SN74LVC1G29DCTT [TI]

2-OF-3 DECODER/DEMULTIPLEXER; 2 -OF- 3解码器/解复用器
SN74LVC1G29DCTT
型号: SN74LVC1G29DCTT
厂家: TEXAS INSTRUMENTS    TEXAS INSTRUMENTS
描述:

2-OF-3 DECODER/DEMULTIPLEXER
2 -OF- 3解码器/解复用器

解码器 驱动器 解复用器 逻辑集成电路 光电二极管
文件: 总14页 (文件大小:325K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
SN74LVC1G29  
2-OF-3 DECODER/DEMULTIPLEXER  
www.ti.com  
SCES569AJUNE 2004REVISED SEPTEMBER 2006  
FEATURES  
Available in the Texas Instruments  
NanoStar™ and NanoFree™ Packages  
Ioff Supports Partial-Power-Down Mode  
Operation  
Supports 5-V VCC Operation  
Latch-Up Performance Exceeds 100 mA Per  
JESD 78, Class II  
Inputs Accept Voltages to 5.5 V  
Max tpd of 5.1 ns at 3.3 V  
ESD Protection Exceeds JESD 22  
– 2000-V Human-Body Model (A114-A)  
– 200-V Machine Model (A115-A)  
Low Power Consumption, 10-µA Max ICC  
±24-mA Output Drive at 3.3 V  
– 1000-V Charged-Device Model (C101)  
Typical VOLP (Output Ground Bounce) <0.8 V  
at VCC = 3.3 V, TA = 25°C  
Typical VOHV (Output VOH Undershoot) >2 V at  
VCC = 3.3 V, TA = 25°C  
DCT PACKAGE  
(TOP VIEW)  
DCU PACKAGE  
(TOP VIEW)  
YEP OR YZP PACKAGE  
(BOTTOM VIEW)  
4 5  
GND  
A0  
Y2  
A1  
VCC  
Y0  
A1  
Y2  
1
2
3
4
8
7
6
5
G
Y1  
VCC  
Y0  
A1  
Y2  
1
2
3
4
8
7
6
5
G
Y1  
3 6  
2 7  
1 8  
Y1  
Y0  
A0  
VCC  
G
GND  
A0  
GND  
See mechanical drawings for dimensions.  
DESCRIPTION/ORDERING INFORMATION  
This decoder is designed for 1.65-V to 5.5-V VCC operation.  
The SN74LVC1G29 is a 2-of-3 decoder/demultiplexer. When the enable (G) input signal is low, only one of the  
outputs is in the low state, depending on the input levels of A0 and A1. When G is high, Y0, Y1, and Y2 are  
high, regardless of the input states.  
This device is fully specified for partial-power-down applications using Ioff. The Ioff circuitry disable the outputs,  
preventing damaging current backflow through the device when it is powered down.  
NanoStar™ and NanoFree™ package technology is a major breakthrough in IC packaging concepts, using the  
die as the package.  
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas  
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.  
NanoStar, NanoFree are trademarks of Texas Instruments.  
PRODUCTION DATA information is current as of publication date.  
Copyright © 2004–2006, Texas Instruments Incorporated  
Products conform to specifications per the terms of the Texas  
Instruments standard warranty. Production processing does not  
necessarily include testing of all parameters.  
SN74LVC1G29  
2-OF-3 DECODER/DEMULTIPLEXER  
www.ti.com  
SCES569AJUNE 2004REVISED SEPTEMBER 2006  
ORDERING INFORMATION  
(1)  
(2)  
TA  
PACKAGE  
NanoStar™– WCSP (DSBGA)  
ORDERABLE PART NUMBER  
TOP-SIDE MARKING  
SN74LVC1G29YEPR  
0.23-mm Large Bump – YEP  
Reel of 3000  
_ _ _D9_  
NanoFree™– WCSP (DSBGA)  
SN74LVC1G29YZPR  
0.23-mm Large Bump – YZP (Pb-free)  
SSOP – DCT  
–40°C to 85°C  
Reel of 3000  
Reel of 250  
Reel of 3000  
Reel of 250  
SN74LVC1G29DCTR  
SN74LVC1G29DCTT  
SN74LVC1G29DCUR  
SN74LVC1G29DCUT  
C29_ _ _  
C29_  
VSSOP – DCU  
(1) Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at  
www.ti.com/sc/package.  
