TPS92663-Q1 [TI]
适用于汽车前照灯系统的 6 通道高亮度 LED 矩阵管理器;
| 型号： | TPS92663-Q1 |
| 厂家： | 
TEXAS INSTRUMENTS |
| 描述： | 适用于汽车前照灯系统的 6 通道高亮度 LED 矩阵管理器 |
| 文件： | 总13页 (文件大小：1691K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
Support &
Community
Product
Folder
Order
Now
Tools &
Software
Technical
Documents
TPS92663-Q1
ZHCSKC3 –JULY 2018
适用于汽车前照灯系统的 TPS92663-Q1 高亮度 LED 矩阵管理器
1 特性
3 说明
1
•
符合面向汽车应用的 AEC-Q100 标准
TPS92663-Q1 LED 矩阵管理器器件通过提供单个像素
级 LED 控制来实现完全动态的自适应照明解决方案。
–
–
–
器件温度等级 1：–40°C 至 125°C，TA
器件 HBM 分类等级：H1C
该器件的 3 个串联集成开关各有 2 个子灯串，可绕过
单个 LED。各个子灯串允许器件接受单个或多个电流
源。它还能并联 2 个开关，用于绕过高电流 LED。
器件 CDM 分类等级：C5
•
•
输入电压范围：4.5V 至 60V
6 个集成旁路开关
主微控制器通过多点通用异步收发传输器 (UART) 串行
接口，控制和管理 TPS92663-Q1 器件。串行接口支持
使用 CAN 收发器，实现更可靠稳健的物理层。应用可
使用 TPS92663-Q1 器件，也可以使用与该器件在同一
总线上的 TPS92662-Q1 器件。
–
–
–
3 个串联开关各有 2 个子灯串
20V 最大跨开关电压
62V 最大开关到接地电压
•
•
多点 UART 通信接口
–
–
多达 16 个可寻址器件
与 TPS92662-Q1 在同一总线上集成
具有两个多路复用输入的内置 8 位 ADC 可用于系统温
度补偿和测量分箱值，从而实现 LED 分箱和编码。
与 CAN 物理层兼容
电缆线束中具有最少的导线数
–
内部电荷泵轨为 LED 旁路开关提供栅极驱动电压。旁
路开关的低电阻 (RDS(on)) 可最大程度地减少传导损耗
和功率耗散。
•
•
•
具有 2 个多路复用器输入的 8 位 ADC
晶体振荡器驱动器
可编程 10 位 PWM 调光
灯串中每个 LED 的相移和脉冲宽度是可编程的。该器
件使用内部寄存器来调节 PWM 频率。可以对多个器
件进行同步。在 PWM 调光操作过程中，开关转换具
有可编程的压摆率，用于缓解 EMI 问题。
–
–
单个相移和脉宽
器件间同步
•
LED 开路/短路检测和保护
2 应用
该器件 的每个 开路 LED 保护功能（具有可编程阈
值）。串行接口会报告开路 LED 或短路 LED 故障。
•
•
•
•
汽车前照灯系统
高亮度 LED 矩阵系统
ADB 或无眩光远光灯
器件信息(1)
器件型号
封装
PWP (24)
封装尺寸（标称值）
连续转向和动画日间行车灯
TPS92663-Q1
7.70mm × 4.40mm
(1) 如需了解所有可用封装，请参阅数据表末尾的可订购产品附
录。
简化应用
VBAT
Boost
Buck
VIN
CPPx
XTALI
TPS92663
XTALO
ADCx
MCU
BIN
UART
RX
TX
CAN
CAN
ECU
LEDx
GND
VDD
1
本文档旨在为方便起见，提供有关 TI 产品中文版本的信息，以确认产品的概要。 有关适用的官方英文版本的最新信息，请访问 www.ti.com，其内容始终优先。 TI 不保证翻译的准确
性和有效性。 在实际设计之前，请务必参考最新版本的英文版本。
English Data Sheet: SLUSD34
TPS92663-Q1
ZHCSKC3 –JULY 2018
www.ti.com.cn
目录
5.1 接收文档更新通知 ..................................................... 3
5.2 社区资源.................................................................... 3
5.3 商标........................................................................... 3
5.4 静电放电警告............................................................. 3
5.5 Glossary.................................................................... 3
机械、封装和可订购信息 ......................................... 4
1
2
3
4
5
特性.......................................................................... 1
应用.......................................................................... 1
说明.......................................................................... 1
修订历史记录 ........................................................... 2
器件和文档支持........................................................ 3
6
4 修订历史记录
注：之前版本的页码可能与当前版本有所不同。
日期
修订版本
说明
2018 年 7 月
*
初始发行版。
2
版权 © 2018, Texas Instruments Incorporated
TPS92663-Q1
www.ti.com.cn
ZHCSKC3 –JULY 2018
5 器件和文档支持
5.1 接收文档更新通知
要接收文档更新通知，请导航至 ti.com. 上的器件产品文件夹。单击右上角的通知我进行注册，即可每周接收产品
信息更改摘要。有关更改的详细信息，请查看任何已修订文档中包含的修订历史记录。
5.2 社区资源
TI E2E™ support forums are an engineer's go-to source for fast, verified answers and design help — straight
from the experts. Search existing answers or ask your own question to get the quick design help you need.
