TPS7A8500RGRT [TI]

具有电源正常指示功能的 4A、低输入电压、低噪声、高精度、超低压降稳压器 | RGR | 20 | -40 to 125;
TPS7A8500RGRT
型号: TPS7A8500RGRT
厂家: TEXAS INSTRUMENTS    TEXAS INSTRUMENTS
描述:

具有电源正常指示功能的 4A、低输入电压、低噪声、高精度、超低压降稳压器 | RGR | 20 | -40 to 125

输出元件 稳压器 调节器
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TPS7A85  
ZHCSEP4A JANUARY 2016REVISED FEBRUARY 2016  
TPS7A85  
高电流 (4A)、高效 (1%)、低噪声 (4.4 µVRMS) LDO 稳压器  
1 特性  
3 说明  
1
低压降:4A 电流时为 150mV(典型值)  
TPS7A85 是一款低噪声 (4.4 µVRMS)、低压降 (LDO)  
线性稳压器,具备 4A 的拉电流能力,其最高压降仅为  
240mV。该器件的输出电压可通过引脚在 0.8V 至  
3.95V 的范围内进行编程并可通过外部电阻分压器在  
0.8V 5.0V 范围内进行调节。  
线路、负载和温度精度为 1%(最大值)  
输出电压噪声:  
4.4 µVRMS(输出为 0.8V)  
8.4 µVRMS(输出为 5.0V)  
输入电压范围:  
TPS7A85 将低噪声 (4.4 µVRMS)、高电源抑制比  
(PSRR) 和高输出电流性能相结合,非常适合为高速通  
信、视频、医疗或测试和测量 最高可驱动 1A 负载电  
流。TPS7A85 的高性能可限制电源生成的相位噪声和  
时钟抖动,非常适合为高性能串行器和解串器  
(SerDes)、模数转换器 (ADC)、数模转换器 (DAC) 以  
及射频 (RF) 组件供电。RF 放大器尤其受益于该器件  
的高性能和 5.0V 输出性能。  
无偏置:1.4V 6.5V  
有偏置:1.1V 6.5V  
ANY-OUT™运行:  
输出电压范围:0.8V 3.95V  
可调节运行:  
输出电压范围:0.8V 5.0V  
电源纹波抑制:  
500kHz 时为 40dB  
对于需要以低输入电压、低输出 (LILO) 电压运行的数  
字负载 [如特定用途集成电路 (ASIC)、现场可编程门阵  
(FPGA) 以及数字信号处理器 (DSP)]TPS7A85 优  
异的精度特性(负载和温度范围内的精度为  
0.75%)、远程感测、出色的瞬态性能以及软启动功能  
可确保最优系统性能。  
出色的负载瞬态响应  
可调节软启动浪涌电流控制  
开漏电源正常 (PG) 输出  
47µF 或更大的陶瓷输出电容一起工作时保持稳  
工作温度范围:  
–40°C +125°C  
TPS7A85 的多种用途使其成为许多高要求应用会考虑  
的 选择。  
20 引脚 3.5mm × 3.5mm 超薄型四方扁平无引线  
(VQFN) 封装  
器件信息(1)  
2 应用  
器件型号  
TPS7A85  
封装  
封装尺寸(标称值)  
超薄四方扁平无引线  
封装 (VQFN) (20)  
数字负载:串行解串器、现场可编程门阵列  
3.50mm x 3.50mm  
(FPGA) 和数字信号处理器 (DSP)  
仪器仪表、医疗和音频  
高速模拟电路:  
(1) 如需了解所有可用封装,请见数据表末尾的可订购产品附录。  
压控振荡器 (VCO)、模数转换器 (ADC)、数模  
转换器 (DAC) 以及低压差分信令 (LVDS)  
成像:互补金属氧化物半导体 (CMOS) 传感器和视  
频专用集成电路 (ASIC)  
测试和测量  
1
An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,  
intellectual property matters and other important disclaimers. PRODUCTION DATA.  
English Data Sheet: SBVS267  
 
 
 
 
TPS7A85  
ZHCSEP4A JANUARY 2016REVISED FEBRUARY 2016  
www.ti.com.cn  
RF 组件供电  
为数字负载供电  
Bias Supply  
Bias Supply  
BIAS  
Input Supply  
EN Signal  
BIAS  
IN  
Input Supply  
IN  
TPS7A85  
OUT  
TPS7A85  
OUT  
EN  
EN Signal  
PG  
EN  
PG  
VDD  
DSP,  
ASIC,  
FPGA  
ADC  
DAC  
GPIO  
ADS54J40  
ADS54J66  
ACD31JB68  
DAC38J82  
DAC39J84  
DAC5670  
C6000  
2
版权 © 2016, Texas Instruments Incorporated  
TPS7A85  
www.ti.com.cn  
ZHCSEP4A JANUARY 2016REVISED FEBRUARY 2016  
目录  
7.4 Device Functional Modes........................................ 20  
Application and Implementation ........................ 21  
8.1 Application Information............................................ 21  
8.2 Typical Applications ................................................ 36  
Power-Supply Recommendations...................... 38  
1
2
3
4
5
6
特性.......................................................................... 1  
8
9
应用.......................................................................... 1  
说明.......................................................................... 1  
修订历史记录 ........................................................... 3  
Pin Configurations and Functions....................... 4  
Specifications......................................................... 5  
6.1 Absolute Maximum Ratings ...................................... 5  
6.2 ESD Ratings.............................................................. 5  
6.3 Recommended Operating Conditions....................... 5  
6.4 Thermal Information.................................................. 6  
6.5 Electrical Characteristics........................................... 6  
6.6 Typical Characteristics.............................................. 8  
Detailed Description ............................................ 16  
7.1 Overview ................................................................. 16  
7.2 Functional Block Diagram ....................................... 17  
7.3 Feature Description................................................. 18  
10 Layout................................................................... 39  
10.1 Layout Guidelines ................................................. 39  
10.2 Layout Example .................................................... 39  
11 器件和文档支持 ..................................................... 40  
11.1 器件支持................................................................ 40  
11.2 文档支持................................................................ 40  
11.3 社区资源................................................................ 40  
11.4 ....................................................................... 41  
11.5 静电放电警告......................................................... 41  
11.6 Glossary................................................................ 41  
12 机械、封装和可订购信息....................................... 41  
7
4 修订历史记录  
Changes from Original (January 2016) to Revision A  
Page  
已发布为量产数................................................................................................................................................................... 1  
Copyright © 2016, Texas Instruments Incorporated  
3
 
TPS7A85  
ZHCSEP4A JANUARY 2016REVISED FEBRUARY 2016  
www.ti.com.cn  
5 Pin Configurations and Functions  
RGR Package  
3.5-mm × 3.5-mm, 20-Pin VQFN  
Top View  
OUT  
SNS  
FB  
1
2
3
4
5
15 IN  
14 EN  
13 NR/SS  
12 BIAS  
11 1.6V  
Thermal Pad  
PG  
50mV  
Pin Functions  
PIN  
NAME  
50mV  
NO.  
5
I/O  
DESCRIPTION  
100mV  
200mV  
400mV  
800mV  
1.6V  
6
ANY-OUT voltage setting pins. Connect these pins to ground, SNS, or leave floating. Connecting these pins to ground  
increases the output voltage, whereas connecting these pins to SNS increases the resolution of the ANY-OUT network  
but decreases the range of the network; multiple pins can be simultaneously connected to GND or SNS to select the  
desired output voltage. Leave these pins floating (open) when not in use. See the ANY-OUT Programmable Output  
Voltage section for additional details.  
7
I
9
10  
11  
BIAS supply voltage. This pin enables the use of low-input voltage, low-output (LILO) voltage conditions (that is, VIN  
1.2 V, VOUT = 1 V) to reduce power dissipation across the die. The use of a BIAS voltage improves dc and ac  
performance for VIN 2.2 V. A 10-µF capacitor or larger must be connected between this pin and ground. If not used,  
=
BIAS  
EN  
12  
14  
3
I
I
I
this pin must be left floating or tied to ground.  
Enable pin. Driving this pin to logic high enables the device; driving this pin to logic low disables the device. If enable  
functionality is not required, this pin must be connected to IN. If enable functionality is required, VEN must always be high  
after VIN is established when a BIAS supply is used. See the Sequencing Requirements section for more details.  
Feedback pin connected to the error amplifier. Although not required, a 10-nF feed-forward capacitor from FB to OUT  
(as close to the device as possible) is recommended to maximize ac performance. The use of a feed-forward capacitor  
can disrupt PG (power good) functionality. See the ANY-OUT Programmable Output Voltage and Adjustable Operation  
sections for more details.  
FB  
Ground pin. These pins must be connected to ground, the thermal pad, and each other with a low-impedance  
connection.  
GND  
IN  
8, 18  
I
Input supply voltage pins. A 47-μF or larger ceramic capacitor (25 μF or greater of effective capacitance) from IN to  
ground is recommended to reduce the impedance of the input supply. Place the input capacitor as close to the input as  
possible. See the Input and Output Capacitor Requirements section for more details.  
15-17  
Noise-reduction and soft-start pin. Connecting an external capacitor between this pin and ground reduces reference  
voltage noise and also enables the soft-start function. Although not required, a 10-nF or larger capacitor is recommended  
to be connected from NR/SS to GND (as close to the pin as possible) to maximize ac performance. See the Noise-  
Reduction and Soft-Start Capacitor section for more details.  
NR/SS  
13  
Regulated output pins. A 47-μF or larger ceramic capacitor (25 μF or greater of effective capacitance) from OUT to  
ground is required for stability and must be placed as close to the output as possible. Minimize the impedance from the  
OUT pin to the load. See the Input and Output Capacitor Requirements section for more details.  
OUT  
PG  
1, 19, 20  
O
O
Active-high, power-good pin. An open-drain output indicates when the output voltage reaches 89.3% of the target. The  
use of a feed-forward capacitor can disrupt PG (power good) functionality. See the Power-Good (PG) Function section  
for more details.  
4
2
Output voltage sense input pin. This pin connects the internal R1 resistor to the output. Connect this pin to the load side  
of the output trace only if the ANY-OUT feature is used. If the ANY-OUT feature is not used, leave this pin floating. See  
the ANY-OUT Programmable Output Voltage and Adjustable Operation sections for more details.  
SNS  
I
Thermal pad  
Connect the thermal pad to a large-area ground plane. The thermal pad is internally connected to GND.  
4
Copyright © 2016, Texas Instruments Incorporated  
TPS7A85  
www.ti.com.cn  
ZHCSEP4A JANUARY 2016REVISED FEBRUARY 2016  
6 Specifications  
6.1 Absolute Maximum Ratings  
over junction temperature range (unless otherwise noted)(1)  
MIN  
–0.3  
–0.3  
–0.3  
–0.3  
–0.3  
MAX  
7.0  
UNIT  
IN, BIAS, PG, EN  
IN, BIAS, PG, EN (5% duty cycle, pulse duration = 200 µs)  
SNS, OUT  
7.5  
VIN + 0.3(2)  
Voltage  
Current  
V
NR/SS, FB  
3.6  
50mV, 100mV, 200mV, 400mV, 800mV, 1.6V  
OUT  
VOUT + 0.3  
Internally limited  
A
PG (sink current into device)  
5
mA  
°C  
°C  
Operating junction temperature, TJ  
Storage temperature, Tstg  
–55  
–55  
150  
150  
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings  
only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended  
Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.  
(2) The absolute maximum rating is VIN + 0.3 V or 7.0 V, whichever is smaller.  
6.2 ESD Ratings  
VALUE  
±2000  
±500  
UNIT  
Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1)  
Charged-device model (CDM), per JEDEC specification JESD22-C101(2)  
V(ESD)  
Electrostatic discharge  
V
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.  
(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.  
6.3 Recommended Operating Conditions  
over junction temperature range (unless otherwise noted)  
MIN  
1.1  
3.0  
0.8  
0
NOM  
MAX  
UNIT  
VIN  
Input supply voltage range  
Bias supply voltage range(1)  
Output voltage range(2)  
Enable voltage range  
Output current  
6.5  
6.5  
5
V
V
VBIAS  
VOUT  
VEN  
V
VIN  
4
V
IOUT  
CIN  
0
A
Input capacitor  
10  
47  
10  
47  
µF  
µF  
kΩ  
nF  
nF  
COUT  
RPG  
Output capacitor  
47 || 10 || 10(3)  
Power-good pullup resistance  
NR/SS capacitor  
100  
CNR/SS  
CFF  
10  
10  
Feed-forward capacitor  
Top resistor value in feedback network for  
adjustable operation  
R1  
12.1(4)  
kΩ  
Bottom resistor value in feedback network for  
adjustable operation  
R2  
TJ  
160(5)  
125  
kΩ  
Operating junction temperature  
–40  
°C  
(1) BIAS supply is required when the VIN supply is below 1.4 V. Conversely, no BIAS supply is required when the VIN supply is higher than  
or equal to 1.4 V. A BIAS supply helps improve dc and ac performance for VIN 2.2 V.  
(2) This output voltage range does not include device accuracy or accuracy of the feedback resistors.  
(3) The recommended output capacitors are selected to optimize PSRR for the frequency range of 400 kHz to 700 kHz. This frequency  
range is a typical value for dc-dc supplies.  
(4) The 12.1-kΩ resistor is selected to optimize PSRR and noise by matching the internal R1 value.  
(5) The upper limit for the R2 resistor is to ensure accuracy by making the current through the feedback network much larger than the  
leakage current into the feedback node.  
Copyright © 2016, Texas Instruments Incorporated  
5
TPS7A85  
ZHCSEP4A JANUARY 2016REVISED FEBRUARY 2016  
www.ti.com.cn  
6.4 Thermal Information  
TPS7A85  
RGR (VQFN)  
20 PINS  
35.4  
THERMAL METRIC(1)  
UNIT  
RθJA  
Junction-to-ambient thermal resistance  
°C/W  
°C/W  
°C/W  
°C/W  
°C/W  
°C/W  
RθJC(top)  
RθJB  
Junction-to-case (top) thermal resistance  
Junction-to-board thermal resistance  
47.6  
12.3  
ψJT  
Junction-to-top characterization parameter  
Junction-to-board characterization parameter  
Junction-to-case (bottom) thermal resistance  
0.5  
ψJB  
12.4  
RθJC(bot)  
1.0  
(1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.  
