功能方框图
3 说明
5
DIR
SN74AXC1T45-Q1 是一款采用两个独立可配置电源轨
的符合 AEC-Q100 标准的单比特位同相总线收发器。
3
A
V
CCA 和 VCCB 电源电压低至 0.65V 时,该器件可正常
工作。A 端口用于跟踪 VCCA,该端口可支持 0.65V 至
3.6V 范围内的任何电源电压。B 端口用于跟踪 VCCB
4
B
,
该端口也可支持 0.65V 至 3.6V 范围内的任何电源电
压。此外,SN74AXC1T45-Q1 还与单电源系统兼容。
V
V
CCB
CCA
1
本文档旨在为方便起见,提供有关 TI 产品中文版本的信息,以确认产品的概要。 有关适用的官方英文版本的最新信息,请访问 www.ti.com,其内容始终优先。 TI 不保证翻译的准确
性和有效性。 在实际设计之前,请务必参考最新版本的英文版本。
English Data Sheet: SCES901
SN74AXC1T45-Q1
ZHCSK32B –FEBRUARY 2019–REVISED SEPTEMBER 2019
www.ti.com.cn
目录
8.3 Feature Description................................................. 20
8.4 Device Functional Modes........................................ 21
Application and Implementation ........................ 22
9.1 Application Information............................................ 22
9.2 Typical Applications ................................................ 22
1
2
3
4
5
6
特性.......................................................................... 1
应用.......................................................................... 1
说明.......................................................................... 1
修订历史记录 ........................................................... 2
Pin Configuration and Functions......................... 3
Specifications......................................................... 4
6.1 Absolute Maximum Ratings ...................................... 4
6.2 ESD Ratings.............................................................. 4
6.3 Recommended Operating Conditions....................... 5
6.4 Thermal Information.................................................. 5
6.5 Electrical Characteristics........................................... 6
6.6 Operating Characteristics: TA = 25°C ..................... 15
6.7 Typical Characteristics............................................ 16
Parameter Measurement Information ................ 18
7.1 Load Circuit and Voltage Waveforms ..................... 18
Detailed Description ............................................ 20
8.1 Overview ................................................................. 20
8.2 Functional Block Diagram ....................................... 20
9
10 Power Supply Recommendations ..................... 25
11 Layout................................................................... 25
11.1 Layout Guidelines ................................................. 25
11.2 Layout Example .................................................... 25
12 器件和文档支持 ..................................................... 26
12.1 文档支持................................................................ 26
12.2 接收文档更新通知 ................................................. 26
12.3 支持资源................................................................ 26
12.4 商标....................................................................... 26
12.5 静电放电警告......................................................... 26
12.6 Glossary................................................................ 26
13 机械、封装和可订购信息....................................... 26
7
8
4 修订历史记录
注:之前版本的页码可能与当前版本有所不同。
Changes from Revision A (July 2019) to Revision B
Page
•
Device with DCK package is now Active status ..................................................................................................................... 3
Changes from Original (February 2019) to Revision A
Page
•
•
•
已添加 将 DRY 封装添加到“器件信息”表中............................................................................................................................. 1
Added DRY package to Pin Configuration and Functions ..................................................................................................... 3
Added DRY package to Thermal Information table................................................................................................................ 5
2
Copyright © 2019, Texas Instruments Incorporated
SN74AXC1T45-Q1
www.ti.com.cn
ZHCSK32B –FEBRUARY 2019–REVISED SEPTEMBER 2019
5 Pin Configuration and Functions
DCK Package
6-Pin SC70
Top View
VCCA
VCCB
1
2
3
6
5
4
GND
A
DIR
B
DRY Package(1)
6-Pin SON
Transparent Top View
1
2
3
6
5
4
VCCA
VCCB
GND
A
DIR
B
(1) PREVIEW device
Pin Functions
PIN
NAME
VCCA
GND
A
TYPE
DESCRIPTION
NO.
1
—
—
I/O
I/O
I
A-port supply voltage. 0.65V ≤ VCCA ≤ 3.6 V
Ground
2
3
Input/output A. This pin is referenced to VCCA
Input/output B. This pin is referenced to VCCB
Direction control signal. See for functionality
B-port supply voltage. 0.65V ≤ VCCB ≤ 3.6 V.
.
4
B
.
5
DIR
VCCB
6
—
Copyright © 2019, Texas Instruments Incorporated
3
SN74AXC1T45-Q1
ZHCSK32B –FEBRUARY 2019–REVISED SEPTEMBER 2019
www.ti.com.cn
6 Specifications
6.1 Absolute Maximum Ratings
over operating free-air temperature range (unless otherwise noted)(1)
MIN
–0.5
–0.5
–0.5
–0.5
–0.5
–0.5
–0.5
MAX UNIT
VCCA Supply voltage A
VCCB Supply voltage B
4.2
4.2
4.2
4.2
4.2
4.2
4.2
V
V
I/O Ports (A Port)
I/O Ports (B Port)
Control Inputs
A Port
VI
Input Voltage(2)
V
VO
VO
Voltage applied to any output in the high-impedance or power-off state(2)
Voltage applied to any output in the high or low state(2) (3)
V
V
B Port
A Port
–0.5 VCCA + 0.2
–0.5 VCCB + 0.2
–50
B Port
IIK
IOK
IO
Input clamp current
VI < 0
mA
mA
Output clamp current
VO < 0
–50
Continuous output current
Continuous current through VCC or GND
Junction Temperature
–50
50 mA
–100
100 mA
TJ
150
150
°C
°C
TSTG
Storage temperature
–65
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended
Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) The input voltage and output negative-voltage ratings may be exceeded if the input and output current ratings are observed.
(3) The output positive-voltage rating may be exceeded up to 4.2 V maximum if the output current rating is observed.
6.2 ESD Ratings
VALUE
±8000
±1000
UNIT
Human body model (HBM), per AEC Q100-002(1)
Charged device model (CDM), per AEC Q100-011
V(ESD)
Electrostatic discharge
V
(1) AEC Q100-002 indicates that HBM stressing shall be in accordance with the ANSI/ESDA/JEDEC JS-001 specification.
