TB6571FG [TOSHIBA]

IC BRUSHLESS DC MOTOR CONTROLLER, 20 A, PQFP52, 10 X 10 MM, 0.65 MM PITCH, ROHS COMPLIANT, PLASTIC, QFP-52, Motion Control Electronics;
TB6571FG
型号: TB6571FG
厂家: TOSHIBA    TOSHIBA
描述:

IC BRUSHLESS DC MOTOR CONTROLLER, 20 A, PQFP52, 10 X 10 MM, 0.65 MM PITCH, ROHS COMPLIANT, PLASTIC, QFP-52, Motion Control Electronics

电动机控制 信息通信管理
文件: 总23页 (文件大小:216K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
TB6571FG  
TOSHIBA Bi-CMOS Integrated Circuit Silicon Monolithic  
TB6571FG  
3-Phase Full-Wave Brushless Motor Controller  
Featuring Speed Control and Sine Wave PWM Drive  
The TB6571FG is a 3-phase full-wave brushless motor  
controller IC that employs a sine wave PWM drive mechanism  
with a speed control function.  
Sine wave current driving with 2-phase modulation enables the  
IC to drive a motor with high efficiency and low noise.  
It also incorporates a speed control circuit that can vary the  
motor speed using to an external clock.  
Features  
Weight: 0.50 g (typ.)  
Sine wave PWM drive  
2-phase modulation with low switching loss  
Triangular wave generator  
Dead time function  
Speed control function  
External clock input  
Speed discrimination + PLL speed control circuit  
Ready circuit output  
FG amplifier  
Automatic lead angle correction  
Forward/stop/reverse/brake functions  
Current limiter  
Lock protection  
TB6571FG:  
TB6571FG is a Pb-free product.  
The following conditions apply to solderability:  
*Solderability  
1. Use of Sn-63Pb solder bath  
*solder bath temperature = 230°C  
*dipping time = 5 seconds  
*number of times = once  
*use of R-type flux  
2. Use of Sn-3.0Ag-0.5Cu solder bath  
*solder bath temperature=245°C  
*dipping time = 5 seconds  
*the number of times = once  
*use of R-type flux  
z
This product has a MOS structure and is sensitive to electrostatic discharge. When handling the product,  
ensure that the environment is protected against electrostatic discharge by using an earth strap, a  
conductive mat and an ionizer. Ensure also that the ambient temperature and relative humidity are  
maintained at reasonable levels.  
Install the product correctly. Otherwise, breakdown, damage and/or degradation in the product or  
equipment may result.  
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2005-04-15  
TB6571FG  
Block Diagram  
Some of the functional blocks, circuits, or constants in the block diagram may be omitted or simplified for explanatory purpose.  
R21  
R23  
R22  
C18  
C16  
C14  
C19  
R20  
R19  
36  
C13  
VCO  
C12  
C17  
L3  
28  
L2  
L1  
26  
Fref  
S-GND  
C15  
24 V  
LP1  
Td1  
23  
VCC  
Td2  
15  
VDD  
27  
20  
22  
25  
24  
30  
Vref2  
Phase comparator  
VCO  
LPF  
5 V  
31  
8 V  
C11  
Idc  
CP1  
33  
1/N frequency  
divider  
Triangular wave  
generator  
Automatic  
lead angle  
correction  
Internal  
reference clock  
C10  
Charge  
pump  
24 V  
6 bits (fx/252)  
34  
35  
CP2  
CP3  
C9  
R1  
HA+  
HA−  
A/D 5 bits  
Counter  
3
4
R18  
LA(U1)  
LA(U2)  
LB(U1)  
LB(U2)  
Position  
estimation  
39  
40  
44  
45  
49  
50  
Output  
Data  
HB+  
HB−  
R17  
R16  
5
6
waveform  
selector  
Predriver  
Nch  
Dead  
time  
LC(U1)  
LC(U2)  
M
+
120/180  
switching  
&
HC+  
HC−  
7
8
setting  
Nch  
Frequency  
divider  
R15  
R14  
R13  
LA(L1)  
LA(L2)  
LB(L1)  
LB(L2)  
43  
42  
48  
47  
1
R2  
gate  
PWM  
Speed  
discriminator  
block  
Predriver  
Fref  
PLL  
Ha/Hb/Hc  
120°  
energization  
matrix  
LC(L1)  
LC(L2)  
52  
CW/CCW  
OUT-A  
OUT-B  
Ready Charge  
41  
46  
Protection  
& reset  
R3  
circuit  
pump  
Lock protection  
counter  
17  
OUT-C  
Ready  
51  
5 V  
21  
CP  
10  
16  
FGS  
12 14  
CW  
13  
37  
29  
32  
P-GND  
19  
38  
9
FGin11  
R9  
CLd  
18  
Vref1  
FGin+  
5 V  
Idc2  
Idc1  
START  
R4  
R5  
C6  
/CCW  
BRAKE  
C8  
FGO  
R6  
C2  
R10  
PLL-GAIN  
C1  
R8  
R11  
C5  
R7  
5 V  
C4  
R12  
C3  
C7  
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TB6571FG  
Pin Functions  
Pin No.  
