TPS92662QPHPTQ1 [TI]

适用于汽车前照灯系统的 12 通道高亮度 LED 矩阵管理器 | PHP | 48 | -40 to 125;


型号：	TPS92662QPHPTQ1
厂家：	TEXAS INSTRUMENTS
描述：	适用于汽车前照灯系统的 12 通道高亮度 LED 矩阵管理器 \| PHP \| 48 \| -40 to 125 驱动接口集成电路
文件：	总13页 (文件大小：901K)
中文：	中文翻译
下载：	下载PDF数据表文档文件

TPS92662-Q1

ZHCSGE3B –OCTOBER 2018 –REVISED JULY 2020

TPS92662-Q1 适用于汽车前照灯系统的高亮度LED 矩阵管理器

该器件的 3 个串联集成开关各有 4 个子灯串，可绕过

单个 LED。各个子灯串允许器件接受单个或多个电流

源。它还允许并联多达 4 个开关，用于绕过高电流

LED。

1 特性

• 符合面向汽车应用的AEC-Q100 标准

– 1 级：–40°C 至125°C 的工作环境温度范围

– 器件HBM 分类等级H1C

– 器件CDM 分类等级C5

使用主微控制器通过多点通用异步接收器发送器

(UART) 串行接口来控制和管理 TPS92662-Q1 器件。

串行接口支持使用 CAN 收发器，适用于更可靠稳健的

物理层。I²C 通信接口用于从存储系统校准数据的外部

EEPROM 读取数据或向其中写入数据。

• 输入电压范围：4.5V 至60V

• 12 个集成旁路开关

– 3 个串联开关各有4 个子灯串

– 20V 最大跨开关电压

– 62V 最大开关到接地电压

• 多点UART 通信接口

具有两个多路复用输入的板载 8 位 ADC 可用于系统温

度补偿，并用于测量分级值，从而实现 LED 分级和编

码。

– 多达31 个可寻址器件

• 与CAN 物理层兼容

内部电荷泵轨为 LED 旁路开关提供栅极驱动电压。旁

路开关的低电阻 (R_DS(on)) 可最大程度地减少传导损耗

和功率耗散。

– 电缆线束中具有最少的导线数

• 具有2 个多路复用输入的8 位ADC

• 晶体振荡器驱动器

• 外部EEPROM I²C 接口

灯串中每个 LED 的相移和脉冲宽度是可编程的。该器

件使用内部寄存器来调节PWM 频率。可以对多个器件

进行同步。在PWM 调光操作过程中，开关转换具有可

编程的压摆率，用于缓解EMI 问题。

• 可编程10 位PWM 调光

– 单个相移和脉宽

– 器件间同步

该器件具有开路 LED 保护功能（阈值可编程）。串行

接口会报告开路LED 或短路LED 故障。

• LED 开路/短路检测和保护

2 应用

器件信息

封装⁽¹⁾

• 汽车前照灯系统

封装尺寸（标称值）

器件型号

• 高亮度LED 矩阵系统

• ADB 或无眩光远光灯

• 连续转向和动画日间行车灯

TPS92662-Q1

PHP (48)

7.00mm × 7.00mm

(1) 如需了解所有可用封装，请参阅数据表末尾的可订购产品附

录。

3 说明

TPS92662-Q1 LED 矩阵管理器器件通过提供单个像素

级LED 控制来实现完全动态的自适应照明解决方案。

VBAT

BOOST

BUCK

VIN

XTALI

CPPx

TPS92662

XTALO

ADCx

MCU

BIN

CAN

E²

UART

CAN

ECU

I²

LEDx

GND

SDA

SCL

VDD

VIO

简化版应用

本文档旨在为方便起见，提供有关TI 产品中文版本的信息，以确认产品的概要。有关适用的官方英文版本的最新信息，请访问

www.ti.com，其内容始终优先。TI 不保证翻译的准确性和有效性。在实际设计之前，请务必参考最新版本的英文版本。

English Data Sheet: SLUSD15

TPS92662-Q1

ZHCSGE3B –OCTOBER 2018 –REVISED JULY 2020

www.ti.com.cn

Table of Contents

5.2 Support Resources..................................................... 3

5.3 Trademarks.................................................................3

5.4 Electrostatic Discharge Caution..................................3

5.5 Glossary......................................................................3

6 Mechanical, Packaging, and Orderable Information....4

1 特性................................................................................... 1

2 应用................................................................................... 1

3 说明................................................................................... 1

4 Revision History.............................................................. 2

5 Device and Documentation Support..............................3

5.1 Receiving Notification of Documentation Updates......3

4 Revision History

注：以前版本的页码可能与当前版本的页码不同

Changes from Revision A (January 2019) to Revision B (July 2020)

