TB6569FG [TOSHIBA]
Full-Bridge DC Motor Driver IC; 全桥直流马达驱动器IC
| 型号： | TB6569FG |
| 厂家： | 
TOSHIBA |
| 描述： | Full-Bridge DC Motor Driver IC |
| 文件： | 总18页 (文件大小：281K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
TB6569FG
TOSHIBA Bi-CMOS Integrated Circuit Silicon Monolithic
TB6569FG
Full-Bridge DC Motor Driver IC
The TB6569FG is a full-bridge DC motor driver with MOS
output transistors.
The low ON-resistance MOS process and PWM control enables
driving DC motors with high thermal efficiency.
Four operating modes are selectable via IN1 and IN2: clockwise
(CW), counterclockwise (CCW), Short Brake and Stop.
Features
•
•
•
•
•
•
•
•
•
•
•
•
Power supply voltage: 50 V (max)
Output current: 4.5 A (max)
Weight: 0.5 g (typ.)
Direct PWM control
PWM constasnt-current control
CW/CCW/Short Brake/Stop modes
Overcurrent shutdown circuit (ISD)
Overcurrent detection threshold control
Overcurrent detection time control
Overvoltage shutdown circuit (VSD)
Thermal shutdown circuit (TSD)
Undervoltage lockout circuit (UVLO)
Dead time for preventing shoot-through current
Note: The following conditions apply to solderability:
About solderability, following conditions were confirmed
(1) Use of Sn-37Pb solder Bath
• solder bath temperature: 230°C
• dipping time: 5 seconds
• the number of times: once
• use of R-type flux
(2) Use of Sn-3.0Ag-0.5Cu solder Bath
• solder bath temperature: 245°C
• dipping time: 5 seconds
• the number of times: once
• use of R-type flux
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TB6569FG
Block Diagram (application circuit example)
The application circuits shown in this document are provided for reference purposes only. Thorough evaluation is
required, especially at the mass production design stage.
Toshiba does not grant any license to any industrial property rights by providing these examples of application
circuits.
VM
5 V regulator
UVLO
ALERT
VSD
TSD
ISD detection
ISD detection
OUT1
OUT2
IN1
IN2
Motor
Control
Predriver
ISD detection
ISD
ISD detection
PWM
OSC
Level
Time
0.4 V (typ.)
1/10
VREF
RSGND
OSC
SGND
VISD
TISD
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TB6569FG
Pin Functions
Pin No.
Pin Name
Functional Description
Error detection output pin
1
2
ALERT
OSC
Capacitor pin for controlling oscillation frequency for the PWM
constant-current control
3
4
5
6
7
IN1
SGND
IN2
Control signal input pin 1
Small signal ground pin
Control signal input pin 2
No-connect
N.C.
OUT1
Output pin 1
Power ground pin/
Detection resistor pin for PWM constant-current control
8
RSGND
9
N.C.
OUT2
N.C.
No-connect
10
11
12
13
14
15
16
⎯
Output pin 2
No-connect
VM
Power supply voltage pin
VISD
TISD
PWM
VREF
FIN
Resistor pin for overcurrent detection threshold control
Resistor pin for overcurrent detection time control
PWM input pin
Supply voltage pin for PWM constant-current control
Pin-fin heat sink (Note)
Note: Since the pin-fin is provided for discharging heat, the thermal design must be considered on the PCB designing.
(The fin is installed on the second surface of the chip and electrified; therefore it must be insulated or earthed to
the ground.)
Pin Assignment (top view)
16
15
14
13
12
11
10
9
VREF
PWM
TISD
VISD
FIN
VM
OUT2
N.C.
N.C.
ALERT
1
OSC
2
IN1
3
SGND
4
FIN
IN2
5
N.C.
6
OUT1
7
RSGND
8
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TB6569FG
Absolute Maximum Ratings (Note) (Ta = 25°C)
Characteristics
Power supply voltage
Symbol
VM
Rating
Unit
50
V
V
Output voltage
V
O
50 (Note 1)
4.5 (Note 2)
4.0 (Note 3)
−0.3 to 5.5
5.5
Output current 1
I
I
peak1
peak2
A
O
Output current 2
A
O
Input voltage
V
V
IN
ALERT pin output voltage
ALERT pin output current
Power dissipation
Operating temperature
Storage temperature
V
V
ALERT
ALERT
I
5
mA
W
°C
°C
P
0.89 (Note 4)
−40 to 85
−55 to 150
D
T
opr
T
stg
Note: The absolute maximum ratings of a semiconductor device are a set of ratings that must not be exceeded, even
for a moment. Do not exceed any of these ratings.
