TB2906HQ [TOSHIBA]
Maximum Power 43 W BTL x 4-ch Audio Power IC; 最大功率43 W¯¯ BTL ×4通道音频功率IC
| 型号： | TB2906HQ |
| 厂家： | 
TOSHIBA |
| 描述： | Maximum Power 43 W BTL x 4-ch Audio Power IC |
| 文件： | 总16页 (文件大小：282K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
TB2906HQ
TOSHIBA Bi-CMOS Digital Integrated Circuit Silicon Monolithic
TB2906HQ
Maximum Power 43 W BTL × 4-ch Audio Power IC
The TB2906HQ is 4-ch BTL audio amplifier for car audio
applications.
This IC can generate higher power: P
MAX = 43 W as it
OUT
includes the pure complementary P-ch and N-ch DMOS output
stage.
It is designed to yield low distortion ratio for 4-ch BTL audio
power amplifier, built-in standby function, muting function, and
various kinds of protectors.
Additionally, Off-set detector is built in.
Weight: 7.7 g (typ.)
Features
•
High power output
MAX (1) = 43 W (typ.)
:
:
:
:
P
OUT
P (V
= 14.4 V, f = 1 kHz, JEITA max, R = 4 Ω)
L
CC
P
OUT
MAX (2) = 39 W (typ.)
(V
CC
= 13.7 V, f = 1 kHz, JEITA max, R = 4 Ω)
L
P
OUT
(1) = 26 W (typ.)
(V
CC
= 14.4 V, f = 1 kHz, THD = 10%, R = 4 Ω)
L
P
OUT
(2) = 23 W (typ.)
(V
CC
= 13.2 V, f = 1 kHz, THD = 10%, R = 4 Ω)
L
•
•
Low distortion ratio: THD = 0.015% (typ.)
(V = 13.2 V, f = 1 kHz, P
= 5 W, R = 4 Ω)
CC
OUT
L
Low noise: V
= 180 µVrms (typ.)
NO
(V
CC
= 13.2 V, Rg = 0 Ω, BW = 20 Hz to 20 kHz, R = 4 Ω)
L
•
•
•
•
Built-in standby switch function (pin 4)
Built-in muting function (pin 22)
Built-in Off-set detection function (pin 25)
Built-in various protection circuits:
Thermal shut down, overvoltage, out to GND, out to V , out to out short
CC
•
Operating supply voltage: V (opr) = 9 to 18 V (R = 4 Ω)
CC L
Note 1: Since this device’s pins have a low withstanding voltage, please handle it with care.
Note 2: Install the product correctly. Otherwise, it may result in break down, damage and/or degradation to the
product or equipment.
Note 3: These protection functions are intended to avoid some output short circuits or other abnormal conditions
temporarily. These protect functions do not warrant to prevent the IC from being damaged.
In case of the product would be operated with exceeded guaranteed operating ranges, these protection
features may not operate and some output short circuits may result in the IC being damaged.
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TB2906HQ
Block Diagram
1
20
6
TAB
V
V
CC2
CC1
OUT1 (+)
9
8
7
IN1
IN2
11
12
PW-GND1
R
R
L
C
C
1
OUT1 (−)
OUT2 (+)
5
2
3
PW-GND2
L
1
OUT2 (−)
AC-GND
IN3
16
15
C
C
6
OUT3 (+)
17
18
19
PW-GND3
R
R
L
1
OUT3 (−)
OUT4 (+)
21
24
23
IN4
14
13
PW-GND4
L
C
1
OUT4 (−)
PRE-GND
OFF-SET
DET
RIP
10
STBY
MUTE
22
5 V
4
25
PLAY
R
1
MUTE
: PRE-GND
: PW-GND
Note:
Some of the functional blocks, circuits, or constants in the block diagram may be omitted or simplified for
explanatory purpose.
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Caution and Application Method (Description is made only on the single channel)
1. Voltage Gain Adjustment
This IC has no NF (negative feedback) Pins. Therefore, the voltage gain can not be adjusted, but it makes
the device a space and total costs saver.
Amp. 2A
Amp. 1
Input
Amp. 2B
Figure 1 Block Diagram
The voltage gain of amp.1
: G = 8dB
V1
The voltage gain of amp.2A, B
: G = 20dB
V2
The voltage gain of BTL connection: G
= 6dB
V (BTL)
Therefore, the total voltage gain is decided by expression below.
