CMS14(T2L,TEM,Q) [TOSHIBA]
Rectifier Diode;
| 型号： | CMS14(T2L,TEM,Q) |
| 厂家： | 
TOSHIBA |
| 描述： | Rectifier Diode 测试 光电二极管 |
| 文件： | 总5页 (文件大小：360K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
CMS14
Schottky Barrier Diode
CMS14
○ Radio-Frequency Rectification in Switching Regulators
Unit: mm
○ DC-DC Converters
•
•
•
•
Repetitive peak reverse voltage : V
= 60 V
RRM
Average forward current
Peak forward voltage
: I
= 2.0 A
F (AV)
: V
FM
= 0.58 V (max)
Suitable for high-density board assembly due to the use of a small
Toshiba Nickname: M−FLATTM
Absolute Maximum Ratings (Ta = 25°C)
Characteristics
Symbol
Rating
Unit
1
2
ANODE
Repetitive peak reverse voltage
Average forward current
V
60
V
A
RRM
CATHODE
I
2.0 (Note 1)
40 (50 Hz)
−40 to 150
−40 to 150
F (AV)
Non-repetitive peak forward surge current
Junction temperature
I
A
FSM
T
°C
°C
j
JEDEC
JEITA
―
―
Storage temperature range
T
stg
Note 1: Tℓ = 112°C
Device mounted on a ceramic board
board size
Soldering land size
board thickness
: 50 mm × 50 mm
: 2 mm × 2 mm
: 0.64 mm
TOSHIBA
3-4E1S
Weight: 0.023 g (typ.)
Rectangular waveform : α = 180°, V = 30 V
R
Note2: Using continuously under heavy loads (e.g. the application of
high temperature/current/voltage and the significant change in temperature, etc.) may cause this product to
decrease in the reliability significantly even if the operating conditions (i.e. operating
temperature/current/voltage, etc.) are within the absolute maximum ratings.
Please design the appropriate reliability upon reviewing the Toshiba Semiconductor Reliability Handbook
(“Handling Precautions”/“Derating Concept and Methods”) and individual reliability data (i.e. reliability test
report and estimated failure rate, etc).
Electrical Characteristics (Ta = 25°C)
Characteristics
Peak forward voltage
Symbol
Test Condition
= 1 A (pulse test)
Min
Typ.
Max
Unit
V
V
V
I
I
―
―
―
―
―
0.45
0.53
0.6
25
―
0.58
―
FM (1)
FM (2)
FM
FM
= 2 A (pulse test)
I
V
V
V
= 5 V (pulse test)
= 60 V (pulse test)
RRM (1)
RRM (2)
RRM
RRM
Repetitive peak reverse current
Junction capacitance
μA
I
200
―
C
j
= 10 V, f = 1 MHz
R
77
pF
Device mounted on a ceramic board
board size
soldering land size
board thickness
50 mm × 50 mm
2 mm × 2 mm
0.64 mm
―
―
―
―
60
Device mounted on a glass-epoxy board
board size
soldering land size
board thickness
Thermal resistance
(junction to ambient)
50 mm × 50 mm
6 mm × 6 mm
1.6 mm
R
135
°C/W
°C/W
th (j-a)
Device mounted on a glass-epoxy board
board size
50 mm × 50 mm
2.1 mm × 1.4 mm
1.6 mm
―
―
―
―
210
16
soldering land size
board thickness
Thermal resistance (junction to lead)
R
―
th (j-ℓ)
Start of commercial production
2002-12
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CMS14
Marking
Abbreviation Code
SD
Part No.
CMS14
Land pattern dimensions for reference only
Unit: mm
1.4
3.0
1.4
Handling Precaution
1) Schottky barrier diodes have reverse current characteristics compared to other diodes.
There is a possibility SBD may cause thermal runaway when it is used under high temperature or high voltage.
Please take forward and reverse loss into consideration during design.
2) The absolute maximum ratings denote the absolute maximum ratings, which are rated values and must not be
exceeded during operation, even for an instant. The following are the general derating methods that we recommend
when you design a circuit with a device.
V : Use this rating with reference to (1) above. V has a temperature coefficient of 0.1%/°C. Take this
RRM RRM
temperature coefficient into account designing a device at low temperature.
I
I
: We recommend that the worst case current be no greater than 80% of the absolute maximum rating of
F (AV)
I
and T be below 120°C. When using this device, take the margin into consideration by using an
j
F (AV)
allowable Ta max - I
curve.
F (AV)
: This rating specifies the non-repetitive peak current. This is only applied for an abnormal operation,
which seldom occurs during the lifespan of the device.
FSM
T : Derate this rating when using a device in order to ensure high reliability.
j
We recommend that the device be used at a T of below 120°C.
j
3) Thermal resistance between junction and ambient fluctuates depending on the device’s mounting condition. When
using a device, design a circuit board and a soldering land size to match the appropriate thermal resistance value.