Linked content is provided "AS IS" by the respective contributors. They do not constitute TI specifications and do
not necessarily reflect TI's views; see TI's Terms of Use.
5.3 商标
E2E is a trademark of Texas Instruments.
5.4 静电放电警告
ESD 可能会损坏该集成电路。德州仪器 (TI) 建议通过适当的预防措施处理所有集成电路。如果不遵守正确的处理措施和安装程序 , 可
能会损坏集成电路。
ESD 的损坏小至导致微小的性能降级 , 大至整个器件故障。 精密的集成电路可能更容易受到损坏 , 这是因为非常细微的参数更改都可
能会导致器件与其发布的规格不相符。
5.5 Glossary
SLYZ022 — TI Glossary.
This glossary lists and explains terms, acronyms, and definitions.
版权 © 2018, Texas Instruments Incorporated
3
TPS92663-Q1
ZHCSKC3 –JULY 2018
www.ti.com.cn
6 机械、封装和可订购信息
以下页面包含机械、封装和可订购信息。这些信息是指定器件的最新可用数据。数据如有变更，恕不另行通知，且
不会对此文档进行修订。如需获取此数据表的浏览器版本，请查阅左侧的导航栏。
4
版权 © 2018, Texas Instruments Incorporated
PACKAGE OPTION ADDENDUM
www.ti.com
10-Dec-2020
PACKAGING INFORMATION
Orderable Device
Status Package Type Package Pins Package
Eco Plan
Lead finish/
Ball material
MSL Peak Temp
Op Temp (°C)
Device Marking
Samples
Drawing
Qty
(1)
(2)
(3)
(4/5)
(6)
TPS92663QPWPRQ1
TPS92663QPWPTQ1
ACTIVE
ACTIVE
HTSSOP
HTSSOP
PWP
PWP
24
24
2000 RoHS & Green
250 RoHS & Green
NIPDAU
Level-3-260C-168 HR
Level-3-260C-168 HR
-40 to 125
-40 to 125
TPS92663Q
TPS92663Q
NIPDAU
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance
do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may
reference these types of products as "Pb-Free".
RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.
Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based
flame retardants must also meet the <=1000ppm threshold requirement.
(3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6)
Lead finish/Ball material - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead finish/Ball material values may wrap to two
lines if the finish value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 1
PACKAGE OPTION ADDENDUM
www.ti.com
10-Dec-2020
Addendum-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com
1-Sep-2021
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
A0
B0
K0
P1
W
Pin1
Diameter Width (mm) (mm) (mm) (mm) (mm) Quadrant
(mm) W1 (mm)
TPS92663QPWPRQ1 HTSSOP PWP
24
2000
330.0
16.4
6.95
8.3
1.6
8.0
16.0
Q1
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
1-Sep-2021
*All dimensions are nominal
Device
Package Type Package Drawing Pins
HTSSOP PWP 24
SPQ
Length (mm) Width (mm) Height (mm)
350.0 350.0 43.0
TPS92663QPWPRQ1
2000
Pack Materials-Page 2
GENERIC PACKAGE VIEW
PWP 24
4.4 x 7.6, 0.65 mm pitch
PowerPADTM TSSOP - 1.2 mm max height
PLASTIC SMALL OUTLINE
This image is a representation of the package family, actual package may vary.
Refer to the product data sheet for package details.
4224742/B
www.ti.com
PACKAGE OUTLINE
PWP0024B
PowerPADTM TSSOP - 1.2 mm max height
S
C
A
L
E
2
.
2
0
0
PLASTIC SMALL OUTLINE
6.6
6.2
SEATING PLANE
C
TYP
PIN 1 ID
A
0.1 C
AREA
22X 0.65
24
1
2X
7.9
7.7
NOTE 3
7.15
12
13
0.30
24X
4.5
4.3
0.19
B
0.1
C A
B
(0.15) TYP
SEE DETAIL A
4X (0.2) MAX
NOTE 5
2X (0.95) MAX
NOTE 5
EXPOSED
THERMAL PAD
0.25
GAGE PLANE
5.16
4.12
1.2 MAX
0.15
0.05
0 - 8
0.75
0.50
DETAIL A
TYPICAL
(1)
2.40
1.65
4222709/A 02/2016
PowerPAD is a trademark of Texas Instruments.