Exceeding the rating (s) may cause the device breakdown, damage or deterioration, and may result injury by
explosion or combustion.
Please use the TB6569FG within the specified operating ranges.
Note 1: OUT1, OUT2
Note 2: The absolute maximum output current rating of 4.5 A must be kept for OUT1 and OUT2 when VM ≤ 36 V.
Note 3: The absolute maximum output current rating of 4.0 A must be kept for OUT1 and OUT2 when VM >36 V.
Note 4: IC only
Operating Ranges
Characteristics
Supply voltage
Symbol
VM
Rating
Unit
10 to 45
Up to 500
V
kHz
V
opr
OSC frequency
f
osc
VREF pin input voltage
PWM frequency
Output current
VREF
opr
0 to 3.6
f
Up to 100
kHz
A
PWM
(Ave.)
I
Up to 1.5 (Note 5) (given as a guide)
O
Note 5: Ta = 25°C, the TB6569FG is mounted on the PCB (70 × 70 × 1.6 (mm), double-sided, Cu thickness: 50 μm,
Cu dimension: 67%).
*: The average output current shall be increased or decreased depending on usage conditions such as ambient
temperature and IC mounting method).
Use the average output current so that the junction temperature of 150°C (T ) and the absolute maximum output
j
current rating of 4.5 A or 4.0 A are not exceeded.
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TB6569FG
Electrical Characteristics (unless otherwise specified, Ta = 25°C, VM = 24 V)
Characteristics
Symbol
Test Condition
Min
Typ.
Max
Unit
mA
I
I
I
Stop mode
⎯
⎯
⎯
2
3
3
8
8
CC1
CC2
CC3
Power supply voltage
CW/CCW mode
Short Brake mode
3
8
V
⎯
⎯
0.4
50
⎯
⎯
5.5
0.8
⎯
75
5
INH
Input voltage
Control circuit
IN1 pin,
V
V
0
INL
IN (HYS)
Hysteresis voltage
Input current
V
⎯
⎯
⎯
−3
IN2 pin,
I
V
V
= 5 V
= 0 V
INH
IN
IN
PWM pin
μA
I
INL
VREF pin input current
I
3
μA
INVREF
Constant-current control amplifier
offset
V
RSGND = VREF
⎯
1
⎯
mV
OFFSET
PWM frequency
f
Duty: 50 %
⎯
1
100
⎯
⎯
⎯
kHz
μs
PWM
PWM minimum pulse width
Output ON resistance
f
(given as a guide only)
PWM (TW)
R
I
= 3 A
O
⎯
−2
⎯
⎯
⎯
0.55
⎯
0.9
⎯
Ω
ON (U + L)
I
VM = 50 V, V
= 0 V
L (U)
OUT
Output leakage
current
μA
OUT1 pin,
I
VM = V
= 50 V
⎯
2
L (L)
OUT
OUT2 pin
V
I
I
= 3 A
1.3
1.3
1.7
1.7
F (U)
O
O
Diode forward voltage
V
V
V
= −3 A
= 1 mA
F (L)
Output fall time
V
I
⎯
⎯
0.4
AL (LO)
AL (LE)
ALERT
voltage
ALERT pin
Output leakage
current
I
V
= 5.5 V
⎯
⎯
2
μA
ALERT
OSC charge/discharge current
I
0.3
0.5
0.7
mA
OSC
Thermal Performance Characteristics
P
– Ta
Thermal Resistance (rth) – Pulse Width (t)
D
(1) On the PCB
IC only
Input Pulse
(60 × 30 × 1.6 (mm),
Cu: more than 50%:
On the PCB
1.5
1.0
0.5
0
(60 × 30 × 1.6 (mm),
Cu: more than 50%)
R
= 89.3°C /W,
th (j-a)
Pd = 1.4 W when Ta = 25°C
(2) IC only: R = 140°C/W,
(1)
(2)
th (j-a)
= 0.89 W when Ta = 25°C.