6.5 Electrical Characteristics  
Over operating junction temperature range (TJ = –40°C to +125°C), VIN = 1.4 V or VIN = VOUT(nom) + 0.5 V (whichever is  
greater), VBIAS = open, VOUT(nom) = 0.8 V(1), OUT connected to 50 Ω to GND(2), VEN = 1.1 V, CIN = 10 μF, COUT = 47 μF, CNR/SS  
without CFF, and PG pin pulled up to VIN with 100 kΩ, unless otherwise noted. Typical values are at TJ = 25°C.  
PARAMETER  
TEST CONDITIONS  
MIN  
TYP  
MAX  
UNIT  
VIN  
Input supply voltage range(3)  
Bias supply voltage range(3)  
Feedback voltage  
1.1  
6.5  
V
VBIAS  
VIN = 1.1 V  
3.0  
6.5  
V
VFB  
0.8  
0.8  
V
VNR/SS  
NR/SS pin voltage  
V
VUVLO1(IN)  
VHYS1(IN)  
VUVLO2(IN)  
VHYS2(IN)  
VUVLO(BIAS)  
VHYS(BIAS)  
Input supply UVLO with BIAS  
VUVLO1(IN) hysteresis  
VIN rising with VBIAS = 3.0 V  
VBIAS = 3.0 V  
1.02  
320  
1.31  
253  
2.83  
290  
1.085  
1.39  
2.9  
V
mV  
V
Input supply UVLO without BIAS  
VUVLO2(IN) hysteresis  
VIN rising  
mV  
V
Bias supply UVLO  
VBIAS rising, VIN = 1.1 V  
VUVLO(BIAS) hysteresis  
VIN = 1.1 V  
mV  
Using the ANY-OUT pins  
Using external resistors(4)  
0.8 V VOUT 5 V, 5 mA IOUT 4 A, over VIN  
0.8 – 1.0%  
0.8 – 1.0%  
–1.0%  
3.95 + 1.0%  
5.0 + 1.0%  
1.0%  
Range  
V
Accuracy(4)(5)  
Output voltage  
VOUT  
Accuracy with  
BIAS  
VIN = 1.1 V, 5 mA IOUT 4 A,  
3.0 V VBIAS 6.5 V  
–0.75%  
0.75%  
ΔVOUT  
ΔVIN  
/
/
Line regulation  
Load regulation  
IOUT = 5 mA, 1.4 V VIN 6.5 V  
0.0035  
0.07  
mV/V  
mV/A  
5 mA IOUT 4 A, 3.0 V VBIAS 6.5 V,  
VIN = 1.1 V  
ΔVOUT  
ΔIOUT  
5 mA IOUT 4 A  
0.08  
0.4  
5 mA IOUT 4 A, VOUT = 5.0 V  
VIN = 1.4 V, IOUT = 4 A, VFB = 0.8 V – 3%  
VIN = 5.5 V, IOUT = 4 A, VFB = 0.8 V – 3%  
215  
325  
320  
500  
VDO  
Dropout voltage  
mV  
VIN = 1.1 V, VBIAS = 5.0 V,  
IOUT = 4 A, VFB = 0.8 V – 3%  
150  
5.2  
240  
5.7  
VOUT forced at 0.9 × VOUT(nom)  
VIN = VOUT(nom) + 0.4 V  
,
ILIM  
ISC  
Output current limit  
4.7  
A
A
Short-circuit current limit  
RLOAD = 20 mΩ  
1.0  
2.8  
4.8  
VIN = 6.5 V, IOUT = 5 mA  
VIN = 1.4 V, IOUT = 4 A  
4.0  
6.0  
25  
mA  
µA  
IGND  
GND pin current  
Shutdown, PG = open, VIN = 6.5 V, VEN = 0.5 V  
(1) VOUT(nom) is the calculated VOUT target value from the ANY-OUT in a fixed configuration. In an adjustable configuration, VOUT(nom) is the  
expected VOUT value set by the external feedback resistors.  
(2) This 50-Ω load is disconnected when the test conditions specify an IOUT value.  
(3) BIAS supply is required when the VIN supply is below 1.4 V. Conversely, no BIAS supply is required when the VIN supply is higher than  
or equal to 1.4 V. A BIAS supply helps improve dc and ac performance for VIN 2.2 V.  
(4) When the device is connected to external feedback resistors at the FB pin, external resistor tolerances are not included.  
(5) The device is not tested under conditions where VIN > VOUT + 1.25 V and IOUT = 4 A, because the power dissipation is higher than the  
maximum rating of the package.  
6
Copyright © 2016, Texas Instruments Incorporated  
 
TPS7A85  
www.ti.com.cn  
ZHCSEP4A JANUARY 2016REVISED FEBRUARY 2016  
Electrical Characteristics (continued)  
Over operating junction temperature range (TJ = –40°C to +125°C), VIN = 1.4 V or VIN = VOUT(nom) + 0.5 V (whichever is  
greater), VBIAS = open, VOUT(nom) = 0.8 V(1), OUT connected to 50 Ω to GND(2), VEN = 1.1 V, CIN = 10 μF, COUT = 47 μF, CNR/SS  
without CFF, and PG pin pulled up to VIN with 100 kΩ, unless otherwise noted. Typical values are at TJ = 25°C.  
PARAMETER  
TEST CONDITIONS  
MIN  
TYP  
MAX  
UNIT  
IEN  
EN pin current  
VIN = 6.5 V, VEN = 0 V and 6.5 V  
–0.1  
0.1  
µA  
VIN = 1.1 V, VBIAS = 6.5 V,  
VOUT(nom) = 0.8 V, IOUT = 4 A  
IBIAS  
BIAS pin current  
2.3  
3.5  
0.5  
mA  
V
EN pin high-level input voltage  
(enable device)  
VIL(EN)  
VIH(EN)  
0
1.1  
EN pin low-level input voltage  
(disable device)  
6.5  
V
88.3% ×  
VOUT  
VIT(PG)  
PG pin threshold  
For falling VOUT  
For rising VOUT  
82% × VOUT  
93% × VOUT  
V
V
V
VHYS(PG)  
VOL(PG)  
PG pin hysteresis  
1% × VOUT  
VOUT < VIT(PG), IPG = –1 mA  
(current sunk into pin)  
PG pin low-level output voltage  
0.4  
Ilkg(PG)  
INR/SS  
IFB  
PG pin leakage current  
NR/SS pin charging current  
FB pin leakage current  
VOUT > VIT(PG), VPG = 6.5 V  
VNR/SS = GND, VIN = 6.5 V  
VIN = 6.5 V  
1
9.0  
µA  
µA  
nA  
4.0  
6.2  
–100  
100  
f = 10 kHz,  
VOUT = 0.8 V,  
VBIAS = 5.0 V  
42  
39  
f = 500 kHz,  
VOUT = 0.8 V,  
VBIAS = 5.0 V  
VIN – VOUT = 0.5 V,  
IOUT = 4 A, CNR/SS = 100 nF,  
PSRR  
Power-supply ripple rejection  
dB  
CFF = 10 nF, COUT  
=
47 μF || 10 μF || 10 μF  
f = 10 kHz,  
VOUT = 3.3 V  
40  
25  
f = 500 kHz,  
VOUT = 3.3 V  
BW = 10 Hz to 100 kHz, VIN = 1.2 V,  
VOUT = 0.8 V, VBIAS = 5.0 V, IOUT = 4 A,  
CNR/SS = 100 nF, CFF = 10 nF,  
4.4  
8.4  
COUT = 47 μF || 10 μF || 10 μF  
Vn  
Output noise voltage  
μVRMS  
BW = 10 Hz to 100 kHz,  
VOUT = 5.0 V, IOUT = 4 A, CNR/SS = 100 nF,  
CFF = 10 nF, COUT = 47 μF || 10 μF || 10 μF  
Shutdown, temperature increasing  
Reset, temperature decreasing  
160  
140  
Tsd  
TJ  
Thermal shutdown temperature  
Operating junction temperature  
°C  
°C  
–40  
125  
版权 © 2016, Texas Instruments Incorporated  
7
 
TPS7A85  
ZHCSEP4A JANUARY 2016REVISED FEBRUARY 2016  
www.ti.com.cn  
6.6 Typical Characteristics  
at TA = 25°C, VIN = 1.4 V or VIN = VOUT(NOM) + 0.5 V (whichever is greater), VBIAS = open, VOUT(NOM) = 0.8 V, VEN = 1.1 V, COUT  
= 47 μF, CNR/SS = 0 nF, CFF = 0 nF, and PG pin pulled up to VIN with 100 kΩ (unless otherwise noted)  
100  
80  
60  
40  
20  
0
100  
80  
60  
40  
20  
0
IOUT = 0.1 A  
IOUT = 0.5 A  
IOUT = 1.0 A  
IOUT = 2.0 A  
IOUT = 3.0 A  
IOUT = 3.5 A  
IOUT = 4.0 A  
VIN = 1.10 V  
VIN = 1.15 V  
VIN = 1.20 V  
VIN = 1.25 V  
VIN = 1.30 V  
VIN = 1.35 V  
VIN = 1.40 V  
10  
100  
1k  
10k  
100k  
1M  
10M  
10  
100  
1k  
10k  
100k  
1M  
10M  
Frequency (Hz)  
Frequency (Hz)  
VIN = 1.2 V, VBIAS = 5 V,  
IOUT = 4 A, VBIAS = 5 V,  
COUT = 47 μF || 10 μF || 10 μF, CNR/SS = 10 nF, CFF = 10 nF  
COUT = 47 μF || 10 μF || 10 μF, CNR/SS = 10 nF, CFF = 10 nF  
1. PSRR vs Frequency and IOUT  
2. PSRR vs Frequency and VIN with Bias  
100  
100  
VBIAS = 0 V  
VBIAS = 3.0 V  
VBIAS = 5.0 V  
VBIAS = 6.5 V  
80  
80  
60  
40  
60  
40  
20  
0
VIN = 1.1 V, VBIAS = 5 V  
VIN = 1.2 V, VBIAS = 5 V  
VIN = 1.4 V, VBIAS = 0 V  
20  
VIN = 2.5 V, VBIAS = 0 V  
VIN = 5.0 V, VBIAS = 0 V  
0
10  
100  
1k  
10k  
100k  
1M  
10M  
10  
100  
1k  
10k  
100k  
1M  
10M  
Frequency (Hz)  
Frequency (Hz)  
VIN = 1.4 V, IOUT = 1 A,  
IOUT = 1 A,  
COUT = 47 μF || 10 μF || 10 μF, CNR/SS = 10 nF, CFF = 10 nF  
COUT = 47 μF || 10 μF || 10 μF, CNR/SS = 10 nF, CFF = 10 nF  
3. PSRR vs Frequency and VBIAS  
4. PSRR vs Frequency and VIN  
100  
100  
VOUT = 0.8 V  
VOUT = 0.9 V  
VIN = 3.60 V  
VIN = 3.65 V  
VOUT = 1.1 V  
VIN = 3.70 V  
80  
80  
VOUT = 1.2 V  
VOUT = 1.5 V  
VOUT = 1.8 V  
VIN = 3.75 V  
VIN = 3.80 V  
VIN = 3.85 V  
60  
60  
VOUT = 2.5 V  
VIN = 3.90 V  
40  
20  
0
40  
20  
0
10  
100  
1k  
10k  
100k  
1M  
10M  
10  
100  
1k  
10k  
100k  
1M  
10M  
Frequency (Hz)  
Frequency (Hz)  
VIN = VOUT + 0.4 V, VBIAS = 5.0 V, IOUT = 4 A,  
IOUT = 4 A, COUT = 47 μF || 10 μF || 10 μF, CNR/SS = 10 nF,  
COUT = 47 μF || 10 μF || 10 μF, CNR/SS = 10 nF, CFF = 10 nF  
CFF = 10 nF  
5. PSRR vs Frequency and VOUT with Bias  
6. PSRR vs Frequency and VIN for VOUT = 3.3 V  
版权 © 2016, Texas Instruments Incorporated  
8
 
TPS7A85  
www.ti.com.cn  
ZHCSEP4A JANUARY 2016REVISED FEBRUARY 2016  
Typical Characteristics (接下页)  
at TA = 25°C, VIN = 1.4 V or VIN = VOUT(NOM) + 0.5 V (whichever is greater), VBIAS = open, VOUT(NOM) = 0.8 V, VEN = 1.1 V, COUT  
= 47 μF, CNR/SS = 0 nF, CFF = 0 nF, and PG pin pulled up to VIN with 100 kΩ (unless otherwise noted)  
100  
80  
60  
40  
20  
0
100  
80  
60  
40  
20  
0
COUT = 47 mF||10 mF||10 mF  
COUT = 47 mF  
IOUT = 0.1 A  
IOUT = 0.5 A  
IOUT = 1.0 A  
IOUT = 2.0 A  
IOUT = 3.0 A  
IOUT = 4.0 A  
COUT = 100 mF  
COUT = 200 mF  
COUT = 500 mF  
10  
100  
1k  
10k  
100k  
1M  
10M  
10  
100  
1k  
10k  
100k  
1M  
10M  
Frequency (Hz)  
Frequency (Hz)  
VIN = 5.6 V, COUT = 47 μF || 10 μF || 10 μF,  
VIN = VOUT + 0.4 V, VOUT = 1 V, IOUT = 4 A,  
CNR/SS = 10 nF, CFF = 10 nF  
COUT = 47 μF || 10 μF || 10 μF, CNR/SS = 10 nF, CFF = 10 nF  
7. PSRR vs Frequency and COUT  
8. PSRR vs Frequency and IOUT for VOUT = 5.0 V  
100  
80  
60  
40  
20  
0
100  
VIN = 5.35 V  
VIN = 5.4 V  
VIN = 5.45 V  
VIN = 5.5 V  
VIN = 5.55 V  
VIN = 5.60 V  
VIN = 5.65 V  
80  
60  
40  
20  
VBIAS = 3.0 V  
VBIAS = 5.0 V  
VBIAS = 6.5 V  
0
10  
10  
100  
1k  
10k  
100k  
1M  
10M  
100 1k  
10k  
100k  
1M  
10M  
Frequency (Hz)  
Frequency (Hz)  
IOUT = 4 A, COUT = 47 μF || 10 μF || 10 μF, CNR/SS = 10 nF,  
VIN = VOUT + 0.4 V, VOUT = 1 V, IOUT = 4 A,  
CFF = 10 nF  
COUT = 47 μF || 10 μF || 10 μF, CNR/SS = 10 nF, CFF = 10 nF  
9. PSRR vs Frequency and VIN for VOUT = 5.0 V  
10. VBIAS PSRR vs Frequency  
15  
2
IOUT = 1.0 A  
VOUT = 0.8 V, 4.5 mVRMS  
1
IOUT = 2.0 A  
IOUT = 3.0 A  
IOUT = 4.0 A  
VOUT = 1.5 V, 5.4 mVRMS  
13.5  
12  
10.5  
9
VOUT = 3.3 V, 8.5 mVRMS  
VOUT = 5.0 V, 12.4 mVRMS  
0.5  
0.2  
0.1  
0.05  
0.02  
0.01  
7.5  
6
0.005  
4.5  
3
0.002  
0.001  
0.6  
1.2  
1.8  
2.4  
3
3.6  
4.2  
4.8  
5.4  
10  
100  
1k  
10k  
100k  
1M  
Output Voltage (V)  
Frequency (Hz)  
VIN = VOUT + 0.4 V and VBIAS = 5 V for VOUT 2.2 V,  
COUT = 47 μF || 10 μF || 10 μF, CNR/SS = 10 nF, CFF = 10 nF  
VIN = VOUT + 0.4 V and VBIAS = 5 V for VOUT 2.2 V, IOUT = 4 A,  
COUT = 47 μF || 10 μF || 10 μF, CNR/SS = 10 nF, CFF = 10 nF  
12. Output Noise vs Frequency and VOUT  
11. Output Voltage Noise vs Output Voltage  
版权 © 2016, Texas Instruments Incorporated  
9
 
 
TPS7A85  
ZHCSEP4A JANUARY 2016REVISED FEBRUARY 2016  
www.ti.com.cn  
Typical Characteristics (接下页)  
at TA = 25°C, VIN = 1.4 V or VIN = VOUT(NOM) + 0.5 V (whichever is greater), VBIAS = open, VOUT(NOM) = 0.8 V, VEN = 1.1 V, COUT  
= 47 μF, CNR/SS = 0 nF, CFF = 0 nF, and PG pin pulled up to VIN with 100 kΩ (unless otherwise noted)  
2
2
VIN = 1.4 V, VBIAS = 5.0 V, 4.5 mVRMS  
VIN = 1.4 V, 6.0 mVRMS  
CNR/SS = 0 nF, 6.2 mVRMS  
CNR/SS = 1 nF, 4.9 mVRMS  
CNR/SS = 10 nF, 4.5 mVRMS  
CNR/SS = 100 nF, 4.4 mVRMS  
1
1
VIN = 1.5 V, 4.5 mVRMS  