(2) DCT: The actual top-side marking has three additional characters that designate the year, month, and assembly/test site.  
DCU: The actual top-side marking has one additional character that designates the assembly/test site.  
YEP/YZP: The actual top-side marking has three preceding characters to denote year, month, and sequence code, and one following  
character to designate the assembly/test site. Pin 1 identifier indicates solder-bump composition (1 = SnPb, = Pb-free).  
FUNCTION TABLE  
INPUTS  
OUTPUTS  
G
L
A1  
L
A0  
X
Y0  
L
Y1  
H
L
Y2  
H
H
L
L
H
H
X
L
H
H
H
L
H
X
H
H
H
H
LOGIC DIAGRAM (POSITIVE LOGIC)  
1
6
G
7
Y0  
A1  
2
5
Y1  
Y2  
3
A0  
2
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SN74LVC1G29  
2-OF-3 DECODER/DEMULTIPLEXER  
www.ti.com  
SCES569AJUNE 2004REVISED SEPTEMBER 2006  
Absolute Maximum Ratings(1)  
over operating free-air temperature range (unless otherwise noted)  
MIN  
–0.5  
–0.5  
–0.5  
–0.5  
MAX  
6.5  
UNIT  
V
VCC  
VI  
Supply voltage range  
(2)  
Input voltage range  
6.5  
V
VO  
VO  
IIK  
Voltage range applied to any output in the high-impedance or power-off state(2)  
Voltage range applied to any output in the high or low state(2)(3)  
6.5  
V
VCC + 0.5  
–50  
V
Input clamp current  
VI < 0  
mA  
mA  
mA  
mA  
IOK  
IO  
Output clamp current  
VO < 0  
–50  
Continuous output current  
Continuous current through VCC or GND  
±50  
±100  
220  
DCT package  
θJA  
Package thermal impedance(4)  
DCU package  
227  
°C/W  
°C  
YEP/YZP package  
102  
Tstg  
Storage temperature range  
–65  
150  
(1) Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings  
only, and functional operation of the device at these or any other conditions beyond those indicated under recommended operating  
conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.  
(2) The input and output negative-voltage ratings may be exceeded if the input and output current ratings are observed.  
(3) The value of VCC is provided in the recommended operating conditions table.  
(4) The package thermal impedance is calculated in accordance with JESD 51-7.  
3
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SN74LVC1G29  
2-OF-3 DECODER/DEMULTIPLEXER  
www.ti.com  
SCES569AJUNE 2004REVISED SEPTEMBER 2006  
Recommended Operating Conditions(1)  
MIN  
1.65  
MAX  
UNIT  
Operating  
5.5  
VCC Supply voltage  
V
Data retention only  
VCC = 1.65 V to 1.95 V  
VCC = 2.3 V to 2.7 V  
VCC = 3.0 V to 3.6 V  
VCC = 4.5 V to 5.5 V  
VCC = 1.65 V to 1.95 V  
VCC = 2.3 V to 2.7 V  
VCC = 3.0 V to 3.6 V  
VCC = 4.5 V to 5.5 V  
1.5  
0.65 × VCC  
1.7  
VIH  
High-level input voltage  
Low-level input voltage  
V
2
0.7 × VCC  
0.35 × VCC  
0.7  
VIL  
V
0.8  
0.3 × VCC  
5.5  
VCC  
–4  
VI  
Input voltage  
0
0
V
V
VO  
Output voltage  
VCC = 1.65 V  
VCC = 2.3 V  
–8  
IOH  
High-level output current  
Low-level output current  
–16  
–24  
–32  
4
mA  
mA  
VCC = 3 V  
VCC = 4.5 V  
VCC = 1.65 V  
VCC = 2.3 V  
8
IOL  
16  
VCC = 3 V  
24  
VCC = 4.5 V  
32  
VCC = 1.8 V ± 0.15 V, 2.5 V ± 0.2 V  
VCC = 3.3 V ± 0.3 V  
VCC = 5 V ± 0.5 V  
20  
t/v Input transition rise or fall rate  
10  
ns/V  
5
TA  
Operating free-air temperature  
–40  
85  
°C  
(1) All unused inputs of the device must be held at VCC or GND to ensure proper device operation. Refer to the TI application report,  
Implications of Slow or Floating CMOS Inputs, literature number SCBA004.  