P
D
0
25
50
75
100
125
150
Ambient Temperature Ta (°C)
Input width
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TB6569FG
I/O Equivalent Circuits
The equivalent circuit diagrams may be simplified or some parts of them may be omitted for explanatory
purposes.
Pin No.
I/O Signal
I/O Internal Circuit
10 kΩ
(typ.)
Digital input
L: 0.8 V (max)
H: 2 V (min)
IN1 (IN2)
IN1 (3)
IN2 (5)
PWM
Digital input
L: 0.8 V (max)
H: 2 V (min)
PWM (15)
VREF
Analog input
VREF (16)
Input range: 0 V to 3.6 V
RSGND
Open-drain output
ALERT
An externally attached pull-up resistor enalbes
the High output.
ALERT (1)
H (High-impedance):
Abnormal operation (When the UVLO, TSD,
VSD and/or ISD is activated)
L: Normal operation
The pin connects a capacitor for controlling the
oscillation frequency used in the PWM
constant-current control.
OSC (2)
OSC
The oscillation frequency of the oscillator is
approximated by the following formula:
3
fosc = 0.42/(Cosc [F] × 10 ) = [Hz] (typ.)
The pin connects a resistor controlling
overcurrent detection threshold.
VISD (13)
VISD
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TB6569FG
Pin No.
I/O Signal
I/O Internal Circuit
The pin connects a resistor controlling
overcurrent detection time.
TISD (14)
TISD
VM
The RSGND pin must be connected to a
resistor for detection when it is used in the
PWM constant-current control; it must be
earthed to the ground, otherwise.
OUT1 (OUT2)
OUT1 (7)
OUT2 (10)
RSGND (8)
Utmost care must be taken for designing the
pin-arrangement pattern because a large
current flows through these pins.
RSGND
0.4 V (typ.)
Functional Description
The equivalent circuit diagrams may be simplified or some parts of them may be omitted for explanatory
purposes.
Timing charts may be simplified for explanatory purposes.
1. Input/Output Functions
Input
IN2
Output
IN1
H
PWM
OUT1
OUT2
Mode
H
L
L
L
L
L
H
L
L
L
H
L
L
L
H
H
L
Short brake
H
L
CW/CCW
Short brake
CCW/CW
Short brake
L
H
L
H
L
H
L
Stop
L
OFF (Hi-Z)
(a release of TSD and/or ISD)
2. Protective Operation Alert Output (ALERT)
The ALERT pin behaves as an open-drain output and provides a high-impedance state on output being
pulled up by a resistor externally wired.
The output is Low when the TB6569FG performs a normal operation (in which state the operational mode is
selectable through the IN1 pin and IN2 pin among CW, CCW, Short Brake and Stop modes.).
In any other cases (in which state the thermal shutdown circuit (TSD), overcurrent shutdown circuit (ISD),
overvoltage shutdown circuit (VSD) and/or undervoltage lockout (UVLO) is activated), the output is High.
Driving both the IN1 pin and IN2 pin Low allows a release of the shutdown operations; the TB6569FG
resumes the normal operations.
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TB6569FG
3. Undervoltage Lockout Circuit (UVLO)
The TB6569FG incorporates an undervoltage lockout circuit. When the supply voltage drops under 8 V
(typ.), all the outputs are turned off (Hi-Z).
The UVLO circuit has a hysteresis of 0.7 V (typ.); the TB6569FG resumes the normal operation at 8.7 V
(typ.).
UVLO operation
8.7 V (typ.)
8.0 V (typ.)
VM voltage
UVLO operation
H
UVLO internal signal
L
H
ALERT output
L
H
OUT1, OUT2
L
Normal operation
Normal operation
OFF (Hi-Z)
4. Overvoltage Shutdown Circuit (VSD)
The TB6569FG incorporates an overvoltage shutdown circuit. If the supply voltage exceeds 53 V (typ.), all
the outputs are turned off (Hi-Z).
The VSD circuit has a hysteresis of 3 V (typ.); the TB6569FG resumes the normal operation at 50 V (typ.).