NOTES:
1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing
per ASME Y14.5M.
2. This drawing is subject to change without notice.
3. This dimension does not include mold flash, protrusions, or gate burrs. Mold flash, protrusions, or gate burrs shall not
exceed 0.15 mm per side.
4. Reference JEDEC registration MO-153.
5. Features may not be present and may vary.
www.ti.com
EXAMPLE BOARD LAYOUT
PWP0024B
PowerPADTM TSSOP - 1.2 mm max height
PLASTIC SMALL OUTLINE
(3.4)
NOTE 9
SOLDER MASK
DEFINED PAD
(2.4)
24X (1.5)
SYMM
SEE DETAILS
1
24
24X (0.45)
(R0.05)
TYP
(7.8)
NOTE 9
(1.1)
TYP
SYMM
(5.16)
22X (0.65)
(
0.2) TYP
VIA
12
13
(1) TYP
METAL COVERED
BY SOLDER MASK
(5.8)
LAND PATTERN EXAMPLE
SCALE:10X
METAL UNDER
SOLDER MASK
SOLDER MASK
OPENING
SOLDER MASK
OPENING
METAL
0.05 MIN
ALL AROUND
0.05 MAX
ALL AROUND
SOLDER MASK
DEFINED
NON SOLDER MASK
DEFINED
SOLDER MASK DETAILS
PADS 1-24
4222709/A 02/2016
NOTES: (continued)
6. Publication IPC-7351 may have alternate designs.
7. Solder mask tolerances between and around signal pads can vary based on board fabrication site.
8. This package is designed to be soldered to a thermal pad on the board. For more information, see Texas Instruments literature
numbers SLMA002 (www.ti.com/lit/slma002) and SLMA004 (www.ti.com/lit/slma004).
9. Size of metal pad may vary due to creepage requirement.
www.ti.com
EXAMPLE STENCIL DESIGN
PWP0024B
PowerPADTM TSSOP - 1.2 mm max height
PLASTIC SMALL OUTLINE
(2.4)
BASED ON
0.125 THICK
STENCIL
24X (1.5)
(R0.05) TYP
1
24
24X (0.45)
(5.16)
SYMM
BASED ON
0.125 THICK
STENCIL
22X (0.65)
13
12
SYMM
(5.8)
METAL COVERED
BY SOLDER MASK
SEE TABLE FOR
DIFFERENT OPENINGS
FOR OTHER STENCIL
THICKNESSES
SOLDER PASTE EXAMPLE
EXPOSED PAD
100% PRINTED SOLDER COVERAGE BY AREA
SCALE:10X
STENCIL
THICKNESS
SOLDER STENCIL
OPENING
0.1
2.68 X 5.77
2.4 X 5.16 (SHOWN)
2.19 X 4.71
0.125
0.15
0.175
2.03 X 4.36
4222709/A 02/2016
NOTES: (continued)
10. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate
design recommendations.
11. Board assembly site may have different recommendations for stencil design.
www.ti.com
重要声明和免责声明
TI 提供技术和可靠性数据（包括数据表）、设计资源（包括参考设计）、应用或其他设计建议、网络工具、安全信息和其他资源，不保证没
有瑕疵且不做出任何明示或暗示的担保，包括但不限于对适销性、某特定用途方面的适用性或不侵犯任何第三方知识产权的暗示担保。
这些资源可供使用 TI 产品进行设计的熟练开发人员使用。您将自行承担以下全部责任：(1) 针对您的应用选择合适的 TI 产品，(2) 设计、验
证并测试您的应用，(3) 确保您的应用满足相应标准以及任何其他安全、安保或其他要求。这些资源如有变更，恕不另行通知。TI 授权您仅可
将这些资源用于研发本资源所述的 TI 产品的应用。严禁对这些资源进行其他复制或展示。您无权使用任何其他 TI 知识产权或任何第三方知
识产权。您应全额赔偿因在这些资源的使用中对 TI 及其代表造成的任何索赔、损害、成本、损失和债务，TI 对此概不负责。
TI 提供的产品受 TI 的销售条款 (https:www.ti.com.cn/zh-cn/legal/termsofsale.html) 或 ti.com.cn 上其他适用条款/TI 产品随附的其他适用条款
的约束。TI 提供这些资源并不会扩展或以其他方式更改 TI 针对 TI 产品发布的适用的担保或担保免责声明。IMPORTANT NOTICE
邮寄地址：上海市浦东新区世纪大道 1568 号中建大厦 32 楼，邮政编码：200122
Copyright © 2021 德州仪器半导体技术（上海）有限公司
相关型号：
TPS92682-Q1_V03
TPS92682-Q1 Dual-Channel Constant-Voltage and Constant-Current Controller with SPI Interface
TI
©2020 ICPDF网 联系我们和版权申明