TB6581H_06 [TOSHIBA]
3-Phase Full-Wave Sine-Wave PWM Brushless Motor Controller; 3相全波正弦波PWM无刷电机控制器
| 型号： | TB6581H_06 |
| 厂家： | 
TOSHIBA |
| 描述： | 3-Phase Full-Wave Sine-Wave PWM Brushless Motor Controller |
| 文件： | 总15页 (文件大小：584K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
TB6581H/HG
TOSHIBA Bi-CMOS Power Integrated Circuit Multi-Chip Package (MCP)
TB6581H/HG
3-Phase Full-Wave Sine-Wave PWM Brushless Motor Controller
The TB6581H/HG is a high-voltage PWM BLDC motor driver.
The product integrates the TB6551F/FG sine-wave controller and
the TPD4103AK high-voltage driver in a single package (“2-in-1”).
It is designed to change the speed of a BLDC directly motor by
using a speed control signal (analog) from a microcontroller.
Features
•
A sine wave PWM drive controller and a high-voltage driver
integrated in a single package.
•
•
•
•
•
•
•
IGBTs arranged in three half-bridge units
Triangle wave generator (carrier frequency = f /254 (Hz))
osc
Weight:
HZIP25-P-1.00K: 7.7 g (typ.)
Dead-time insertion (1.9 µs)
High-side bootstrap supply
Bootstrap diode
Overcurrent protection, thermal shutdown, and undervoltage lockout
On-chip regulator (V
reg
= 7 V (typ.), 30 mA (max),
Vrefout = 5 V (typ.), 30 mA (max))
•
•
Operating power supply voltage range: V
= 13.5~16.5 V
CC
Motor power supply operating voltage range: VB = 50~400 V
TB6581HG:
TB6581HG is a Pb-free product.
The following conditions apply to solderability:
*Solderability
1. Use of Sn-37Pb solder bath
*solder bath temperature = 230˚C
*dipping time = 5 seconds
*number of times = once
*use of R-type flux
2. Use of Sn-3.0Ag-0.5Cu solder bath
*solder bath temperature = 245˚C
*dipping time = 5 seconds
*the number of times = once
*use of R-type flux
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TB6581H/HG
Pin Description
Pin No.
Symbol
Description
Function
1
2
3
4
PGND
VREG
IS
Grounding pin
Power ground
Reference voltage output Connected to pin 5. 7 V (typ.), 30 mA (max)
IGBT emitter pin
Not connected
For connecting a current sensing resistor to ground.
This pin is left open and can be used as a jumper on a PCB.
NC
Signal control power
supply pin
5
6
7
V
Connected to pin 2. The control stage operating voltage: V
= 6 to 10 V
CC
CC7
5 V (typ.), 30 mA (max)
V
refout
Reference voltage output
Current limit input
For connecting a bypass capacitor for internal V
DC link input
.
DD
Idc
∼
−
Reference potential of 0.5 V. This pin has a filter ( 1 µs).
8
9
SGND
Grounding pin
Clock input
Signal ground
X
in
These pins have a feedback resistor. For connecting to a crystal oscillator.
This pin has a pull-down resistor.
10
11
X
out
Clock output
Ve
Voltage command input
U-phase position sensing
input
12
13
14
HU
HV
If the position sensing inputs are all HIGH or LOW, the outputs are turned off.
This pin has a pull-up resistor.
V-phase position sensing
input
W-phase position
sensing input
HW
15
16
17
LA
FG
Lead angle control input 0 to 58° in 32 steps
FG signal output
This pin drives three pulses per rotation.
REV
Reverse rotation signal
For reverse rotation detection.
Bootstrap supply
(phase U)
18
19
20
21
22
23
24
BSU
U
For connecting a bootstrap capacitor to the U-phase output.
U-phase output pin
⎯
Bootstrap supply
(phase V)
BSV
V
For connecting a bootstrap capacitor to the V-phase output.
V-phase output pin
⎯
For connecting a bootstrap capacitor to the W-phase output.
⎯
Bootstrap supply
(phase W)
BSW
W
W-phase output pin
High-voltage power
supply pin
VB
Power supply pin for driving a motor.