4
Copyright © 2019, Texas Instruments Incorporated
SN74AXC1T45-Q1
www.ti.com.cn
ZHCSK32B –FEBRUARY 2019–REVISED SEPTEMBER 2019
6.3 Recommended Operating Conditions
over operating free-air temperature range (unless otherwise noted)(1)
(2) (3)
MIN
0.65
MAX UNIT
VCCA
VCCB
Supply voltage A
Supply voltage B
3.6
3.6
V
V
0.65
VCCI = 0.65 V - 0.75 V
VCCI = 0.76 V - 1 V
VCCI = 1.1 V - 1.95 V
VCCI = 2.3 V - 2.7 V
VCCI = 3 V - 3.6 V
VCCI x 0.70
VCCI x 0.70
VCCI x 0.65
1.6
Data Inputs
2
VIH
High-level input voltage
V
VCCA = 0.65 V - 0.75 V
VCCA = 0.76 V - 1 V
VCCA = 1.1 V - 1.95 V
VCCA = 2.3 V - 2.7 V
VCCA = 3 V - 3.6 V
VCCI = 0.65 V - 0.75 V
VCCI = 0.76 V - 1 V
VCCI = 1.1 V - 1.95 V
VCCI = 2.3 V - 2.7 V
VCCI = 3 V - 3.6 V
VCCA x 0.70
VCCA x 0.70
VCCA x 0.65
1.6
Control Input (DIR)
Referenced to VCCA
2
VCCI x 0.30
VCCI x 0.30
VCCI x 0.35
0.7
Data Inputs
0.8
VIL
Low-level input voltage
V
VCCA = 0.65 V - 0.75 V
VCCA = 0.76 V - 1 V
VCCA = 1.1 V - 1.95 V
VCCA = 2.3 V - 2.7 V
VCCA = 3 V - 3.6 V
VCCA x 0.30
VCCA x 0.30
VCCA x 0.35
0.7
Control Input (DIR)
Referenced to VCCA
0.8
(3)
VI
Input voltage
0
0
0
3.6
V
V
Active State
Tri-State
VCCO
VO
Output voltage
3.6
Δt/Δv
Input transition rate
100 ns/V
125 °C
TA
Operating free-air temperature
–40
(1) VCCI is the VCC associated with the input port.
(2) VCCO is the VCC associated with the output port.
(3) All unused inputs of the device must be held at VCC or GND to ensure proper device operation. Refer to the TI application report,
Implications of Slow or Floating CMOS Inputs.
6.4 Thermal Information
SN74AXC1T45-Q1
THERMAL METRIC(1)
DCK (SC70)
6 PINS
235.3
DRY (SON)(2)
6 PINS
305.2
UNIT
RθJA
RθJC(top)
RθJB
ψJT
Junction-to-ambient thermal resistance
Junction-to-case (top) thermal resistance
Junction-to-board thermal resistance
°C/W
°C/W
°C/W
°C/W
°C/W
160.5
202.2
76.9
181.1
Junction-to-top characterization parameter
Junction-to-board characterization parameter
59.7
41.9
ψJB
77.1
180.0
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application
report, SPRA953.
(2) PREVIEW device
Copyright © 2019, Texas Instruments Incorporated
5
SN74AXC1T45-Q1
ZHCSK32B –FEBRUARY 2019–REVISED SEPTEMBER 2019
www.ti.com.cn
6.5 Electrical Characteristics
over operating free-air temperature range (unless otherwise noted)
(1) (2)
Operating free-air temperature (TA)
PARAMETER
TEST CONDITIONS
VCCA
VCCB
-40°C to 85°C
-40°C to 125°C
UNIT
MIN TYP(3) MAX
MIN
TYP MAX
VCCO
– 0.1
VCCO
– 0.1
IOH = -100 µA
0.7 V - 3.6 V 0.7 V - 3.6 V
IOH = -50 µA
IOH = -200 µA
IOH = -500 µA
0.65 V
0.76 V
0.85 V
1.1 V
1.4 V
1.65 V
2.3 V
3 V
0.65 V
0.76 V
0.85 V
1.1 V
1.4 V
1.65 V
2.3 V
3 V
0.55
0.58
0.65
0.85
1.05
1.2
0.55
0.58
0.65
0.85
1.05
1.2
High-level
output
voltage
VOH
VI = VIH
V
IOH = -3 mA
IOH = -6 mA
IOH = -8 mA
IOH = -9 mA
IOH = -12 mA
IOL = 100 µA
IOL = 50 µA
IOL = 200 µA
IOL = 500 µA
IOL = 3 mA
IOL = 6 mA
IOL = 8 mA
IOL = 9 mA
IOL = 12 mA
1.75
2.3
1.75
2.3
0.7 V - 3.6 V 0.7 V - 3.6 V
0.1
0.1
0.1
0.65 V
0.76 V
0.85 V
1.1 V
1.4 V
1.65 V
2.3 V
3 V
0.65 V
0.76 V
0.85 V
1.1 V
1.4 V
1.65 V
2.3 V
3 V
0.1
0.18
0.2
0.18
0.2
Low-level
output
voltage
VOL
VI = VIL
0.25
0.35
0.45
0.55
0.7
0.25
0.35
0.45
0.55
0.7
V
Control input (DIR): VI =
VCCA or GND
0.65 V- 3.6 V 0.65 V- 3.6 V
0.65 V- 3.6 V 0.65 V- 3.6 V
–1
–4
1
4
–1.5
–8
1.5
8
Input leakage
current
II
µA
A or B Port: Vi = VCCI or
GND
0 V
0 V - 3.6 V
0 V
–5
–5
5
5
6
–7.5
–7.5
7.5
7.5
9
Partial power A or B Port: Vi or Vo = 0 V -
down current 3.6 V
Ioff
µA
µA
0 V - 3.6 V
0.65 V- 3.6 V 0.65 V- 3.6 V
VCCA supply VI = VCCI
IO = 0
ICCA
0 V
3.6 V
0 V
–2
–8
current
or GND
3.6 V
2
6
2
8
9
8
0.65 V- 3.6 V 0.65 V- 3.6 V
VCCB supply VI = VCCI
ICCB
IO = 0
IO = 0
0 V
3.6 V
0 V
µA
current
or GND
3.6 V
–2
–8
Combined
supply
current
ICCA
ICCB
+
VI = VCCI
or GND
0.65 V- 3.6 V 0.65 V- 3.6 V
8
14 µA
pF
Control input
capacitance
CI
VI = 3.3 V or GND
3.3 V
3.3 V
3.3 V
0 V
4.5
5
4.5
5
Data I/O
capacitance,
A Port
VO = 1.65V DC +1 MHz -16
dBm sine wave
CIO
pF
Data I/O
capacitance,
B Port
VO = 1.65V DC +1 MHz -16
dBm sine wave
CIO
0 V
3.3 V
5
5
pF
(1) VCCI is the VCC associated with the input port.
(2) VCCO is the VCC associated with the output port.
(3) All typical data is taken at 25°C.