4
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SN74LVC1G29  
2-OF-3 DECODER/DEMULTIPLEXER  
www.ti.com  
SCES569AJUNE 2004REVISED SEPTEMBER 2006  
Electrical Characteristics  
over recommended operating free-air temperature range (unless otherwise noted)  
PARAMETER  
TEST CONDITIONS  
VCC  
1.65 V to 5.5 V  
1.65 V  
MIN  
VCC – 0.1  
1.2  
TYP(1)  
MAX  
UNIT  
IOH = –100 µA  
IOH = –4 mA  
IOH = –8 mA  
IOH = –16 mA  
IOH = –24 mA  
IOH = –32 mA  
IOL = 100 µA  
IOL = 4 mA  
2.3 V  
1.9  
VOH  
V
2.4  
3 V  
2.3  
4.5 V  
1.65 V to 5.5 V  
1.65 V  
3.8  
0.1  
0.45  
0.3  
IOL = 8 mA  
2.3 V  
VOL  
V
IOL = 16 mA  
0.4  
3 V  
IOL= 24 mA  
0.55  
0.55  
±1  
IOL= 32 mA  
4.5 V  
0 to 5.5 V  
0
II  
Ioff  
VI = 5.5 V or GND  
VI or VO = 5.5 V  
VI = 5.5 V or GND,  
µA  
µA  
µA  
µA  
pF  
±10  
10  
ICC  
ICC  
Ci  
IO = 0  
1.65 V to 5.5 V  
3 V to 5.5 V  
3.3 V  
One input at VCC – 0.6 V,  
VI = VCC or GND  
Other inputs at VCC or GND  
500  
3.5  
(1) All typical values are at VCC = 3.3 V, TA = 25°C.  
5
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SN74LVC1G29  
2-OF-3 DECODER/DEMULTIPLEXER  
www.ti.com  
SCES569AJUNE 2004REVISED SEPTEMBER 2006  
Switching Characteristics  
over recommended operating free-air temperature range, CL = 15 pF (unless otherwise noted) (see Figure 1)  
VCC = 1.8 V VCC = 2.5 V VCC = 3.3 V  
VCC = 5 V  
± 0.5 V  
FROM  
(INPUT)  
TO  
(OUTPUT)  
± 0.15 V  
MIN MAX MIN MAX  
2.5 15.4 1.5 7.1  
± 0.2 V  
± 0.3 V  
PARAMETER  
UNIT  
MIN MAX  
MIN MAX  
0.5 4.2  
tpd  
A or G  
Y
1
5.1  
ns  
Switching Characteristics  
over recommended operating free-air temperature range, CL = 30 pF or 50 pF (unless otherwise noted) (see Figure 2)  
VCC = 1.8 V VCC = 2.5 V VCC = 3.3 V  
VCC = 5 V  
± 0.5 V  
FROM  
(INPUT)  
TO  
(OUTPUT)  
± 0.15 V  
± 0.2 V  
± 0.3 V  
PARAMETER  
UNIT  
MIN MAX MIN MAX  
MIN MAX  
MIN MAX  
tpd  
A or G  
Y
2.5  
15.8  
1.5  
7.5  
1
6.1  
0.5  
5.1  
ns  
Operating Characteristics  
TA = 25°C  
VCC = 1.8 V  
VCC = 2.5 V  
VCC = 3.3 V  
VCC = 5 V  
TYP  
TEST  
CONDITIONS  
PARAMETER  
UNIT  
TYP  
17  
TYP  
17  
TYP  
18  
G to Y1  
A1 to Yn  
19  
Power dissipation  
capacitance  
Cpd  
f = 10 MHz  
pF  
33  
33  
33  
35  
6
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SN74LVC1G29  
2-OF-3 DECODER/DEMULTIPLEXER  
www.ti.com  
SCES569AJUNE 2004REVISED SEPTEMBER 2006  
PARAMETER MEASUREMENT INFORMATION  
VLOAD  
Open  
S1  
RL  
From Output  
Under Test  
TEST  
tPLH/tPHL  
tPLZ/tPZL  
tPHZ/tPZH  
S1  
GND  
Open  
VLOAD  
GND  
CL  
(see Note A)  
RL  
LOAD CIRCUIT  
INPUTS  
VCC  
VM  
VLOAD  
CL  
RL  
V
D
VI  
tr/tf  
VCC  
VCC  
3 V  
VCC  
1.8 V ± 0.15 V  
2.5 V ± 0.2 V  
3.3 V ± 0.3 V  
5 V ± 0.5 V  
£2 ns  
£2 ns  
VCC/2  
VCC/2  
1.5 V  
VCC/2  
2 × VCC  
2 × VCC  
6 V  
15 pF  
15 pF  
15 pF  
15 pF  
1 MW  
0.15 V  
0.15 V  
0.3 V  
1 MW  
1 MW  
1 MW  
£2.5 ns  
£2.5 ns  
2 × VCC  
