SSM3K333R,LF [TOSHIBA]
MOSFET, SOT23F;
| 型号： | SSM3K333R,LF |
| 厂家： | 
TOSHIBA |
| 描述： | MOSFET, SOT23F 开关 光电二极管 晶体管 |
| 文件： | 总5页 (文件大小：227K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
SSM3K333R
TOSHIBA Field-Effect Transistor Silicon N-Channel MOS Type (U-MOS VII-H)
SSM3K333R
○Power Management Switch Applications
○High-Speed Switching Applications
Unit: mm
+0.08
-0.05
0.42
+0.08
0.17
0.05ꢀM A
-0.07
3
•
•
4.5V drive
Low ON-resistance: R
= 42 mΩ (max) (@V
= 4.5 V)
= 10 V)
DS(ON)
DS(ON)
GS
: R
= 28 mΩ (max) (@V
GS
1
2
0.95
0.95
Absolute Maximum Ratings (Ta = 25°C)
2.9±0.2
A
Characteristic
Drain-source voltage
Symbol
Rating
Unit
V
30
V
V
DSS
V
±20
Gate-source voltage
GSS
I
(Note1)
6
DC
D
1. Gate
2. Source
3. Drain
Drain current
A
I
(Note1)
(Note 2)
12
Pulse
DP
P
1
2
D
Power dissipation
W
SOT-23F
t = 10s
ch
JEDEC
―
―
T
T
150
°C
°C
Channel temperature
−55 to 150
Storage temperature range
JEITA
stg
TOSHIBA
2-3Z1A
Note: Using continuously under heavy loads (e.g. the application of high
temperature/current/voltage and the significant change in
Weight: 11 mg (typ.)
temperature, etc.) may cause this product to decrease in the
reliability significantly even if the operating conditions (i.e. operating temperature/current/voltage, etc.) are
within the absolute maximum ratings.
Please design the appropriate reliability upon reviewing the Toshiba Semiconductor Reliability Handbook
(“Handling Precautions”/“Derating Concept and Methods”) and individual reliability data (i.e. reliability test
report and estimated failure rate, etc).
Note 1: The channel temperature should not exceed 150°C during use.
Note 2: Mounted on a FR4 board.
(25.4 mm × 25.4 mm × 1.6 mm, Cu Pad: 645 mm2)
Marking
Equivalent Circuit (top view)
3
3
KFK
1
2
1
2
Start of commercial production
2010-10
1
2014-03-01
SSM3K333R
Electrical Characteristics (Ta = 25°C)
Characteristic
Symbol
Test Conditions
Min
Typ.
Max
Unit
V
V
V
I
I
= 10 mA, V
= 10 mA, V
= 0 V
30
15
⎯
⎯
1.3
12
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
(BR) DSS
(BR) DSX
D
D
GS
GS
Drain-source breakdown voltage
= −20 V
= 0 V
Drain cut-off current
I
V
V
V
V
= 30 V, V
⎯
1
μA
μA
V
DSS
GSS
DS
GS
DS
DS
GS
Gate leakage current
Gate threshold voltage
Forward transfer admittance
I
= ± 20 V, V
= 0 V
⎯
±0.1
2.5
⎯
DS
V
= 10 V, I = 0.1 mA
⎯
th
D
⏐Y ⏐
= 10 V, I = 5 A
(Note 3)
(Note 3)
(Note 3)
24
S
fs
D
I
I
= 3.0 A, V
= 5.0 A, V
= 4.5 V
= 10 V
25.7
18.7
436
77
42
28
⎯
D
D
GS
GS
Drain–source ON-resistance
R
mΩ
DS (ON)
Input capacitance
C
C
iss
V
= 15V, V
= 0 V, f = 1 MHz
GS
pF
Output capacitance
Reverse transfer capacitance
Total gate charge
⎯
DS
oss
C
28
⎯
rss
Q
g
3.4
1.8
1.0
12
⎯
V
V
= 15V, I = 6.0 A
D
DD
GS
nC
Gate-source charge
Gate-drain charge
Q
gs1
⎯
= 4.5V
Q
gd
⎯
Turn-on time
Switching time
t
t
⎯
V
V
= 15 V, I = 3.0 A,
on
DD
GS
D
ns
V
= 0 to 4.5 V, R = 10 Ω
Turn-off time
9
⎯
G
off
Drain-source forward voltage
Note 3: Pulse test
V
I
= -6.0 A, V = 0 V
GS
(Note 3)
-0.85
-1.2
DSF
D
Switching Time Test Circuit
(a) Test Circuit
(b) V
(c) V
IN
4.5V
90%
V
= 15 V
DD
= 10 Ω
4.5 V
0
OUT
R
G
10%
IN
0 V
Duty ≤ 1%
: t , t < 5 ns
V
IN
r f
V
DD
Common Source
90%
10%
10 μs
OUT
Ta = 25°C
V
DD
V
DS (ON)
t
t
f
r
t
t
off
on
Usage Considerations
Let V be the voltage applied between gate and source that causes the drain current (I ) to below (0.1 mA for the
th
D
SSM3K333R). Then, for normal switching operation, V
must be higher than V and V
must be lower than
GS(off)
GS(on)
th,
V
th.