= G + G + G = 8 + 20 + 6 = 34dB
G
V
V1
V2
V (BTL)
2. Standby SW Function (pin 4)
By means of controlling pin 4 (standby pin) to
High and Low, the power supply can be set to ON
and OFF. The threshold voltage of pin 4 is set at
V
CC
about 3 V
about 2 µA (typ.) in the standby state.
(typ.), and the power supply current is
BE
ON
Power
10 kΩ
4
≈ 2 V
BE
OFF
to BIAS
CUTTING CIRCUIT
Control Voltage of Pin 4: V
SB
Stand-by
Power
V
(V)
SB
ON
OFF
ON
0 to 1.5
OFF
3.5 to 6 V
Figure 2 With pin 4 set to High,
Power is turned ON
When changing the time constant of pin 4, check the
pop noise.
Advantage of Standby SW
(1) Since V
CC
can directly be controlled to ON or OFF by the microcomputer, the switching relay can be
omitted.
(2) Since the control current is microscopic, the switching relay of small current capacity is satisfactory
for switching.
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Relay
Large current capacity switch
Battery
Battery
From
microcomputer
V
V
CC
CC
– Conventional Method –
From microcomputer
Small current capacity switch
Battery
Battery
Stand-By
V
Stand-By V
CC
CC
– Standby Switch Method –
Figure 3
3. Muting Function (pin 22)
Audio muting function is enabled when pin 22 is Low. When the time constant of the muting function is
determined by R and C it should take into account the pop noise. The pop noise, which is generated when
,
1
4
the power or muting function is turned ON/OFF, will vary according to the time constant. (Refer to Figure 4
and Figure 5.)
The pin 22 is designed to operate off 5 V so that the outside pull-up resistor R is determined on the basic
1
of this value:
ex) When control voltage is changed in to 6 V from 5 V.
6 V/5 V × 47 k = 56 k
Additionally, as the V
is rapidly falling, the IC internal low voltage muting operates to eliminate the
CC
large pop noise basically.
The low voltage muting circuit pull 200 µA current into the IC so that the effect of the internal low
voltage muting does not become enough if the R is too small value.
1
To obtain enough operation of the internal low voltage muting, a series resistor, R at pin 22 should be
1
47 kΩ or more.
ATT – V
MUTE
20
0
V
= 13.2 V
CC
f = 1 kHz
= 4 Ω
R
L
V
= 7.75 Vrms
out
(20dBm)
−20
−40
−60
5 V
1 kΩ
22
−80
−100
−120
R
1
C
4
Mute ON/OFF
control
0
0.5
1
1.5
2
2.5
3
3.5
Pin 22 control voltage
V
(V)
MUTE
Figure 4 Muting Function
Figure 5 Mute Attenuation − V
(V)
MUTE
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4. Off-set detection function
In case of Appearing output offset voltage by Generating a Large Leakage Current on the input
Capacitor etc.
V
DC Voltage (+) Amp (at leak) (R
)
S1
V
(normal DC voltage)
CC/2
Leak or short
V
ref
DC Voltage (−) Amp (at short) (R
)
S2
+
−
R
S1
Offset voltage (at leak or short)
Elec. vol
5 V
V
V
bias
ref/2
25
L.P.F.
To CPU
A
B
Figure 6 Application and Detection Mechanism
Threshold level (R
)
)
S1
(+) Amp output
V
CC/2
Threshold level (R
S2
GND
t
t
t
Voltage of
point (A)
GND
Voltage of
point (B)
GND
R
S2
Figure 7 Wave Form
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5. Prevention of speaker burning accident (in case of rare short circuit of speaker)
When the direct current resistance between OUT+ and OUT− terminal becomes 1 Ω or less and output
current over 4 A flows, this IC makes a protection circuit operate and suppresses the current into a speaker.
This system makes the burning accident of the speaker prevent as below mechanism.
<The guess mechanism of a burning accident of the speaker>
Abnormal output offset voltage (voltage between OUT+ and OUT−) over 4 V is made by the external
circuit failure.(Note 1)
↓
The speaker imepedance becomes 1 Ω or less as it is in a rare short circuit condition.
↓
The current more than 4 A flows into the speaker and the speaker is burned.
Current into a speaker
Operating point of protector
Less than 4A
Speaker Impedance
About 1 Ω
4 Ω
Figure 8
Note 1: It is appeared by biased input DC voltage
(For example, large leakage of the input capacitor, short-circuit between copper patterns of PCB.)