0.5  
0.5  
VIN = 1.8 V, 4.5 mVRMS  
VIN = 2.5 V, 4.6 mVRMS  
0.2  
0.1  
0.2  
0.1  
VIN = 5.0 V, 5.15 mVRMS  
0.05  
0.05  
0.02  
0.01  
0.02  
0.01  
0.005  
0.005  
0.002  
0.001  
0.002  
0.001  
10  
100  
1k  
10k  
100k  
1M  
10  
100  
1k  
10k  
100k  
1M  
Frequency (Hz)  
Frequency (Hz)  
IOUT = 1 A, COUT = 47 μF || 10 μF || 10 μF, CNR/SS = 10 nF,  
VIN = VOUT + 0.4 V, VBIAS = 5 V, IOUT = 4 A,  
CFF = 10 nF  
COUT = 47 μF || 10 μF || 10 μF, CFF = 10 nF  
13. Output Noise vs Frequency and VIN  
14. Output Noise vs Frequency and CNR/SS  
2
2
CFF = 0 nF, 6.2 mVRMS  
CNR/SS = 10 nF, 12.3 mVRMS  
1
1
CFF = 0.1 nF, 5.8 mVRMS  
CNR/SS = 100 nF, 8.4 mVRMS  
CFF = 1 nF, 4.9 mVRMS  
CFF = 10 nF, 4.5mVRMS  
CFF = 100 nF, 4.4 mVRMS  
CFF = CNR/SS = 100 nF, 6.6 mVRMS  
0.5  
0.5  
0.2  
0.1  
0.2  
0.1  
0.05  
0.05  
0.02  
0.01  
0.02  
0.01  
0.005  
0.005  
0.002  
0.001  
0.002  
0.001  
10  
100  
1k  
10k  
100k  
1M  
10  
100  
1k  
10k  
100k  
1M  
Frequency (Hz)  
Frequency (Hz)  
VIN = VOUT + 0.4 V, VBIAS = 5 V, IOUT = 4 A,  
VIN = 5.6 V, IOUT = 4 A, COUT = 47 μF || 10 μF || 10 μF,  
COUT = 47 μF || 10 μF || 10 μF, CNR/SS = 10 nF  
CFF = 10 nF  
15. Output Noise vs Frequency and CFF  
16. Output Noise at 5.0-V Output vs CNR/SS and CFF  
1.2  
10  
7.5  
5
50  
25  
0
Output Current  
VOUT = 0.9 V  
VOUT = 1.2 V  
VOUT = 1.8 V  
1
0.8  
0.6  
0.4  
0.2  
0
VEN  
2.5  
0
-25  
-50  
VOUT, CNR/SS = 0 nF  
VOUT, CNR/SS = 10 nF  
VOUT, CNR/SS = 47 nF  
VOUT, CNR/SS = 100 nF  
-0.2  
0
5
10  
15  
20  
25  
30  
35  
40  
45  
50  
0
0.5  
1
1.5  
2
Time (ms)  
Time (ms)  
VIN = 1.2 V, VOUT = 0.9 V, VBIAS = 5.0 V, IOUT = 4 A,  
VIN = VOUT + 0.3 V, VBIAS = 5 V, IOUT, DC = 100 mA, slew rate =  
1 A/μs, CNR/SS = CFF = 10 nF, COUT = 47 μF || 10 μF || 10 μF  
COUT = 47 μF || 10 μF || 10 μF, CFF = 10 nF  
18. Load Transient Waveform vs Time and  
17. Start-Up Waveform vs Time and CNR/SS  
VOUT with Bias  
10  
版权 © 2016, Texas Instruments Incorporated  
 
TPS7A85  
www.ti.com.cn  
ZHCSEP4A JANUARY 2016REVISED FEBRUARY 2016  
Typical Characteristics (接下页)  
at TA = 25°C, VIN = 1.4 V or VIN = VOUT(NOM) + 0.5 V (whichever is greater), VBIAS = open, VOUT(NOM) = 0.8 V, VEN = 1.1 V, COUT  
= 47 μF, CNR/SS = 0 nF, CFF = 0 nF, and PG pin pulled up to VIN with 100 kΩ (unless otherwise noted)  
50  
25  
0
10  
7.5  
5
50  
25  
0
Slew Rate = 2 A/ms  
Slew Rate = 1 A/ms  
Slew Rate = 0.5 A/ms  
Output Current  
VOUT = 3.3 V  
VOUT = 5.0 V  
2.5  
0
-25  
-50  
-25  
-50  
0
0.4  
0.8  
1.2  
1.6  
2
0
0.4  
0.8  
1.2  
1.6  
2
Time (ms)  
Time (ms)  
IOUT, DC = 100 mA, COUT = 47 μF || 10 μF || 10 μF,  
CNR/SS = CFF = 10 nF, slew rate = 1 A/μs  
VOUT = 5 V, IOUT, DC = 100 mA, IOUT = 100 mA to 4 A,  
COUT = 47 μF || 10 μF || 10 μF, CNR/SS = CFF = 10 nF  
19. Load Transient Waveform vs Time and  
20. Load Transient Waveform vs Time and  
VOUT without Bias  
Slew Rate  
50  
25  
0
50  
IOUT = 100 mA to 4 A  
IOUT = 500 mA to 4 A  
IOUT = 1 A to 4 A  
25  
0
-25  
-25  
-50  
COUT = 100 mF  
COUT = 200 mF  
COUT = 500 mF  
COUT = 500 mF || 1 mF Oscon  
-50  
0
0.4  
0.8  
1.2  
1.6  
2
0
0.4  
0.8  
1.2  
1.6  
2
Time (ms)  
Time (ms)  
VIN = 1.2 V, VBIAS = 5.0 V, IOUT = 100 mA to 4 A,  
VIN = 1.2 V, VBIAS = 5.0 V, COUT = 47 μF || 10 μF || 10 μF,  
CNR/SS = CFF = 10 nF, slew rate = 1 A/μs  
CNR/SS = CFF = 10 nF, slew rate = 1 A/μs  
21. Load Transient Waveform vs Time and COUT  
22. Load Transient Waveform vs Time and DC Load  
(VOUT = 0.9 V)  
(VOUT = 0.9 V)  
450  
-40°C  
0°C  
450  
-40°C  
0°C  
400  
350  
300  
250  
200  
150  
400  
350  
300  
250  
200  
150  
25°C  
85°C  
125°C  
25°C  
85°C  
125°C  
1
2
3
4
5
6
1
2
3
4
5
6
Input Voltage (V)  
Input Voltage (V)  
IOUT = 4 A, VBIAS = 0 V  
IOUT = 4 A, VBIAS = 6.5 V  
23. Dropout Voltage vs Input Voltage without Bias  
24. Dropout Voltage vs Input Voltage with Bias  
版权 © 2016, Texas Instruments Incorporated  
11  
 
 
TPS7A85  
ZHCSEP4A JANUARY 2016REVISED FEBRUARY 2016  
www.ti.com.cn  
Typical Characteristics (接下页)  
at TA = 25°C, VIN = 1.4 V or VIN = VOUT(NOM) + 0.5 V (whichever is greater), VBIAS = open, VOUT(NOM) = 0.8 V, VEN = 1.1 V, COUT  
= 47 μF, CNR/SS = 0 nF, CFF = 0 nF, and PG pin pulled up to VIN with 100 kΩ (unless otherwise noted)  
300  
250  
200  
150  
100  
50  
0.2  
0.175  
0.15  
0.125  
0.1  
-40°C  
0°C  
25°C  
85°C  
125°C  
-40°C  
0°C  
25°C  
85°C  
125°C  
0.075  
0.05  
0.025  
0
0
0
0.5  
1
1.5  
2
2.5  
3
3.5  
4
0
0.5  
1
1.5  
2
2.5  
3
3.5  
4
Output Current (A)  
Output Current (A)  
VIN = 1.4 V, VBIAS = 0 V  
VIN = 1.1 V, VBIAS = 3 V  
26. Dropout Voltage vs Output Current with Bias  
25. Dropout Voltage vs Output Current without Bias  
350  
0.2  
-40°C  
0°C  
25°C  
85°C  
125°C  
-40°C  
0°C  
25°C  
85°C  
125°C  
300  
0.15  
0.1  
250  
200  
150  
100  
50  
0.05  
0
-0.05  
-0.1  
0
0
0.5  
1
1.5  
2
2.5  
3
3.5  
4
0.5  
1
1.5  
2
2.5  
3
3.5  
4
4.5  
5
Output Current (A)  
Output Voltage (V)  
VIN = 5.5 V  
IOUT = 100 mA to 4 A  
27. Dropout Voltage vs Output Current (High VIN  
)
28. Load Regulation vs Output Voltage  
0.15  
0.025  
0
-40°C  
0°C  
25°C  
85°C  
125°C  
0.1  
0.05  
0
-0.025  
-0.05  
-0.075  
-0.1  
-40°C  
0°C  
25°C  
85°C  
125°C  
-0.05  
-0.1  
0
0.8  
1.6  
2.4  
3.2  
4
0
0.8  
1.6  
2.4  
3.2  
4
Output Current (A)  
Output Current (A)  
29. Load Regulation (0.8-V Output)  
30. Load Regulation (3.3-V Output)  
12  
版权 © 2016, Texas Instruments Incorporated  
 
 
TPS7A85  
www.ti.com.cn  
ZHCSEP4A JANUARY 2016REVISED FEBRUARY 2016  
Typical Characteristics (接下页)  
at TA = 25°C, VIN = 1.4 V or VIN = VOUT(NOM) + 0.5 V (whichever is greater), VBIAS = open, VOUT(NOM) = 0.8 V, VEN = 1.1 V, COUT  
= 47 μF, CNR/SS = 0 nF, CFF = 0 nF, and PG pin pulled up to VIN with 100 kΩ (unless otherwise noted)  
0.025  
0
-0.025  
-0.05  
0
-0.025  
-0.05  
-0.075  
-0.1  
-0.075  
-0.1  
-40°C  
0°C  
25°C  
85°C  
125°C  
-40°C  
0°C  
25°C  
85°C  
125°C  
-0.125  
0
0.8  
1.6  
2.4  
3.2  
4
1
1.5  
2
2.5  
3
3.5  
4
4.5  
5
5.5  
6
6.5  
Output Current (A)  
Input Voltage (V)  
IOUT = 5 mA  
31. Load Regulation (5-V Output)  
32. Line Regulation without Bias  
25  
0
0
-20  
-40  
-60  
-25  
-50  
-75  
-40°C  
0°C  
25°C  
85°C  
125°C  
-40°C  
0°C  
25°C  
85°C  
125°C  
-100  
3
3.5  
4
4.5  
5
5.5  
6
6.5  
5.25  
5.5  
5.75  
6
6.25  
6.5  
Bias Voltage (V)  
Input Voltage (V)  
VIN = 1.1 V, IOUT = 5 mA  
33. Line Regulation vs Bias Voltage  
IOUT = 5 mA  
34. Line Regulation (5-V Output)  
3.3  
3
2.4  
2
1.6  
1.2  
0.8  
2.7  
2.4  
2.1  
1.8  
-40°C  
0°C  
25°C  
85°C  
125°C  
-40°C  
0°C  
25°C  
85°C  
125°C  
1.5  
1
2
3
4
5
6
7
3
3.5  
4
4.5  
5
5.5  
6
6.5  
Input Voltage (V)  
Bias Voltage (V)  
IOUT = 5 mA  
VIN = 1.1 V, IOUT = 5 mA  
36. Bias Pin Current vs Bias Voltage  
35. Ground Pin Current vs Input Voltage  
版权 © 2016, Texas Instruments Incorporated  
13  
TPS7A85  
ZHCSEP4A JANUARY 2016REVISED FEBRUARY 2016  
www.ti.com.cn  
Typical Characteristics (接下页)  
at TA = 25°C, VIN = 1.4 V or VIN = VOUT(NOM) + 0.5 V (whichever is greater), VBIAS = open, VOUT(NOM) = 0.8 V, VEN = 1.1 V, COUT  
= 47 μF, CNR/SS = 0 nF, CFF = 0 nF, and PG pin pulled up to VIN with 100 kΩ (unless otherwise noted)  
5
4
3
2
1
0
6
5
4
3
2
1
0
-40°C  
0°C  
25°C  
85°C  
125°C  
-40°C  
0°C  
25°C  
85°C  
125°C  
1
1.5  
2
2.5  
3
3.5  
4
4.5  
5
5.5  
6
6.5  
3
3.5  
4
4.5  
5
5.5  
6
6.5  
Input Voltage (V)  
Bias Voltage (V)  
VIN = 1.1 V  
37. Shutdown Current vs Input Voltage  
38. Shutdown Current vs Bias Voltage  
7.5  
7
1.4  
1.2  
1
6.5  
6
0.8  
0.6  
0.4  
0.2  
5.5  
5
-40°C  
0°C  
25°C  
85°C  
125°C  
VUVLO2(IN), Rising  
VUVLO2(IN), Falling  
VUVLO1(IN), Rising  
VUVLO1(IN), Falling  
4.5  
1
1.5  
2
2.5  
3
3.5  
4
4.5  
5
5.5  
6
6.5  
-40  
-20  
0
20  
40  
60  
80  
100 120 140  
Input Voltage (V)  
Temperature (°C)  
39. NR/SS Charging Current vs Input Voltage  
40. VIN UVLO vs Temperature  
0.85  
0.8  
3
2.9  
2.8  
2.7  
2.6  
2.5  
VUVLO(BIAS), Rising  
VUVLO(BIAS), Falling  
0.75  
0.7  
0.65  
0.6  
VIH(EN), VIN = 1.4 V  
VIH(EN), VIN = 6.5 V  
VIL(EN), VIN = 1.4 V  
VIL(EN), VIN = 6.5 V  
0.55  
-60  
-30  
0
30  
60  
90  
120  
150  
-40  
-20  
0
20  
40  
60  
80  
100 120 140  
Temperature (°C)  
Temperature (°C)  
VIN = 1.1 V  
41. VBIAS UVLO vs Temperature  
42. Enable Threshold vs Temperature  
14  
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Typical Characteristics (接下页)  
at TA = 25°C, VIN = 1.4 V or VIN = VOUT(NOM) + 0.5 V (whichever is greater), VBIAS = open, VOUT(NOM) = 0.8 V, VEN = 1.1 V, COUT  
= 47 μF, CNR/SS = 0 nF, CFF = 0 nF, and PG pin pulled up to VIN with 100 kΩ (unless otherwise noted)  
0.75  
0.6  
0.45  
0.3  
0.15  
0
0.4  
0.32  
0.24  
0.16  
0.08  
0
-40°C  
0°C  
25°C  
85°C  
125°C  
-40°C  
0°C  
25°C  
85°C  
125°C  
0
0.5  
1
1.5  
2
2.5  
3
0
0.5  
1
1.5  
2
2.5  
3
PG Current Sink (mA)  
PG Current Sink (mA)  
VIN = 6.5 V  
43. PG Voltage vs PG Current Sink  
44. PG Voltage vs PG Current Sink  
90.25  
VIT(PG) Rising, VIN = 1.4 V  
VIT(PG) Rising, VIN = 6.5 V  
VIT(PG) Falling, VIN = 1.4V  
VIT(PG) Falling, VIN = 6.5 V  
90  
89.75  
89.5  
89.25  
89  
88.75  
88.5  
88.25  
88  
87.75  
-50  
-25  
0
25  
50  
75  
100  
125  
Temperature (°C)  
45. PG Threshold vs Temperature  
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7 Detailed Description  
7.1 Overview  
The TPS7A85 is a high-current (4 A), low-noise (4.4 µVRMS), high accuracy (1%) low-dropout linear voltage  
regulator (LDO). These features make the device a robust solution to solve many challenging problems in  
generating a clean, accurate power supply.  
The TPS7A85 has several features that make the device useful in a variety of applications. As detailed in the  
Functional Block Diagram section, these features include:  
Low-noise, high-PSRR output  
ANY-OUT resistor network  
Optional bias rail  
Power-good (PG) output  
Programmable soft-start  
Foldback current limit  
Enable circuitry  
Active discharge  
Thermal protection  
Overall, these features make the TPS7A85 the component of choice because of its versatility and ability to  
generate a supply for most applications.  
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7.2 Functional Block Diagram  
PSRR  
Boost  
Current  