Name  
Pin Functions  
Remarks  
1
2
LC (L1)  
NC  
Phase-C energization signal output (L1)  
No connection  
For source driving for phase-C output FET gate (lower N-ch)  
3
HA+  
Phase-A hall signal input + pin  
Phase-A hall signal input - pin  
Phase-B hall signal input + pin  
Phase-B hall signal input - pin  
Phase-C hall signal input + pin  
Phase-C hall signal input - pin  
FG amplifier input + pin  
Input the positive phase-A Hall device signal.  
Input the negative phase-A Hall device signal.  
Input the positive phase-B Hall device signal.  
Input the negative phase-B Hall device signal.  
Input the positive phase-C Hall device signal.  
Input the negative phase-C Hall device signal.  
FG signal input  
4
HA−  
5
HB+  
6
HB−  
7
HC+  
HC−  
FGin+  
FGin−  
FGo  
8
9
10  
11  
12  
13  
14  
15  
16  
FG amplifier input - pin  
FG signal input  
FG amplifier output pin  
CW/CCW Forward/reverse switching pin  
H: Reverse/L: Forward  
BRAKE  
START  
Fref  
Brake  
Pull-up resistor, L for braking (all-phase ON for lower circuit)  
Pull-up resistor, L for start, H for standby  
Pull-up resistor  
Start  
External clock input  
FG hysteresis comparator output pin  
FGS  
Open collector output, I = 1 mA (max)  
O
Open collector output.  
Within ±6%: L, Otherwise: High impedance  
17  
Ready  
Vref1  
Ready output pin  
18  
19  
20  
21  
22  
5-V reference power supply  
5-V output. Connect to GND through a capacitor.  
Connect a resistor.  
PLL-GAIN PLL gain adjustment pin  
S-GND  
CP  
Ground pin  
Charge pump pin for speed control  
Capacitor pin for VCO  
Connect to GND through a capacitor.  
Connect to GND through a capacitor.  
VCO  
Frequency setting pin 1 for internal  
reference clock  
23  
24  
Td1  
Td2  
Connect external CR to generate a reference clock.  
Frequency setting pin 2 for internal  
reference clock  
25  
26  
27  
28  
29  
30  
31  
32  
33  
34  
35  
36  
37  
38  
39  
40  
LP1  
L1  
For LPF  
Lead angle correction circuit  
Lead angle correction circuit  
Lead angle correction circuit  
Oscillation pin for lock protection circuit  
Internal logic power supply pin  
8-V reference power supply  
Ground pin  
Connect an external capacitor.  
L2  
Connect an external resistor for adjusting the correction gain.  
Connect an external resistor for adjusting the correction gain.  
Connect to GND through a capacitor.  
L3  
CLd  
VDD  
Vref2  
P-GND  
CP1  
CP2  
CP3  
VCC  
Idc2  
5-V output. Connect to GND through a capacitor.  
8-V output. Connect to GND through a capacitor.  
Charge pump pin  
For generating upper N-ch FET gate voltage  
For generating upper N-ch FET gate voltage  
For generating upper N-ch FET gate voltage  
Charge pump pin  
Charge pump pin  
Voltage input pin for control power supply  
V
(opr.) = 10~28 V  
CC  
Input pin for output current detection signal GND sense pin  
Idc1  
Input pin for output current detection signal Gate block operation when 0.25 V (typ.) or higher  
LA (U1)  
LA (U2)  
Phase-A energization signal output (U1)  
Phase-A energization signal output (U2)  
For source driving for phase-A output FET gate (upper N-ch)  
For sink driving for phase-A output FET gate (upper N-ch)  
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TB6571FG  
Pin No.  