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TB2906HQ
6. Pop Noise Suppression
Since the AC-GND pin (pin 16) is used as the NF pin for all amps, the ratio between the input
capacitance (C1) and the AC-to-GND capacitance (C6) should be 1:4.
Also, if the power is turned OFF before the C1 and C6 batteries have been completely charged, pop noise
will be generated because of the DC input unbalance.
To counteract the noise, it is recommended that a longer charging time be used for C2 as well as for C1
and C6. Note that the time which audio output takes to start will be longer, since the C2 makes the muting
time (the time from when the power is turned ON to when audio output starts) is fix.
The pop noise which is generated when the muting function is turned ON/OFF will vary according to the
time constant of C4.
The greater the capacitance, the lower the pop noise. Note that the time from when the mute control
signal is applied to C4 to when the muting function is turned ON/OFF will be longer.
7. External Component Constants
Effect
Component Recommended
Purpose
Notes
Lower than recommended
value
Higher than recommended
value
Name
Value
Pop noise is
Cut-off frequency is
increased
C1
C2
C3
0.22 µF
10 µF
To eliminate DC
To reduce ripple
Cut-off frequency is reduced generated when
is ON
V
CC
Powering ON/OFF takes
longer
Powering ON/OFF is faster
To provide
sufficient
0.1 µF
Reduces noise and provides sufficient oscillation margin
oscillation margin
High pop noise. Duration until Low pop noise. Duration until
To reduce pop
noise
C4
C5
C6
1 µF
3900 µF
1 µF
muting function is turned
ON/OFF is short
muting function is turned
ON/OFF is long
Ripple filter
Power supply ripple filtering
Pop noise is
generated when
NF for all outputs Pop noise is suppressed when C1:C6 = 1:4
V
is ON
CC
Note:
If recommended value is not used.
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Maximum Ratings (Ta = 25°C)
Characteristics
Symbol
Rating
Unit
Peak supply voltage (0.2 s)
DC supply voltage
V
50
V
V
CC (surge)
V
28
18
CC (DC)
CC (opr)
O (peak)
Operation supply voltage
Output current (peak)
Power dissipation
V
V
I
9
A
P
(Note 2)
125
W
°C
°C
D
Operation temperature
Storage temperature
T
opr
−40 to 85
−55 to 150
T
stg
Note 2: Package thermal resistance θ = 1°C/W (typ.) (Ta = 25°C, with infinite heat sink)
j-T
The absolute maximum ratings of a semiconductor device are a set of specified parameter values, which must not
be exceeded during operation, even for an instant. If any of these rating would be exceeded during operation, the
device electrical characteristics may be irreparably altered and the reliability and lifetime of the device can no
longer be guaranteed. Moreover, these operations with exceeded ratings may cause break down, damage and/or
degradation to any other equipment. Applications using the device should be designed such that each maximum
rating will never be exceeded in any operating conditions. Before using, creating and/or producing designs, refer to
and comply with the precautions and conditions set forth in this documents.
Electrical Characteristics
(unless otherwise specified, V = 13.2 V, f = 1 kHz, R = 4 Ω, Ta = 25°C)
CC
L
Test
Circuit
Characteristics
Quiescent current
Symbol
Test Condition
Min
Typ.
Max
Unit
mA
I
V
V
V
V
= 0
170
43
340
CCQ
IN
P
P
MAX (1)
MAX (2)
= 14.4 V, max POWER
= 13.7 V, max POWER
= 14.4 V, THD = 10%
OUT
OUT
CC
CC
CC
39
Output power
W
P
P
(1)
(2)
26
OUT
OUT
THD = 10%
21
23
Total harmonic distortion
Voltage gain
THD
P
V
V
= 5 W
0.015
34
0.15
36
%
OUT
OUT
OUT
G
V
= 0.775 Vrms
= 0.775 Vrms
32
−1.0
dB
dB
Voltage gain ratio
∆G
0
1.0
V
V
(1)
Rg = 0 Ω, DIN45405
160
180
NO
NO
Output noise voltage
µVrms
V
(2)
Rg = 0 Ω, BW = 20 Hz~20 kHz
300
f
V
= 100 Hz, R = 620 Ω
g
rip
Ripple rejection ratio
Cross talk
R.R.
C.T.