Limit  
IN  
OUT  
Charge  
Pump  
BIAS  
Active  
RNR/SS = 250 kW  
Discharge  
0.8-V  
VREF  
+
Error  
Amp  
œ
INR/SS  
SNS  
NR/SS  
200 pF  
R1 = 2×R = 12.1 kW  
FB  
1×R = 6.05 kW  
1.6V  
2×R = 12.1 kW  
Internal  
800mV  
Controller  
UVLO  
4×R = 24.2 kW  
400mV  
Circuits  
8×R = 48.4 kW  
200mV  
16×R = 96.8 kW  
100mV  
32×R = 193.6 kW  
50mV  
ANY-OUT Network  
Thermal  
Shutdown  
PG  
œ
0.893 x VREF  
+
EN  
GND  
NOTE: For the ANY-OUT network, the ratios between the values are highly accurate as a result of matching, but the actual  
resistance can vary significantly from the values listed.  
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7.3 Feature Description  
7.3.1 Low-Noise, High-PSRR Output  
The TPS7A85 includes a low-noise reference and error amplifier ensuring minimal noise during operation. The  
NR/SS capacitor (CNR/SS) and feed-forward capacitor (CFF) are the most effective way to reduce device noise.  
CNR/SS filters the noise from the reference and CFF filters the noise from the error amplifier. The noise contribution  
from the charge pump is minimal. The overall noise of the system at low output voltages can be reduced by  
using a bias rail because this rail provides more headroom for internal circuitry.  
The high power-supply rejection ratio (PSRR) of the TPS7A85 ensures minimal coupling of input supply noise to  
the output. The PSRR performance primarily results from a high-bandwidth, high-gain error amplifier and an  
innovative circuit to boost the PSRR between 200 kHz and 1 MHz.  
The combination of a low noise floor and high PSRR ensure that the device provides a clean supply to the  
application; see the Optimizing Noise and PSRR section for more information on optimizing the noise and PSRR  
performance.  
7.3.2 Integrated Resistance Network (ANY-OUT)  
An internal feedback resistance network is provided, allowing the TPS7A85 output voltage to be programmed  
easily between 0.8 V to 3.95 V with a 50-mV step by tying the ANY-OUT pins to ground. Tying the ANY-OUT  
pins to SNS increases the resolution but limits the range of the output voltage because the effective value of R1  
is decreased. The ANY-OUT network provides excellent accuracy across output voltage and temperature; see  
the Application and Implementation section for more details.  
7.3.3 Bias Rail  
The device features a bias rail to enable low-input voltage, low-output (LILO) voltage operation by providing  
power to the internal circuitry of the device. The bias rail is required for operation with VIN < 1.4 V.  
An internal power MUX supplies the greater of either the input voltage or the bias voltage to an internal charge  
pump to power the internal circuitry. Unlike other LDOs that have a bias supply, the TPS7A85 does not have a  
minimum bias voltage with respect to the input supply because an internal charge pump is used instead.  
The internal charge pump multiples the output voltage of the power MUX by a factor of 4 to a maximum of  
typically 8 V; therefore, using a bias supply with VIN 2.2 V is recommended for optimal dc and ac performance.  
Sequencing requirements exist for when the bias rail is used; see the Sequencing Requirements section for more  
details.  
7.3.4 Power-Good (PG) Function  
The power-good circuit monitors the voltage at the feedback pin to indicate the status of the output voltage.  
When the feedback pin voltage falls below the PG threshold voltage (VIT(PG) + VHYS(PG), typically 89.3%), the PG  
pin open-drain output engages and pulls the PG pin close to GND. When the feedback voltage exceeds the  
VIT(PG) threshold by an amount greater than VHYS(PG) (typically 91.3%), the PG pin becomes high impedance. By  
connecting a pullup resistor to an external supply, any downstream device can receive power-good as a logic  
signal that can be used for sequencing. Make sure that the external pullup supply voltage results in a valid logic  
signal for the receiving device or devices. Using a pullup resistor from 10 kΩ to 100 kΩ is recommended. Using  
an external voltage detector device such as the TPS3702 is also recommended in applications where more  
accurate voltage monitoring or overvoltage monitoring is required.  
The use of a feed-forward capacitor (CFF) can cause glitches on start-up, and the power-good circuit may not  
function normally below the minimum input supply range. For more details on the use of the power-good circuitry,  
see the Power-Good (PG) Operation section.  
7.3.5 Programmable Soft-Start  
Soft-start refers to the ramp-up time of the output voltage during LDO turn-on after EN and UVLO exceed the  
respective threshold voltages. The noise-reduction capacitor (CNR/SS) serves a dual purpose of both governing  
output noise reduction and programming the soft-start ramp time during turn-on. The start-up ramp is monotonic.  
The majority of the ramp is linear; however, there is an offset voltage in the error amplifier that can cause a small  
initial jump in output voltage; see the Application and Implementation section on implementing a soft-start.  
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Feature Description (接下页)  
7.3.6 Internal Current Limit (ILIM  
)
The internal current limit circuit is used to protect the LDO against high-load current faults or shorting events.  
During a current-limit event, the LDO sources constant current; therefore, the output voltage falls with decreased  
load impedance. Thermal shutdown can activate during a current limit event because of the high power  
dissipation typically found in these conditions. To ensure proper operation of the current limit, minimize the  
inductances to the input and load. Continuous operation in current limit is not recommended.  
The foldback current limit crosses 0 A when VOUT < 0 V and prevents the device from turning on into a  
negatively-biased output. See the Negatively-Biased Output section for additional ways to ensure start-up when  
the TPS7A85 output is pulled below ground.  
If VOUT > VIN + 0.3 V, then reverse current can flow from the output to the input. The reverse current can cause  
damage to the device; therefore, limit this reverse current to 10% of the rated output current of the device. See  
the Reverse Current Protection section for more details.  
7.3.7 Enable  
The enable pin for the TPS7A85 is active high. The output of the TPS7A85 is turned on when the enable pin  
voltage is greater than its rising voltage threshold (1.1 V, max), and the output of the TPS7A85 is turned off when  
the enable pin voltage is less than its falling voltage threshold (0.5 V, min). A voltage less than 0.5 V on the  
enable pin disables all internal circuits. At the next turn-on this voltage ensures a normal start-up waveform with  
in-rush control, provided there is enough time to discharge the output capacitance.  
When the enable functionality is not desired, EN must be tied to VIN. However, when the enable functionality is  
desired, the enable voltage must come after VIN is above VUVLO1(IN) when a BIAS rail is used; see the Application  
and Implementation section for further details.  
7.3.8 Active Discharge Circuit  
The TPS7A85 has an internal pulldown MOSFET that connects a resistance of several hundred ohms to ground  
when the device is disabled to actively discharge the output voltage when the device is disabled.  
Do not rely on the active discharge circuit for discharging a large amount of output capacitance after the input  
supply has collapsed because reverse current can possibly flow from the output to the input. This reverse current  
flow can cause damage to the device. Limit reverse current to no more than 10% of the device rated current for a  
short period of time; see the Reverse Current Protection section for more details.  
7.3.9 Undervoltage Lockout (UVLO)  
The undervoltage lockout (UVLO) circuit monitors the input and bias voltage (VIN and VBIAS, respectively) to  
prevent the device from turning on before VIN and VBIAS rise above the lockout voltage. The UVLO circuit also  
disables the output of the device when VIN or VBIAS fall below the lockout voltage.  
The UVLO circuit responds quickly to glitches on VIN or VBIAS and attempts to disable the output of the device if  
either of these rails collapse. As a result of the fast response time of the input supply UVLO circuit, fast slew rate  
and short duration line transients well below the input supply UVLO falling threshold can cause momentary  
glitches during the edges of the transient; see the Application and Implementation section for more details.  
7.3.10 Thermal Protection  
The TPS7A85 contains a thermal shutdown protection circuit to disable the device when thermal junction  
temperature (TJ) of the main pass-FET exceeds 160°C (typical). Thermal shutdown hysteresis assures that the  
LDO resets again (turns on) when the temperature falls to 140°C (typical). The thermal time-constant of the  
semiconductor die is fairly short, and thus the device may cycle on and off when thermal shutdown is reached  
until the power dissipation is reduced.  
For reliable operation, limit the junction temperature to a maximum of 125°C. Operation above 125°C causes the  
device to exceed its operational specifications. Although the internal protection circuitry of the TPS7A85 is  
designed to protect against thermal overload conditions, this circuitry is not intended to replace proper heat  
sinking. Continuously running the TPS7A85 into thermal shutdown or above a junction temperature of 125°C  
reduces long-term reliability.  
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7.4 Device Functional Modes  
7.4.1 Operation with 1.1 V VIN < 1.4 V  
The TPS7A85 requires a bias voltage on the BIAS pin greater than or equal to 3.0 V if the high-current input  
supply voltage is between 1.1 V to 1.4 V. The bias voltage pin consumes 2.3 mA, typically.  
7.4.2 Operation with 1.4 V VIN 6.5 V  
If the input voltage is equal to or exceeds 1.4 V, no BIAS voltage is required. The TPS7A85 is powered from  
either the input supply or the BIAS supply, whichever is greater. For higher performance, a BIAS rail is  
recommended for VIN 2.2 V.  
7.4.3 Shutdown  
Shutting down the device reduces the ground current of the device to a maximum of 25 µA.  
