TPS53685 [TI]
适用于 AMD 平台且具有 SVI3 和 PMBus 的八相数字降压多相控制器;
| 型号： | TPS53685 |
| 厂家： | 
TEXAS INSTRUMENTS |
| 描述： | 适用于 AMD 平台且具有 SVI3 和 PMBus 的八相数字降压多相控制器 控制器 |
| 文件： | 总11页 (文件大小：1482K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
TPS53685
ZHCSQN7 –DECEMBER 2022
TPS53685 具有AMD-SVI3 和PMBus 接口的
双通道（N + M ≤ 8 相）D-CAP+™、降压多相控制器
1 特性
3 说明
• 输入电压范围：4.5V 至17V
• 输出电压范围：0.25V 至5.5V
• 支持N+M ≤8 相、M ≤4 相的双路输出
• 自带跨电感稳压器(TLVR) 拓扑支持
• 符合AMD® SVI3 标准
• 增强型D-CAP+™ 控制可提供卓越的瞬态性能和出
色的动态电流共享
• 可编程环路补偿
• 灵活的相位触发时序控制
• 单独的相电流校准和报告
• 可通过可编程电流阈值实现动态切相，从而提高轻
负载和重负载下的效率
• 快速增相可实现下冲衰减
• 无驱动器配置，有助于实现高效的高频开关
• 与TI NexFET™ 功率级完全兼容，可实现高密度解
决方案
TPS53685 是一款完全符合 AMD SVI3 标准的降压控
制器，具有跨电感稳压器 (TLVR) 拓扑支持、双通道、
内置非易失性存储器 (NVM) 和PMBus™ 接口，而且与
TI 的NexFET™ 智能功率级完全兼容。D-CAP+™ 架构
和下冲衰减 (USR) 等高级控制特性可提供快速瞬态响
应和良好的电流共享，从而更大程度降低对输出电容的
要求。该器件还提供全新的相位交错策略和动态切相功
能，可提升不同负载条件下的效率。VCORE 压摆率和
电压定位的可调节控制符合 AMD SVI3 标准。此外，
该器件还支持 PMBus 通信接口，可向系统报告遥测的
电压、电流、功率、温度和故障状况。所有可编程参数
均可通过 PMBus 接口进行配置，而且可作为新的默认
值存储在NVM 中，以尽可能减少外部组件数量。
TPS53685 器件采用热增强型 40 引脚 QFN 封装，额
定工作温度为–40°C 至125°C。
• 精确可调电压定位
• 获得专利的AutoBalance™ 相电流平衡
• 每相位电流限值可选
• PMBus™ 系统接口，用于遥测电压、电流、功率、
温度和故障条件
器件信息
器件型号(1)
TPS53685
封装尺寸（标称值）
封装
QFN (40)
5.00 × 5.00 mm
(1) 如需了解所有可用封装，请参阅数据表末尾的可订购产品附
录。
• 5.00 × 5.00 mm、40 引脚0.4 mm 间距QFN 封装
TPS53685
2 应用
PWM1
Power
Stage
CSP1
• 机架式服务器
• 微服务器和塔式服务器
• 高性能计算
• 基带单元(BBU)
PWM2
CSP2
PMBus
SVI3
Power
Stage
PWM8
CSP8
Power
Stage
图3-1. 简化的示例应用
本文档旨在为方便起见，提供有关TI 产品中文版本的信息，以确认产品的概要。有关适用的官方英文版本的最新信息，请访问
www.ti.com，其内容始终优先。TI 不保证翻译的准确性和有效性。在实际设计之前，请务必参考最新版本的英文版本。
English Data Sheet: SLUSEZ5
TPS53685
ZHCSQN7 –DECEMBER 2022
www.ti.com.cn
Table of Contents
1 特性................................................................................... 1
2 应用................................................................................... 1
3 说明................................................................................... 1
4 Revision History.............................................................. 2
5 Device and Documentation Support..............................3
5.1 Documentation Support.............................................. 3
5.2 接收文档更新通知....................................................... 3
5.3 支持资源......................................................................3
5.4 Trademarks.................................................................3
5.5 Electrostatic Discharge Caution..................................3
5.6 术语表......................................................................... 3
6 Mechanical, Packaging, and Orderable Information....4
6.1 Tape and Reel Information..........................................4
4 Revision History
注：以前版本的页码可能与当前版本的页码不同
DATE
REVISION
NOTES
December 2022
*
Initial release
Copyright © 2022 Texas Instruments Incorporated
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5 Device and Documentation Support
5.1 Documentation Support
5.1.1 Related Documentation
For related documentation see the following:
• Texas Instruments, Dual channel DCAP+ multiphase controllers: TPS53685, TPS536C5 Technical Reference
Manual SLUUCN5
5.2 接收文档更新通知
要接收文档更新通知，请导航至 ti.com 上的器件产品文件夹。点击订阅更新 进行注册，即可每周接收产品信息更
改摘要。有关更改的详细信息，请查看任何已修订文档中包含的修订历史记录。
5.3 支持资源
TI E2E™ 支持论坛是工程师的重要参考资料，可直接从专家获得快速、经过验证的解答和设计帮助。搜索现有解
答或提出自己的问题可获得所需的快速设计帮助。
链接的内容由各个贡献者“按原样”提供。这些内容并不构成 TI 技术规范，并且不一定反映 TI 的观点；请参阅
TI 的《使用条款》。
5.4 Trademarks
D-CAP+™, NexFET™, AutoBalance™, TI E2E™ are trademarks of Texas Instruments.
