UC1611 [TI]

Quad Schottky Diode Array; QUAD肖特基二极管阵列
UC1611
型号: UC1611
厂家: TEXAS INSTRUMENTS    TEXAS INSTRUMENTS
描述:

Quad Schottky Diode Array
QUAD肖特基二极管阵列

肖特基二极管
文件: 总4页 (文件大小:160K)
中文:  中文翻译
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UC1611  
UC3611  
Quad Schottky Diode Array  
FEATURES  
DESCRIPTION  
Matched, Four-Diode Monolithic Array This four-diode array is designed for general purpose use as individual  
diodes or as a high-speed, high-current bridge. It is particularly useful on  
the outputs of high-speed power MOSFET drivers where Schottky diodes  
High Peak Current  
are needed to clamp any negative excursions caused by ringing on the  
driven line.  
Low-Cost MINIDIP Package  
Low-Forward Voltage  
These diodes are also ideally suited for use as voltage clamps when driv-  
ing inductive loads such as relays and solenoids, and to provide a path  
for current free-wheeling in motor drive applications.  
Parallelable for Lower VF or Higher IF  
Fast Recovery Time  
The use of Schottky diode technology features high efficiency through  
lowered forward voltage drop and decreased reverse recovery time.  
Military Temperature Range Available  
This single monolithic chip is fabricated in both hermetic CERDIP and  
copper-leaded plastic packages. The UC1611 in ceramic is designed for  
-55°C to +125°C environments but with reduced peak current capability:  
while the UC3611 in plastic has higher current rating over a 0°C to +70°C  
ambient temperature range.  
CONNECTION DIAGRAM  
DIL-8 (TOP VIEW)  
N or J Package  
SOIC-16 (TOP VIEW)  
DW Package  
PLCC-20 (TOP VIEW)  
Q Package  
6/93  
UC1611  
UC3611  
ABSOLUTE MAXIMUM RATINGS  
Peak Inverse Voltage (per Diode). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 50V  
Diode-to-Diode Voltage. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 80V  
Peak Forward Current  
UC1611 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1A  
UC3611 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3A  
Power Dissipation at TA = +70°C . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1W  
Storage Temperature Range . . . . . . . . . . . . . . . . . . . . . . . . . . -65°C to +150°C  
Lead Temperature (Soldering, 10 Seconds). . . . . . . . . . . . . . . . . . . . . . . +300°C  
Note: Please consult Packaging Section of Databook for thermal limitations and  
considerations of package.  
All specifications apply to each individual diode. TJ = +25°C except as noted.  
TA = TJ.  
ELECTRICAL CHARACTERISTICS:  
PARAMETER  
TEST CONDITIONS  
MIN. TYP. MAX. UNITS  
Forward Voltage Drop  
IF = 100mA  
0.3  
0.4  
0.9  
0.01  
0.1  
20  
0.7  
1.2  
0.1  
1.0  
V
V
IF = 1A  
Leakage Current  
VR = 40V  
mA  
mA  
ns  
ns  
pF  
VR = 40V, TJ = +100°C  
0.5A Forward to 0.5A Reverse  
1A Forward to 1.1V Recovery  
VR = 5V  
Reverse Recovery  
Forward Recovery  
Junction Capacitance  
40  
100  
Note: At Forward currents of greater than 1.0A, a parasitic current of approximately 10mA may be collected by adjacent diodes.  
Reverse Current vs Voltage  
Forward Current vs Voltage  
2
UC1611  
UC3611  
TYPICAL APPLICATIONS  
A. Clamp Diodes - PWMS and Drivers  
B. Transformer Coupled Drive Circuits  
C. Linear Regulations  
UNITRODE INTEGRATED CIRCUITS  
7 CONTINENTAL BLVD. MERRIMACK, NH 03054  
TEL. (603) 424-2410 FAX (603) 424-3460  
3
IMPORTANT NOTICE  
Texas Instruments and its subsidiaries (TI) reserve the right to make changes to their products or to discontinue  
any product or service without notice, and advise customers to obtain the latest version of relevant information  
to verify, before placing orders, that information being relied on is current and complete. All products are sold  
subject to the terms and conditions of sale supplied at the time of order acknowledgement, including those  
pertaining to warranty, patent infringement, and limitation of liability.  
TI warrants performance of its semiconductor products to the specifications applicable at the time of sale in  
accordance with TI’s standard warranty. Testing and other quality control techniques are utilized to the extent  
TI deems necessary to support this warranty. Specific testing of all parameters of each device is not necessarily  
performed, except those mandated by government requirements.  
CERTAIN APPLICATIONS USING SEMICONDUCTOR PRODUCTS MAY INVOLVE POTENTIAL RISKS OF  
DEATH, PERSONAL INJURY, OR SEVERE PROPERTY OR ENVIRONMENTAL DAMAGE (“CRITICAL  
APPLICATIONS”). TI SEMICONDUCTOR PRODUCTS ARE NOT DESIGNED, AUTHORIZED, OR  
WARRANTED TO BE SUITABLE FOR USE IN LIFE-SUPPORT DEVICES OR SYSTEMS OR OTHER  
CRITICAL APPLICATIONS. INCLUSION OF TI PRODUCTS IN SUCH APPLICATIONS IS UNDERSTOOD TO  
BE FULLY AT THE CUSTOMER’S RISK.  
In order to minimize risks associated with the customer’s applications, adequate design and operating  
safeguards must be provided by the customer to minimize inherent or procedural hazards.  
TI assumes no liability for applications assistance or customer product design. TI does not warrant or represent  
that any license, either express or implied, is granted under any patent right, copyright, mask work right, or other  
intellectual property right of TI covering or relating to any combination, machine, or process in which such  
semiconductor products or services might be or are used. TI’s publication of information regarding any third  
party’s products or services does not constitute TI’s approval, warranty or endorsement thereof.  
Copyright 1999, Texas Instruments Incorporated  

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