VSD operation
53 V (typ.)
50 V (typ.)
VM voltage
VSD operation
H
VSD internal signal
L
H
ALERT output
L
H
OUT1, OUT2
L
Normal operation
Normal operation
OFF (Hi-Z)
Note: The VSD circuit is activated if the absolute maximum voltage rating is violated. Note that the circuit is
provided as an auxiliary only and does not necessarily provide the IC with a perfect protection from any
kind of damages.
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TB6569FG
5. Thermal Shutdown Circuit (TSD)
The TB6569FG incorporates a thermal shutdown circuit. If the junction temperature (T ) exceeds 170°C
j
(typ.), all the outputs are turned off (Hi-Z).
Driving both the IN1 pin and IN2 pin Low allows a release of the shutdown operation; the TB6569FG
resumes the normal operation.
TSD = 170°C (typ.)
TSD operation
TSD operation
170°C (typ.)
Chip temperature
junction temperature (T )
j
H
Internal TSD signal
L
H
ALERT output
L
H
IN1, IN2
More than 1 μs (typ.)
L
H
OUT1, OUT2
L
Normal operation
Normal operation
OFF (Hi-Z)
Note: The TSD circuit is activated if the absolute maximum junction temperature rating (T ) of 150°C is violated.
j
Note that the circuit is provided as an auxiliary only and does not necessarily provide the IC with a perfect
protection from any kind of damages.
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TB6569FG
6. Overcurrent Shutdown Circuit (ISD)
The TB6569FG incorporates overcurrent shutdown (ISD) circuits monitoring the current that flows through
each of all the four output power transistors.
The detection time threshold is programmable through the VISD pin with a pull-up resistor. If the
overcurrent flowing through any one of the ISD circuit flows beyond the detected time threshold, all the
outputs are turned off (Hi-Z).
The detection time threshold is controllable through the external resistor of the TISD pin.
Driving both the IN1 pin and IN2 pin Low allows a release of the shutdown operations; the TB6569FG
resumes the normal operation.
•
Detection current threshold of the external resistor, R1, of the VISD pin
10 kΩ: 6.3 A (typ.)
20 kΩ: 4.2A (typ.)
30 kΩ: 3.1 A (typ.)
•
Detection time threshold of the external resistor, R2, of the TISD pin
10 kΩ: 1.6 μs (typ.)
20 kΩ: 2.8 μs (typ.)
100 kΩ: 12.4 μs (typ.)
IC
VISD pin
TISD pin
R2
R1
ISD operation
Predefined VISD value
Output current
0
T: Predefined TISD value
H
Internal ISD signal
ALERT output
L
H
L
H
IN1, IN2
More than 1 μs (typ.)
L
OUT1, OUT2
Normal operation
Normal operation
OFF (Hi-Z)
Note: The ISD circuit is activated if the absolute maximum current rating is violated. Note that the circuit is
provided as an auxiliary only and does not necessarily provide the IC with a perfect protection from
damages due to overcurrent caused by power fault, ground fault, load-short and the like.
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TB6569FG
7. Direct PWM Control
The motor rotation speed is controllable by the PWM input sent through the PWM pin.
It is also possible to control the motor rotation speed by sending in the PWM signal through not the PWM
pin but the IN1 and IN2 pins.
When the motor drive is controlled by the PWM input, the TB6569FG repeats operating in Normal
Operation mode and Short Brake mode alternately.
For preventing the shoot-through current in the output circuit caused by the upper and lower power
transistors being turned on simultaneously, the dead time is internally generated at the time the upper and
lower power transistors switches between on and off.
This eliminates the need of inserting Off time externally; thus the PWM control with synchronous
rectification is enabled.
Note that inserting Off time externally is not required on operation mode changes between CW and CCW,
and CW (CCW) and Short Brake, again, because of the dead time generated internally.
VM
VM
VM
OUT1
M
OUT1
M
OUT1
M
GND
GND
GND
PWM ON
t1
PWM ON → OFF
t2 = 200 ns (typ.)
PWM OFF
t3
VM
VM
OUT1
M
OUT1
M
GND
GND
PWM OFF → ON
t4 = 500 ns (typ.)
PWM ON
t5
VM
t5
Output voltage
waveform
(OUT1)
t1
t3
RSGND
t4
t2
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TB6569FG
8. Output Circuit
The switching characteristics of the output transistors of the OUT1 and OUT2 pins are as shown below:
Characteristic
Value
Unit
ns
t
t
650 (typ.)