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8 Application and Implementation  
Information in the following applications sections is not part of the TI component  
specification, and TI does not warrant its accuracy or completeness. TI’s customers are  
responsible for determining suitability of components for their purposes. Customers should  
validate and test their design implementation to confirm system functionality.  
8.1 Application Information  
The TPS7A85 is a linear voltage regulator with an input voltage range of 1.1 V to 6.5 V and an output voltage  
range of 0.8 V to 5.0 V with a 1% accuracy and a 4-A maximum output current. The TPS7A85 has an integrated  
charge pump for ease of use and an external bias rail to allow for the lowest dropout across the entire output  
voltage range.  
8.1.1 Recommended Capacitor Types  
The TPS7A85 is designed to be stable using low equivalent series resistance (ESR) ceramic capacitors at the  
input, output, and noise-reduction pin (NR, pin 13). Multilayer ceramic capacitors have become the industry  
standard for these types of applications and are recommended, but must be used with good judgment. Ceramic  
capacitors that employ X7R-, X5R-, and COG-rated dielectric materials provide relatively good capacitive stability  
across temperature, whereas the use of Y5V-rated capacitors is discouraged because of large variations in  
capacitance.  
Regardless of the ceramic capacitor type selected, ceramic capacitance varies with operating voltage and  
temperature. As a rule of thumb, derate ceramic capacitors by at least 50%. The input and output capacitors  
recommended herein account for a effective capacitance derating of approximately 50%, but at high VIN and  
VOUT conditions (that is, VIN = 5.5 V to VOUT = 5.0 V) the derating can be greater than 50% and must be taken  
into consideration.  
8.1.2 Input and Output Capacitor Requirements (CIN and COUT  
)
The TPS7A85 is designed and characterized for operation with ceramic capacitors of 47 µF or greater (22 μF or  
greater of effective capacitance) at the output and 10 µF or greater (5 μF or greater of effective capacitance) at  
the input. Using at least a 47-µF capacitor is highly recommended at the input to minimize input impedance.  
Place the input and output capacitors as near as practical to the respective input and output pins to minimize  
trace parasitics. If the trace inductance from the input supply to the TPS7A85 is high, a fast current transient can  
cause VIN to ring above the absolute maximum voltage rating and damage the device. This situation can be  
mitigated by additional input capacitors to dampen the ringing and to keep the ringing below the device absolute  
maximum ratings.  
A combination of multiple output capacitors boosts the high-frequency PSRR, as illustrated in several of the  
PSRR curves. The combination of one 0805-sized, 47-µF ceramic capacitor in parallel with two 0805-sized,  
10-µF ceramic capacitors with a sufficient voltage rating in conjunction with the PSRR boost circuit optimizes  
PSRR for the frequency range of 400 kHz to 700 kHz (which is a typical range for dc-dc supply switching  
frequency). This 47-µF || 10-µF || 10-µF combination also ensures that at high input voltage and high output  
voltage configurations, the minimum effective capacitance is met. Many 0805-sized, 47-µF ceramic capacitors  
have a voltage derating of approximately 60% to 75% at 5.0 V, so the addition of the two 10-µF capacitors  
ensures that the capacitance is at or above 22 µF.  
8.1.3 Noise-Reduction and Soft-Start Capacitor (CNR/SS  
)
The TPS7A85 features a programmable, monotonic, voltage-controlled soft-start that is set with an external  
capacitor (CNR/SS).The use of an external CNR/SS is highly recommended, especially to minimize in-rush current  
into the output capacitors. This soft-start eliminates power-up initialization problems when powering field-  
programmable gate arrays (FPGAs), digital signal processors (DSPs), or other processors. The controlled  
voltage ramp of the output also reduces peak in-rush current during start-up, minimizing start-up transients to the  
input power bus.  
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Application Information (接下页)  
To achieve a monotonic start-up, the TPS7A85 error amplifier tracks the voltage ramp of the external soft-start  
capacitor until the voltage approaches the internal reference. The soft-start ramp time depends on the soft-start  
charging current (INR/SS), the soft-start capacitance (CNR/SS), and the internal reference (VNR/SS). Soft-start ramp  
time can be calculated with 公式 1:  
tSS = (VNR/SS × CNR/SS) / INR/SS  
(1)  
Note that INR/SS is provided in the Electrical Characteristics table and has a typical value of 6.2 µA.  
The noise-reduction capacitor, in conjunction with the noise-reduction resistor, forms a low-pass filter (LPF) that  
filters out the noise from the reference before being gained up with the error amplifier, thereby reducing the  
device noise floor. The LPF is a single-pole filter and the cutoff frequency can be calculated with 公式 2. The  
typical value of RNR is 250 kΩ. Increasing the CNR/SS capacitor has a greater affect because the output voltage  
increases when the noise from the reference is gained up even more at higher output voltages. For low-noise  
applications, a 10-nF to 1-µF CNR/SS is recommended.  
fcutoff = 1/ (2 × π × RNR × CNR/SS  
)
(2)  
8.1.4 Feed-Forward Capacitor (CFF)  
Although a feed-forward capacitor (CFF) from the FB pin to the OUT pin is not required to achieve stability, a  
10-nF external feed-forward capacitor optimizes the transient, noise, and PSRR performance. A higher  
capacitance CFF can be used; however, the start-up time is longer and the power-good signal can incorrectly  
indicate that the output voltage is settled. To ensure proper PG functionality the time constant defined by CNR/SS  
must be greater than or equal to the time constant from the CFF. For a detailed description, see application report  
Pros and Cons of Using a Feed-Forward Capacitor with a Low Dropout Regulator, SBVA042.  
8.1.5 Soft-Start and In-Rush Current  
Soft-start refers to the ramp-up characteristic of the output voltage during LDO turn-on after EN and both UVLOs  
exceed their threshold voltages. The noise-reduction capacitor serves a dual purpose of both governing output  
noise reduction and programming the soft-start ramp during turn-on.  
The soft-start ramp is not fully linear as the error amplifier has a several millivolt offset voltage. The output  
voltage starts to ramp only after the voltage created by the soft-start circuit increases above this offset voltage, at  
which point the output rises quickly to the voltage on the NR/SS pin. After this initial jump, the voltage rises at the  
ramp rate determined by the soft-start function. This jump typically does not cause a problem in applications  
because the quick rise in the output voltage has a very small amplitude.  
In-rush current is defined as the current into the LDO at the IN pin during start-up. In-rush current then consists  
primarily of the sum of load current and the current used to charge the output capacitor. This current is difficult to  
measure because the input capacitor must be removed, which is not recommended. However, this soft-start  
current can be estimated by 公式 3:  
C
OUT ´ dVOUT(t)  
VOUT(t)  
RLOAD  
IOUT(t)  
=
+
dt  
where:  
VOUT(t) is the instantaneous output voltage of the turn-on ramp  
dVOUT(t) / dt is the slope of the VOUT ramp  
RLOAD is the resistive load impedance  
(3)  
8.1.6 Optimizing Noise and PSRR  
The ultra-low noise floor and PSRR of the device can be improved by careful selection of:  
CNR/SS for the low-frequency range  
CFF for the mid-band frequency range  
COUT for the high-frequency range  
VIN – VOUT for all frequencies, and  
VBIAS at lower input voltages  
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Application Information (接下页)  
The noise-reduction capacitor filters out low-frequency noise from the reference and the feed-forward capacitor  
reduces output voltage noise by filtering out the mid-band frequency noise. However, a large feed-forward  
capacitor can create some new issues that are discussed in application report Pros and Cons of Using a Feed-  
Forward Capacitor with a Low Dropout Regulator, SBVA042.  
Note that a large output capacitor reduces high-frequency output voltage noise. Additionally, a bias rail or higher  
input voltage improves the noise because greater headroom is provided for the internal circuits. A high power  
dissipation across the die increases the output noise because of the increase in junction temperature.  
A larger noise-reduction capacitor improves low-frequency PSRR by filtering any noise coupling from the input  
into the reference. The feed-forward capacitor can be optimized by placing a pole-zero pair near the edge of the  
loop bandwidth and pushing out the loop bandwidth, thus improving mid-band PSRR. Larger output capacitors  
and various output capacitors can be used to improve high-frequency PSRR; see 7 for more details.  
A higher input voltage improves PSRR by providing the device more headroom to respond to noise on the input;  
see 2. A bias rail also improves the PSRR at lower input voltages because greater headroom is provided for  
the internal circuits. 1 lists the output voltage noise for the 10-Hz to 100-kHz band at a 5.0-V output for a  
variety of conditions with an input voltage of 5.6 V, an R1 of 12.1 kΩ, and a load current of 4 A. The 5.0-V output  
is chosen because this output is the worst-case condition for output voltage noise. Note that the input voltage is  
5.6 V, not 5.5 V as provided in the Electrical Characteristics table. The higher input voltage limits the maximum  
ambient temperature to below 40°C on a standard-JEDEC high-K board; see the Power Dissipation (PD) section  
for more information.  
1. Output Noise Voltage at a 5.0-V Output with a 5.6-V Input  
OUTPUT VOLTAGE NOISE  
CNR/SS (nF)  
CFF (nF)  
COUT (µF)  
(µVRMS  
12.3  
8.4  
)
10  
10  
10  
47 || 10 || 10  
47 || 10 || 10  
47 || 10 || 10  
1000  
100  
100  
100  
100  
100  
6.6  
6.4  
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8.1.6.1 Charge Pump Noise  
The device internal charge pump generates a minimal amount of noise, as shown in 46.  
Using a bias rail minimizes the internal charge pump noise when the internal voltage is clamped, thereby  
reducing the overall output noise floor.  
The high-frequency components of the output voltage noise density curve are filtered out in most applications by  
using 10-nF to 100-nF bypass capacitors close to the load. Using a ferrite bead between the LDO output and the  
load input capacitors forms a pi-filter, further reducing the high-frequency noise contribution.  
0.5  
VIN = 1.5 V, 4.5 mVRMS  
VIN = 1.4 V, VBIAS = 5.0 V, 4.5 mVRMS  
0.3  
0.2  
0.1  
0.07  
0.05  
0.03  
0.02  
0.01  
0.007  
0.005  
0.003  
0.002  
0.001  
1000000  
2000000  
3000000  
4000000  
5000000  
6000000  
7000000  
8000000  
9000000  
1E+7  
Frequency (Hz)  
46. Charge Pump Noise  
8.1.7 ANY-OUT Programmable Output Voltage  
The TPS7A85 can either use external resistors or the internally-matched ANY-OUT feedback resistor network to  
set the output voltage. The ANY-OUT resistors are accessible via pins 2 and 5 to 11 and are used to program  
the regulated output voltage. Each pin can be connected to ground (active) or left open (floating), or connected to  
SNS. ANY-OUT programming is set by 公式 4 as the sum of the internal reference voltage (VNR/SS = 0.8 V) plus  
the accumulated sum of the respective voltages assigned to each active pin; that is, 50mV (pin 5), 100mV (pin  
6), 200mV (pin 7), 400mV (pin 9), 800mV (pin 10), or 1.6V (pin 11). 2 summarizes these voltage values  
associated with each active pin setting for reference. By leaving all program pins open or floating, the output is  
thereby programmed to the minimum possible output voltage equal to VFB  
.
VOUT = VNR/SS + (Σ ANY-OUT Pins to Ground)  
(4)  
2. ANY-OUT Programmable Output Voltage  
ANY-OUT PROGRAM PINS (Active Low)  
ADDITIVE OUTPUT VOLTAGE LEVEL  
Pin 5 (50mV)  
Pin 6 (100mV)  
Pin 7 (200mV)  
Pin 9 (400mV)  
Pin 10 (800mV)  
Pin 11 (1.6V)  
50 mV  
100 mV  
200 mV  
400 mV  
800 mV  
1.6 V  
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3 provides a full list of target output voltages and corresponding pin settings when the ANY-OUT pins are only  
tied to ground or left floating. The voltage setting pins have a binary weight; therefore, the output voltage can be  
programmed to any value from 0.8 V to 3.95 V in 50-mV steps when tying these pins to ground. There are  
several alternative ways to set the output voltage. The program pins can be driven by using external general-  
purpose input/output pins (GPIOs), manually connected using 0-Ω resistors (or left open), or hardwired by the  
given layout of the printed circuit board (PCB) to set the ANY-OUT voltage. As with the adjustable operation, the  
output voltage is set according to 公式 5 except that R1 and R2 are internally integrated and matched for higher  
accuracy. Tying any of the ANY-OUT pins to SNS can increase the resolution of the internal feedback network  
by lowering the value of R1; see the Increasing ANY-OUT Resolution for LILO Conditions section for additional  
information.  
VOUT = VNR/SS × (1 + R1 / R2)  
(5)  
For output voltages greater than 3.95 V, use a traditional adjustable configuration (see the  
Adjustable Operation section).  