Page

• 向电气特性添加了CLK 低电平(V_IL-TH) 和高电平(V_IH-TH) 输入电压阈值.......................................................0

• 更新了整个文档中的表格、图和交叉参考的编号格式.........................................................................................1

Changes from Revision * (June 2017) to Revision A (January 2019)

Page

• 更新了节3 ......................................................................................................................................................... 1

Submit Document Feedback

Product Folder Links: TPS92662-Q1

TPS92662-Q1

ZHCSGE3B –OCTOBER 2018 –REVISED JULY 2020

www.ti.com.cn

5 Device and Documentation Support

5.1 Receiving Notification of Documentation Updates

To receive notification of documentation updates, navigate to the device product folder on ti.com. Click on

Subscribe to updates to register and receive a weekly digest of any product information that has changed. For

change details, review the revision history included in any revised document.

5.2 Support Resources

TI E2E^™support forums are an engineer's go-to source for fast, verified answers and design help — straight

from the experts. Search existing answers or ask your own question to get the quick design help you need.

Linked content is provided "AS IS" by the respective contributors. They do not constitute TI specifications and do

not necessarily reflect TI's views; see TI's Terms of Use.

5.3 Trademarks

TI E2E^™is a trademark of Texas Instruments.

所有商标均为其各自所有者的财产。

5.4 Electrostatic Discharge Caution

This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled

with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.

ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may

be more susceptible to damage because very small parametric changes could cause the device not to meet its published

specifications.

5.5 Glossary

TI Glossary

This glossary lists and explains terms, acronyms, and definitions.

Submit Document Feedback

Product Folder Links: TPS92662-Q1

TPS92662-Q1

ZHCSGE3B –OCTOBER 2018 –REVISED JULY 2020

www.ti.com.cn

6 Mechanical, Packaging, and Orderable Information

The following pages include mechanical, packaging, and orderable information. This information is the most

current data available for the designated devices. This data is subject to change without notice and revision of

this document. For browser-based versions of this data sheet, refer to the left-hand navigation.

Submit Document Feedback

Product Folder Links: TPS92662-Q1

PACKAGE OPTION ADDENDUM

www.ti.com

10-Dec-2020

PACKAGING INFORMATION

Orderable Device

Status Package Type Package Pins Package

Eco Plan

Lead finish/

Ball material

MSL Peak Temp

Op Temp (°C)

Device Marking

Samples

Drawing

Qty

(1)

(2)

(3)

(4/5)

(6)

TPS92662QPHPRQ1

TPS92662QPHPTQ1

ACTIVE

HTQFP

PHP

1000 RoHS & Green

250 RoHS & Green

NIPDAU

Level-3-260C-168 HR

-40 to 125

92662Q

NIPDAU

⁽¹⁾The marketing status values are defined as follows:

ACTIVE: Product device recommended for new designs.

LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.

NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.

PREVIEW: Device has been announced but is not in production. Samples may or may not be available.

OBSOLETE: TI has discontinued the production of the device.

⁽²⁾RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance

do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may

reference these types of products as "Pb-Free".

RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.

Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based

flame retardants must also meet the <=1000ppm threshold requirement.

⁽³⁾MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.

⁽⁴⁾There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.

⁽⁵⁾Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation

of the previous line and the two combined represent the entire Device Marking for that device.

(6)

Lead finish/Ball material - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead finish/Ball material values may wrap to two

lines if the finish value exceeds the maximum column width.

Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information

provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and

continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.

TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.

In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.

Addendum-Page 1

PACKAGE OPTION ADDENDUM

www.ti.com

10-Dec-2020

Addendum-Page 2

PACKAGE MATERIALS INFORMATION

www.ti.com

24-Feb-2023

TAPE AND REEL INFORMATION

REEL DIMENSIONS

TAPE DIMENSIONS

Reel

Diameter

Cavity

A0 Dimension designed to accommodate the component width

B0 Dimension designed to accommodate the component length

K0 Dimension designed to accommodate the component thickness

Overall width of the carrier tape

P1 Pitch between successive cavity centers

Reel Width (W1)

QUADRANT ASSIGNMENTS FOR PIN 1 ORIENTATION IN TAPE

Sprocket Holes

Q1 Q2

Q3 Q4

Q1 Q2

Q3 Q4

User Direction of Feed

Pocket Quadrants

*All dimensions are nominal

Device

Package Package Pins

Type Drawing

SPQ

Reel

Pin1

Diameter Width (mm) (mm) (mm) (mm) (mm) Quadrant

(mm) W1 (mm)