0.3 V  
VI  
Timing Input  
Data Input  
VM  
0 V  
tW  
tsu  
th  
VI  
VI  
Input  
VM  
VM  
VM  
VM  
0 V  
0 V  
VOLTAGE WAVEFORMS  
PULSE DURATION  
VOLTAGE WAVEFORMS  
SETUP AND HOLD TIMES  
VI  
VI  
Output  
Control  
VM  
VM  
Input  
VM  
VM  
0 V  
0 V  
tPZL  
tPLZ  
tPLH  
tPHL  
VM  
Output  
Waveform 1  
S1 at VLOAD  
VOH  
VOL  
VLOAD/2  
VOL  
VM  
VM  
Output  
Output  
VOL + V  
D
(see Note B)  
tPHL  
tPLH  
tPZH  
tPHZ  
VOH  
VOL  
Output  
Waveform 2  
S1 at GND  
VOH  
VOH – V  
D
VM  
VM  
VM  
»0 V  
(see Note B)  
VOLTAGE WAVEFORMS  
PROPAGATION DELAY TIMES  
INVERTING AND NONINVERTING OUTPUTS  
VOLTAGE WAVEFORMS  
ENABLE AND DISABLE TIMES  
LOW- AND HIGH-LEVEL ENABLING  
NOTES: A. CL includes probe and jig capacitance.  
B. Waveform 1 is for an output with internal conditions such that the output is low, except when disabled by the output control.  
Waveform 2 is for an output with internal conditions such that the output is high, except when disabled by the output control.  
C. All input pulses are supplied by generators having the following characteristics: PRR £ 10 MHz, ZO = 50 W.  
D. The outputs are measured one at a time, with one transition per measurement.  
E. tPLZ and tPHZ are the same as tdis.  
F. tPZL and tPZH are the same as ten.  
G. tPLH and tPHL are the same as tpd.  
H. All parameters and waveforms are not applicable to all devices.  
Figure 1. Load Circuit and Voltage Waveforms  
7
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SN74LVC1G29  
2-OF-3 DECODER/DEMULTIPLEXER  
www.ti.com  
SCES569AJUNE 2004REVISED SEPTEMBER 2006  
PARAMETER MEASUREMENT INFORMATION (continued)  
VLOAD  
Open  
S1  
RL  
From Output  
Under Test  
TEST  
tPLH/tPHL  
tPLZ/tPZL  
tPHZ/tPZH  
S1  
GND  
Open  
VLOAD  
GND  
CL  
(see Note A)  
RL  
LOAD CIRCUIT  
INPUTS  
VCC  
VM  
VLOAD  
CL  
RL  
V
D
VI  
tr/tf  
VCC  
VCC  
3 V  
VCC  
1.8 V ± 0.15 V  
2.5 V ± 0.2 V  
3.3 V ± 0.3 V  
5 V ± 0.5 V  
£2 ns  
£2 ns  
VCC/2  
VCC/2  
1.5 V  
VCC/2  
2 × VCC  
2 × VCC  
6 V  
30 pF  
30 pF  
50 pF  
50 pF  
1 kW  
0.15 V  
0.15 V  
0.3 V  
500 W  
500 W  
500 W  
£2.5 ns  
£2.5 ns  
2 × VCC  
0.3 V  
VI  
Timing Input  
Data Input  
VM  
0 V  
tW  
tsu  
th  
VI  
VI  
Input  
VM  
VM  
VM  
VM  
0 V  
0 V  
VOLTAGE WAVEFORMS  
PULSE DURATION  
VOLTAGE WAVEFORMS  
SETUP AND HOLD TIMES  
VI  
VI  
Output  
Control  
VM  
VM  
Input  
VM  
VM  
0 V  
0 V  
tPZL  
tPLZ  
tPLH  
tPHL  
VM  
Output  
Waveform 1  
S1 at VLOAD  
VOH  
VOL  
VLOAD/2  
VM  
VM  
Output  
Output  
VOL + V  
D
VOL  
(see Note B)  
tPHL  
tPLH  
tPZH  
tPHZ  
VOH  
VOL  
Output  
Waveform 2  
S1 at GND  
VOH  
VOH – V  
D
VM  
VM  
VM  
»0 V  
(see Note B)  
VOLTAGE WAVEFORMS  
PROPAGATION DELAY TIMES  
INVERTING AND NONINVERTING OUTPUTS  
VOLTAGE WAVEFORMS  
ENABLE AND DISABLE TIMES  
LOW- AND HIGH-LEVEL ENABLING  
NOTES: A. CL includes probe and jig capacitance.  