450 (typ.)
90 (typ.)
pLH
pHL
t
r
t
130 (typ.)
f
PWM input
(IN1, IN2)
t
pLH
t
pHL
90%
50%
90%
50%
Output voltage
(OUT1, OUT2)
10%
10%
t
t
r
f
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TB6569FG
9. PWM Constant-Current Control
The TB6569FG uses a peak current detection technique to keep the output current constant by applying
constant voltage through the VREF pin. When running in Discharge mode, the TB6569FG powers the motor
to operate in Short Brake mode.
(1) PWM constant-current control programming
The peak current upon the constant-current operation is determined by applying voltage on the VREF
pin. The peak current value is calculated by the following equation:
I
O
= VREF/R × 1/10 [A]
The PWM current-constant frequency is also programmable by using the capacitor of the OSC pin. The
oscillation frequency is approximated by using the following equation:
fosc = 0.42/(Cosc [F] × 103) = [Hz] (typ.)
For preventing the overvoltage on connecting a detection resistor, the RSGND pin is driven High (the
outputs are turned off (Hi-Z)) when the applied voltage is over 0.4 V (typ.). The subsequent control of
the RSGND is the same as the ISD circuit. The ALERT pin is also driven High. However, when the IN1
and IN2 pins are pulled Low, the ALERT pin is pulled Low and the TB6569FG resumes the normal
operation.
It is recommended to use a detection resistor of over 0.1 Ω for the RSGND pin.
Control
VM
circuit
Control
circuit
ISD
Control
circuit
OUT1
M
OUT2
I
O
OSC
VREF
0.4 V (typ.)
1/10
Analog input voltage
RSGND
R
OSC
I
O
(2) Constant-current chopping
The TB6569FG enters Discharge mode when V
reaches the predetermined voltage (VREF/10).
RSGND
After a lapse of four internal clocks generated by the OSC signal, the TB6569FG shifts to Charge
mode.
Coil current
VREF/10
V
RSGND
OSC
Internal CLK
VREF/10
Coil current
Charge
Discharge
Discharge
V
RSGND
GND
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TB6569FG
(3) Operation on change of predetermined current value (when in Discharge mode)
The TB6569FG enters Discharge mode as V reaches the predetermined voltage (VREF/10) and
RSGND
then transits to Charge mode after four internal clocks. However, if V
> VREF/10 at the time,
RSGND
the TB6569FG goes back to Discharge mode. If V
> VREF/10 after another four internal clocks,
RSGND
then the TB6569FG enters Charge mode and stays until V
reaches VREF/10.
RSGND
OSC
Internal CLK
VREF/10
Coil current
Discharge
Discharge
Charge
Charge
GND
2.4 μs (typ.)
(4) Operation on change of predetermined current value (when in Charge mode)
Even though VREF reaches the predetermined current value, Discharge mode continues for four
internal clocks after that. And then Charge mode is entered.
OSC
Internal CLK
VREF/10
Coil current
V
RSGND
GND
Discharge
Charge
Discharge
Due to the peak current detection technique, the average current value of the constant-current
operation shall be smaller than the predetermined value. Because this depends on characteristics of
used motor coils, precise identification of the used motor coils must be performed when determining
the current value.
When both the PWM constant-current control and the direct PWM control (applying the PWM input
on the PWM pin, or on the IN1 and IN2 pins), Short Brake mode is preferentially selected.
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TB6569FG
Package Dimensions
Weight: 0.5 g (typ.)
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TB6569FG
Notes on Contents
1. Block Diagrams
Some of the functional blocks, circuits, or constants in the block diagram may be omitted or simplified for
explanatory purposes.
2. Equivalent Circuits
The equivalent circuit diagrams may be simplified or some parts of them may be omitted for explanatory
purposes.
3. Timing Charts
Timing charts may be simplified for explanatory purposes.
4. Application Circuits
The application circuits shown in this document are provided for reference purposes only. Thorough
evaluation is required, especially at the mass production design stage.
Toshiba does not grant any license to any industrial property rights by providing these examples of
application circuits.