6
Copyright © 2019, Texas Instruments Incorporated
SN74AXC1T45-Q1
www.ti.com.cn
ZHCSK32B –FEBRUARY 2019–REVISED SEPTEMBER 2019
Table 1. Switching Characteristics, VCCA = 0.7 V
B-Port Supply Voltage (VCCB
)
Test
Conditions
PARAMETER
FROM
TO
0.7 ± 0.05 V 0.8 ± 0.04 V 0.9 ± 0.045 V 1.2 ± 0.1 V
MIN MAX MIN MAX MIN MAX MIN MAX
1.5 ± 0.1 V
MIN MAX
1.8 ± 0.15 V
MIN MAX
2.5 ± 0.2 V
MIN MAX
3.3 ± 0.3 V
MIN MAX
UNIT
-40°C to 85°C
-40°C to 125°C
-40°C to 85°C
-40°C to 125°C
-40°C to 85°C
-40°C to 125°C
-40°C to 85°C
-40°C to 125°C
-40°C to 85°C
-40°C to 125°C
-40°C to 85°C
-40°C to 125°C
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
173
173
173
173
143
143
163
163
389
406
369
395
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
117
117
154
154
143
143
123
123
331
333
313
339
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
85
85
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
51
51
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
50
50
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
53
53
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
65
65
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
143
143
80
A
B
A
A
B
A
B
Propagation
delay
tpd
ns
127
127
143
143
100
100
287
287
281
307
88
83
82
80
B
88
83
82
80
80
143
143
50
143
143
45
143
143
49
143
143
61
143
143
109
109
200
200
339
365
DIR
DIR
DIR
DIR
tdis Disable time
ns
ns
50
45
49
61
143
143
247
273
134
134
246
272
137
137
249
275
147
147
261
287
ten Enable time
Copyright © 2019, Texas Instruments Incorporated
7
SN74AXC1T45-Q1
ZHCSK32B –FEBRUARY 2019–REVISED SEPTEMBER 2019
www.ti.com.cn
Table 2. Switching Characteristics, VCCA = 0.8 V
B-Port Supply Voltage (VCCB
)
Test
Conditions
PARAMETER
FROM
TO
0.7 ± 0.05 V 0.8 ± 0.04 V 0.9 ± 0.045 V 1.2 ± 0.1 V
MIN MAX MIN MAX MIN MAX MIN MAX
1.5 ± 0.1 V
MIN MAX
1.8 ± 0.15 V
MIN MAX
2.5 ± 0.2 V
MIN MAX
3.3 ± 0.3 V
MIN MAX
UNIT
-40°C to 85°C
-40°C to 125°C
-40°C to 85°C
-40°C to 125°C
-40°C to 85°C
-40°C to 125°C
-40°C to 85°C
-40°C to 125°C
-40°C to 85°C
-40°C to 125°C
-40°C to 85°C
-40°C to 125°C
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
153
153
117
117
100
100
151
151
321
341
309
317
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
95
95
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
64
64
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
33
33
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
27
27
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
26
26
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
27
27
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
36
36
A
B
A
A
B
A
B
Propagation
delay
tpd
ns
96
78
52
42
41
40
39
B
96
78
52
42
41
40
39
100
100
111
111
261
266
251
259
100
100
88
100
100
38
100
100
32
100
100
30
100
100
30
100
100
38
DIR
DIR
DIR
DIR
tdis Disable time
ns
ns
88
38
32
30
30
38
226
229
220
228
96
80
78
76
87
97
80
78
76
87
ten Enable time
189
197
183
191
182
190
183
191
192
200
8
Copyright © 2019, Texas Instruments Incorporated
SN74AXC1T45-Q1
www.ti.com.cn
ZHCSK32B –FEBRUARY 2019–REVISED SEPTEMBER 2019
Table 3. Switching Characteristics, VCCA = 0.9 V
B-Port Supply Voltage (VCCB
)
Test
Conditions
PARAMETER
FROM
TO
0.7 ± 0.05 V 0.8 ± 0.04 V 0.9 ± 0.045 V 1.2 ± 0.1 V
MIN MAX MIN MAX MIN MAX MIN MAX
1.5 ± 0.1 V
MIN MAX
1.8 ± 0.15 V
MIN MAX
2.5 ± 0.2 V
MIN MAX
3.3 ± 0.3 V
MIN MAX
UNIT
-40°C to 85°C
-40°C to 125°C
-40°C to 85°C
-40°C to 125°C
-40°C to 85°C
-40°C to 125°C
-40°C to 85°C
-40°C to 125°C
-40°C to 85°C
-40°C to 125°C
-40°C to 85°C
-40°C to 125°C
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
126
126
85
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
78
78
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
52
52
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
23
23
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
18
18
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
16
16
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
15
15
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
18
18
A
B
A
A
B
A
B
Propagation
delay
tpd
ns
64
53
40
28
24
22
21
B
85
64
53
40
28
24
22
21
75
75
75
75
75
75
75
75
DIR
DIR
DIR
DIR
79
79
79
79
79
79
79
79
tdis Disable time
ns
ns
144
144
282
304
262
269
105
105
223
229
214
221
82
32
25
24
21
23
83
36
28
26
21
23
195
199
188
195
77
59
54
48
54
81
62
56
49
54
ten Enable time
159
166
154
161
152
159
151
158
154
161
Copyright © 2019, Texas Instruments Incorporated
9
SN74AXC1T45-Q1
ZHCSK32B –FEBRUARY 2019–REVISED SEPTEMBER 2019
www.ti.com.cn
Table 4. Switching Characteristics, VCCA = 1.2 V
B-Port Supply Voltage (VCCB
)
Test
Conditions
PARAMETER
FROM
TO
0.7 ± 0.05 V 0.8 ± 0.04 V 0.9 ± 0.045 V 1.2 ± 0.1 V
MIN MAX MIN MAX MIN MAX MIN MAX
1.5 ± 0.1 V
MIN MAX
1.8 ± 0.15 V
MIN MAX
2.5 ± 0.2 V
MIN MAX
3.3 ± 0.3 V
MIN MAX
UNIT
-40°C to 85°C
-40°C to 125°C
-40°C to 85°C
-40°C to 125°C
-40°C to 85°C
-40°C to 125°C
-40°C to 85°C
-40°C to 125°C
-40°C to 85°C
-40°C to 125°C
-40°C to 85°C
-40°C to 125°C
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
87
87
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
52
52
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
39
39
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
15
15
15
15
22
29
24
30
45
51
43
49
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
9
10
12
12
22
29
18
23
36
41
37
44
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
8
9
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
7
7
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
7
8
A
B
A
A
B
A
B
Propagation
delay
tpd
ns
51
33
23
10
10
22
29
16
21
33
37
36
43
7
7
B
51
33
23
8
7
22
22
22
22
29
13
17
26
30
35
41
22
29
13
16
29
32
35
42
DIR
DIR
DIR
