TPS92662-Q1 [TI]
适用于汽车前照灯系统的 12 通道高亮度 LED 矩阵管理器;型号: | TPS92662-Q1 |
厂家: | TEXAS INSTRUMENTS |
描述: | 适用于汽车前照灯系统的 12 通道高亮度 LED 矩阵管理器 |
文件: | 总13页 (文件大小:901K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
TPS92662-Q1
ZHCSGE3B –OCTOBER 2018 –REVISED JULY 2020
TPS92662-Q1 适用于汽车前照灯系统的高亮度LED 矩阵管理器
该器件的 3 个串联集成开关各有 4 个子灯串,可绕过
单个 LED。各个子灯串允许器件接受单个或多个电流
源。它还允许并联多达 4 个开关,用于绕过高电流
LED。
1 特性
• 符合面向汽车应用的AEC-Q100 标准
– 1 级:–40°C 至125°C 的工作环境温度范围
– 器件HBM 分类等级H1C
– 器件CDM 分类等级C5
使用主微控制器通过多点通用异步接收器发送器
(UART) 串行接口来控制和管理 TPS92662-Q1 器件。
串行接口支持使用 CAN 收发器,适用于更可靠稳健的
物理层。I2C 通信接口用于从存储系统校准数据的外部
EEPROM 读取数据或向其中写入数据。
• 输入电压范围:4.5V 至60V
• 12 个集成旁路开关
– 3 个串联开关各有4 个子灯串
– 20V 最大跨开关电压
– 62V 最大开关到接地电压
• 多点UART 通信接口
具有两个多路复用输入的板载 8 位 ADC 可用于系统温
度补偿,并用于测量分级值,从而实现 LED 分级和编
码。
– 多达31 个可寻址器件
• 与CAN 物理层兼容
内部电荷泵轨为 LED 旁路开关提供栅极驱动电压。旁
路开关的低电阻 (RDS(on)) 可最大程度地减少传导损耗
和功率耗散。
– 电缆线束中具有最少的导线数
• 具有2 个多路复用输入的8 位ADC
• 晶体振荡器驱动器
• 外部EEPROM I2C 接口
灯串中每个 LED 的相移和脉冲宽度是可编程的。该器
件使用内部寄存器来调节PWM 频率。可以对多个器件
进行同步。在PWM 调光操作过程中,开关转换具有可
编程的压摆率,用于缓解EMI 问题。
• 可编程10 位PWM 调光
– 单个相移和脉宽
– 器件间同步
该器件具有开路 LED 保护功能(阈值可编程)。串行
接口会报告开路LED 或短路LED 故障。
• LED 开路/短路检测和保护
2 应用
器件信息
封装(1)
• 汽车前照灯系统
封装尺寸(标称值)
器件型号
• 高亮度LED 矩阵系统
• ADB 或无眩光远光灯
• 连续转向和动画日间行车灯
TPS92662-Q1
PHP (48)
7.00mm × 7.00mm
(1) 如需了解所有可用封装,请参阅数据表末尾的可订购产品附
录。
3 说明
TPS92662-Q1 LED 矩阵管理器器件通过提供单个像素
级LED 控制来实现完全动态的自适应照明解决方案。
VBAT
BOOST
BUCK
VIN
XTALI
CPPx
TPS92662
XTALO
ADCx
MCU
BIN
CAN
E2
UART
RX
TX
CAN
ECU
I2
C
LEDx
GND
SDA
SCL
VDD
VIO
简化版应用
本文档旨在为方便起见,提供有关TI 产品中文版本的信息,以确认产品的概要。有关适用的官方英文版本的最新信息,请访问
www.ti.com,其内容始终优先。TI 不保证翻译的准确性和有效性。在实际设计之前,请务必参考最新版本的英文版本。
English Data Sheet: SLUSD15
TPS92662-Q1
ZHCSGE3B –OCTOBER 2018 –REVISED JULY 2020
www.ti.com.cn
Table of Contents
5.2 Support Resources..................................................... 3
5.3 Trademarks.................................................................3
5.4 Electrostatic Discharge Caution..................................3
5.5 Glossary......................................................................3
6 Mechanical, Packaging, and Orderable Information....4
1 特性................................................................................... 1
2 应用................................................................................... 1
3 说明................................................................................... 1
4 Revision History.............................................................. 2
5 Device and Documentation Support..............................3
5.1 Receiving Notification of Documentation Updates......3
4 Revision History
注:以前版本的页码可能与当前版本的页码不同
Changes from Revision A (January 2019) to Revision B (July 2020)
Page
• 向电气特性添加了CLK 低电平(VIL-TH) 和高电平(VIH-TH) 输入电压阈值.......................................................0
• 更新了整个文档中的表格、图和交叉参考的编号格式.........................................................................................1
Changes from Revision * (June 2017) to Revision A (January 2019)
Page