40
50
60
dB
dB
= 0.775 Vrms
rip
R
V
= 620 Ω
g
= 0.775 Vrms
OUT
Output offset voltage
Input resistance
V
(−150)
0
(150)
mV
kΩ
µA
OFFSET
R
30
2
IN
Standby current
I
Standby condition
POWER: ON
POWER: OFF
MUTE: OFF
10
SB
V
H
L
3.5
0
6.0
1.5
6.0
0.5
SB
Standby control voltage
V
V
SB
V
H
3.0
0
M
Mute control voltage
Mute attenuation
V
V
L
MUTE: ON, R = 47 kΩ
M
1
MUTE: ON
ATT M
85
100
dB
V
= 7.75 Vrms→Mute: OFF
OUT
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Offset detection
Rpull-up = 47 kΩ, +V = 5.0V
Based on output DC voltage
Detection threshold voltage
Voff-set
±1.0
±1.5
±2.0
V
Test Circuit
1
20
6
TAB
V
V
CC2
CC1
OUT1 (+)
9
0.22 µF
IN1
IN2
11
12
PW-GND1
R
R
8
7
L
C
1
OUT1 (−)
OUT2 (+)
5
2
3
0.22 µF
PW-GND2
L
C
1
OUT2 (−)
1 µF
AC-GND
IN3
16
15
C
6
OUT3 (+)
17
18
19
0.22 µF
PW-GND3
R
R
L
C
1
OUT3 (−)
OUT4 (+)
21
24
23
0.22 µF
IN4
14
13
PW-GND4
L
C
1
OUT4 (−)
PRE-GND
OFF-SET
DET
RIP
10
STBY
MUTE
22
5 V
4
25
47 kΩ
PLAY
R
1
MUTE
: PRE-GND
: PW-GND
Components in the test circuits are only used to obtain and confirm the device characteristics.
These components and circuits do not warrant to prevent the application equipment from malfunction or failure.
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THD – P
(ch1)
THD – P
(ch2)
OUT
OUT
100
100
V
= 13.2 V
V
= 13.2 V
CC
CC
R = 4 Ω
L
50
30
50
30
R
= 4 Ω
L
Filter
Filter
100 Hz : ~30 kHz
100 Hz : ~30 kHz
1kHz : 400 Hz~30 kHz
10 kHz : 400 Hz~
20 kHz : 400 Hz~
1kHz : 400 Hz~30 kHz
10 kHz : 400 Hz~
20 kHz : 400 Hz~
10
10
5
3
5
3
1
1
0.5
0.3
20 kHz
10 kHz
0.5
0.3
20 kHz
10 kHz
0.1
0.1
1 kHz
1 kHz
0.05
0.03
0.05
0.03
f = 100 Hz
f = 100 Hz
0.01
0.01
0.005
0.003
0.005
0.003
0.001
0.001
0.1
0.3 0.5
1
3
5
10
30 50 100
0.1
0.3 0.5
1
3
5
10
30 50 100
Output power
P
(W)
Output power
P
(W)
OUT
OUT
THD – P
(ch3)
THD – P
(ch4)
OUT
OUT
100
100
V
= 13.2 V
V
= 13.2 V
CC
CC
R = 4 Ω
L
50
30
50
30
R
= 4 Ω
L
Filter
Filter
100 Hz : ~30 kHz
100 Hz : ~30 kHz
1kHz : 400 Hz~30 kHz
10 kHz : 400 Hz~
20 kHz : 400 Hz~
1kHz : 400 Hz~30 kHz
10 kHz : 400 Hz~
20 kHz : 400 Hz~
10
10
5
3
5
3
1
1
0.5
0.3
0.5
0.3
20 kHz
20 kHz
10 kHz
10 kHz
0.1
0.1
1 kHz
0.05
0.03
0.05
0.03
1 kHz
f = 100 Hz
0.01
0.01
f = 100 Hz
0.005
0.003
0.005
0.003
0.001
0.001
0.1
0.3 0.5
1
3
5
10
30 50 100
0.1
0.3 0.5
1
3
5
10
30 50 100
Output power
P
(W)
Output power
P
(W)
OUT
OUT
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THD – P
(ch1)
THD – P
(ch2)
OUT
OUT
100
100
V
= 13.2 V
V
= 13.2 V
CC
CC
R = 4 Ω
L
50
30
50
30
R
= 4 Ω
L
13.2 V
13.2 V
f = 1 kHz
f = 1 kHz
Filter
Filter
400 Hz~30 kHz
400 Hz~30 kHz
10
10
5
3
5
3
1
1
0.5
0.3
0.5
0.3
V
= 9.0 V
16.0 V
V
= 9.0 V
CC
16.0 V
CC
0.1
0.1
0.05
0.03
0.05
0.03
0.01
0.01
0.005
0.003
0.005
0.003
0.001
0.001
0.1
0.3 0.5
1
3
5
10
30 50 100
0.1
0.3 0.5
1
3
5
10
30 50 100
Output power
P
(W)
Output power
P
(W)
OUT
OUT
THD – P
(ch3)
THD – P
(ch4)
OUT
OUT
100
100
V
= 13.2 V
V
= 13.2 V
CC
CC
R = 4 Ω
L
50
30
50
30
R
= 4 Ω
L
13.2 V
13.2 V
f = 1 kHz
f = 1 kHz
Filter
Filter
400 Hz~30 kHz
400 Hz~30 kHz
10
10
5
3
5