B. Waveform 1 is for an output with internal conditions such that the output is low, except when disabled by the output control.  
Waveform 2 is for an output with internal conditions such that the output is high, except when disabled by the output control.  
C. All input pulses are supplied by generators having the following characteristics: PRR £ 10 MHz, ZO = 50 W.  
D. The outputs are measured one at a time, with one transition per measurement.  
E. tPLZ and tPHZ are the same as tdis.  
F. tPZL and tPZH are the same as ten.  
G. tPLH and tPHL are the same as tpd.  
H. All parameters and waveforms are not applicable to all devices.  
Figure 2. Load Circuit and Voltage Waveforms  
8
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PACKAGE OPTION ADDENDUM  
www.ti.com  
18-Jul-2006  
PACKAGING INFORMATION  
Orderable Device  
SN74LVC1G29DCTR  
SN74LVC1G29DCTRE4  
Status (1)  
ACTIVE  
ACTIVE  
Package Package  
Pins Package Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3)  
Qty  
Type  
Drawing  
SM8  
DCT  
8
3000  
3000  
250  
Pb-Free  
(RoHS)  
CU NIPDAU Level-1-260C-UNLIM  
SM8  
DCT  
8
Pb-Free  
(RoHS)  
CU NIPDAU Level-1-260C-UNLIM  
SN74LVC1G29DCTT  
SN74LVC1G29DCUR  
PREVIEW  
ACTIVE  
SM8  
US8  
DCT  
DCU  
8
8
TBD  
Call TI  
Call TI  
3000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
SN74LVC1G29DCURE4  
SN74LVC1G29DCUT  
SN74LVC1G29DCUTE4  
ACTIVE  
ACTIVE  
ACTIVE  
US8  
US8  
US8  
DCU  
DCU  
DCU  
8
8
8
3000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
250 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
250 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
SN74LVC1G29YEPR  
SN74LVC1G29YZPR  
NRND  
WCSP  
WCSP  
YEP  
YZP  
8
8
3000  
TBD  
SNPB  
Level-1-260C-UNLIM  
Level-1-260C-UNLIM  
ACTIVE  
3000 Green (RoHS &  
no Sb/Br)  
SNAGCU  
(1) The marketing status values are defined as follows:  
ACTIVE: Product device recommended for new designs.  
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.  
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in  
a new design.  
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.  
OBSOLETE: TI has discontinued the production of the device.  
(2)  
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check  
http://www.ti.com/productcontent for the latest availability information and additional product content details.  
TBD: The Pb-Free/Green conversion plan has not been defined.  
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements  
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered  
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.  
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and  
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS  
compatible) as defined above.  
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame  
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)  
(3)  
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder  
temperature.  
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is  
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the  
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take  
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on  
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited  
information may not be available for release.  
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI  
to Customer on an annual basis.  
Addendum-Page 1  
MECHANICAL DATA  
MPDS049B – MAY 1999 – REVISED OCTOBER 2002  
DCT (R-PDSO-G8)  
PLASTIC SMALL-OUTLINE PACKAGE  
0,30  
0,15  
M
0,13  
0,65  
8
5
0,15 NOM  
2,90  
2,70  
4,25  
3,75  
Gage Plane  
PIN 1  
INDEX AREA  
0,25  
1
4
0° – 8°  
0,60  
0,20  
3,15  
2,75  
1,30 MAX  
Seating Plane  
0,10  
0,10  
0,00  
4188781/C 09/02  
NOTES: A. All linear dimensions are in millimeters.  
B. This drawing is subject to change without notice.  
C. Body dimensions do not include mold flash or protrusion  
D. Falls within JEDEC MO-187 variation DA.  
POST OFFICE BOX 655303 DALLAS, TEXAS 75265  
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