This relationship can be expressed as: V < V < V
GS(off) th GS(on).
Take this into consideration when using the device.
Handling Precaution
When handling individual devices that are not yet mounted on a circuit board, make sure that the environment is
protected against electrostatic discharge. Operators should wear antistatic clothing, and containers and other objects that
come into direct contact with devices should be made of antistatic materials.
Thermal resistance R
and Power dissipation P vary depending on board material, board area, board thickness
D
th (ch-a)
and pad area. When using this device, please take heat dissipation into consideration.
2
2014-03-01
SSM3K333R
I
– V
GS
I
– V
D
D
DS
12
10
8
100
10
10 V
Common Source
= 10 V
V
= 4.0 V
GS
V
DS
Pulse test
4.5 V
1
6
0.1
0.01
Ta = 100 °C
4
2
0
25 °C
− 25 °C
0.001
Common Source
Ta = 25 °C
Pulse test
0.0001
0
0.4
0.6
0.8
1.0
0.2
3.0
1.0
2.0
4.0
Drain–source voltage
V
(V)
Gate–source voltage
V
(V)
DS
GS
R
– V
R
– I
DS (ON)
GS
DS (ON) D
100
100
50
0
I
=3.0A
Common Source
Ta = 25°C
D
Common Source
Pulse test
Pulse test
50
25 °C
4.5 V
Ta = 100 °C
V
= 10 V
GS
− 25 °C
0
0
20
10
0
2
4
12
6
8
10
Gate–source voltage
V
(V)
Drain current
I
(A)
GS
D
R
– Ta
DS (ON)
V
– Ta
th
2.5
100
50
0
Common Source
= 10V
Common Source
Pulse test
V
DS
I
= 0.1 mA
D
2.0
1.5
1.0
3.0 A / 4.5 V
0.5
0
I
= 5.0 A / V
= 10 V
GS
D
0
50
100
150
−50
0
50
100
150
−50
Ambient temperature Ta (°C)
Ambient temperature Ta (°C)
3
2014-03-01
SSM3K333R
I
– V
DR
DS
C – V
DS
100
10
1000
Common Source
= 0 V
Pulse test
D
V
GS
C
iss
300
100
I
G
DR
1
S
−25 °C
0.1
C
oss
100 °C
30
10
25 °C
Common Source
Ta = 25 °C
0.01
0.001
C
rss
f = 1 MHz
V
= 0 V
GS
0.1
1
10
100
0
-0.2
-0.4
-0.6
-0.8
-1.0
-1.2
Drain–source voltage
V
(V)
Drain–source voltage
V
(V)
DS
DS
Dynamic Input Characteristic
t – I
D
10
8
Common Source
= 6.0A
1000
100
Common Source
I
D
V
V
= 15 V
DD
GS
Ta = 25°C
t
f
off
= 0 to 4.5 V
Ta = 25 °C
R
G
= 10 Ω
t
6
4
V
=24 V
DD
V
=15 V
DD
t
on
10
2
0
t
r
1
0.01
0.1
1
10
100
10
0
4
6
8
2
Drain current
I
(A)
D
Total Gate Charge Qg (nC)
R
th
– t
w
P
– Ta
D
1000
100
10
1600
1200
a: Mounted on FR4 board
(25.4mm × 25.4mm × 1.6 mm , Cu Pad : 645 mm2)
b: Mounted on FR4 board
(25.4mm × 25.4mm × 1.6 mm , Cu Pad : 0.72 mm2 ×3)
b
a
a
800
400
b
Single pulse
a. Mounted on FR4 board
(25.4 mm × 25.4 mm × 1.6 mm, Cu Pad: 645 mm2)
b. Mounted on FR4 board
(25.4 mm × 25.4 mm × 1.6 mm, Cu Pad: 0.72 mm2×3)
0
1
-40 -20
0
20
40
60
80 100 120 140 160
0.001
0.01
0.1
1
10
100
1000
Ambient temperature Ta (°C)
Pulse width tw (s)
4
2014-03-01
SSM3K333R
RESTRICTIONS ON PRODUCT USE
•
•
•
Toshiba Corporation, and its subsidiaries and affiliates (collectively "TOSHIBA"), reserve the right to make changes to the information
in this document, and related hardware, software and systems (collectively "Product") without notice.
This document and any information herein may not be reproduced without prior written permission from TOSHIBA. Even with
TOSHIBA's written permission, reproduction is permissible only if reproduction is without alteration/omission.