5. Test Circuits
Components in the test circuits are used only to obtain and confirm the device characteristics. These
components and circuits are not guaranteed to prevent malfunction or failure from occurring in the
application equipment.
IC Usage Considerations
Notes on Handling of ICs
(1) The absolute maximum ratings of a semiconductor device are a set of ratings that must not be
exceeded, even for a moment. Do not exceed any of these ratings.
Exceeding the rating(s) may cause the device breakdown, damage or deterioration, and may result
injury by explosion or combustion.
(2) Use an appropriate power supply fuse to ensure that a large current does not continuously flow in case
of over current and/or IC failure. The IC will fully break down when used under conditions that exceed
its absolute maximum ratings, when the wiring is routed improperly or when an abnormal pulse noise
occurs from the wiring or load, causing a large current to continuously flow and the breakdown can
lead smoke or ignition. To minimize the effects of the flow of a large current in case of breakdown,
appropriate settings, such as fuse capacity, fusing time and insertion circuit location, are required.
(3) If your design includes an inductive load such as a motor coil, incorporate a protection circuit into the
design to prevent device malfunction or breakdown caused by the current resulting from the inrush
current at power ON or the negative current resulting from the back electromotive force at power OFF.
IC breakdown may cause injury, smoke or ignition.
Use a stable power supply with ICs with built-in protection functions. If the power supply is unstable,
the protection function may not operate, causing IC breakdown. IC breakdown may cause injury,
smoke or ignition.
(4) Do not insert devices in the wrong orientation or incorrectly.
Make sure that the positive and negative terminals of power supplies are connected properly.
Otherwise, the current or power consumption may exceed the absolute maximum rating, and
exceeding the rating(s) may cause the device breakdown, damage or deterioration, and may result
injury by explosion or combustion.
In addition, do not use any device that is applied the current with inserting in the wrong orientation or
incorrectly even just one time.
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TB6569FG
Points to Remember on Handling of ICs
(1) Over Current Protection Circuit
Over current protection circuits (referred to as current limiter circuits) do not necessarily protect ICs
under all circumstances. If the Over current protection circuits operate against the over current, clear
the over current status immediately.
Depending on the method of use and usage conditions, such as exceeding absolute maximum ratings
can cause the over current protection circuit to not operate properly or IC breakdown before operation.
In addition, depending on the method of use and usage conditions, if over current continues to flow for
a long time after operation, the IC may generate heat resulting in breakdown.
(2) Thermal Shutdown Circuit
Thermal shutdown circuits do not necessarily protect ICs under all circumstances. If the thermal
shutdown circuits operate against the over temperature, clear the heat generation status immediately.
Depending on the method of use and usage conditions, such as exceeding absolute maximum ratings
can cause the thermal shutdown circuit to not operate properly or IC breakdown before operation.
(3) Heat Radiation Design
In using an IC with large current flow such as power amp, regulator or driver, please design the device
so that heat is appropriately radiated, not to exceed the specified junction temperature (T ) at any time
j
and condition. These ICs generate heat even during normal use. An inadequate IC heat radiation
design can lead to decrease in IC life, deterioration of IC characteristics or IC breakdown. In addition,
please design the device taking into considerate the effect of IC heat radiation with peripheral
components.
(4) Back-EMF
When a motor rotates in the reverse direction, stops or slows down abruptly, a current flow
back to the motor’s power supply due to the effect of back-EMF. If the current sink capability
of the power supply is small, the device’s motor power supply and output pins might be
exposed to conditions beyond maximum ratings. To avoid this problem, take the effect of
back-EMF into consideration in system design.
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TB6569FG
RESTRICTIONS ON PRODUCT USE
•
•
•
Toshiba Corporation, and its subsidiaries and affiliates (collectively “TOSHIBA”), reserve the right to make changes to the information
in this document, and related hardware, software and systems (collectively “Product”) without notice.
This document and any information herein may not be reproduced without prior written permission from TOSHIBA. Even with
TOSHIBA’s written permission, reproduction is permissible only if reproduction is without alteration/omission.