TPS92662QPHPRQ1

TPS92662QPHPTQ1

HTQFP

PHP

1000

250

330.0

16.4

9.6

1.5

12.0

16.0

Pack Materials-Page 1

PACKAGE MATERIALS INFORMATION

www.ti.com

24-Feb-2023

TAPE AND REEL BOX DIMENSIONS

Width (mm)

*All dimensions are nominal

Device

Package Type Package Drawing Pins

SPQ

Length (mm) Width (mm) Height (mm)

TPS92662QPHPRQ1

TPS92662QPHPTQ1

HTQFP

PHP

1000

250

336.6

350.0

336.6

350.0

336.6

31.8

43.0

31.8

Pack Materials-Page 2

GENERIC PACKAGE VIEW

PHP 48

7 x 7, 0.5 mm pitch

TQFP - 1.2 mm max height

QUAD FLATPACK

This image is a representation of the package family, actual package may vary.

Refer to the product data sheet for package details.

4226443/A

www.ti.com

PACKAGE OUTLINE

PHP0048G

PowerPAD^TMHTQFP - 1.2 mm max height

SCALE 1.900

PLASTIC QUAD FLATPACK

7.2

6.8

NOTE 3

PIN 1 ID

7.2

6.8

9.2

TYP

8.8

NOTE 3

0.27

48X

44X 0.5

0.17

0.08

C A B

4X 5.5

1.2 MAX

SEATING PLANE

SEE DETAIL A

0.08

(0.13)

TYP

0.25

(1)

GAGE PLANE

5.17

3.89

0.75

0.45

0.15

0.05

0 -7

DETAIL A

TYPICAL

5.17

3.89

4X (0.109) NOTE 5

4225861/A 4/2020

PowerPAD is a trademark of Texas Instruments.

NOTES:

1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing

per ASME Y14.5M.

2. This drawing is subject to change without notice.

3. This dimension does not include mold flash, protrusions, or gate burrs. Mold flash, protrusions, or gate burrs shall not

exceed 0.15 mm per side.

4. Reference JEDEC registration MS-026.

5. Feature may not be present.

www.ti.com

EXAMPLE BOARD LAYOUT

PHP0048G

PowerPAD^TMHTQFP - 1.2 mm max height

PLASTIC QUAD FLATPACK

(

6.5)

NOTE 10

(5.17)

SYMM

SOLDER MASK

DEFINED PAD

48X (1.6)

48X (0.3)

SYMM

(5.17)

(1.1 TYP)

(8.5)

44X (0.5)

(R0.05) TYP

(

0.2) TYP

VIA

METAL COVERED

BY SOLDER MASK

(1.1 TYP)

SEE DETAILS

(8.5)

LAND PATTERN EXAMPLE

EXPOSED METAL SHOWN

SCALE:8X

0.05 MAX

ALL AROUND

0.05 MIN

ALL AROUND

SOLDER MASK

OPENING

METAL

EXPOSED METAL

METAL UNDER

SOLDER MASK

OPENING

NON SOLDER MASK

DEFINED

SOLDER MASK

DEFINED

SOLDER MASK DETAILS

4225861/A 4/2020

NOTES: (continued)

6. Publication IPC-7351 may have alternate designs.

7. Solder mask tolerances between and around signal pads can vary based on board fabrication site.

8. This package is designed to be soldered to a thermal pad on the board. See technical brief, Powerpad thermally enhanced package,

Texas Instruments Literature No. SLMA002 (www.ti.com/lit/slma002) and SLMA004 (www.ti.com/lit/slma004).

9. Vias are optional depending on application, refer to device data sheet. It is recommended that vias under paste be filled, plugged

or tented.

10. Size of metal pad may vary due to creepage requirement.

www.ti.com

EXAMPLE STENCIL DESIGN

PHP0048G

PowerPAD^TMHTQFP - 1.2 mm max height

PLASTIC QUAD FLATPACK

(5.17)

BASED ON

0.125 THICK STENCIL

SEE TABLE FOR

SYMM

DIFFERENT OPENINGS

FOR OTHER STENCIL

THICKNESSES

48X (1.6)

48X (0.3)

(8.5)

(5.17)

SYMM

BASED ON

0.125 THICK

STENCIL

44X (0.5)

(R0.05) TYP

METAL COVERED

BY SOLDER MASK

(8.5)

SOLDER PASTE EXAMPLE

EXPOSED PAD

100% PRINTED SOLDER COVERAGE BY AREA

SCALE:8X

STENCIL

THICKNESS

SOLDER STENCIL

OPENING

0.1

5.78 X 5.78

5.17 X 5.17 (SHOWN)

4.72 X 4.72

0.125

0.150

0.175

4.37 X 4.37

4225861/A 4/2020

NOTES: (continued)

11. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate

design recommendations.

12. Board assembly site may have different recommendations for stencil design.

www.ti.com

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