DIR
29
29
29
tdis Disable time
ns
ns
137
137
240
265
115
121
98
74
98
78
185
193
80
157
164
67
ten Enable time
86
73
10
Copyright © 2019, Texas Instruments Incorporated
SN74AXC1T45-Q1
www.ti.com.cn
ZHCSK32B –FEBRUARY 2019–REVISED SEPTEMBER 2019
Table 5. Switching Characteristics, VCCA = 1.5 V
B-Port Supply Voltage (VCCB
)
Test
Conditions
PARAMETER
FROM
TO
0.7 ± 0.05 V 0.8 ± 0.04 V 0.9 ± 0.045 V 1.2 ± 0.1 V
MIN MAX MIN MAX MIN MAX MIN MAX
1.5 ± 0.1 V
MIN MAX
1.8 ± 0.15 V
MIN MAX
2.5 ± 0.2 V
MIN MAX
3.3 ± 0.3 V
MIN MAX
UNIT
-40°C to 85°C
-40°C to 125°C
-40°C to 85°C
-40°C to 125°C
-40°C to 85°C
-40°C to 125°C
-40°C to 85°C
-40°C to 125°C
-40°C to 85°C
-40°C to 125°C
-40°C to 85°C
-40°C to 125°C
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
83
83
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
42
42
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
28
28
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
12
12
10
10
15
20
22
29
38
44
33
38
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
8
9
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
7
8
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
5
6
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
5
6
A
B
A
A
B
A
B
Propagation
delay
tpd
ns
50
28
18
8
7
5
4
B
50
28
18
9
8
6
5
15
15
15
15
20
16
21
30
36
29
35
15
20
14
19
28
33
28
34
15
20
11
15
22
26
26
32
15
20
11
14
24
27
26
32
DIR
DIR
DIR
DIR
20
20
20
tdis Disable time
ns
ns
136
136
238
263
104
109
96
72
96
76
178
186
63
151
157
49
ten Enable time
68
54
Copyright © 2019, Texas Instruments Incorporated
11
SN74AXC1T45-Q1
ZHCSK32B –FEBRUARY 2019–REVISED SEPTEMBER 2019
www.ti.com.cn
Table 6. Switching Characteristics, VCCA = 1.8 V
B-Port Supply Voltage (VCCB
)
Test
Conditions
PARAMETER
FROM
TO
0.7 ± 0.05 V 0.8 ± 0.04 V 0.9 ± 0.045 V 1.2 ± 0.1 V
MIN MAX MIN MAX MIN MAX MIN MAX
1.5 ± 0.1 V
MIN MAX
1.8 ± 0.15 V
MIN MAX
2.5 ± 0.2 V
MIN MAX
3.3 ± 0.3 V
MIN MAX
UNIT
-40°C to 85°C
-40°C to 125°C
-40°C to 85°C
-40°C to 125°C
-40°C to 85°C
-40°C to 125°C
-40°C to 85°C
-40°C to 125°C
-40°C to 85°C
-40°C to 125°C
-40°C to 85°C
-40°C to 125°C
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
81
81
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
41
41
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
24
24
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
10
10
8
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
7
8
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
6
7
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
5
5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
4
5
A
B
A
A
B
A
B
Propagation
delay
tpd
ns
53
26
16
7
6
5
4
B
53
26
16
9
7
7
5
4
13
13
13
13
18
22
28
35
42
30
34
13
18
15
20
28
33
27
32
13
18
14
18
26
32
26
31
13
18
11
14
21
24
25
29
13
18
11
13
24
26
24
29
DIR
DIR
DIR
DIR
18
18
18
tdis Disable time
ns
ns
136
136
241
266
101
105
96
72
96
75
176
184
61
148
155
44
ten Enable time
65
48
12
Copyright © 2019, Texas Instruments Incorporated
SN74AXC1T45-Q1
www.ti.com.cn
ZHCSK32B –FEBRUARY 2019–REVISED SEPTEMBER 2019
Table 7. Switching Characteristics, VCCA = 2.5 V
B-Port Supply Voltage (VCCB
)
Test
Conditions
PARAMETER
FROM
TO
0.7 ± 0.05 V 0.8 ± 0.04 V 0.9 ± 0.045 V 1.2 ± 0.1 V
MIN MAX MIN MAX MIN MAX MIN MAX
1.5 ± 0.1 V
MIN MAX
1.8 ± 0.15 V
MIN MAX
2.5 ± 0.2 V
MIN MAX
3.3 ± 0.3 V
MIN MAX
UNIT
-40°C to 85°C
-40°C to 125°C
-40°C to 85°C
-40°C to 125°C
-40°C to 85°C
-40°C to 125°C
-40°C to 85°C
-40°C to 125°C
-40°C to 85°C
-40°C to 125°C
-40°C to 85°C
-40°C to 125°C
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
80
80
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
40
40
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
22
22
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
7
8
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
5
6
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
5
5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
4
5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
4
4
A
B
A
A
B
A
B
Propagation
delay
tpd
ns
66
27
15
7
5
5
4
3
B
66
27
15
7
6
5
5
4
10
10
10
10
13
21
27
33
39
22
26
10
13
14
20
25
31
24
24
10
13
13
17
24
29
20
23
10
13
10
13
19
23
23
23
10
13
10
12
22
25
19
22
DIR
DIR
DIR
DIR
13
13
13
tdis Disable time
ns
ns
136
136
254
278
99
95
71
95
75
176
185
55
147
153
41
ten Enable time
98
58
40
Copyright © 2019, Texas Instruments Incorporated
13
SN74AXC1T45-Q1
ZHCSK32B –FEBRUARY 2019–REVISED SEPTEMBER 2019
www.ti.com.cn
Table 8. Switching Characteristics, VCCA = 3.3 V
B-Port Supply Voltage (VCCB
)
Test
Conditions
PARAMETER
FROM
TO
0.7 ± 0.05 V 0.8 ± 0.04 V 0.9 ± 0.045 V 1.2 ± 0.1 V
MIN MAX MIN MAX MIN MAX MIN MAX
1.5 ± 0.1 V
MIN MAX
1.8 ± 0.15 V
MIN MAX
2.5 ± 0.2 V
MIN MAX
3.3 ± 0.3 V
MIN MAX
UNIT
-40°C to 85°C
-40°C to 125°C
-40°C to 85°C
-40°C to 125°C
-40°C to 85°C
-40°C to 125°C
-40°C to 85°C
-40°C to 125°C
-40°C to 85°C
-40°C to 125°C
-40°C to 85°C
-40°C to 125°C
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
79
79
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
39
39
36
36
9
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
22
22
18
18
9
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
7
7
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
4
5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
4
4
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
3
4
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
3
4
A
B
A
A
B
A
B
Propagation
delay
tpd
ns
144
144
9
7
5
4
4
3
B
8
6
5
4
4
9
9
9
9
9
DIR
DIR
DIR
DIR
12
12
95
95
185
93
58
59
12
71
75
149
156
41
42
12
21
27
33
40
26
27
12
14
19
25
31
23
25
12
12
17
23
29
23
24
12
10
13
19
22
22
24
12
10
12
22
24
22
24
tdis Disable time