3
1
1
0.5
0.3
0.5
0.3
V
= 9.0 V
16.0 V
V
= 9.0 V
CC
16.0 V
CC
0.1
0.1
0.05
0.03
0.05
0.03
0.01
0.01
0.005
0.003
0.005
0.003
0.001
0.001
0.1
0.3 0.5
1
3
5
10
30 50 100
0.1
0.3 0.5
1
3
5
10
30 50 100
Output power
P
(W)
Output power
P
(W)
OUT
OUT
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R.R. – f
muteATT – f
0
−20
0
−20
−40
−60
−80
V
= 13.2 V
V
= 13.2 V
CC
CC
R = 4 Ω
L
R
= 4 Ω
L
V
= 7.75 Vrms (20dBm)
Vrip = 0.775 Vrms (0dBm)
OUT
−40
−60
2ch
1ch
3ch
−80
4ch
−100
−120
1 ch ~4ch
10
100
1 k
10 k
0.01
0.1
1
10
100 k
100
frequency
f
(Hz)
frequency
f
(Hz)
THD – f
G
V
– f
40
30
20
10
0
30
10
V
= 13.2 V
CC
R
= 4 Ω
L
P
= 5 W
OUT
No filter
3
1 ch ~4ch
1
0.3
0.1
0.03
0.01
2ch
3ch
4ch
V
= 13.2 V
CC
R
= 4 Ω
L
1ch
V
= 0.775 Vrms (0dBm)
OUT
0.01
0.1
1
10
100
0.01
0.1
1
10
100
frequency
f
(Hz)
frequency
f
(Hz)
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V
– P
(ch1)
V
– P
(ch2)
OUT
IN
OUT
IN
40
30
20
10
0
40
30
20
10
0
100 Hz
100 Hz
1 kHz
1 kHz
10 kHz
10 kHz
f = 20 kHz
f = 20 kHz
V
= 13.2 V
V
= 13.2 V
CC
R = 4 Ω
L
CC
R
L
= 4 Ω
No filter
No filter
0
2
4
6
8
10
10
25
0
2
4
6
8
10
Input voltage
V
IN
(Vrms)
Input voltage
V
IN
(Vrms)
V
– P
(ch3)
V
– P
(ch4)
OUT
IN
OUT
IN
40
30
20
10
0
40
30
20
10
0
100 Hz
1 kHz
100 Hz
1 kHz
10 kHz
10 kHz
f = 20 kHz
f = 20 kHz
V
R
= 13.2 V
V
= 13.2 V
CC
CC
= 4 Ω
R
= 4 Ω
L
L
No filter
No filter
0
2
4
6
8
0
2
4
6
8
10
Input voltage
V
IN
(Vrms)
Input voltage
V
IN
(Vrms)
I
– V
P MAX – Ta
D
CCQ
CC
2000
160
120
80
120
100
80
60
40
20
0
(1) INFINITE HEAT SINK
R
= ∞
L
RθJC = 1°C/W
V
= 0 V
IN
(2) HEAT SINK (RθHS = 3.5°C/W
RθJC + RθHS = 4.5°C/W
(3) NO HEAT SINK
RθJA = 39°C/W
(1)
40
(2)
(3)
0
0
5
10
15
20
0
25
50
75
100
125
150
Supply voltage
V
CC
(V)
Ambient temperature Ta (°C)
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C.T. – f (ch1)
C.T. – f (ch2)
0
−20
−40
−60
−80
0
−20
−40
−60
−80
V
R
V
R
= 13.2 V
= 4 Ω
V
R
V
R
= 13.2 V
CC
CC
L
= 4 Ω
L
= 0.775 Vrms (0dBm)
= 0.775 Vrms (0dBm)
OUT
OUT
= 620 Ω
= 620 Ω
G
G
ch2
ch1
ch3
ch4
ch3
ch4
10
100
1 k
10 k
10 k
10 k
100 k
10
100
1 k
10 k
100 k
frequency
f
(Hz)
frequency
f
(Hz)
C.T. – f (ch3)
C.T. – f (ch4)
0
−20
−40
−60
−80
0
−20
−40
−60
−80
V
= 13.2 V
= 4 Ω
= 0.775 Vrms (0dBm)
= 620 Ω
V
R
V
R
= 13.2 V
CC
CC
R
= 4 Ω
L
L
V
= 0.775 Vrms (0dBm)
OUT
OUT
R
= 620 Ω
G
G
ch1
ch2
ch1
ch2
ch4
ch3
10
100
1 k
100 k
10
100
1 k
10 k
100 k
frequency
f
(Hz)
frequency
f
(Hz)
V
– R
P
– P
OUT
NO
g
D
400
80
60
40
20
0
f = 1 kHz
= 4 Ω
V
= 13.2 V
CC
R
L
18 V
R
= 4 Ω
L
4ch drive
Filter:
20 Hz~20 kHz
300
200
100
0
16 V
1ch~4ch
13.2 V
9.0 V
10
10
100
1 k
100 k
0
5
15
20
25
30
Signal source resistance
R
g
(Ω)
Output power
P
(W)
OUT
14
2004-03-23
TB2906HQ
Package Dimensions
Weight: 7.7 g (typ.)
15
2004-03-23
TB2906HQ
About solderability, following conditions were confirmed
•
Solderability
(1) Use of Sn-63Pb solder Bath
· solder bath temperature = 230°C
· dipping time = 5 seconds
· the number of times = once
· use of R-type flux
(2) Use of Sn-3.0Ag-0.5Cu solder Bath
· solder bath temperature = 245°C