3. User-Configurable Output Voltage Settings  
VOUT(NOM)  
(V)  
VOUT(NOM)  
50mV  
100mV 200mV 400mV 800mV  
1.6V  
50mV 100mV 200mV 400mV 800mV  
1.6V  
(V)  
0.80  
0.85  
0.90  
0.95  
1.00  
1.05  
1.10  
1.15  
1.20  
1.25  
1.30  
1.35  
1.40  
1.45  
1.50  
1.55  
1.60  
1.65  
1.70  
1.75  
1.80  
1.85  
1.90  
1.95  
2.00  
2.05  
2.10  
2.15  
2.20  
2.25  
2.30  
2.35  
Open  
GND  
Open  
GND  
Open  
GND  
Open  
GND  
Open  
GND  
Open  
GND  
Open  
GND  
Open  
GND  
Open  
GND  
Open  
GND  
Open  
GND  
Open  
GND  
Open  
GND  
Open  
GND  
Open  
GND  
Open  
GND  
Open  
Open  
GND  
GND  
Open  
Open  
GND  
GND  
Open  
Open  
GND  
GND  
Open  
Open  
GND  
GND  
Open  
Open  
GND  
GND  
Open  
Open  
GND  
GND  
Open  
Open  
GND  
GND  
Open  
Open  
GND  
GND  
Open  
Open  
Open  
Open  
GND  
GND  
GND  
GND  
Open  
Open  
Open  
Open  
GND  
GND  
GND  
GND  
Open  
Open  
Open  
Open  
GND  
GND  
GND  
GND  
Open  
Open  
Open  
Open  
GND  
GND  
GND  
GND  
Open  
Open  
Open  
Open  
Open  
Open  
Open  
Open  
GND  
GND  
GND  
GND  
GND  
GND  
GND  
GND  
Open  
Open  
Open  
Open  
Open  
Open  
Open  
Open  
GND  
GND  
GND  
GND  
GND  
GND  
GND  
GND  
Open  
Open  
Open  
Open  
Open  
Open  
Open  
Open  
Open  
Open  
Open  
Open  
Open  
Open  
Open  
Open  
GND  
GND  
GND  
GND  
GND  
GND  
GND  
GND  
GND  
GND  
GND  
GND  
GND  
GND  
GND  
GND  
Open  
Open  
Open  
Open  
Open  
Open  
Open  
Open  
Open  
Open  
Open  
Open  
Open  
Open  
Open  
Open  
Open  
Open  
Open  
Open  
Open  
Open  
Open  
Open  
Open  
Open  
Open  
Open  
Open  
Open  
Open  
Open  
2.40  
2.45  
2.50  
2.55  
2.60  
2.65  
2.70  
2.75  
2.80  
2.85  
2.90  
2.95  
3.00  
3.05  
3.10  
3.15  
3.20  
3.25  
3.30  
3.35  
3.40  
3.45  
3.50  
3.55  
3.60  
3.65  
3.70  
3.75  
3.80  
3.85  
3.90  
3.95  
Open  
GND  
Open  
GND  
Open  
GND  
Open  
GND  
Open  
GND  
Open  
GND  
Open  
GND  
Open  
GND  
Open  
GND  
Open  
GND  
Open  
GND  
Open  
GND  
Open  
GND  
Open  
GND  
Open  
GND  
Open  
GND  
Open  
Open  
GND  
GND  
Open  
Open  
GND  
GND  
Open  
Open  
GND  
GND  
Open  
Open  
GND  
GND  
Open  
Open  
GND  
GND  
Open  
Open  
GND  
GND  
Open  
Open  
GND  
GND  
Open  
Open  
GND  
GND  
Open  
Open  
Open  
Open  
GND  
GND  
GND  
GND  
Open  
Open  
Open  
Open  
GND  
GND  
GND  
GND  
Open  
Open  
Open  
Open  
GND  
GND  
GND  
GND  
Open  
Open  
Open  
Open  
GND  
GND  
GND  
GND  
Open  
Open  
Open  
Open  
Open  
Open  
Open  
Open  
GND  
GND  
GND  
GND  
GND  
GND  
GND  
GND  
Open  
Open  
Open  
Open  
Open  
Open  
Open  
Open  
GND  
GND  
GND  
GND  
GND  
GND  
GND  
GND  
Open  
Open  
Open  
Open  
Open  
Open  
Open  
Open  
Open  
Open  
Open  
Open  
Open  
Open  
Open  
Open  
GND  
GND  
GND  
GND  
GND  
GND  
GND  
GND  
GND  
GND  
GND  
GND  
GND  
GND  
GND  
GND  
GND  
GND  
GND  
GND  
GND  
GND  
GND  
GND  
GND  
GND  
GND  
GND  
GND  
GND  
GND  
GND  
GND  
GND  
GND  
GND  
GND  
GND  
GND  
GND  
GND  
GND  
GND  
GND  
GND  
GND  
GND  
GND  
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8.1.8 ANY-OUT Operation  
Considering the use of the ANY-OUT internal network (where the unit resistance of 1R is equal to 6.05 kΩ) the  
output voltage is set by grounding the appropriate control pins, as shown in 47. When grounded, all control  
pins add a specific voltage on top of the internal reference voltage (VNR/SS = 0.8 V). The output voltage can be  
calculated by 公式 6 and 公式 7. 47 and 48 show a 3.3-V and a 0.9-V output voltage, respectively, that  
provides an example of the circuit usage with and without bias voltage.  
BIAS  
EN  
IN  
PG  
OUT  
SNS  
FB  
RPG  
Input  
Supply  
To Load  
COUT  
CIN  
Device  
CFF  
NR/SS  
CNR/SS  
GND 50mV 100mV 200mV 400mV 800mV 1.6V  
47. ANY-OUT Configuration Circuit  
(3.3-V Output, No External Bias)  
VOUT(nom) = VNR/SS + 1.6 V + 0.8 V + 0.1 V = 0.8 V + 1.6 V + 0.8 V + 0.1 V = 3.3 V  
(6)  
CBIAS  
Bias  
Supply  
BIAS  
EN  
IN  
PG  
OUT  
SNS  
FB  
RPG  
Input  
Supply  
To Load  
COUT  
CIN  
Device  
CFF  
NR/SS  
CNR/SS  
GND 50mV 100mV 200mV 400mV 800mV 1.6V  
48. ANY-OUT Configuration Circuit  
(0.9-V Output with Bias)  
VOUT(nom) = VNR/SS + 0.1 V = 0.8 V + 0.1 V = 0.9 V  
(7)  
26  
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8.1.9 Increasing ANY-OUT Resolution for LILO Conditions  
As with the adjustable operation, the output voltage is set according to 公式 5, except that R1 and R2 are  
internally integrated and matched for higher accuracy. Tying any of the ANY-OUT pins to SNS can increase the  
resolution of the internal feedback network by lowering the value of R1. One of the more useful pin combinations  
is to tie the 800mV pin to SNS, which reduces the resolution by 50% to 25 mV but limits the range. The new  
ANY-OUT ranges are 0.8 V to 1.175 V and 1.6 V to 1.975 V. The new additive output voltage levels are listed in  
4.  
4. ANY-OUT Programmable Output Voltage with 800mV Tied to SNS  
ANY-OUT PROGRAM PINS (Active Low)  
Pin 5 (50mV)  
ADDITIVE OUTPUT VOLTAGE LEVEL  
25 mV  
50 mV  
Pin 6 (100mV)  
Pin 7 (200mV)  
100 mV  
200 mV  
800 mV  
Pin 9 (400mV)  
Pin 11 (1.6V)  
8.1.10 Current Sharing  
Current sharing is possible through the use of external operational amplifiers. For more details, see the reference  
design 6A Current-Sharing Dual LDO, TIDU421.  
8.1.11 Adjustable Operation  
The TPS7A85 can either be used with the internal ANY-OUT network or by using external resistors. Using the  
ANY-OUT network allows the TPS7A85 to be programmed from 0.8 V to 3.95 V. To extend this output voltage  
range to 5.0 V, external resistors must be used. This configuration is referred to as the adjustable configuration  
of the TPS7A85 throughout this document. Regardless whether the internal resistor network or external resistors  
are used, the output voltage is set by two resistors, as shown in 49. Using the internal resistor ensures a 1%  
accurate output voltage and minimizes the number of external components.  
Optional Bias  
CBIAS  
Supply  
BIAS  
EN  
IN  
PG  
OUT  
SNS  
FB  
RPG  
Input  
Supply  
To Load  
CIN  
COUT  
Device  
CFF  
R1  
R2  
NR/SS  
CNR/SS  
GND 50mV 100mV 200mV 400mV 800mV 1.6V  
49. Adjustable Operation  
R1 and R2 can be calculated for any output voltage range using 公式 8. This resistive network must provide a  
current equal to or greater than 5 μA for dc accuracy. Using an R1 of 12.1 kΩ is recommended to optimize the  
noise and PSRR.  
VOUT = VNR/SS × (1 + R1 / R2)  
(8)  
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5 shows the resistor combinations required to achieve several common rails using standard 1%-tolerance  
resistors.  
5. Recommended Feedback-Resistor Values(1)  
TARGETED OUTPUT  
FEEDBACK RESISTOR VALUES  
CALCULATED OUTPUT  
VOLTAGE  
(V)  
VOLTAGE  
(V)  
R1 (kΩ)  
R2 (kΩ)  
0.9  
12.4  
12.4  
12.4  
12.4  
12.4  
12.4  
12.4  
12.1  
12.4  
12.1  
12.1  
11.8  
12.1  
11.8  
12.4  
100  
66.5  
49.9  
33.2  
24.9  
14.3  
10  
0.899  
0.949  
0.999  
1.099  
1.198  
1.494  
1.798  
1.89  
0.95  
1.00  
1.10  
1.20  
1.50  
1.80  
1.90  
2.50  
2.85  
3.00  
3.30  
3.60  
4.5  
8.87  
5.9  
2.48  
4.75  
4.42  
3.74  
3.48  
2.55  
2.37  
2.838  
2.990  
3.324  
3.582  
4.502  
4.985  
5.00  
(1) R1 is connected from OUT to FB; R2 is connected from FB to GND.  
8.1.12 Sequencing Requirements  
Supply and enable sequencing is only required when the bias rail is present. The start-up is always monotonic,  
independent of the sequencing requirements. Under these conditions the following requirements apply:  
VBIAS and VIN can be sequenced in any order, as long as VEN is tied to VIN or established after VIN, as shown  
in 50.  
tt0 0t  
VUVLO1(IN)  
VIN  
VIH(EN)  
VEN  
50. Sequencing Diagram  
Two typical application circuits for implementing the sequencing requirements are detailed in the Sequencing  
with a Power-Good DC-DC Converter Pin and Sequencing with a Microcontroller (MCU) sections.  
28  
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8.1.12.1 Sequencing with a Power-Good DC-DC Converter Pin  
When a dc-dc converter is used to power the device and the PG of the dc-dc converter is used to enable the  
device, pull PG up to VIN, as shown in 51.  
From Input Supply  
BIAS  
OUT  
PG  
IN  
DC-DC  
RPU  
Device  
IN  
EN  
51. Sequencing with a DC-DC Converter and PG  
8.1.12.2 Sequencing with a Microcontroller (MCU)  
If a push-pull output stage is used to provide the enable signal to the device and the enable signal can possibly  
come before VIN when a bias is present (such as with an MCU), convert the enable signal to an open-drain signal  
as shown in 52. Using an open-drain signal ensures that if the signal arrives before VIN, then the enable  
voltage does not violate the sequencing requirement.  
Bias Supply  
Input Supply  
RPU  
BIAS  
IN  
Device  
EN  
Enable Signal  
MCU  
52. Push-Pull Enable to Open-Drain Enable  
8.1.13 Power-Good (PG) Operation  
To ensure proper operation of the power-good circuit, the pullup resistor value must be between 10 kΩ and  
100 kΩ. The lower limit of 10 kΩ results from the maximum pulldown strength of the power-good transistor, and  
the upper limit of 100 kΩ results from the maximum leakage current at the power-good node. If the pullup resistor  
is outside of this range, then the power-good signal may not read a valid digital logic level.  
Using a large CFF with a small CNR/SS causes the power-good signal to incorrectly indicate that the output voltage  
has settled during turn-on. The CFF time constant must be greater than the soft-start time constant to ensure  
proper operation of the PG during start-up. For a detailed description, see application report Pros and Cons of  
Using a Feed-Forward Capacitor with a Low Dropout Regulator, SBVA042.  
The state of PG is only valid when the device operates above the minimum supply voltage. During short UVLO  
events and at light loads, power-good does not assert because the output voltage is sustained by the output  
capacitance.  
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8.1.14 Undervoltage Lockout (UVLO) Operation  
The UVLO circuit ensures that the device stays disabled before its input or bias supplies reach the minimum  
operational voltage range, and ensures that the device shuts down when the input supply or bias supply  
collapse.  
The UVLO circuit has a minimum response time of several microseconds to fully assert. During this time, a  
downward line transient below approximately 0.8 V causes the UVLO to assert for a short time; however, the  
UVLO circuit does not have enough stored energy to fully discharge the internal circuits inside of the device.  
When the UVLO circuit does not fully discharge, the internal circuits of the output are not fully disabled.  
The effect of the downward line transient can be mitigated by either using a larger input capacitor to limit the fall  
time of the input supply when operating near the minimum VIN, or by using a bias rail.  
53 shows the UVLO circuit response to various input voltage events. The diagram can be separated into the  
following parts:  
Region A: The device does not turn on until the input reaches the UVLO rising threshold.  
Region B: Normal operation with a regulated output  
Region C: Brownout event above the UVLO falling threshold (UVLO rising threshold – UVLO hysteresis). The  
output may fall out of regulation but the device is still enabled.  
Region D: Normal operation with a regulated output  
Region E: Brownout event below the UVLO falling threshold. The device is disabled in most cases and the  
output falls because of the load and active discharge circuit. The device is reenabled when the UVLO rising  
threshold is reached by the input voltage and a normal start-up then follows.  
Region F: Normal operation followed by the input falling to the UVLO falling threshold.  
Region G: The device is disabled when the input voltage falls below the UVLO falling threshold to 0 V. The  
output falls because of the load and active discharge circuit.  
UVLO Rising Threshold  
UVLO Hysteresis  
VIN  
C
VOUT  
tAt  
tBt  
tDt  
tEt  
tFt  
tGt  
53. Typical UVLO Operation  
8.1.15 Dropout Voltage (VDO  
)
Generally speaking, the dropout voltage often refers to the minimum voltage difference between the input and  
output voltage (VDO = VIN – VOUT) that is required for regulation. When VIN drops below the required VDO for the  
given load current, the device functions as a resistive switch and does not regulate output voltage. Dropout  
voltage is proportional to the output current because the device is operating as a resistive switch; see 25, 图  
26, and 27.  
Dropout voltage is affected by the drive strength for the gate of the pass element, which is nonlinear with respect  
to VIN on this device because of the internal charge pump. The charge pump causes a higher dropout voltage at  
lower input voltages when a bias rail is not used, as illustrated in 23.  
For this device, dropout voltage increases exponentially when the input voltage nears its maximum operating  
voltage because the charge pump is internally clamped to 8.0 V; see 23 and 24.  
30  
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8.1.16 Behavior when Transitioning from Dropout into Regulation  
Some applications may have transients that place the device into dropout, especially because this device is a  
high-current linear regulator. A typical application with these conditions requires setting VIN VDO in order to  
keep the device junction temperature within its specified operating range. A load transient or line transient in  
these conditions can place the device into dropout, such as a load transient from 1 A to 4 A at 1A/µs when  
operating with a VIN of 5.4- V and a VOUT of 5.0 V.  