ns
ns
136
136
331
356
98
ten Enable time
99
14
Copyright © 2019, Texas Instruments Incorporated
SN74AXC1T45-Q1
www.ti.com.cn
ZHCSK32B –FEBRUARY 2019–REVISED SEPTEMBER 2019
6.6 Operating Characteristics: TA = 25°C
PARAMETER
TEST CONDITIONS
VCCA
0.7 V
VCCB
0.7 V
MIN
TYP
1.3
MAX UNIT
0.8 V
0.9 V
1.2 V
1.5 V
1.8 V
2.5 V
3.3 V
0.7 V
0.8 V
0.9 V
1.2 V
1.5 V
1.8 V
2.5 V
3.3 V
0.7 V
0.8 V
0.9 V
1.2 V
1.5 V
1.8 V
2.5 V
3.3 V
0.7 V
0.8 V
0.9 V
1.2 V
1.5 V
1.8 V
2.5 V
3.3 V
0.8 V
0.9 V
1.2 V
1.5 V
1.8 V
2.5 V
3.3 V
0.7 V
0.8 V
0.9 V
1.2 V
1.5 V
1.8 V
2.5 V
3.3 V
0.7 V
0.8 V
0.9 V
1.2 V
1.5 V
1.8 V
2.5 V
3.3 V
0.7 V
0.8 V
0.9 V
1.2 V
1.5 V
1.8 V
2.5 V
3.3 V
1.3
1.3
1.3
Power Dissipation Capacitance CL = 0, RL = Open f = 1
pF
per transceiver (A to B)
MHz, tr = tf = 1 ns
1.3
1.4
1.7
2.1
CpdA
9.2
9.4
9.4
9.8
Power Dissipation Capacitance CL = 0, RL = Open f = 1
per transceiver (B to A) MHz, tr = tf = 1 ns
pF
pF
pF
10.1
11.0
14.4
18.6
9.2
9.3
9.4
9.7
Power Dissipation Capacitance CL = 0, RL = Open f = 1
per transceiver (A to B) MHz, tr = tf = 1 ns
10.1
11.0
14.4
18.3
1.3
CpdB
1.3
1.3
1.3
Power Dissipation Capacitance CL = 0, RL = Open f = 1
per transceiver (B to A) MHz, tr = tf = 1 ns
1.3
1.4
1.7
2.1
版权 © 2019, Texas Instruments Incorporated
15
SN74AXC1T45-Q1
ZHCSK32B –FEBRUARY 2019–REVISED SEPTEMBER 2019
www.ti.com.cn
6.7 Typical Characteristics
50
45
40
35
30
25
20
15
10
CL = 45 pF
CL = 62 pF
CL = 79 pF
CL = 105 pF
CL = 123 pF
CL = 45 pF
CL = 62 pF
CL = 79 pF
CL = 105 pF
CL = 123 pF
45
40
35
30
25
20
15
0.6
0.9
1.2
1.5
1.8 2.1
Supply B (V)
2.4
2.7
3
3.3
0.6
0.9
1.2
1.5
1.8 2.1
Supply B (V)
2.4
2.7
3
3.3
D016
D001
TA = 25°C
VCCA = 0.7 V
TA = 25°C
VCCA = 0.8 V
图 1. Typical Propagation Delay of Low-to-High
图 2. Typical Propagation Delay of Low-to-High
(A to B) vs Load Capacitance
(A to B) vs Load Capacitance
40
30
CL = 45 pF
CL = 62 pF
CL = 79 pF
CL = 105 pF
CL = 123 pF
CL = 45 pF
CL = 62 pF
CL = 79 pF
CL = 105 pF
CL = 123 pF
27
24
21
18
15
12
9
35
30
25
20
15
10
5
6
0.6
0.9
1.2
1.5
1.8 2.1
Supply B (V)
2.4
2.7
3
3.3
0.6
0.9
1.2
1.5
1.8 2.1
Supply B (V)
2.4
2.7
3
3.3
D002
D003
TA = 25°C
VCCA = 0.9 V
TA = 25°C
VCCA = 1.2 V
图 3. Typical Propagation Delay of Low-to-High
图 4. Typical Propagation Delay of Low-to-High
(A to B) vs Load Capacitance
(A to B) vs Load Capacitance
30
27
CL = 45 pF
CL = 45 pF
CL = 62 pF
CL = 79 pF
CL = 105 pF
CL = 123 pF
CL = 62 pF
CL = 79 pF
CL = 105 pF
CL = 123 pF
27
24
21
18
15
12
9
24
21
18
15
12
9
6
6
3
0.6
0.9
1.2
1.5
1.8 2.1
Supply B (V)
2.4
2.7
3
3.3
0.6
0.9
1.2
1.5
1.8 2.1
Supply B (V)
2.4
2.7
3
3.3
D004
D005
TA = 25°C
VCCA = 1.5 V
TA = 25°C
VCCA = 1.8 V
图 5. Typical Propagation Delay of Low-to-High
图 6. Typical Propagation Delay of Low-to-High
(A to B) vs Load Capacitance
(A to B) vs Load Capacitance
27
27
CL = 45 pF
CL = 45 pF
CL = 62 pF
CL = 79 pF
CL = 105 pF
CL = 123 pF
CL = 62 pF
CL = 79 pF
CL = 105 pF
CL = 123 pF
24
21
18
15
12
9
24
21
18
15
12
9
6
6
3
3
0.6
0.9
1.2
1.5
1.8 2.1
Supply B (V)
2.4
2.7
3
3.3
0.6
0.9
1.2
1.5
1.8 2.1
Supply B (V)
2.4
2.7
3
3.3
D007
D006
TA = 25°C
VCCA = 3.3 V
TA = 25°C
VCCA = 2.5 V
图 7. Typical Propagation Delay of Low-to-High
图 8. Typical Propagation Delay of Low-to-High
(A to B) vs Load Capacitance
(A to B) vs Load Capacitance
16
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Typical Characteristics (接下页)
50
45
40
35
30
25
20
15
40
CL = 45 pF
CL = 62 pF
CL = 79 pF
CL = 105 pF
CL = 123 pF
CL = 45 pF
CL = 62 pF
CL = 79 pF
CL = 105 pF
CL = 123 pF
35
30
25
20
15
10
0.6
0.9
1.2
1.5
1.8 2.1
Supply A (V)
2.4
2.7
3
3.3
0.6
0.9
1.2
1.5
1.8 2.1
Supply A (V)
2.4
2.7
3
3.3
D008
D009
TA = 25°C
VCCA = 0.7 V
TA = 25°C
VCCA = 0.8 V
图 9. Typical Propagation Delay of Low-to-High
图 10. Typical Propagation Delay of Low-to-High
(B to A) vs Load Capacitance
(B to A) vs Load Capacitance
36
27.5
CL = 45 pF
CL = 45 pF
33
30
27
24
21
18
15
12
9
CL = 62 pF
CL = 79 pF
CL = 105 pF
CL = 123 pF
CL = 62 pF
CL = 79 pF
CL = 105 pF
CL = 123 pF
25
22.5
20
17.5
15
12.5
10
7.5
0.6
0.9
1.2
1.5
1.8 2.1
Supply A (V)
2.4
2.7
3
3.3
0.6
0.9
1.2
1.5
1.8 2.1
Supply A (V)
2.4
2.7
3
3.3
D010
D011
TA = 25°C
VCCA = 0.9 V
TA = 25°C
VCCA = 1.2 V
图 11. Typical Propagation Delay of Low-to-High
图 12. Typical Propagation Delay of Low-to-High
(B to A) vs Load Capacitance
(B to A) vs Load Capacitance
30
25
CL = 45 pF
CL = 45 pF
CL = 62 pF
CL = 79 pF
CL = 105 pF
CL = 123 pF
CL = 62 pF
CL = 79 pF
CL = 105 pF
CL = 123 pF
27
24
21
18
15
12
9
22.5
20
17.5
15
12.5
10
7.5
5
6
0.6
0.9
1.2
1.5
1.8 2.1
Supply A (V)
2.4
2.7
3
3.3
0.6
0.9
1.2
1.5
1.8 2.1
Supply A (V)
2.4
2.7
3
3.3
D012
D013
TA = 25°C
VCCA = 1.5 V
TA = 25°C
VCCA = 1.8 V
图 13. Typical Propagation Delay of Low-to-High
图 14. Typical Propagation Delay of Low-to-High
(B to A) vs Load Capacitance
(B to A) vs Load Capacitance
30
30
CL = 45 pF
CL = 62 pF
CL = 79 pF
CL = 105 pF
CL = 123 pF
CL = 45 pF
27
24
21
18
15
12
9
CL = 62 pF
CL = 79 pF
CL = 105 pF
CL = 123 pF
25
20
15
10
5
6
3
0.6
0.9
1.2
1.5
1.8 2.1
Supply A (V)
2.4
2.7
3
3.3
0.6
0.9
1.2
1.5
1.8 2.1
Supply A (V)
2.4
2.7
3
3.3
D014
D015
TA = 25°C
VCCA = 2.5 V
TA = 25°C
VCCA = 3.3 V
图 15. Typical Propagation Delay of Low-to-High
图 16. Typical Propagation Delay of Low-to-High
(B to A) vs Load Capacitance
(B to A) vs Load Capacitance
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7 Parameter Measurement Information
7.1 Load Circuit and Voltage Waveforms
Unless otherwise noted, all input pulses are supplied by generators having the following characteristics:
•
•
•
f = 1 MHz
ZO = 50 Ω
dv/dt ≤ 1 ns/V
Measurement Point
2 x VCCO
Open
S1
RL
Output Pin
Under Test
GND
(1)
CL
RL
(1) CL includes probe and jig capacitance.