Name  
Pin Functions  
Phase-A motor pin  
Remarks  
41  
42  
43  
44  
45  
46  
47  
48  
49  
50  
51  
52  
OUT-A  
LA (L2)  
LA (L1)  
LB (U1)  
LB (U2)  
OUT-B  
LB (L2)  
LB (L1)  
LC (U1)  
LC (U2)  
OUT-C  
LC (L2)  
Phase-A energization signal output (L2)  
Phase-A energization signal output (L1)  
Phase-B energization signal output (U1)  
Phase-B energization signal output (U2)  
Phase-B motor pin  
For sink driving for phase-A output FET gate (lower N-ch)  
For source driving for phase-A output FET gate (lower N-ch)  
For source driving for phase-B output FET gate (upper N-ch)  
For sink driving for phase-B output FET gate (upper N-ch)  
Phase-B energization signal output (L2)  
Phase-B energization signal output (L1)  
Phase-C energization signal output (U1)  
Phase-C energization signal output (U2)  
Phase-C motor pin  
For sink driving for phase-B output FET gate (lower N-ch)  
For source driving for phase-B output FET gate (lower N-ch)  
For source driving for phase-C output FET gate (upper N-ch)  
For sink driving for phase-C output FET gate (upper N-ch)  
Phase-C energization signal output (L2)  
For sink driving for phase-C output FET gate (lower N-ch)  
Pin Layout  
39 38 37 36 35 34 33 32 31 30 29 28 27  
LA(U2) 40  
OUT-A 41  
LA(L2) 42  
LA(L1) 43  
LB(U1) 44  
LB(U2) 45  
OUT-B 46  
LB(L2) 47  
LB(L1) 48  
LC(U1) 49  
LC(U2) 50  
OUT-C 51  
LC(L2) 52  
26 L1  
25 LP1  
24 Td2  
23 Td1  
22 VCO  
21 CP  
20 S-GND  
19 PLL_Gain  
18 Vref1  
17 Ready  
FGS  
16  
15 Fref  
14 START  
1
2
3
4
5
6
7
8
9
10 11 12 13  
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2005-04-15  
TB6571FG  
Maximum Ratings (Ta = 25°C)  
Characteristics  
Symbol  
Rating  
Unit  
Supply voltage  
Input voltage  
V
30  
5.5  
V
V
CC  
V
(Note 1)  
(Note 2)  
(Note 3)  
(Note 4)  
(Note 5)  
(Note 6)  
IN  
5.5  
Output voltage  
Output current  
V
V
OUT  
40  
20  
I
mA  
OUT  
10  
Power dissipation  
P
1.3  
W
°C  
°C  
D
Operating temperature  
Storage temperature  
T
30~85  
55~150  
opr  
T
stg  
Note 1: CW/CCW, STB,START,BRAKE, Idc,Fref  
Note 2: Ready, FGS  
Note 3: LA (U), LB (U), LC (U)  
Note 4: LA (U), LB (U), LC (U), LA (L), LB (L), LC (L)  
Note 5: Vref1  
Note 6: When mounted on the board  
(glass epoxy, 50 mm × 50 mm × 1.6 mm, copper foil 36%, thickness = 18 µm, single-sided)  
The absolute maximum ratings of a semiconductor device are a set of specified parameter values, which must not  
be exceeded during operation, even for an instant.  
If any of these rating would be exceeded during operation, the device electrical characteristics may be irreparably  
altered and the reliability and lifetime of the device can no longer be guaranteed.  
Moreover, these operations with exceeded ratings may cause break down, damage and/or degradation to any other  
equipment. Applications using the device should be designed such that each maximum rating will never be exceeded  
in any operating conditions.  
Before using, creating and/or producing designs, refer to and comply with the precautions and conditions set forth in  
this documents.  
Operating Conditions (Ta = 25°C)  
Characteristics  
Symbol  
Rating  
Unit  
Supply voltage  
External clock frequency  
V
10~28  
V
CC  
Fref  
200~2 k  
Hz  
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2005-04-15  
TB6571FG  
Functional Description  
The equivalent circuit diagrams may be simplified or some parts of them may be omitted for explanatory purpose.  
Sine Wave PWM Drive  
<Energization Switching>  
Upon start-up, the TB6571FG drives the motor with square waves for 120° energization using phase  
detection signals (hall device signals).  
If the frequency (f) of the position detection signal (hall device signal) for a single phase exceeds the  
specified value (f ), the TB6571FG switches to 180° energization.  
H
The following formula determines: f = fx1 / (210 × 32 × 6)  
H
fx1: The system clock frequency (fx1) is obtained by multiplying the external clock frequency (fref).  
fx 1 = 4 × 1024 × fref  
Thus, a transition from 120° energization to 180° energization occurs according to the external clock  
frequency.  
Mode Table  
Rotation State  
Drive Mode  
f
f
> f  
< f  
Square wave drive (120°energization)  
Sine wave PWM drive (180°energization)  
H
H
<Operation Flow>  
Phase-A  
Counter  
LA (U)  
LA (L)  
PLL (frequency  
multiplication)  
Position signal  
Phase-B  
LB (U)  
LB (L)  
Phase alignment  
(A, B, C)  
Phase-  
C
Sine wave pattern  
(modulation signal)  
Comparator  
Frequency multiplication  
of external clock  
LC (U)  
LC (L)  
Speed control  
signal  
Triangular wave  
(carrier frequency)  
Generate internal  
reference clock  
C/R  
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2005-04-15  
TB6571FG  
The TB6571FG uses position detection signals to create modulation waveforms, which it compares with  
triangular waves to generate sine wave PWM signals.  