• 更新了节3 ......................................................................................................................................................... 1
Copyright © 2022 Texas Instruments Incorporated
2
Submit Document Feedback
Product Folder Links: TPS92662-Q1
TPS92662-Q1
ZHCSGE3B –OCTOBER 2018 –REVISED JULY 2020
www.ti.com.cn
5 Device and Documentation Support
5.1 Receiving Notification of Documentation Updates
To receive notification of documentation updates, navigate to the device product folder on ti.com. Click on
Subscribe to updates to register and receive a weekly digest of any product information that has changed. For
change details, review the revision history included in any revised document.
5.2 Support Resources
TI E2E™ support forums are an engineer's go-to source for fast, verified answers and design help — straight
from the experts. Search existing answers or ask your own question to get the quick design help you need.
Linked content is provided "AS IS" by the respective contributors. They do not constitute TI specifications and do
not necessarily reflect TI's views; see TI's Terms of Use.
5.3 Trademarks
TI E2E™ is a trademark of Texas Instruments.
所有商标均为其各自所有者的财产。
5.4 Electrostatic Discharge Caution
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled
with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may
be more susceptible to damage because very small parametric changes could cause the device not to meet its published
specifications.
5.5 Glossary
TI Glossary
This glossary lists and explains terms, acronyms, and definitions.
Copyright © 2022 Texas Instruments Incorporated
Submit Document Feedback
3
Product Folder Links: TPS92662-Q1
TPS92662-Q1
ZHCSGE3B –OCTOBER 2018 –REVISED JULY 2020
www.ti.com.cn
6 Mechanical, Packaging, and Orderable Information
The following pages include mechanical, packaging, and orderable information. This information is the most
current data available for the designated devices. This data is subject to change without notice and revision of
this document. For browser-based versions of this data sheet, refer to the left-hand navigation.
Copyright © 2022 Texas Instruments Incorporated
4
Submit Document Feedback
Product Folder Links: TPS92662-Q1
PACKAGE OPTION ADDENDUM
www.ti.com
10-Dec-2020
PACKAGING INFORMATION
Orderable Device
Status Package Type Package Pins Package
Eco Plan
Lead finish/
Ball material
MSL Peak Temp
Op Temp (°C)
Device Marking
Samples
Drawing
Qty
(1)
(2)
(3)
(4/5)
(6)
TPS92662QPHPRQ1
TPS92662QPHPTQ1
ACTIVE
ACTIVE
HTQFP
HTQFP
PHP
PHP
48
48
1000 RoHS & Green
250 RoHS & Green
NIPDAU
Level-3-260C-168 HR
Level-3-260C-168 HR
-40 to 125
-40 to 125
92662Q
92662Q
NIPDAU
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance
do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may
reference these types of products as "Pb-Free".
RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.
Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based
flame retardants must also meet the <=1000ppm threshold requirement.