· dipping time = 5 seconds
· the number of times = once
· use of R-type flux
RESTRICTIONS ON PRODUCT USE
030619EBF
• The information contained herein is subject to change without notice.
• The information contained herein is presented only as a guide for the applications of our products. No
responsibility is assumed by TOSHIBA for any infringements of patents or other rights of the third parties which
may result from its use. No license is granted by implication or otherwise under any patent or patent rights of
TOSHIBA or others.
• TOSHIBA is continually working to improve the quality and reliability of its products. Nevertheless, semiconductor
devices in general can malfunction or fail due to their inherent electrical sensitivity and vulnerability to physical
stress. It is the responsibility of the buyer, when utilizing TOSHIBA products, to comply with the standards of
safety in making a safe design for the entire system, and to avoid situations in which a malfunction or failure of
such TOSHIBA products could cause loss of human life, bodily injury or damage to property.
In developing your designs, please ensure that TOSHIBA products are used within specified operating ranges as
set forth in the most recent TOSHIBA products specifications. Also, please keep in mind the precautions and
conditions set forth in the “Handling Guide for Semiconductor Devices,” or “TOSHIBA Semiconductor Reliability
Handbook” etc..
• The TOSHIBA products listed in this document are intended for usage in general electronics applications
(computer, personal equipment, office equipment, measuring equipment, industrial robotics, domestic appliances,
etc.). These TOSHIBA products are neither intended nor warranted for usage in equipment that requires
extraordinarily high quality and/or reliability or a malfunction or failure of which may cause loss of human life or
bodily injury (“Unintended Usage”). Unintended Usage include atomic energy control instruments, airplane or
spaceship instruments, transportation instruments, traffic signal instruments, combustion control instruments,
medical instruments, all types of safety devices, etc.. Unintended Usage of TOSHIBA products listed in this
document shall be made at the customer’s own risk.
• The products described in this document are subject to the foreign exchange and foreign trade laws.
• TOSHIBA products should not be embedded to the downstream products which are prohibited to be produced
and sold, under any law and regulations.
• This product generates heat during normal operation. However, substandard performance or malfunction may
cause the product and its peripherals to reach abnormally high temperatures.
The product is often the final stage (the external output stage) of a circuit. Substandard performance or
malfunction of the destination device to which the circuit supplies output may cause damage to the circuit or to the
product.
16
2004-03-23
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