It counts the time between zero-crossing points for the three position detection signals (electrical angle:  
60°) and uses the time as data for the next 60° phase of the modulation waveforms.  
A 60° phase part of a modulation waveform consists of 32 data items. The time width for a single data  
item in a 60° phase part is 1/32 of that for the preceding 60° phase part. The modulation waveform  
proceeds with that width.  
HA  
(6)  
(1)  
(3)  
* HA, HB, HC: Hall amplifier  
HB  
(5)  
(2)  
HC  
(6)’  
(1)’  
(2)’  
(3)’  
S
S
A
B
S
C
In the above chart, the time between HA rising and HC falling is marked (1). The modulation waveform  
within the (1)' period proceeds with a width that is 1/32 of (1). In the same way, the waveform within the  
(2)' period proceeds with 1/32 of (2), which is the time between HC falling and HB rising.  
If next zero-crossing does not take place appear after 32 data items, the next 32 data items proceed with  
the same time width until next zero-crossing occurs.  
*t  
32  
31  
30  
6
5
4
3
2
1
S
B
(1)’  
32 data item  
* t = t (1) × 1/32  
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2005-04-15  
TB6571FG  
In addition, the TB6571FG performs phase alignment with the modulation waveforms at each  
zero-crossing in the position detection signals.  
For every 60° of electrical angle, it synchronizes with the rising and falling edges of the position detection  
signals (Hall amplifier output signals), thus resetting the modulation waveforms.  
If zero-crossing timing is shifted in position detection signals, causing next zero-crossing to occur before  
32 data items are reached for the 60° phase, the data is reset and data for the next 60° phase is started.  
In that case, the modulation waveforms become discontinuous at a reset.  
HA  
HB  
HC  
3
(1)  
(2)  
2
1
31  
30  
29  
28  
4
3
2
1
S
B
Reset  
(1)’  
Operating Waveforms for Sine wave PWM Drive  
Modulation signal  
Carrier frequency  
2.7 V  
(typ.)  
Phase-A  
(inside IC)  
GND  
V
CC  
V
A
B
C
GND  
Pin  
voltage  
V
CC  
V
GND  
V
CC  
V
GND  
Line-to-line  
voltage  
V
AB  
(V V )  
A
B
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TB6571FG  
Timing Charts  
HA  
HB  
HC  
Position  
detection  
(Hall amplifier  
output)  
LA (U)  
LB (U)  
LC (U)  
LA (L)  
LB (L)  
LC (L)  
Energization  
signal output  
when driven  
with square  
wave  
S
S
A
B
C
Modulation  
waveform when  
driven with sine  
wave (inside IC)  
S
Forward rotation  
Position  
HA  
HB  
HC  
detection  
(Hall amplifier  
output)  
LA (U)  
LB (U)  
LC (U)  
LA (L)  
LB (L)  
LC (L)  
Energization  
signal output  
when driven  
with square  
wave  
S
A
B
C
Modulation  
waveform when  
driven with sine  
wave (inside IC)  
S
S
Reverse rotation  
* HA, HB, HC: Hall amplifier outputs  
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2005-04-15  
TB6571FG  
Generating an Internal Reference Clock  
The TB6571FG uses external C and R to generate a reference clock internally.  
It uses the reference clock to generate triangular waves, which determine the carrier frequency, and set a  
dead time.  
The clock also functions as a reference clock for the charge pump (booster) and lead angle circuit ADC.  
Generating Triangular Waves  
The TB6571FG compares the modulation waveforms with triangular waves to generate PWM signals.  
The carrier frequency for PWM control depends on the frequency of the triangular waves.  
The triangular waves are switched according to the internal reference clock frequency.  
The following formula obtains the PWM frequency, where fx2 is the internal reference clock frequency:  
PWM frequency fpwm = fx2/252 (= triangular wave frequency)  
For example: When fx2 = 5 MHz: fpwm = 19.8 kHz  
When fx2 = 4 MHz: fpwm = 15.8 kHz  
When fx2 = 3 MHz: fpwm = 11.9 kHz  
Dead time Setup Circuit  
To apply PWM control with synchronous regeneration for output FETs, the TB6571FG sets a dead time for  
energization signal outputs, thus preventing the upper and lower output power FETs from turning on  
simultaneously.  
It uses the internal reference clock, generated from external CR, to set a dead time.  
Dead Time  
LA (U)  
(LB (U), LC (U) )  
TOFF  
TOFF  
LA (L)  
(LB (L), LC (L) )  
The following formula obtains the dead time, where fx2 is the internal reference clock frequency:  
Dead time td = (1/fx2) × 4  
For example: When fx2 = 5 MHz: td = 0.8 µs  
When fx2 = 4 MHz: td = 1.0 µs  
When fx2 = 3 MHz: td = 1.3 µs  
Charge Pump  
The TB6571FG incorporates a charge pump to drive two N-ch FETs in the external output FET configuration,  
in particular, to generate the gate voltage for the upper N-ch FET.  