Power supply pin for the
power stage
25
V
CC15
Power stage operating range: V
= 15 V
CC
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TB6581H/HG
Pin Assignment
1
2
3
4
5
6
7
8
9
10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25
Ve HV LA REV
PGND
IS
V
Idc
Xin
U
V
W
V
CC15
VB
CC7
VREG
NC
Vrefout SGND
Xout
HU
HW
FG
BSU
BSV
BSW
Absolute Maximum Ratings (Ta = 25°C)
Characteristics
Symbol
Rating
Unit
V
12
18
CC7
Power supply voltage
V
V
V
CC15
VB
500
−0.3 to V
CC1
V
V
in (1)
(Note 1)
Input voltage
−0.3 to 5.5
in (2)
(Note 2)
2
PWM output current
Power dissipation
I
A
OUT
(Note 3)
40
(Note 4)
P
W
D
−30 to 115
(Note 5)
Operating temperature
Storage temperature
T
°C
°C
opr
T
−50 to 150
stg
Note 1:
Note 2:
V
V
pin: V , LA
e
in (1)
pin: I , HU, HV, HW
dc
in (2)
Note 3: Apply pulse
Note 4: Package thermal resistance (θ j-c = 1°C/W) with an infinite heat sink at Ta = 25°C
Note 5: The operating temperature range is determined according to the P MAX − Ta characteristics.
D
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TB6581H/HG
Recommended operating conditions (Ta = 25°C)
Characteristics
Symbol
Min
Typ.
Max
Unit
V
V
CC7
6
13.5
2
7
15
4
10
16.5
5
Power supply voltage
V
CC15
Crystal oscillator frequency
Motor power supply voltage
Output current
X
in
MHz
V
VB
50
⎯
280
1
400
2
Iout
A
P
Max – Ta
D
80
60
40
20
0
(1) INFINITE HEAT SINK
Rθj-c = 1°C/W
(2) HEAT SINK (RθHS = 3.5°C/W)
Rθj-c + RθHS = 4.5°C/W
(3) NO HEAT SINK
Rθj-a = 39°C/W
(1)
(3)
(2)
0
25
50
75
100
125
150
Ambient temperature Ta (°C)
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TB6581H/HG
Electrical Characteristics (Ta = 25°C)
Characteristics
Symbol
Test Condition
Min
Typ.
Max
Unit
mA
I
B
V
V
V
V
V
= 400 V
⎯
⎯
0.1
1.1
3
0.5
3
B
I
= OPEN, V
= 15 V
CC15
reg
refout
CC
Current dissipation
I
= OPEN, V
= 7 V
⎯
6
CC7
CC
I
= 15 V, high-side ON
= 15 V, high-side OFF
⎯
260
230
25
410
370
50
70
⎯
BS (ON)
BS
BS
µA
µA
I
⎯
BS (OFF)
I
(LA)
Vin = 5 V, LA
Vin = 5 V, V
⎯
in
Input current
Input voltage
I
(V )
e
⎯
35
in
e
I
(Hall)
Vin = 0 V, HU, HV, HW
−50
−25
in
V
refout
HIGH
⎯
V
refout
V
in
− 1
HU, HV, HW
(Hall)
LOW
⎯
5.1
1.8
0.7
⎯
⎯
0.8
5.7
2.4
1.3
⎯
⎯
⎯
3
V
HIGH PWM Duty 100%
5.4
2.1
1.0
0.3
4.0
4.0
2.4
2.4
V
in
(V )
e
Middle Refresh → Start motor operation
LOW Turned-off → Refresh
Input hysteresis voltage
Input delay time
V
HU, HV, HW
HU, HV, HW
Idc
(Note 6)
= 4.19 MHz
V
H
V
X
X
⎯
DT
DC
in
µs
V
= 4.19 MHz
⎯
in
V
H
CEsat
V
CC
V
CC
= 15 V, IC = 0.5 A
= 15 V, IC = 0.5 A
⎯
Output saturation voltage
Output voltage
V
V
V
V
L
⎯
3
CEsat
V
V
refout
− 0.2
refout
V
FG (H)
I
= 1 mA
FG
FG
⎯
OUT
− 1.0
V
I
I
I
= −1 mA
= 30 mA
= 30 mA
⎯
0.2
5.0
7
1.0
5.5
7.5
2.0
2.0
1.2
0.53
200
⎯
FG (L)
OUT
OUT
OUT
V
refout
V
4.5
6.5
⎯
refout
V
reg
V H
F
IF = 0.5 A, high-side
IF = 0.5 A, low-side
IF = 500 µA
1.3
1.3
0.9
0.5
165
20
FRD forward voltage
V L
F
⎯
BSD forward voltage
Current detection
V
⎯
V
V
F (BSD)
V
I
dc
0.47
150
⎯
dc
TSD
TSDhys
(H)
Thermal shutdown protection
(Note 7)
°C
V
V
CC15
Undervoltage positive-going threshold
Undervoltage negative-going threshold
Undervoltage positive-going threshold
Undervoltage negative-going threshold
Undervoltage positive-going threshold
Undervoltage negative-going threshold
10.5
10
11.5
11
12.5
12
V
driver
undervoltage protection for
CC15
V
CC15
(L)
VBS (H)
VBS (L)
8.5
8
9.5
9
10.5
10
VBS undervoltage protection for driver
V
V
(H)
(L)
4.2
3.7
⎯
4.5
4.0
1.5
1.2
1.8
200
4.8
4.3
3
CC7
V
CC7
undervoltage protection for
V
controller
V
CC7
t
t
V
V
X
V
= 280 V, V
= 280 V, V
= 15 V, IC = 0.5 A
= 15 V, IC = 0.5 A
on
off
BB
BB
CC
CC
Output turn-on/-off delay time
µs
⎯
3
Dead time
tdead
= 4.19 MHz
1.5
⎯
⎯
µs
in
FRD reverse recovery time
t
rr
= 280 V, V
= 15 V, IC = 0.5 A
⎯
ns
BB
CC
Note 6 and Note 7: Toshiba does not implement testing before shipping.