图 17. Load Circuit
表 9. Load Circuit Conditions
Parameter
VCCO
RL
CL
S1
VTP
N/A
N/A
Δt/Δv Input transition rise or fall rate
0.65 V – 3.6 V
1.1 V – 3.6 V
1 MΩ
2 kΩ
15 pF
15 pF
Open
Open
tpd Propagation (delay) time
0.65 V – 0.95
V
20 kΩ
15 pF
Open
N/A
3 V – 3.6 V
1.65 V – 2.7 V
1.1 V – 1.6 V
2 kΩ
2 kΩ
2 kΩ
15 pF
15 pF
15 pF
2 × VCCO
2 × VCCO
2 × VCCO
0.3 V
0.15 V
0.1 V
ten, tdis Enable time, disable time
0.65 V – 0.95
V
20 kΩ
15 pF
2 × VCCO
0.1 V
3 V – 3.6 V
1.65 V – 2.7 V
1.1 V – 1.6 V
2 kΩ
2 kΩ
2 kΩ
15 pF
15 pF
15 pF
GND
GND
GND
0.3 V
0.15 V
0.1 V
ten, tdis Enable time, disable time
0.65 V – 0.95
V
20 kΩ
15 pF
GND
0.1 V
(1)
VCCI
(1)
VCCI
Input A, B
100 kHz
VCCI / 2
VCCI / 2
Input A, B
500 ps/V œ 100 ns/V
0 V
VOH
0 V
VOH
(2)
tpd
tpd
(2)
Output B, A
Ensure Monotonic
Rising and Falling Edge
(2)
VOL
Output B, A
VCCI / 2
VCCI / 2
(2)
VOL
1. VCCI is the supply pin associated with the input port.
2. VOH and VOL are typical output voltage levels that occur with
specified RL, CL, and S1
1. VCCI is the supply pin associated with the input port.
2. VOH and VOL are typical output voltage levels that occur with
specified RL, CL, and S1
图 19. Input Transition Rise or Fall Rate
图 18. Propagation Delay
18
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VCCA
VCCA / 2
DIR
VCCA / 2
GND
(1)
ten
(5)
VCCO
Output A(2)
Output A(3)
VCCO / 2
VOL + VTP
(6)
VOL
tdis
(6)
VOH
VOH - VTP
VCCO / 2
GND
(1)
ten
(5)
VCCO
Output B(2)
Output B(3)
VCCO / 2
VOL + VTP
(6)
VOL
tdis
(6)
VOH
VOH - VTP
VCCO / 2
GND
1. Illustrative purposes only. Enable Time is a calculation as described in the data sheet.
2. Output waveform on the condition that input is driven to a valid Logic Low.
3. Output waveform on the condition that input is driven to a valid Logic High.
4. VCCI is the supply pin associated with the input port
5. VCCO is the supply pin associated with the output port.
6. VOH and VOL are typical output voltage levels that occur with specified RL, CL, and S1
图 20. Disable and Enable Time
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8 Detailed Description
8.1 Overview
The SN74AXC1T45-Q1 is AEC-Q100 qualified single-bit, dual-supply, non-inverting voltage level translator. Pin A
and the direction control pin are referenced to VCCA logic levels and pin B is referenced to VCCB logic levels, as
depicted in the Functional Block Diagram. The A port can accept I/O voltages ranging from 0.65 V to 3.6 V, and
the B port can accept I/O voltages from 0.65 V to 3.6 V. A logic high on the DIR pin enables data transmission
from A to B and a logic low on the DIR pin enables data transmission from B to A.
8.2 Functional Block Diagram
5
DIR
3
A
4
B
V
V
CCB
CCA
图 21. Functional Block Diagram
8.3 Feature Description
8.3.1 Standard CMOS Inputs
Standard CMOS inputs are high impedance and are typically modeled as a resistor in parallel with the input
capacitance given in the Electrical Characteristics. The worst case resistance is calculated with the maximum
input voltage, given in the Absolute Maximum Ratings, and the maximum input leakage current, given in the
Electrical Characteristics, using ohm's law (R = V ÷ I).
Signals applied to the inputs need to have fast edge rates, as defined by Δt/Δv in Recommended Operating
Conditions to avoid excessive current consumption and oscillations. If a slow or noisy input signal is required, a
device with a Schmitt-trigger input should be used to condition the input signal prior to the standard CMOS input.
8.3.2 Balanced High-Drive CMOS Push-Pull Outputs
A balanced output allows the device to sink and source similar currents. The high drive capability of this device
creates fast edges into light loads so routing and load conditions should be considered to prevent ringing.
Additionally, the outputs of this device are capable of driving larger currents than the device can sustain without
being damaged. The electrical and thermal limits defined in the Absolute Maximum Ratings must be followed at
all times.
8.3.3 Partial Power Down (Ioff
)
The inputs and outputs for this device enter a high-impedance state when the device is powered down, inhibiting
current backflow into the device. The maximum leakage into or out of any input or output pin on the device is
specified by Ioff in the Electrical Characteristics.