The booster voltage is V  
CC  
+ 8.0 V and the upper gate drive voltage is V + 7.75 V.  
CC  
The charge pump boosts the voltage using a frequency that is 1/16 of the internal reference clock frequency, fx2  
(250 kHz when fx2 = 4 MHz).  
Motor Output Pins  
During PWM operation, the source voltage for the upper external N-ch FET swings between GND and VM.  
VGS for the Nch-FET is clamped so that it does not exceed VGS (max) = 20 V.  
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2005-04-15  
TB6571FG  
External FET Gate Drive Output  
The output for driving the upper FET is divided into two pins  
so that resistor adjustment is enabled only for gate driving  
(sourcing), thus reducing impedance for extraction.  
The output for driving the lower FET is also divided.  
The upper FET is driven with the LA(U1) pin on the source  
and the LA(U2) pin on the sink. The lower FET is driven with  
LA(L1) on the source and LA(L2) on the sink.  
LA(U1)  
LA(U2)  
Upper FET  
OUT-A  
LA(L1)  
LA(L2)  
Lower FET  
Speed Control  
Phase  
comparator  
LPF  
VCO  
1/1024  
1/4  
frequency  
divider  
frequency  
divider  
Sine wave system clock  
Speed  
discriminator  
1024  
Charge  
pump  
Control  
amplifier  
Fref signal  
FG signal  
PLL  
CP  
PLL-Gain  
5V  
FG  
amplifier  
The TB6571FG uses a speed discriminator and PLL to control speed.  
The speed discriminator has two counter stages, each of which alternately counts a single period of the FG  
signal. The resulting difference signal is output as two signals (charge pulses and discharge pulses).  
The PLL counts the phase difference between the 1/2 FG signal and reference signal. The resulting  
difference signal is output as two signals (charge pulses and discharge pulses). The phase difference is  
assumed to be zero when the FG frequency is outside the lock range (±6% of the specified value).  
The gain ratio between the speed discriminator and PLL is set using an external resistor.  
The total gain is set using an external constant for the charge pump.  
VCO PLL  
The maximum guaranteed range for the VCO oscillation frequency is a quadruple width, with a single  
external constant as a condition.  
FG frequency = speed control clock/speed discriminator  
Speed control clock = FG frequency × speed discriminator  
FG frequency = 200 to 2 k, speed discriminator = 1024  
Speed control clock = 0.2048 to 2.048 MHz  
System clock = speed control clock × 4  
= 0.8192 to 8.192 MHz  
When the Fref input is open, the output is turned off.  
Note that a sudden variation in rotation speed may cause a motor current to be regenerated into the power  
supply, resulting in the rise of the motor voltage.  
(Note)  
When the system clock is saturated, a READY signal may remain being L output even if external clock  
frequency and FG frequency shift. Please confirm optimization of a VCO system PLL circuit  
constant(25pin,22pin).  
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2005-04-15  
TB6571FG  
Charge Pump  
Speed discriminator  
PLL  
V
DD  
Charge  
signal  
Charge  
signal  
I2  
I2  
I1  
CP  
To control  
amplifier  
Discharge signal  
Discharge signal  
I1  
The charge pump consists of MOS transistors, which enable fast switching, thus allowing control with  
higher resolution.  
For the speed discriminator and PLL gains, the ratio of the charge/discharge current is specified using an  
external resistor (PLL-Gain).  
The charge/discharge current for the speed discriminator, I1, is 100 µA (typ.) and the PLL  
charge/discharge current, I2, can be specified using the external PLL-Gain voltage.  
PLL-Gaincharacteristics  
20  
18  
16  
14  
12  
10  
8
6
4
2
0
0
1
2
3
4
5
PLL-Gain input voltage  
The charge pump is placed in discharge mode upon stop or braking.  
Because the external capacitance becomes zero upon stop or braking, the charge-up time upon start is  
constant, so that the time required for the motor to start is also stable.  
Upon start, the charge pump is forcibly charged.  
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2005-04-15  
TB6571FG  
Control amplifier  
V
ref  
V
DD  
CP  
The voltage integrated in the charge pump is input to the control amplifier.  
The input is placed in high-impedance state because it is a P-ch gate.  
The control amplifier circuit has an offset of 0.45 V (typ.). If the CP pin voltage exceeds the offset value,  
the energization signal outputs become active. It incorporates a clamp circuit that saturates the PWM  
duty ratio for the energization signal outputs when the CP pin voltage becomes 2.7 V (typ.).  
100  
0.45  
2.7  
VCP (V)  
The PWM duty ratio indicates the value at the peak of the modulation waveform. A duty ratio of 100%  
indicates that the peak value coincides with the peak of the triangular wave.  