The load transient saturates the error amplifier output stage when the pass element is fully driven on, thus  
making the pass element function like a resistor from VIN to VOUT. The error amplifier response time to this load  
transient (IOUT = 4 A to 1 A at 1 A/µs) is limited because the error amplifier must first recover from saturation and  
then place the pass element back into active mode. During the recovery from the load transient, VOUT overshoots  
because the pass element is functioning as a resistor from VIN to VOUT. If operating under these conditions, apply  
a higher dc load or increase the output capacitance to reduce the overshoot because these solutions provide a  
path to dissipate the excess charge.  
8.1.17 Load Transient Response  
The load-step transient response is the output voltage response by the LDO to a step in load current, whereby  
output voltage regulation is maintained; see 18. There are two key transitions during a load transient  
response: the transition from a light to a heavy load and the transition from a heavy to a light load. The regions  
shown in 54 are broken down in this section. Regions A, E, and H are where the output voltage is in steady-  
state.  
During transitions from a light load to a heavy load, the:  
Initial voltage dip is a result of the depletion of the output capacitor charge and parasitic impedance to the  
output capacitor (region B).  
Recovery from the dip results from the LDO increasing its sourcing current, and leads to output voltage  
regulation (region C).  
During transitions from a heavy load to a light load, the:  
Initial voltage rise results from the LDO sourcing a large current, and leads to the output capacitor charge to  
increase (region F).  
Recovery from the rise results from the LDO decreasing its sourcing current in combination with the load  
discharging the output capacitor (region G).  
Transitions between current levels changes the internal power dissipation because the TPS7A85 is a high-  
current device (region D). The change in power dissipation changes the die temperature during these transitions,  
and leads to a slightly different voltage level. This different output voltage level shows up in the various load  
transient responses; see 18.  
A larger output capacitance reduces the peaks during a load transient but slows down the response time of the  
device. A larger dc load also reduces the peaks because the amplitude of the transition is lowered and a higher  
current discharge path is provided for the output capacitor; see 20.  
tAt  
tCt  
tDt  
tEt  
tGt  
tHt  
B
F
54. Load Transient Waveform  
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8.1.18 Negatively-Biased Output  
The device does not start or operate as expected if the output voltage is pulled below ground. This issue  
commonly occurs when powering a split-rail system where the negative rail is established before the device is  
enabled. Several application solutions are possible, such as:  
Enable the device before the negative regulator and disable the device after the negative regulator.  
Delaying the EN voltage with respect to the IN voltage allows the internal pulldown resistor to discharge any  
voltage at OUT. If the discharge circuit is not strong enough to keep the output voltage at ground, then use an  
external pulldown resistor.  
Place a zener diode from IN to OUT to provide a small positive dc bias on the output when the input is  
supplied to the device, as shown in 55.  
IN  
VIN  
OUT  
To Load  
COUT  
GND  
55. Zener Diode Placed from IN to OUT  
Use a PMOSFET to isolate the output of the device from the load causing the negative bias when the device  
is off, as shown in 56.  
To All Other Loads  
To Loads with  
Negative Bias  
IN  
VIN  
OUT  
COUT  
GND  
56. PMOSFET to Isolate the Output from the Load  
8.1.19 Reverse Current Protection  
As with most LDOs, this device can be damaged by excessive reverse current.  
Conditions where excessive reverse current can occur are outlined in this section, all of which can exceed the  
absolute maximum rating of VOUT > VIN + 0.3 V:  
If the device has a large COUT, then the input supply collapses quickly and the load current becomes very  
small  
The output is biased when the input supply is not established  
The output is biased above the input supply  
32  
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If an excessive reverse current flow is expected in the application, then external protection must be used to  
protect the device. 57 shows one approach of protecting the device.  
Schottky Diode  
Internal Body Diode  
IN  
OUT  
Device  
COUT  
CIN  
GND  
57. Example Circuit for Reverse Current Protection Using a Schottky Diode  
8.1.20 Power Dissipation (PD)  
Circuit reliability demands that proper consideration be given to device power dissipation, location of the circuit  
on the printed circuit board (PCB), and correct sizing of the thermal plane. The PCB area around the regulator  
must be as free as possible of other heat-generating devices that cause added thermal stresses.  
As a first-order approximation, power dissipation in the regulator depends on the input-to-output voltage  
difference and load conditions. PD can be approximated using 公式 9:  
PD = (VOUT - VIN) ´ IOUT  
(9)  
An important note is that power dissipation can be minimized, and thus greater efficiency achieved, by proper  
selection of the system voltage rails. Proper selection allows the minimum input-to-output voltage differential to  
be obtained. The low dropout of the TPS7A85 allows for maximum efficiency across a wide range of output  
voltages.  
The main heat conduction path for the device is through the thermal pad on the package. As such, the thermal  
pad must be soldered to a copper pad area under the device. This pad area contains an array of plated vias that  
conduct heat to any inner plane areas or to a bottom-side copper plane.  
The maximum power dissipation determines the maximum allowable junction temperature (TJ) for the device.  
Power dissipation and junction temperature are most often related by the junction-to-ambient thermal resistance  
(θJA) of the combined PCB and device package and the temperature of the ambient air (TA), according to 公式  
10. The equation is rearranged for output current in 公式 11.  
TJ = TA + (qJA ´ PD)  
(10)  
IOUT = (TJ – TA) / [θJA × (VIN – VOUT)]  
(11)  
Unfortunately, this thermal resistance (θJA) is highly dependent on the heat-spreading capability built into the  
particular PCB design, and therefore varies according to the total copper area, copper weight, and location of the  
planes. The θJA recorded in the Electrical Characteristics table is determined by the JEDEC standard, PCB, and  
copper-spreading area, and is only used as a relative measure of package thermal performance. Note that for a  
well-designed thermal layout, θJA is actually the sum of the VQFN package junction-to-case (bottom) thermal  
resistance (θJCbot) plus the thermal resistance contribution by the PCB copper.  
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8.1.20.1 Estimating Junction Temperature  
The JEDEC standard now recommends the use of psi (Ψ) thermal metrics to estimate the junction temperatures  
of the LDO when in-circuit on a typical PCB board application. These metrics are not strictly speaking thermal  
resistances, but rather offer practical and relative means of estimating junction temperatures. These psi metrics  
are determined to be significantly independent of the copper-spreading area. The key thermal metrics (ΨJT and  
ΨJB) are given in the Electrical Characteristics table and are used in accordance with 公式 12.  
YJT: TJ = TT + YJT ´ PD  
YJB: TJ = TB + YJB ´ PD  
where:  
PD is the power dissipated as explained in 公式 9  
TT is the temperature at the center-top of the device package, and  
TB is the PCB surface temperature measured 1 mm from the device package and centered on the package  
edge  
(12)  
8.1.20.2 Recommended Area for Continuous Operation (RACO)  
The operational area of an LDO is limited by the dropout voltage, output current, junction temperature, and input  
voltage. The recommended area for continuous operation for a linear regulator can be separated into the  
following parts, and is shown in 58:  
Limited by dropout: Dropout voltage limits the minimum differential voltage between the input and the output  
(VIN – VOUT) at a given output current level; see the Dropout Voltage (VDO) section for more details.  
Limited by rated output current: The rated output current limits the maximum recommended output current  
level. Exceeding this rating causes the device to fall out of specification.  
Limited by thermals: The shape of the slope is given by 公式 11. The slope is nonlinear because the junction  
temperature of the LDO is controlled by the power dissipation across the LDO; therefore, when VIN – VOUT  
increases, the output current must decrease in order to ensure that the rated junction temperature of the  
device is not exceeded. Exceeding this rating can cause the device to fall out of specifications and reduces  
long-term reliability.  
Limited by VIN range: The rated input voltage range governs both the minimum and maximum of VIN – VOUT.  
Output Current Limited  
by Dropout  
Rated Output  
Current  
Output Current Limited  
by Thermals  
Limited by  
Limited by  
Minimum VIN  
Maximum VIN  
VIN œ VOUT (V)  
58. Continuous Operation Slope Region Description  
34  
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TPS7A85  
www.ti.com.cn  
ZHCSEP4A JANUARY 2016REVISED FEBRUARY 2016  
59 to 64 show the recommended area of operation curves for this device on a JEDEC-standard high-K  
board with a θJA = 35.4°C/W, as given in the Electrical Characteristics table.  
5
4.5  
4
5
4.5  
4
TA = 40èC  
TA = 40èC  
TA = 55èC  
TA = 55èC  
TA = 70èC  
TA = 85èC  
RACO at TA = 85èC  
TA = 70èC  
TA = 85èC  
RACO at TA = 85èC  
3.5  
3
3.5  
3
2.5  
2
2.5  
2
1.5  
1
1.5  
1
0.5  
0
0.5  
0
0
0.25  
0.5  
0.75  
1
1.25  
1.5  
0
0.25  
0.5  
0.75  
1
1.25  
1.5  
VIN - VOUT (V)  
VIN - VOUT (V)  
59. Recommended Area for Continuous Operation for  
60. Recommended Area for Continuous Operation for  
VOUT = 0.9 V with Bias  
VOUT = 1.2 V with Bias  
5
5
TA = 40èC  
TA = 40èC  
4.5  
4.5  
TA = 55èC  
TA = 55èC  
TA = 70èC  
TA = 85èC  
RACO at TA = 85èC  
TA = 70èC  
TA = 85èC  
RACO at TA = 85èC  
4
4
3.5  
3
3.5  
3
2.5  
2
2.5  
2
1.5  
1
1.5  
1
0.5  
0
0.5  
0
0
0.25  
0.5  
0.75  
1
1.25  
1.5  
0
0.25  
0.5  
0.75  
1
1.25  
1.5  
VIN - VOUT (V)  
VIN - VOUT (V)  
61. Recommended Area for Continuous Operation for  
62. Recommended Area for Continuous Operation for  
VOUT = 1.8 V  
VOUT = 2.5 V  
5
5
TA = 40èC  
TA = 40èC  
4.5  
4.5  
TA = 55èC  
TA = 55èC  
TA = 70èC  
TA = 85èC  
RACO at TA = 85èC  
TA = 70èC  
TA = 85èC  
RACO at TA = 85èC  
4
4
3.5  
3
3.5  
3
2.5  
2
2.5  
2
1.5  
1
1.5  
1
0.5  
0
0.5  
0
0
0.25  
0.5  
0.75  
1
1.25  
1.5  
0
0.25  
0.5  
0.75  
1
1.25  
1.5  
VIN - VOUT (V)  
VIN - VOUT (V)  
63. Recommended Area for Continuous Operation for  
64. Recommended Area for Continuous Operation for  
VOUT = 3.3 V  
VOUT = 5.0 V  
版权 © 2016, Texas Instruments Incorporated  
35  
 
 
TPS7A85  
ZHCSEP4A JANUARY 2016REVISED FEBRUARY 2016  
www.ti.com.cn  
8.2 Typical Applications  
8.2.1 Low-Input, Low-Output (LILO) Voltage Conditions  
This section discusses the implementation of the TPS7A85 using the ANY-OUT configuration to regulate a 4.0-A  
load requiring good PSRR at high frequency with low noise at 0.9 V using a 1.3-V input voltage and a 5.0-V bias  
supply. The schematic for this typical application circuit is provided in 65.  
CBIAS  
Bias  
Supply  
BIAS  
EN  
IN  
PG  
OUT  
SNS  
FB  
RPG  
Input  
Supply  
To Load  
COUT  
CIN  
Device  
CFF  
NR/SS  
CNR/SS  
GND 50mV 100mV 200mV 400mV 800mV 1.6V  
65. Typical Application  
8.2.1.1 Design Requirements  
For this design example, use the parameters listed in 6 as the input parameters.  
6. Design Parameters  
PARAMETER  
Input voltage  
DESIGN REQUIREMENT  
1.4 V, ±3%, provided by the dc-dc converter switching at 500 kHz  
Output voltage  
0.9 V, ±1%  
Output current  
4.0 A (maximum), 100 mA (minimum)  
RMS noise, 10 Hz to 100 kHz  
PSRR at 500 kHz  
Start-up time  
< 10 µVRMS  
> 40 dB  
< 25 ms  
8.2.1.2 Detailed Design Procedure  
For these conditions, the maximum dropout of the TPS7A85 is approximately 240 mV, thus a 400-mV headroom  
is sufficient for operation over both input and output voltage accuracy. The bias rail is provided for better  
performance for the LILO conditions. PSRR is greater than 40 dB in these conditions, as per 2. Noise is less  
than 10 µVRMS, as per 11.  
The ANY-OUT internal resistor network is also used for maximum accuracy.  
To achieve 0.9 V on the output, the 100mV pin is grounded. The voltage value of 100 mV is added to the 0.8-V  
internal reference voltage for VOUT(nom) equal to 0.9 V, as described in 公式 13.  
VOUT(nom) = VNR/SS + 0.1 V = 0.8 V + 0.1 V = 0.9 V  
(13)  
Input and output capacitors are selected in accordance with the Recommended Capacitor Types section.  
Ceramic capacitances of 47 µF for the input and one 47-µF capacitor in parallel with two 10-µF capacitors for the  
output are selected.  
36  
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TPS7A85  
www.ti.com.cn  
ZHCSEP4A JANUARY 2016REVISED FEBRUARY 2016  
To satisfy the required start-up time and still maintain low-noise performance, a 100-nF CNR/SS is selected. This  
value is calculated with 公式 14. To further minimize noise, a feed-forward capacitance (CFF) of 10 nF is  
selected.  
tSS = (VNR/SS × CNR/SS) / INR/SS  
(14)  
The maximum ambient temperature for this application is 40°C based on 59 and given the 3% accuracy of the  
input supply.  
8.2.1.3 Application Curves  
100  
80  
60  
40  
20  
0
15  
13.5  
12  
VIN = 1.10 V  
VIN = 1.15 V  
VIN = 1.20 V  
VIN = 1.25 V  
VIN = 1.30 V  
VIN = 1.35 V  
VIN = 1.40 V  
IOUT = 1.0 A  
IOUT = 2.0 A  
IOUT = 3.0 A  
IOUT = 4.0 A  
10.5  
9
7.5  
6
4.5  
3
10  
100  
1k  
10k  
100k  
1M  
10M  
0.6  
1.2  
1.8  
2.4  
3
3.6  
4.2  
4.8  
5.4  
Frequency (Hz)  
Output Voltage (V)  
66. Output PSRR  
67. Output Noise Level  
8.2.2 Typical Application for a 5.0-V Rail  
This section discusses the implementation of the TPS7A85 using an adjustable feedback network to regulate a  
4-A load requiring good PSRR at high frequency with low noise at an output voltage of 5.0 V. The schematic for  
this typical application circuit is provided in 68.  