PMBus™ is a trademark of SMIF, Inc..
AMD® is a registered trademark of Advanced Micro Devices, Inc..
所有商标均为其各自所有者的财产。
5.5 Electrostatic Discharge Caution
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled
with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may
be more susceptible to damage because very small parametric changes could cause the device not to meet its published
specifications.
5.6 术语表
TI 术语表
本术语表列出并解释了术语、首字母缩略词和定义。
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ZHCSQN7 –DECEMBER 2022
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6 Mechanical, Packaging, and Orderable Information
The following pages include mechanical, packaging, and orderable information. This information is the most
current data available for the designated devices. This data is subject to change without notice and revision of
this document. For browser-based versions of this data sheet, refer to the left-hand navigation.
6.1 Tape and Reel Information
REEL DIMENSIONS
TAPE DIMENSIONS
K0
P1
W
B0
Reel
Diameter
Cavity
A0
A0 Dimension designed to accommodate the component width
B0 Dimension designed to accommodate the component length
K0 Dimension designed to accommodate the component thickness
Overall width of the carrier tape
W
P1 Pitch between successive cavity centers
Reel Width (W1)
QUADRANT ASSIGNMENTS FOR PIN 1 ORIENTATION IN TAPE
Sprocket Holes
Q1 Q2
Q3 Q4
Q1 Q2
Q3 Q4
User Direction of Feed
Pocket Quadrants
Reel
Diameter
(mm)
Reel
Width W1
(mm)
Package
Type
Package
Drawing
A0
(mm)
B0
(mm)
K0
(mm)
P1
(mm)
W
(mm)
Pin1
Quadrant
Device
Pins
SPQ
TPS53685RSBR
WQFN
RSB
40
3000
330.0
12.4
5.25
5.25
1.1
8.0
12.0
Q2
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ZHCSQN7 –DECEMBER 2022
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TAPE AND REEL BOX DIMENSIONS
Width (mm)
H
W
L
Device
Package Type
WQFN
Package Drawing Pins
RSB 40
SPQ
Length (mm) Width (mm)
338.0 355.0
Height (mm)
TPS53685RSBR
3000
50.0
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TPS53685
ZHCSQN7 –DECEMBER 2022
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Copyright © 2022 Texas Instruments Incorporated
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Product Folder Links: TPS53685
TPS53685
ZHCSQN7 –DECEMBER 2022
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Copyright © 2022 Texas Instruments Incorporated
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TPS53685
ZHCSQN7 –DECEMBER 2022
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PACKAGE OPTION ADDENDUM
www.ti.com
15-Dec-2022
PACKAGING INFORMATION
Orderable Device
Status Package Type Package Pins Package
Eco Plan
Lead finish/
Ball material
MSL Peak Temp
Op Temp (°C)
Device Marking
Samples
Drawing
Qty
(1)
(2)
(3)
(4/5)
(6)
TPS53685RSBR
ACTIVE
WQFN
RSB
40
3000 RoHS & Green
NIPDAUAG
Level-2-260C-1 YEAR
-40 to 105
TPS
53685
Samples
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance
do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may
reference these types of products as "Pb-Free".
RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.
Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based
flame retardants must also meet the <=1000ppm threshold requirement.
(3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6)
Lead finish/Ball material - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead finish/Ball material values may wrap to two
lines if the finish value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 1
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