(3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6)
Lead finish/Ball material - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead finish/Ball material values may wrap to two
lines if the finish value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 1
PACKAGE OPTION ADDENDUM
www.ti.com
10-Dec-2020
Addendum-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com
24-Feb-2023
TAPE AND REEL INFORMATION
REEL DIMENSIONS
TAPE DIMENSIONS
K0
P1
W
B0
Reel
Diameter
Cavity
A0
A0 Dimension designed to accommodate the component width
B0 Dimension designed to accommodate the component length
K0 Dimension designed to accommodate the component thickness
Overall width of the carrier tape
W
P1 Pitch between successive cavity centers
Reel Width (W1)
QUADRANT ASSIGNMENTS FOR PIN 1 ORIENTATION IN TAPE
Sprocket Holes
Q1 Q2
Q3 Q4
Q1 Q2
Q3 Q4
User Direction of Feed
Pocket Quadrants
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
A0
B0
K0
P1
W
Pin1
Diameter Width (mm) (mm) (mm) (mm) (mm) Quadrant
(mm) W1 (mm)
TPS92662QPHPRQ1
TPS92662QPHPRQ1
TPS92662QPHPTQ1
HTQFP
HTQFP
HTQFP
PHP
PHP
PHP
48
48
48
1000
1000
250
330.0
330.0
330.0
16.4
16.4
16.4
9.6
9.6
9.6
9.6
9.6
9.6
1.5
1.5
1.5
12.0
12.0
12.0
16.0
16.0
16.0
Q2
Q2
Q2
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
24-Feb-2023
TAPE AND REEL BOX DIMENSIONS
Width (mm)
H
W
L
*All dimensions are nominal
Device
Package Type Package Drawing Pins
SPQ
Length (mm) Width (mm) Height (mm)
TPS92662QPHPRQ1
TPS92662QPHPRQ1
TPS92662QPHPTQ1
HTQFP
HTQFP
HTQFP
PHP
PHP
PHP
48
48
48
1000
1000
250
336.6
350.0
336.6
336.6
350.0
336.6
31.8
43.0
31.8
Pack Materials-Page 2
GENERIC PACKAGE VIEW
PHP 48
7 x 7, 0.5 mm pitch
TQFP - 1.2 mm max height
QUAD FLATPACK
This image is a representation of the package family, actual package may vary.
Refer to the product data sheet for package details.
4226443/A
www.ti.com
PACKAGE OUTLINE
PHP0048G
PowerPADTM HTQFP - 1.2 mm max height
PLASTIC QUAD FLATPACK
7.2
6.8
B
NOTE 3
37
48
PIN 1 ID
1
36
7.2
6.8
9.2
TYP
8.8
NOTE 3
12
25
13
24
A
0.27
48X
44X 0.5
0.17
0.08
C A B
4X 5.5
1.2 MAX
C
SEATING PLANE
SEE DETAIL A
0.08
(0.13)
TYP
13
24
12
25
0.25
(1)
GAGE PLANE
5.17
3.89
49
0.75
0.45
0.15
0.05
0 -7
A
16
36
DETAIL A
TYPICAL
1
48
37
5.17
3.89
4X (0.109) NOTE 5
4225861/A 4/2020
PowerPAD is a trademark of Texas Instruments.
NOTES:
1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing
per ASME Y14.5M.
2. This drawing is subject to change without notice.
3. This dimension does not include mold flash, protrusions, or gate burrs. Mold flash, protrusions, or gate burrs shall not
exceed 0.15 mm per side.