Though TOSHIBA works continually to improve Product's quality and reliability, Product can malfunction or fail. Customers are
responsible for complying with safety standards and for providing adequate designs and safeguards for their hardware, software and
systems which minimize risk and avoid situations in which a malfunction or failure of Product could cause loss of human life, bodily
injury or damage to property, including data loss or corruption. Before customers use the Product, create designs including the
Product, or incorporate the Product into their own applications, customers must also refer to and comply with (a) the latest versions of
all relevant TOSHIBA information, including without limitation, this document, the specifications, the data sheets and application notes
for Product and the precautions and conditions set forth in the "TOSHIBA Semiconductor Reliability Handbook" and (b) the
instructions for the application with which the Product will be used with or for. Customers are solely responsible for all aspects of their
own product design or applications, including but not limited to (a) determining the appropriateness of the use of this Product in such
design or applications; (b) evaluating and determining the applicability of any information contained in this document, or in charts,
diagrams, programs, algorithms, sample application circuits, or any other referenced documents; and (c) validating all operating
parameters for such designs and applications. TOSHIBA ASSUMES NO LIABILITY FOR CUSTOMERS' PRODUCT DESIGN OR
APPLICATIONS.
•
PRODUCT IS NEITHER INTENDED NOR WARRANTED FOR USE IN EQUIPMENTS OR SYSTEMS THAT REQUIRE
EXTRAORDINARILY HIGH LEVELS OF QUALITY AND/OR RELIABILITY, AND/OR A MALFUNCTION OR FAILURE OF WHICH
MAY CAUSE LOSS OF HUMAN LIFE, BODILY INJURY, SERIOUS PROPERTY DAMAGE AND/OR SERIOUS PUBLIC IMPACT
("UNINTENDED USE"). Except for specific applications as expressly stated in this document, Unintended Use includes, without
limitation, equipment used in nuclear facilities, equipment used in the aerospace industry, medical equipment, equipment used for
automobiles, trains, ships and other transportation, traffic signaling equipment, equipment used to control combustions or explosions,
safety devices, elevators and escalators, devices related to electric power, and equipment used in finance-related fields. IF YOU USE
PRODUCT FOR UNINTENDED USE, TOSHIBA ASSUMES NO LIABILITY FOR PRODUCT. For details, please contact your
TOSHIBA sales representative.
•
•
Do not disassemble, analyze, reverse-engineer, alter, modify, translate or copy Product, whether in whole or in part.
Product shall not be used for or incorporated into any products or systems whose manufacture, use, or sale is prohibited under any
applicable laws or regulations.
•
•
The information contained herein is presented only as guidance for Product use. No responsibility is assumed by TOSHIBA for any
infringement of patents or any other intellectual property rights of third parties that may result from the use of Product. No license to
any intellectual property right is granted by this document, whether express or implied, by estoppel or otherwise.
ABSENT A WRITTEN SIGNED AGREEMENT, EXCEPT AS PROVIDED IN THE RELEVANT TERMS AND CONDITIONS OF SALE
FOR PRODUCT, AND TO THE MAXIMUM EXTENT ALLOWABLE BY LAW, TOSHIBA (1) ASSUMES NO LIABILITY
WHATSOEVER, INCLUDING WITHOUT LIMITATION, INDIRECT, CONSEQUENTIAL, SPECIAL, OR INCIDENTAL DAMAGES OR
LOSS, INCLUDING WITHOUT LIMITATION, LOSS OF PROFITS, LOSS OF OPPORTUNITIES, BUSINESS INTERRUPTION AND
LOSS OF DATA, AND (2) DISCLAIMS ANY AND ALL EXPRESS OR IMPLIED WARRANTIES AND CONDITIONS RELATED TO
SALE, USE OF PRODUCT, OR INFORMATION, INCLUDING WARRANTIES OR CONDITIONS OF MERCHANTABILITY, FITNESS
FOR A PARTICULAR PURPOSE, ACCURACY OF INFORMATION, OR NONINFRINGEMENT.
•
•
Do not use or otherwise make available Product or related software or technology for any military purposes, including without
limitation, for the design, development, use, stockpiling or manufacturing of nuclear, chemical, or biological weapons or missile
technology products (mass destruction weapons). Product and related software and technology may be controlled under the
applicable export laws and regulations including, without limitation, the Japanese Foreign Exchange and Foreign Trade Law and the
U.S. Export Administration Regulations. Export and re-export of Product or related software or technology are strictly prohibited
except in compliance with all applicable export laws and regulations.
Please contact your TOSHIBA sales representative for details as to environmental matters such as the RoHS compatibility of Product.
Please use Product in compliance with all applicable laws and regulations that regulate the inclusion or use of controlled substances,
including without limitation, the EU RoHS Directive. TOSHIBA ASSUMES NO LIABILITY FOR DAMAGES OR LOSSES
OCCURRING AS A RESULT OF NONCOMPLIANCE WITH APPLICABLE LAWS AND REGULATIONS.
5
2014-03-01
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