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TB6581H/HG
Functional Description
1. Basic operation
The motor is driven by the square-wave turn-on signal based on a positional signal. When the positional
signal reaches number of rotations f = 5 Hz or higher, the rotor position is estimated according to the
positional signal and a modulation wave is generated. The modulation wave and the triangular wave are
compared; then the sine-wave PWM signal is generated and the motor is driven.
12
From start to 5 Hz: When driven by square wave (120° turn-on) f = f /(2 × 32 × 6)
osc
= 4 MHz, approx. 5 Hz
5 Hz~: When driven by sine-wave PWM (180° turn-on);when f
osc
2. V voltage command input and bootstrap power supply
e
<
(1) Voltage command input: When V
1.0 V
e
U, V and W signals are stopped to protect IGBTs
<
(2) Voltage command input: When 1.0 V < V 2.1 V
The low-side IGBTs are turned on at a fixed frequency (carrier frequency) (duty cycle: 8%).
e
(3) Voltage command input: When V > 2.1 V
e
The U, V and W signals are driven out during sine wave drive.
The low-side IGBTs are forced to on at fixed frequency (carrier frequency) during square-wave drive
(duty cycle: 8%).
<
Note 1: At startup, the low-side IGBTs must be turned on for a fixed period at 1.0 V < V
2.1 V to charge the
e
high-side IGBT power supply.
PWM duty cycle
100%
(1) 0 to 1.0 V: Reset state (All outputs are off.)
(2)
V = 1.0 to 2.1 V: Startup operation
e
(duty cycle of 8% for the low-side IGBTs)
(3)
V
= 2.1 to 5.4 V: Running state
e
(5.4 V or higher: PWM duty cycle = 100%)
(1)
(2)
(3)
1.0 V
2.1 V
5.4 V
V
e
3. Dead time function: upper/lower transistor output off-time
When the motor is driven by sine-wave PWM, dead time is digitally generated inside the IC to prevent
short circuit caused by the simultaneously turning on of upper and lower external power devices. When a
square wave is generated in full-duty cycle mode, the dead time function is turned on to prevent a short
circuit.
Internal Counter
8/f
T
OFF
1.9 µs
osc
T
values above are obtained when fosc = 4.19 MHz.
OFF
= reference clock (crystal oscillation)
f
osc
4. Correcting the lead angle
The lead angle can be corrected in the turn-on signal range from 0 to 58° in relation to the induced
voltage.
Analog input from LA pin (0 V to 5 V divided by 32)
0 V = 0°
5 V = 58° (when more than 5 V is input, 58°)
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TB6581H/HG
5. Setting the carrier frequency
This function sets the triangular wave cycle (carrier cycle) necessary for generating the PWM signal.
(The triangular wave is used for forcibly turning on the lower transistor when the motor is driven by
square wave.)
Carrier cycle = f /252 (Hz)
osc
f
= reference clock (crystal oscillation)
osc
6. Outputting the reverse rotation detection signal
This function detects the motor rotation direction every electrical angle of 360°. This function judges
whether the actual direction of a rotating motor coincides with that of the internal reference voltage.
Actual Motor Rotating Direction
REV Pin
Drive Mode
CW (forward)
HIGH
LOW
Square waveform (120° turn-on mode)
Sine-wave waveform (180° turn-on mode)
CCW (reverse)
*: CW or CCW of the motor is determined by the direction of the Hall signal, which is specified in the timing
chart on page 9.
*: When the REV pin is set to LOW, and the Hall signal is higher than 5 Hz, sine-wave drive mode is turned
on.
7. Protecting input pin
(1) Overcurrent protection (Pin I
dc
)
When the DC-link-current exceeds the internal reference voltage, gate block protection is performed.
Overcurrent protection is released for each carrier frequency.
Reference voltage = 0.5 V (typ.)
(2) Positional signal abnormality protection
Output is turned off when the positional signal is HHH or LLL; otherwise, it is restarted.