Though TOSHIBA works continually to improve Product’s quality and reliability, Product can malfunction or fail. Customers are
responsible for complying with safety standards and for providing adequate designs and safeguards for their hardware, software and
systems which minimize risk and avoid situations in which a malfunction or failure of Product could cause loss of human life, bodily
injury or damage to property, including data loss or corruption. Before creating and producing designs and using, customers must also
refer to and comply with (a) the latest versions of all relevant TOSHIBA information, including without limitation, this document, the
specifications, the data sheets and application notes for Product and the precautions and conditions set forth in the “TOSHIBA
Semiconductor Reliability Handbook” and (b) the instructions for the application that Product will be used with or for. Customers are
solely responsible for all aspects of their own product design or applications, including but not limited to (a) determining the
appropriateness of the use of this Product in such design or applications; (b) evaluating and determining the applicability of any
information contained in this document, or in charts, diagrams, programs, algorithms, sample application circuits, or any other
referenced documents; and (c) validating all operating parameters for such designs and applications. TOSHIBA ASSUMES NO
LIABILITY FOR CUSTOMERS’ PRODUCT DESIGN OR APPLICATIONS.
•
Product is intended for use in general electronics applications (e.g., computers, personal equipment, office equipment, measuring
equipment, industrial robots and home electronics appliances) or for specific applications as expressly stated in this document.
Product is neither intended nor warranted for use in equipment or systems that require extraordinarily high levels of quality and/or
reliability and/or a malfunction or failure of which may cause loss of human life, bodily injury, serious property damage or serious public
impact (“Unintended Use”). Unintended Use includes, without limitation, equipment used in nuclear facilities, equipment used in the
aerospace industry, medical equipment, equipment used for automobiles, trains, ships and other transportation, traffic signaling
equipment, equipment used to control combustions or explosions, safety devices, elevators and escalators, devices related to electric
power, and equipment used in finance-related fields. Do not use Product for Unintended Use unless specifically permitted in this
document.
•
•
Do not disassemble, analyze, reverse-engineer, alter, modify, translate or copy Product, whether in whole or in part.
Product shall not be used for or incorporated into any products or systems whose manufacture, use, or sale is prohibited under any
applicable laws or regulations.
•
•
The information contained herein is presented only as guidance for Product use. No responsibility is assumed by TOSHIBA for any
infringement of patents or any other intellectual property rights of third parties that may result from the use of Product. No license to
any intellectual property right is granted by this document, whether express or implied, by estoppel or otherwise.
ABSENT A WRITTEN SIGNED AGREEMENT, EXCEPT AS PROVIDED IN THE RELEVANT TERMS AND CONDITIONS OF SALE
FOR PRODUCT, AND TO THE MAXIMUM EXTENT ALLOWABLE BY LAW, TOSHIBA (1) ASSUMES NO LIABILITY
WHATSOEVER, INCLUDING WITHOUT LIMITATION, INDIRECT, CONSEQUENTIAL, SPECIAL, OR INCIDENTAL DAMAGES OR
LOSS, INCLUDING WITHOUT LIMITATION, LOSS OF PROFITS, LOSS OF OPPORTUNITIES, BUSINESS INTERRUPTION AND
LOSS OF DATA, AND (2) DISCLAIMS ANY AND ALL EXPRESS OR IMPLIED WARRANTIES AND CONDITIONS RELATED TO
SALE, USE OF PRODUCT, OR INFORMATION, INCLUDING WARRANTIES OR CONDITIONS OF MERCHANTABILITY, FITNESS
FOR A PARTICULAR PURPOSE, ACCURACY OF INFORMATION, OR NONINFRINGEMENT.
• Do not use or otherwise make available Product or related software or technology for any military purposes, including without limitation,
for the design, development, use, stockpiling or manufacturing of nuclear, chemical, or biological weapons or missile technology
products (mass destruction weapons). Product and related software and technology may be controlled under the Japanese Foreign
Exchange and Foreign Trade Law and the U.S. Export Administration Regulations. Export and re-export of Product or related software
or technology are strictly prohibited except in compliance with all applicable export laws and regulations.
•
Please contact your TOSHIBA sales representative for details as to environmental matters such as the RoHS compatibility of Product.
Please use Product in compliance with all applicable laws and regulations that regulate the inclusion or use of controlled substances,
including without limitation, the EU RoHS Directive. TOSHIBA assumes no liability for damages or losses occurring as a result of
noncompliance with applicable laws and regulations.
18
2009-08-21
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