8.3.4 VCC Isolation
The inputs and outputs for this device enter a high-impedance state when either supply is <100mV.
20
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Feature Description (接下页)
8.3.5 Over-voltage Tolerant Inputs
Input signals to this device can be driven above the supply voltage so long as they remain below the maximum
input voltage value specified in the Recommended Operating Conditions.
8.3.6 Negative Clamping Diodes
The inputs and outputs to this device have negative clamping diodes as depicted in 图 22.
CAUTION
Voltages beyond the values specified in the Absolute Maximum Ratings table can
cause damage to the device. The input negative-voltage and output voltage ratings
may be exceeded if the input and output clamp-current ratings are observed.
VCC
Device
Input
Output
Logic
GND
-IIK
-IOK
图 22. Electrical Placement of Clamping Diodes for Each Input and Output
8.3.7 Fully Configurable Dual-Rail Design
Both the VCCA and VCCB pins can be supplied at any voltage from 0.65 V to 3.6 V, making the device suitable for
translating between any of the voltage nodes (0.7 V, 0.8 V, 0.9 V, 1.2 V, 1.8 V, 2.5 V and 3.3 V).
8.3.8 Supports High-Speed Translation
The SN74AXC1T45-Q1 device can support high data-rate applications. The translated signal data rate can be up
to 500 Mbps when the signal is translated from 1.8 V to 3.3 V.
8.4 Device Functional Modes
表 10 lists the device functions for the DIR input.
表 10. Function Table
INPUT(1)
OPERATION
DIR
L
B data to A bus
A data to B bus
H
(1) Input circuits of the data I/Os always are active.
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9 Application and Implementation
注
Information in the following applications sections is not part of the TI component
specification, and TI does not warrant its accuracy or completeness. TI’s customers are
responsible for determining suitability of components for their purposes. Customers should
validate and test their design implementation to confirm system functionality.
9.1 Application Information
The SN74AXC1T45-Q1 device can be used in level-translation applications for interfacing devices or systems
with one another when they are operating at different interface voltages. The maximum data rate can be up to
500 Mbps when the device translate signals from 1.8 V to 3.3 V.
9.1.1 Enable Times
Calculate the enable times for the SN74AXC1T45-Q1 using the following formulas:
tPZH (DIR to A) = tPLZ (DIR to B) + tPLH (B to A)
tPZL (DIR to A) = tPHZ (DIR to B) + tPHL (B to A)
tPZH (DIR to B) = tPLZ (DIR to A) + tPLH (A to B)
tPZL (DIR to B) = tPHZ (DIR to A) + tPHL (A to B)
(1)
(2)
(3)
(4)
In a bidirectional application, these enable times provide the maximum delay time from the time the DIR bit is
switched until an output is expected. For example, if the SN74AXC1T45-Q1 initially is transmitting from A to B,
then the DIR bit is switched; the B port of the device must be disabled before presenting it with an input. After the
B port has been disabled, an input signal applied to it appears on the corresponding A port after the specified
propagation delay.
9.2 Typical Applications
9.2.1 Interrupt Request Application
图 23 shows an example of the SN74AXC1T45-Q1 being used in an application where a system controller flags
an interrupt request (IRQ) to the CPU. The system controller determines the direction of the IRQ line to either
flag an interrupt to the CPU or allow the CPU to drive data on the line. In this application the controller is
operating at 3.3 V while the CPU can be operating as low as 0.65 V.
The SN74AXC1T45-Q1 device is used to ensure that these devices can communicate at the appropriate voltage
levels. Because the SN74AXC1T45-Q1 does not have an output-enable (OE) pin, the system designer should
take precautions to avoid bus contention between the CPU and controller when changing directions.
0.7 V
3.3 V
0.1 µF
0.1 µF
VCCA
VCCB
IRQ
Data
IRQ
Data
CPU
Controller
B
SN74AXC1T45-Q1
GND
A
IRQ
Direction
DIR
图 23. Interrupt Request Application
9.2.1.1 Design Requirements
For this design example, use the parameters listed in 表 11.
22
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Typical Applications (接下页)
表 11. Design Parameters
DESIGN PARAMETERS
Input voltage range
EXAMPLE VALUES
0.65 V to 3.6 V
Output voltage range
0.65 V to 3.6 V
9.2.1.2 Detailed Design Procedure
To begin the design process, determine the following:
•
Input voltage range
–
Use the supply voltage of the device that is driving the SN74AXC1T45-Q1 device to determine the input
voltage range. For a valid logic-high, the value must exceed the high-level input voltage (VIH) of the input
port. For a valid logic low the value must be less than the low-level input voltage (VIL) of the input port.
•
Output voltage range
–
Use the supply voltage of the device that the SN74AXC1T45-Q1 device is driving to determine the output
voltage range.
9.2.1.3 Application Curve
图 24. Up Translation at 2.5 MHz (0.7 V to 3.3 V)
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9.2.2 Universal Asynchronous Receiver-Transmitter (UART) Interface Application
图 25 shows the SN74AXC1T45-Q1 being used for the two-bit UART interface application. One SN74AXC1T45-
Q1 device is used to level shift the voltage and drive the TX from the processor to the GPS Module while a
second SN74AXC1T45-Q1 device is used to drive the TX Data line from the GPS Module to the Processor.
0.7 V
3.3 V
0.1 µF
0.1 µF
VCCA
VCCB
RX
TX
B
SN74AXC1T45-Q1
GND
A
DIR
0.1 µF
0.1 µF
Processor
GPS Module
VCCA
VCCB
TX
RX
B
SN74AXC1T45-Q1
GND
A
DIR
图 25. UART Interface Application
9.2.2.1 Design Requirements
Refer to Design Requirements.
9.2.2.2 Detailed Design Procedure
Refer to Detailed Design Procedure.
24
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ZHCSK32B –FEBRUARY 2019–REVISED SEPTEMBER 2019
10 Power Supply Recommendations
Always apply a ground reference to the GND pins first. This device is designed for glitch free power sequencing
without any supply sequencing requirements such as ramp order or ramp rate.
This device was designed with various power supply sequencing methods in mind to help prevent unintended
triggering of downstream devices. For more information regarding the power up glitch performance of the AXC
family of level translators, see the Power Sequencing for AXC Family of Devices application report
11 Layout
11.1 Layout Guidelines
To ensure reliability of the device, following common printed-circuit board layout guidelines are recommended:
•
•
Use bypass capacitors on the power supply pins and place them as close to the device as possible.
Use short trace lengths to avoid excessive loading.