(PWM duty ratio: 100%)  
Triangular wave  
Modulation waveform  
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2005-04-15  
TB6571FG  
FG amplifier/hysteresis comparator  
V
ref  
V
V
V
ref  
ref  
ref  
V
CC  
V
V
CC  
CC  
V
CC  
+
FGin  
FGin  
FGS  
FGo  
The FG amplifier supports pattern FG and incorporates an internal reference voltage of 2.5 V.  
Entering a sine wave of 50 mVpp or greater results in a signal multiplied by the gain being output.  
The open loop gain is 45 dB (min) (design target value).  
The FG amplifier is followed by a hysteresis comparator, which compares the FG output and delivers it to  
the FGS.  
The comparator has a single-side hysteresis of 200 mV for the 2.5 V reference voltage. The square wave  
signal output from the FGS enters the internal counter.  
The FGO output dynamic range is as follows:  
1.0 V~V −1.0 V at IFGO = ±200 µA  
ref  
2.7 V (typ.)  
2.5 V (typ.)  
200 mV (typ.)  
FGO  
FGS  
The FGS has an open-collector output. Connect a pull-up resistor considering the following characteristics.  
The input current is 1 mA (max).  
VFGS = 0.7 V (max) at IFGS = 1 mA  
14  
2005-04-15  
TB6571FG  
Hall amplifier  
V
ref  
V
V
CC  
CC  
+
HA  
HA  
The Hall amplifier accepts Hall device output signals. If input signals contain noise, connect a capacitor  
between inputs.  
The common-mode input voltage range is: VCMRH = 1.5 to 3.5 V.  
The Hall amplifier has an input hysteresis of ±8 mV(typ).  
The Hall amplifier converts Hall device signals into square waves, which then enter the internal logic.  
If positive/negative inputs are open, all external MOS FETs is turned off.  
Ready circuit  
The Ready circuit indicates the motor rotation speed state using two states (L and HZ) of an open-collector  
output.  
When the motor is rotating, the circuit counts FG signals and outputs the following states according to  
whether the frequency is within or outside ±6% of the specified value:  
Within ±6% of motor rotation speed: L output  
Outside ±6% of motor rotation speed: HZ (high impedance)  
Connect a pull-up resistor to the Ready output pin. Determine the resistance considering the following  
characteristics. The input current is 2 mA (max).  
VCER = 0.5 V (max) at IR = 2 mA  
V
CC  
V
DD  
Ready  
(Note)  
When the system clock is saturated, a READY signal may remain being L output even if external clock  
frequency and FG frequency shift. Please confirm optimization of a VCO system PLL circuit  
constant(25pin,22pin).  
15  
2005-04-15  
TB6571FG  
Forward/reverse rotation circuit  
V
DD  
CW/CCW  
The circuit accepts a TTL input and incorporates a pull-up resistor.  
CW/CCW Input  
Mode  
H
L
Reverse  
Forwared  
+
+
+
Forward: Hall device signals HA HB HC  
Note that abrupt switching between forward and reverse rotation may result in an output FET being damaged  
due to reverse torque.  
Start circuit  
V
DD  
START  
The circuit accepts a TTL input and incorporates a pull-up resistor.  
START Input  
Mode  
H
L
Stop  
Start  
Brake  
V
DD  
BRAKE  
The circuit accepts a TTL input and incorporates a pull-up resistor.  
BRAKE Input  
Mode  
H
L
OPERATION  
BRAKE  
Note that abrupt braking from high-speed rotation may result in an output FET being damaged.  
16  
2005-04-15  
TB6571FG  
Operation sequence  
VM power supply  
Vref power  
supply (+5 V)  
V
power  
DD  
supply (+5 V)  
V1 power  
supply (+8 V)  
Internal reference  
clock fx2  
Output charge  
pump voltage  
External reference  
clock fref  
System clock fx1  
(fref multiplied)  
PLL lockup time  
START signal  
Rotate  
Stop  
Rotate  
Brake  
BRAKE signal  
START 信号  
BRAKE 信号  
Mode  
Description  
H
L
H or L  
Stop  
Rotate  
Brake  
Turn all external FETs off.  
Energize  
Turn all lower external FETs on.  
17  
2005-04-15  
TB6571FG  
Automatic phase lead angle correction circuit  
The circuit corrects the lead angle using the motor current value.  
Automatic lead angle correction  
Motor current  
Peak  
hold  
Amp.  
A-D conversion  
Gain x VRF  
Gain x VRF  
(peak)  
VRF  
LA 値  
RF  
R4  
C2  
R3  
R2  
*)Gain = (R2+R3) / R2  
VRF  
Gain x VRF  
(peak)  
Gain x VRF  
V
Î
LA value  
Î
Î
[
T
The circuit can advance the phase of an energization signal relative to the induced voltage for input of  
0 to 2.5 V (16 steps).  