Optional Bias  
CBIAS  
Supply  
BIAS  
EN  
IN  
PG  
OUT  
SNS  
FB  
RPG  
Input  
Supply  
To Load  
CIN  
COUT  
Device  
CFF  
R1  
R2  
NR/SS  
CNR/SS  
GND 50mV 100mV 200mV 400mV 800mV 1.6V  
68. Typical Application  
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TPS7A85  
ZHCSEP4A JANUARY 2016REVISED FEBRUARY 2016  
www.ti.com.cn  
8.2.2.1 Design Requirements  
For this design example, use the parameters listed in 6 as the input parameters.  
7. Design Parameters  
PARAMETER  
Input voltage  
Output voltage  
Output current  
Start-up time  
DESIGN REQUIREMENT  
5.60 V, ±1%, provided by the dc-dc converter switching at 500 kHz  
5.0 V, ±1%  
4.0 A (maximum), 10 mA (minimum)  
< 25 ms  
8.2.2.2 Detailed Design Procedure  
For these conditions, the maximum dropout of the TPS7A85 is approximately 500 mV, thus a 600-mV headroom  
is sufficient for operation over both input and output voltage accuracy. At full load and high temperature on some  
devices, the TPS7A85 can enter dropout if both the input and output supply are beyond the edges of their  
accuracy specification.  
For a 5.0-V output, use external adjustable resistors. See the resistor values in listed 5 for choosing resistors  
for a 5.0-V output.  
Input and output capacitors are selected in accordance with the Recommended Capacitor Types section.  
Ceramic capacitances of 47 µF for the input and one 47-µF capacitor in parallel with two 10-µF capacitors for the  
output are selected. To further minimize noise, a feed-forward capacitance (CFF) of 10 nF is selected.  
To satisfy the required start-up time and still maintain low-noise performance, a 100-nF CNR/SS is selected. This  
value is calculated with 公式 14.  
tSS = (VNR/SS × CNR/SS) / INR/SS  
(15)  
The maximum ambient temperature for this application is 40°C based on 64 and given the 1% accuracy of the  
input supply. This temperature can still exceed the maximum junction temperature, but the 4.0-A load is a short  
pulse requirement and not a dc load so the thermal effects are minimal.  
8.2.2.3 Application Curves  
100  
80  
60  
40  
20  
0
100  
80  
60  
40  
20  
0
IOUT = 0.1 A  
IOUT = 0.5 A  
IOUT = 1.0 A  
IOUT = 2.0 A  
IOUT = 3.0 A  
IOUT = 4.0 A  
VIN = 5.35 V  
VIN = 5.4 V  
VIN = 5.45 V  
VIN = 5.5 V  
VIN = 5.55 V  
VIN = 5.60 V  
VIN = 5.65 V  
10  
100  
1k  
10k  
100k  
1M  
10M  
10  
100  
1k  
10k  
100k  
1M  
10M  
Frequency (Hz)  
Frequency (Hz)  
69. PSRR vs Frequency and IOUT for VOUT = 5.0 V with  
70. PSRR vs Frequency and VIN for VOUT = 5.0 V at IOUT  
VIN = 5.6 V  
= 4.0 A  
9 Power-Supply Recommendations  
The TPS7A85 is designed to operate from an input voltage supply range between 1.1 V and 6.5 V. If the input  
supply is less than 1.4 V, then a bias rail of at least 3.0 V must be used. The input voltage range provides  
adequate headroom in order for the device to have a regulated output. This input supply must be well regulated.  
If the input supply is noisy, additional input capacitors with low ESR can help improve output noise performance.  
38  
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TPS7A85  
www.ti.com.cn  
ZHCSEP4A JANUARY 2016REVISED FEBRUARY 2016  
10 Layout  
10.1 Layout Guidelines  
10.1.1 Board Layout  
For best overall performance, place all circuit components on the same side of the circuit board and as near as  
practical to the respective LDO pin connections. Place ground return connections to the input and output  
capacitor, and to the LDO ground pin as close to each other as possible, connected by a wide, component-side,  
copper surface. The use of vias and long traces to the input and output capacitors is strongly discouraged and  
negatively affects system performance. The grounding and layout scheme shown in 71 minimizes inductive  
parasitics, and thereby reduces load-current transients, minimizes noise, and increases circuit stability.  
A ground reference plane is also recommended and is either embedded in the PCB itself or located on the  
bottom side of the PCB opposite the components. This reference plane serves to assure accuracy of the output  
voltage, shield noise, and behaves similar to a thermal plane to spread (or sink) heat from the LDO device when  
connected to the thermal pad. In most applications, this ground plane is necessary to meet thermal requirements.  
10.2 Layout Example  
Ground Plane for Thermal Relief and Signal  
Ground  
10  
9
8
7
6
To PG Pullup Supply  
PG Output  
1.6V 11  
BIAS  
5
50mV  
PG  
CBIAS  
RPG  
To Bias Supply  
To Signal Ground  
Enable Signal  
12  
4
3
Thermal Pad  
R2  
NR/SS 13  
EN 14  
FB  
To Signal Ground  
To Load  
CNR/SS  
2
1
SNS  
OUT  
CFF R1  
15  
IN  
16  
18 19 20  
17  
Input Power Plane  
Output Power Plane  
CIN  
COUT  
Power Ground Plane  
Vias used for application purposes.  
71. Example Layout  
版权 © 2016, Texas Instruments Incorporated  
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TPS7A85  
ZHCSEP4A JANUARY 2016REVISED FEBRUARY 2016  
www.ti.com.cn  
11 器件和文档支持  
11.1 器件支持  
11.1.1 开发支持  
11.1.1.1 评估模块  
评估模块 (EVM) 可与 TPS7A85 配套使用,帮助评估初始电路性能。有关此固定装置的相关摘要信息,请参见表  
8。  
8. 设计套件与评估模块  
名称  
文献编号  
SLVU919  
SBVU021  
TPS7A8300EVM-209 评估模块  
TPS7A8300EVM-579 评估模块  
您可以在德州仪器 (TI) 网站上的 TPS7A85 产品文件夹中获取 EVM。  
11.1.1.2 Spice 模型  
分析模拟电路和系统的性能时,使用 SPICE 模型对电路性能进行计算机仿真非常有用。您可以从 TPS7A85 产品  
文件夹中的仿真模型下获取 TPS7A85 SPICE 模型。  
11.1.2 器件命名规则  
9. 订购信息(1)  
产品  
说明  
YY 为封装标识符。  
Z 为封装数量。  
TPS7A85YYZ  
(1) 欲获得最新的封装和订货信息,请参阅本文档末尾的封装选项附录,或者访问 www.ti.com 查看器件产品文件夹。  
11.2 文档支持  
11.2.1 相关文档ꢀ  
相关文档如下:  
TPS3702 数据表,SBVS251  
TPS7A8300EVM-209 评估模块,SLVU919  
TPS7A8300EVM-579 评估模块,SBVU021  
TI LDO 应用手册的主题索引,SBVA026  
使用前馈电容器和低压降稳压器的优缺点, SBVA042  
6A 电流均流双路 LDOTIDU421  
11.3 社区资源  
The following links connect to TI community resources. Linked contents are provided "AS IS" by the respective  
contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of  
Use.  
TI E2E™ Online Community TI's Engineer-to-Engineer (E2E) Community. Created to foster collaboration  
among engineers. At e2e.ti.com, you can ask questions, share knowledge, explore ideas and help  
solve problems with fellow engineers.  
Design Support TI's Design Support Quickly find helpful E2E forums along with design support tools and  
contact information for technical support.  
40  
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TPS7A85  
www.ti.com.cn  
ZHCSEP4A JANUARY 2016REVISED FEBRUARY 2016  
11.4 商标  
ANY-OUT, E2E are trademarks of Texas Instruments.  
All other trademarks are the property of their respective owners.  
11.5 静电放电警告  
ESD 可能会损坏该集成电路。德州仪器 (TI) 建议通过适当的预防措施处理所有集成电路。如果不遵守正确的处理措施和安装程序 , 可  
能会损坏集成电路。  
ESD 的损坏小至导致微小的性能降级 , 大至整个器件故障。 精密的集成电路可能更容易受到损坏 , 这是因为非常细微的参数更改都可  
能会导致器件与其发布的规格不相符。  
11.6 Glossary  
SLYZ022 TI Glossary.  
This glossary lists and explains terms, acronyms, and definitions.  
12 机械、封装和可订购信息  
以下页中包括机械、封装和可订购信息。这些信息是针对指定器件可提供的最新数据。这些数据会在无通知且不对  
本文档进行修订的情况下发生改变。欲获得该数据表的浏览器版本,请查阅左侧的导航栏。  
版权 © 2016, Texas Instruments Incorporated  
41  
PACKAGE OPTION ADDENDUM  
www.ti.com  
18-Jul-2023  
PACKAGING INFORMATION  
Orderable Device  
Status Package Type Package Pins Package  
Eco Plan  
Lead finish/  
Ball material  
MSL Peak Temp  
Op Temp (°C)  
Device Marking  
Samples  
Drawing  
Qty  
(1)  
(2)  
(3)  
(4/5)  
(6)  
TPS7A8500RGRR  
TPS7A8500RGRT  
ACTIVE  
ACTIVE  
VQFN  
VQFN  
RGR  
RGR  
20  
20  
3000 RoHS & Green  
250 RoHS & Green  
NIPDAU  
Level-1-260C-UNLIM  
Level-1-260C-UNLIM  
-40 to 125  
-40 to 125  
11DI  
11DI  
Samples  
Samples  
NIPDAU  
(1) The marketing status values are defined as follows:  
ACTIVE: Product device recommended for new designs.  
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.  
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.  
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.  
OBSOLETE: TI has discontinued the production of the device.  
(2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance  
do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may  
reference these types of products as "Pb-Free".  
RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.  
Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based  
flame retardants must also meet the <=1000ppm threshold requirement.  
(3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.  
(4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.  
(5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation  
of the previous line and the two combined represent the entire Device Marking for that device.  
(6)  
Lead finish/Ball material - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead finish/Ball material values may wrap to two  
lines if the finish value exceeds the maximum column width.  
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information  
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and  
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.  
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.  
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.  
Addendum-Page 1  
PACKAGE OPTION ADDENDUM  
www.ti.com  
18-Jul-2023  
Addendum-Page 2  
GENERIC PACKAGE VIEW  
RGR 20  
3.5 x 3.5, 0.5 mm pitch  
VQFN - 1 mm max height  
PLASTIC QUAD FLATPACK - NO LEAD  
This image is a representation of the package family, actual package may vary.  
Refer to the product data sheet for package details.  
4228482/A  
www.ti.com  
PACKAGE OUTLINE  
RGR0020A  
VQFN - 1 mm max height  
PLASTIC QUAD FLATPACK - NO LEAD  
3.65  
3.35  
A
B
PIN 1 INDEX AREA  
3.65  
3.35  
SIDE WALL  
METAL THICKNESS  
DIM A  
1.0  
0.8  
OPTION 1  
0.1  
OPTION 2  
0.2  
C
SEATING PLANE  
0.08 C  
0.05  
0.00  
2X 2  
(DIM A) TYP  
SYMM  
6
10  
EXPOSED  
THERMAL PAD  
11  
5
SYMM  
21  
2X 2  
2.05 0.1  
16X 0.5  
1
15  
0.30  
20X  
PIN 1 ID  
20  
16  
0.18  
0.5  
0.3  
0.1  
C A B  
20X  
0.05  
4219031/B 04/2022  
NOTES:  
1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing  
per ASME Y14.5M.  
2. This drawing is subject to change without notice.  
3. The package thermal pad must be soldered to the printed circuit board for thermal and mechanical performance.  
www.ti.com  
EXAMPLE BOARD LAYOUT  
RGR0020A  
VQFN - 1 mm max height  
PLASTIC QUAD FLATPACK - NO LEAD  
(2.05)  
SYMM  
16  
SEE SOLDER MASK  
DETAIL  
20  
20X (0.6)  
15  
20X (0.24)  
16X (0.5)  
1
(2.05)  
SYMM  
21  
(3.3)  
(0.775)  
5
11  
(R0.05) TYP  
(
0.2) TYP  
VIA  
6
10  
(0.775)  
(3.3)  
LAND PATTERN EXAMPLE  
EXPOSED METAL SHOWN  
SCALE: 20X  
0.07 MIN  
ALL AROUND  
0.07 MAX  
ALL AROUND  
METAL UNDER  
SOLDER MASK  
METAL EDGE  
EXPOSED METAL  
SOLDER MASK  
OPENING  
EXPOSED  
METAL  
SOLDER MASK  
OPENING  
NON SOLDER MASK  
DEFINED  
SOLDER MASK DEFINED  
(PREFERRED)  
SOLDER MASK DETAILS  
4219031/B 04/2022  
NOTES: (continued)  
4. This package is designed to be soldered to a thermal pad on the board. For more information, see Texas Instruments literature  
number SLUA271 (www.ti.com/lit/slua271).  
5. Vias are optional depending on application, refer to device data sheet. If any vias are implemented, refer to their locations shown  
on this view. It is recommended that vias under paste be filled, plugged or tented.  
www.ti.com  
EXAMPLE STENCIL DESIGN  
RGR0020A  
VQFN - 1 mm max height  
PLASTIC QUAD FLATPACK - NO LEAD  
(0.56) TYP  
16  
20  
20X (0.6)  
1
20X (0.24)  
16X (0.5)  
15  
(0.56) TYP  
(3.3)  
21  
SYMM  
4X (0.92)  
11  
(R0.05) TYP  
5
6
10  
4X (0.92)  
SYMM  
(3.3)  
SOLDER PASTE EXAMPLE  
BASED ON 0.125 MM THICK STENCIL  
SCALE: 20X  
EXPOSED PAD 21  
81% PRINTED SOLDER COVERAGE BY AREA UNDER PACKAGE  
4219031/B 04/2022  
NOTES: (continued)  
6. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate  
design recommendations.  
www.ti.com  
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