11.2 Layout Example
LEGEND
Polygonal Copper Pour
VIA to Power Plane
VIA to GND Plane (Inner Layer)
VCCB
VCCA
6
5
4
1
2
3
VCCA
GND
A
VCCB
DIR
B
VCCA
From Controller
To System
图 26. PCB Layout Example
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12 器件和文档支持
12.1 文档支持
相关文档请参见以下部分:
•
•
•
德州仪器 (TI),《使用通用 EVM 评估 SN74AXC1T45DRL》应用报告
德州仪器 (TI),《慢速或浮点 CMOS 输入的影响》应用报告
德州仪器 (TI),《AXC 系列器件电源定序》应用报告
12.2 接收文档更新通知
要接收文档更新通知,请导航至 ti.com. 上的器件产品文件夹。单击右上角的通知我进行注册,即可每周接收产品
信息更改摘要。有关更改的详细信息,请查看任何已修订文档中包含的修订历史记录。
12.3 支持资源
TI E2E™ support forums are an engineer's go-to source for fast, verified answers and design help — straight
from the experts. Search existing answers or ask your own question to get the quick design help you need.
Linked content is provided "AS IS" by the respective contributors. They do not constitute TI specifications and do
not necessarily reflect TI's views; see TI's Terms of Use.
12.4 商标
E2E is a trademark of Texas Instruments.
12.5 静电放电警告
ESD 可能会损坏该集成电路。德州仪器 (TI) 建议通过适当的预防措施处理所有集成电路。如果不遵守正确的处理措施和安装程序 , 可
能会损坏集成电路。
ESD 的损坏小至导致微小的性能降级 , 大至整个器件故障。 精密的集成电路可能更容易受到损坏 , 这是因为非常细微的参数更改都可
能会导致器件与其发布的规格不相符。
12.6 Glossary
SLYZ022 — TI Glossary.
This glossary lists and explains terms, acronyms, and definitions.
13 机械、封装和可订购信息
以下页面包含机械、封装和可订购信息。这些信息是指定器件的最新可用数据。数据如有变更,恕不另行通知,且
不会对此文档进行修订。如需获取此数据表的浏览器版本,请查阅左侧的导航栏。
26
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PACKAGE OPTION ADDENDUM
www.ti.com
10-Dec-2020
PACKAGING INFORMATION
Orderable Device
Status Package Type Package Pins Package
Eco Plan
Lead finish/
Ball material
MSL Peak Temp
Op Temp (°C)
Device Marking
Samples
Drawing
Qty
(1)
(2)
(3)
(4/5)
(6)
SN74AXC1T45QDCKRQ1
SN74AXC1T45QDRYRQ1
ACTIVE
ACTIVE
SC70
SON
DCK
DRY
6
6
3000 RoHS & Green
5000 RoHS & Green
NIPDAU
Level-1-260C-UNLIM
Level-1-260C-UNLIM
-40 to 125
-40 to 125
1E1
G2
NIPDAU
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance
do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may
reference these types of products as "Pb-Free".
RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.
Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based
flame retardants must also meet the <=1000ppm threshold requirement.
(3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6)
Lead finish/Ball material - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead finish/Ball material values may wrap to two
lines if the finish value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 1
PACKAGE OPTION ADDENDUM
www.ti.com
10-Dec-2020
Addendum-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com
16-Jun-2023
TAPE AND REEL INFORMATION
REEL DIMENSIONS
TAPE DIMENSIONS
K0
P1
W
B0
Reel
Diameter
Cavity
A0
A0 Dimension designed to accommodate the component width
B0 Dimension designed to accommodate the component length
K0 Dimension designed to accommodate the component thickness
Overall width of the carrier tape
W
P1 Pitch between successive cavity centers
Reel Width (W1)
QUADRANT ASSIGNMENTS FOR PIN 1 ORIENTATION IN TAPE
Sprocket Holes
Q1 Q2
Q3 Q4
Q1 Q2
Q3 Q4
User Direction of Feed
Pocket Quadrants
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
A0
B0
K0
P1
W
Pin1
Diameter Width (mm) (mm) (mm) (mm) (mm) Quadrant
(mm) W1 (mm)
SN74AXC1T45QDCKRQ1 SC70
SN74AXC1T45QDRYRQ1 SON
DCK
DRY
6
6
3000
5000
178.0
180.0
9.0
9.5
2.4
1.2
2.5
1.2
0.7
4.0
4.0
8.0
8.0
Q3
Q1
1.65
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
16-Jun-2023
TAPE AND REEL BOX DIMENSIONS
Width (mm)
H
W
L
*All dimensions are nominal
Device
Package Type Package Drawing Pins
SPQ
Length (mm) Width (mm) Height (mm)
SN74AXC1T45QDCKRQ1
SN74AXC1T45QDRYRQ1
SC70
SON
DCK
DRY
6
6
3000
5000
190.0
189.0
190.0
185.0
30.0
36.0
Pack Materials-Page 2
GENERIC PACKAGE VIEW
DRY 6
USON - 0.6 mm max height
PLASTIC SMALL OUTLINE - NO LEAD
Images above are just a representation of the package family, actual package may vary.
Refer to the product data sheet for package details.
4207181/G
PACKAGE OUTLINE
DRY0006B
USON - 0.55 mm max height
S
C
A
L
E
8
.
5
0
0
PLASTIC SMALL OUTLINE - NO LEAD
1.05
0.95
A
B
PIN 1 INDEX AREA
1.5
1.4
C
0.55 MAX
SEATING PLANE
0.08 C
0.05
0.00
3X 0.6
SYMM
(0.127) TYP
(0.05) TYP
3
4
4X
0.5
SYMM
2X
1
6
1
0.25
6X
0.15
PIN 1 ID
(OPTIONAL)
0.1
C A
C
B
0.05
0.35
0.25
6X
4222207/B 02/2016
NOTES:
1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing
per ASME Y14.5M.
2. This drawing is subject to change without notice.
www.ti.com
EXAMPLE BOARD LAYOUT
DRY0006B
USON - 0.55 mm max height
PLASTIC SMALL OUTLINE - NO LEAD
SYMM
6X (0.3)
1
6
6X (0.2)
SYMM
4X (0.5)
4
3
(R0.05) TYP
(0.6)
LAND PATTERN EXAMPLE
1:1 RATIO WITH PKG SOLDER PADS
SCALE:40X
0.05 MAX
ALL AROUND
0.05 MIN
ALL AROUND
METAL
SOLDER MASK
OPENING
SOLDER MASK
OPENING
METAL UNDER
SOLDER MASK
NON SOLDER MASK
DEFINED
SOLDER MASK
DEFINED
(PREFERRED)
SOLDER MASK DETAILS
4222207/B 02/2016
NOTES: (continued)
3. For more information, see QFN/SON PCB application report in literature No. SLUA271 (www.ti.com/lit/slua271).
www.ti.com
EXAMPLE STENCIL DESIGN
DRY0006B
USON - 0.55 mm max height
PLASTIC SMALL OUTLINE - NO LEAD
SYMM
6X (0.3)
1
6
6X (0.2)
SYMM
4X (0.5)
4
3
(R0.05) TYP
(0.6)
SOLDER PASTE EXAMPLE
BASED ON 0.075 - 0.1 mm THICK STENCIL
SCALE:40X
4222207/B 02/2016
NOTES: (continued)
4. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate
design recommendations.
www.ti.com
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