0 V 0°  
2.5 V 29°(29° for an input voltage higher than 2.5 V)  
58°  
29°  
5.4°  
0°  
2.5 V  
LA  
0
5 V  
The circuit clamps the lead angle at 29°.  
It logically clamps the angle between 0° and 29°, rather than clamping the input voltage.  
Lock protection circuit  
The circuit turns the output power FET off if the motor is locked.  
It turns off both upper and lower output power FETs if it detects the Ready signal with the following  
condition satisfied.  
The circuit latched state is terminated once the TB6571FG is placed in the stop or brake state.  
Detected signal  
Ready signal  
Condition for triggering lock protection  
The Ready signal output remains high  
for at least 5.5 seconds (typ.).  
A reference oscillation waveform for lock protection is generated using an external capacitor connected  
to the CLD pin and counted with the internal 5-bit counter.  
When CLD = 0.1 µF, the oscillation frequency is approximately 25 Hz, so that the lock protection  
triggering time is 5.5 seconds (typ.).  
18  
2005-04-15  
TB6571FG  
Constant voltage circuit  
(1) Vref1  
The circuit creates 5 V for biasing the internal analog circuit and outputs it from the Vref pin.  
Connect a capacitor (0.1 µF to 1 µF) between the Vref pin and L-GND to prevent oscillation and  
absorb noise.  
The output load current is 10 mA.  
Vref = 5 V (typ.) ± 0.5 V at Io = 10 mA  
(2)  
V
DD  
The circuit outputs 5 V for biasing the internal logic circuit from the V  
pin.  
DD  
pin and L-GND to prevent oscillation  
Connect a capacitor (1 µF recommended) between the V  
DD  
and absorb noise.  
Connect no load to the V  
DD  
pin.  
(3) Vref2  
The circuit creates 8 V for output FET gate driving and outputs it from the Vref2 pin.  
Connect a capacitor (1 µF or larger) between the Vref2 pin and L-GND to prevent oscillation and  
absorb noise.  
Overcurrent protection circuit  
V
ref  
V
CC  
Idc  
The circuit turns the external output power FET off if the detected voltage is higher than 0.25 V (typ.).  
It re-activates the FET according to the carrier frequency.  
Note that the Idc pin accepts a direct analog comparator input and is highly sensitive. Use C and R,  
therefore, for filtering so that output current noise due to chopping does not activate the overcurrent  
protection circuit.  
Power supply monitor circuit  
The circuit monitors the Vref and Vcc voltages and turns the external power FET off if any of the following  
conditions are satisfied:  
V
CC  
(H) 9 V, V (L) 8.5 V, Vref1 (H) 4.5 V, Vref1 (L) 4.0 V  
CC  
Thermal shutdown circuit  
The circuit turns the external output power FET off if the junction temperature TSD (ON) exceeds 160°C.  
The thermal shutdown state is terminated once the TB6571FG is placed in the stop or brake state.  
19  
2005-04-15  
TB6571FG  
Electrical characteristics (V = 24 V, Ta = 25°C)  
CC  
Test  
Circuit  
Characteristics  
Symbol  
Test conditions  
Min  
Typ.  
Max  
Units  
I
I
Start  
Stop  
6.0  
12.0  
9.0  
18.0  
12.6  
CC1  
CC2  
Supply current  
Α  
5.4  
Common-mode input  
voltage range  
VCMRH  
1.5  
3.5  
V
Hall  
amplifier  
Input amplitude range  
Input hysteresis  
Input current  
VH  
VhysH  
IinH  
50  
± 4  
± 8  
± 12  
1
mVpp  
mV  
(Design target value)  
VCMRH = 2.5 V, 1-phase  
µA  
Open collector output,  
ICER = 2 mA  
Remaining output voltage  
VCER  
0.5  
V
Ready  
circuit  
Output leakage current  
Input offset voltage  
ILR  
Vready = 6 V  
1
µA  
VOSFG  
± 7  
mV  
Remaining output voltage  
(upper)  
Vref1  
1.2  
VOFG (H)  
VOFG (L)  
IFG = 100 µA (source current)  
IFG = 100 µA (sink current)  
Vref1  
1.2  
FG  
amplifier  
V
Remaining output voltage  
(lower)  
Vref1/  
2
Reference voltage  
Hysteresis width  
VrefFG  
VhysS  
VCES  
VLS  
2.2  
0.15  
2.8  
0.25  
0.5  
1
V
V
0.2  
FG  
hysteresis  
comparat-  
or  
Open collector output,  
ICES = 1 mA  
Remaining output voltage  
Output leakage current  
Input voltage (H)  
V
VFGS = 6 V  
µA  
CW/CCW, STB, BRAKE,  
START  
Vin(H)  
2.0  
5.5  
V
Control  
input  
circuit  
CW/CCW, STB, BRAKE,  
START  
Input voltage (L)  
Vin(L)  
0
0.8  
Input current (H)  
Input current (L)  
Input voltage (H)  
Input voltage (L)  