4) For other design considerations, see the Toshiba website.
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CMS14
I
– V
P
– I
F (AV) F (AV)
F
F
10
2
1.6
1.2
0.8
0.4
0
Rectangular
waveform
DC
T = 150°C
j
0° α 360°
1
180°
125°C
75°C
Conduction angle α
120°
α = 60°
25°C
0.1
0.01
Pulse test
1
0
0.2
0.4
0.6
0.8
1.2
0
0.6
1.2
1.8
2.4
(A)
3
Forward voltage
V
(V)
Average forward current
I
F (AV)
F
Ta max – IF (AV)
Tℓ max – I
F (AV)
160
140
120
100
80
160
140
120
100
80
Device mounted on a ceramic board: Rectangular
waveform
board size: 50 mm × 50 mm
soldering land:
2 mm × 2 mm
board thickness:
0° α 360°
0.64mm
I
F (AV)
Conduction
angle α
= 30 V
α = 60°
120°
180°
DC
V
R
Rectangular
waveform
60
60
DC
40
40
0° α 360°
I
180°
1.6
F (AV)
Conduction
angle α
= 30 V
20
20
120°
1.2
α = 60°
V
R
0
0
0
0
0.4
0.8
1.2
1.6
2
2.4
F (AV)
2.8
(A)
3.2
0.4
0.8
2
2.4
F (AV)
2.8
(A)
3.2
Average forward current
I
Average forward current
I
r
– t
th (j-a)
1000
100
10
Device mounted on a glass-epoxy board:
board size: 50 mm × 50 mm
Soldering land size: 2.1 mm × 1.4 mm
board thickness: 1.6 mm
Device mounted on a glass-epoxy board:
board size: 50 mm × 50 mm
Soldering land size: 6 mm × 6 mm
board thickness: 1.6 mm
Device mounted on a ceramic board:
board size: 50 mm × 50 mm
Soldering land: size 2 mm × 2 mm
board thickness: 0.64 mm
1
0.001
0.01
0.1
1
10
100
1000
Time
t
(s)
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CMS14
C – V
j
Repetitive peak forward current
R
500
100
50
40
30
20
10
0
Ta = 25°C
f = 50 Hz
Ta = 25°C
f = 1 MHz
10
1
10
100
1
10
100
Reverse voltage
V
(V)
R
Number of cycles
P
– V
R
R (AV)
I
– T
j
R
10
1
0.4
0.32
0.24
0.16
0.08
0
Rectangular
waveform
Pulse test
α
0°
360°
48 V
40 V
DC
V
R
0.1
Conduction angle: α
T = 125°C
30 V
20 V
300°
j
240°
0.01
0.001
0.0001
180°
10 V
= 5 V
120°
V
R
α = 60°
0
20
40
60
80
100
120
(°C)
140
160
0
6
12
18
24
30
36
42
48
Junction temperature
T
Reverse voltage
V
(V)
j
R
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CMS14
RESTRICTIONS ON PRODUCT USE
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TOSHIBA's written permission, reproduction is permissible only if reproduction is without alteration/omission.
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Though TOSHIBA works continually to improve Product's quality and reliability, Product can malfunction or fail. Customers are
responsible for complying with safety standards and for providing adequate designs and safeguards for their hardware, software and
systems which minimize risk and avoid situations in which a malfunction or failure of Product could cause loss of human life, bodily
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all relevant TOSHIBA information, including without limitation, this document, the specifications, the data sheets and application notes
for Product and the precautions and conditions set forth in the "TOSHIBA Semiconductor Reliability Handbook" and (b) the
instructions for the application with which the Product will be used with or for. Customers are solely responsible for all aspects of their
own product design or applications, including but not limited to (a) determining the appropriateness of the use of this Product in such
design or applications; (b) evaluating and determining the applicability of any information contained in this document, or in charts,
diagrams, programs, algorithms, sample application circuits, or any other referenced documents; and (c) validating all operating
parameters for such designs and applications. TOSHIBA ASSUMES NO LIABILITY FOR CUSTOMERS' PRODUCT DESIGN OR
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PRODUCT IS NEITHER INTENDED NOR WARRANTED FOR USE IN EQUIPMENTS OR SYSTEMS THAT REQUIRE
EXTRAORDINARILY HIGH LEVELS OF QUALITY AND/OR RELIABILITY, AND/OR A MALFUNCTION OR FAILURE OF WHICH
MAY CAUSE LOSS OF HUMAN LIFE, BODILY INJURY, SERIOUS PROPERTY DAMAGE AND/OR SERIOUS PUBLIC IMPACT
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limitation, equipment used in nuclear facilities, equipment used in the aerospace industry, lifesaving and/or life supporting medical
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https://toshiba.semicon-storage.com/
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2018-10-16
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