4. Reference JEDEC registration MS-026.
5. Feature may not be present.
www.ti.com
EXAMPLE BOARD LAYOUT
PHP0048G
PowerPADTM HTQFP - 1.2 mm max height
PLASTIC QUAD FLATPACK
(
6.5)
NOTE 10
(5.17)
SYMM
48
37
SOLDER MASK
DEFINED PAD
48X (1.6)
1
36
48X (0.3)
SYMM
49
(5.17)
(1.1 TYP)
(8.5)
44X (0.5)
12
25
(R0.05) TYP
(
0.2) TYP
VIA
METAL COVERED
BY SOLDER MASK
13
24
(1.1 TYP)
SEE DETAILS
(8.5)
LAND PATTERN EXAMPLE
EXPOSED METAL SHOWN
SCALE:8X
0.05 MAX
ALL AROUND
0.05 MIN
ALL AROUND
SOLDER MASK
OPENING
METAL
EXPOSED METAL
EXPOSED METAL
METAL UNDER
SOLDER MASK
SOLDER MASK
OPENING
NON SOLDER MASK
DEFINED
SOLDER MASK
DEFINED
SOLDER MASK DETAILS
4225861/A 4/2020
NOTES: (continued)
6. Publication IPC-7351 may have alternate designs.
7. Solder mask tolerances between and around signal pads can vary based on board fabrication site.
8. This package is designed to be soldered to a thermal pad on the board. See technical brief, Powerpad thermally enhanced package,
Texas Instruments Literature No. SLMA002 (www.ti.com/lit/slma002) and SLMA004 (www.ti.com/lit/slma004).
9. Vias are optional depending on application, refer to device data sheet. It is recommended that vias under paste be filled, plugged
or tented.
10. Size of metal pad may vary due to creepage requirement.
www.ti.com
EXAMPLE STENCIL DESIGN
PHP0048G
PowerPADTM HTQFP - 1.2 mm max height
PLASTIC QUAD FLATPACK
(5.17)
BASED ON
0.125 THICK STENCIL
SEE TABLE FOR
SYMM
DIFFERENT OPENINGS
FOR OTHER STENCIL
THICKNESSES
48
37
48X (1.6)
1
36
48X (0.3)
(8.5)
(5.17)
SYMM
49
BASED ON
0.125 THICK
STENCIL
44X (0.5)
12
25
(R0.05) TYP
METAL COVERED
BY SOLDER MASK
24
13
(8.5)
SOLDER PASTE EXAMPLE
EXPOSED PAD
100% PRINTED SOLDER COVERAGE BY AREA
SCALE:8X
STENCIL
THICKNESS
SOLDER STENCIL
OPENING
0.1
5.78 X 5.78
5.17 X 5.17 (SHOWN)
4.72 X 4.72
0.125
0.150
0.175
4.37 X 4.37
4225861/A 4/2020
NOTES: (continued)
11. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate
design recommendations.
12. Board assembly site may have different recommendations for stencil design.
www.ti.com
重要声明和免责声明
TI“按原样”提供技术和可靠性数据(包括数据表)、设计资源(包括参考设计)、应用或其他设计建议、网络工具、安全信息和其他资源,
不保证没有瑕疵且不做出任何明示或暗示的担保,包括但不限于对适销性、某特定用途方面的适用性或不侵犯任何第三方知识产权的暗示担
保。
这些资源可供使用 TI 产品进行设计的熟练开发人员使用。您将自行承担以下全部责任:(1) 针对您的应用选择合适的 TI 产品,(2) 设计、验
证并测试您的应用,(3) 确保您的应用满足相应标准以及任何其他功能安全、信息安全、监管或其他要求。
这些资源如有变更,恕不另行通知。TI 授权您仅可将这些资源用于研发本资源所述的 TI 产品的应用。严禁对这些资源进行其他复制或展示。
您无权使用任何其他 TI 知识产权或任何第三方知识产权。您应全额赔偿因在这些资源的使用中对 TI 及其代表造成的任何索赔、损害、成
本、损失和债务,TI 对此概不负责。
TI 提供的产品受 TI 的销售条款或 ti.com 上其他适用条款/TI 产品随附的其他适用条款的约束。TI 提供这些资源并不会扩展或以其他方式更改
TI 针对 TI 产品发布的适用的担保或担保免责声明。
TI 反对并拒绝您可能提出的任何其他或不同的条款。IMPORTANT NOTICE
邮寄地址:Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright © 2023,德州仪器 (TI) 公司
相关型号:
©2020 ICPDF网 联系我们和版权申明