Input current (H)  
Input current (L)  
IinCW (H)  
IinCW (L)  
VinSB (H)  
VinSB (L)  
Iin (H)  
Vin = 5 V  
Vin = GND  
Fref  
70  
2.0  
0
100  
1
µA  
130  
5.5  
0.8  
1
V
Fref  
Fref input  
circuit  
Vin = 5 V  
Vin = GND  
70  
µA  
Iin (L)  
100  
130  
V
+
V
+
V
+
CC  
7
CC  
8
CC  
9
Charge pump voltage  
VG  
V
VG  
1.0  
VO (U)-(H)  
VG  
LA (U)/LB (U)/LC (U),  
Io = 20 mA  
VO (U)-(L)  
VO (L)-(H)  
VO (L)-(L)  
7.25  
0.5  
8.25  
0.5  
Energization signal output voltage  
V
V
7.75  
LA (L) /LB (L) /LC (L),  
Io = 20 mA  
V
4.5  
4.5  
8.2  
5.0  
5.0  
8.7  
5.5  
DD  
Internal supply voltage output  
Vref1  
Vref2  
5.5  
9.2  
Current limiter circuit reference  
voltage  
Vdc  
0.23  
0.25  
0.27  
V
Internal clock frequency  
fx2  
R=10kΩ,C=51pF  
R=10kΩ,C=51pF  
R=10kΩ,C=51pF  
3.4  
1.2  
1.2  
3.8  
1.7  
1.7  
4.2  
2.2  
2.2  
MHz  
TOFF1  
TOFF2  
Dead time  
µs  
Phase lead angle  
controller  
Upper clamp limit  
ACLH  
29  
°
20  
2005-04-15  
TB6571FG  
Test  
Circuit  
Characteristics  
Symbol  
Test conditions  
Min  
Typ.  
Max  
Units  
Rising voltage  
Saturation voltage  
Input current  
VCR  
VCLP  
IinCP  
0.3  
2.7  
0.5  
2.85  
0
0.6  
3.0  
V
Control  
amplifier  
µA  
(source current), Vcp = 3.1 V,  
V(PLL-GAIN)0V  
Charge current  
Icp +  
Icp −  
70  
70  
100  
100  
150  
150  
Charge  
pump  
µA  
(sink current), Vcp = 0.35 V,  
V(PLL-GAIN)0V  
Discharge current  
Reference clock  
frequency  
CLd = 0.1 µF  
Lock  
protection  
circuit  
FLd  
tLd  
17.5  
4.2  
25  
30  
Hz  
s
Operating time  
5.5  
7.0  
21  
2005-04-15  
TB6571FG  
Package Dimensions  
Weight: 0.0 g (typ.)  
22  
2005-04-15  
TB6571FG  
RESTRICTIONS ON PRODUCT USE  
030619EBA  
The information contained herein is subject to change without notice.  
The information contained herein is presented only as a guide for the applications of our products. No  
responsibility is assumed by TOSHIBA for any infringements of patents or other rights of the third parties which  
may result from its use. No license is granted by implication or otherwise under any patent or patent rights of  
TOSHIBA or others.  
TOSHIBA is continually working to improve the quality and reliability of its products. Nevertheless, semiconductor  
devices in general can malfunction or fail due to their inherent electrical sensitivity and vulnerability to physical  
stress. It is the responsibility of the buyer, when utilizing TOSHIBA products, to comply with the standards of  
safety in making a safe design for the entire system, and to avoid situations in which a malfunction or failure of  
such TOSHIBA products could cause loss of human life, bodily injury or damage to property.  
In developing your designs, please ensure that TOSHIBA products are used within specified operating ranges as  
set forth in the most recent TOSHIBA products specifications. Also, please keep in mind the precautions and  
conditions set forth in the “Handling Guide for Semiconductor Devices,” or “TOSHIBA Semiconductor Reliability  
Handbook” etc..  
The TOSHIBA products listed in this document are intended for usage in general electronics applications  
(computer, personal equipment, office equipment, measuring equipment, industrial robotics, domestic appliances,  
etc.). These TOSHIBA products are neither intended nor warranted for usage in equipment that requires  
extraordinarily high quality and/or reliability or a malfunction or failure of which may cause loss of human life or  
bodily injury (“Unintended Usage”). Unintended Usage include atomic energy control instruments, airplane or  
spaceship instruments, transportation instruments, traffic signal instruments, combustion control instruments,  
medical instruments, all types of safety devices, etc.. Unintended Usage of TOSHIBA products listed in this  
document shall be made at the customer’s own risk.  
The products described in this document are subject to the foreign exchange and foreign trade laws.  
TOSHIBA products should not be embedded to the downstream products which are prohibited to be produced  
and sold, under any law and regulations.  
23  
2005-04-15  

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