(3) Monitor protection for V low supply voltage
/ V
CC7 CC15
For power supply on/off outside the operating voltage range, the U, V and W drive outputs are
turned off and the motor is stopped when there is a power supply fault.
< V
>
CC7
V
CC7
Power supply voltage 4.5 V (typ.)
4.0 V (typ.)
GND
V
B
Turn-on drive output
Turn-off drive output
Output
Turn-off drive output
< V
>
CC15
V
CC15
Power supply voltage 11.5 V (typ.)
11.0 V (typ.)
GND
V
B
Turn-on drive output
Turn-off drive output
Output
Turn-off drive output
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TB6581H/HG
(4) Monitor protection for V Bootstrap power supply
BS
When V power supply is lowered, the high-side IGBT is turned off.
BS
V
BS
(Output -BS)
9.5 V (typ.)
9.0 V (typ.)
High-side IGBT
Turn-off high-side IGBT
Turn-off high-side IGBT
Output
(5) Overheat protection
The overheat protection circuit will operate and all IGBTs will be turned off if the chip temperature
becomes abnormally high due to internal or external heat generation.
T
SD
= 165°C (typ.)
T
= 20°C (typ.)
SDhys
After the overheat protection circuit is turned on, the return temperature is 145°C (typ.).
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TB6581H/HG
Timing Chart
•
CW (forward) mode (CW mode means that the Hall signal is input in the order shown below.)
H
u
Hall signal
(input)
H
H
v
w
FG signal
(output)
FG
REV signal
(output)
REV
(HIGH
U
V
W
X
Y
Z
Turn-on signal
when driven
by square wave
(inside the IC)
V
V
uv
Motor drive
output
vw
waveform
(line voltage)
V
wu
*
The waveform of actual
operation is the PWM
•
CCW (reverse) mode (CCW mode means that the Hall signal is input in the order shown below.)
H
u
Hall signal
(input)
H
H
v
w
FG signal
(output)
FG
REV signal
(output)
REV
(LO
W)
S
S
S
u
Modulation
waveform when
driven by sine
wave
v
(inside of IC)
w
V
V
V
uv
Motor drive
output
waveform
(line voltage)
vw
wu
*
The waveform of actual
operation is the PWM
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TB6581H/HG
Example of Application Circuit
Power supply
for motor
V
C
6
C
7
C
9
C
8
15 V
refout
LA
2
V
25 V
24 V
B
15
REG
CC15
X
1
9
X
in
System clock
generator
Triangular wave
generator 6-bit
18
BSU
20
22
10
12
13
14
5-bit AD
Counter
BSV
X
out
R
1
Phase
U
Comparator
Comparator
Comparator
4 bit
BSW
C
HU
R
1
Hall IC
input
2
Position detector
C
2
HV
7-V
Regulator
Under-
voltage
Under-
voltage
Under-
voltage
R
3
Output
waveform
generator
Phase
V
Selecting
C
3
HW
protection protection protection
data
Internal
reference
voltage
Phase
matchin
11
5
Phase
W
Under-
voltage
V
e
High-side
level shift
driver
Regula
tor
C
C
C
10 11 12
protection
V
CC7
120°/180°
Charger
Switching
120°/180°
&
U
X
HU
HV
8
6
S-GND
19
21
23
Thermal shutdown
U
V
MCU
Setting
Comparator
PWM
HU
Motor
gate
C
4
V
FG Rotating
direction
refout
dead time
Input control
Power-on
reset
V
Y
HW
LU
block
protection
on/off
W
HV
120°-
turn-on
matrix
Low-side
driver
HW
W
Z
LV
Protection
ST/SP
16
17
&
FG
LW
BRK (CHG)
reset
ERR
GB
REV
(Controller)
(Driver)
Idc
P-GND
1
3 IS
7
R
4
C
5
R
5
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TB6581H/HG
External Parts
Symbol
Purpose
Recommended value
Note
X
Internal clock generation
4.19 MHz
10 V/1000 pF
10 kΩ
(Note 1)
1
C , C , C
1
2
3
Noise absorber
(Note 2)
(Note 3)
(Note 2)
(Note 4)
(Note 3)
R , R , R
1
2
4
5
4
5
6
7
8
9
3
C
C
R
R
C
C
C
C
V
V
oscillation protection
10 V/0.1 µF~1.0 µF
10 V/1000pF
5.1 kΩ
refout
Noise absorber
Overcurrent detection
0.62 Ω ± 1% (1 W)
16 V/1.0 µF~10 µF
10 V/1000 pF
25 V/0.1 µF
power supply stability
power supply stability
REG
V
(Note 3)
(Note 5)
CC15
25 V/10 µF
C
, C , C
10 11 12
Bootstrap capacitor
25 V/2.2 µF
Note 1: For carrier frequency and dead time, connect a 4.19 MHz ceramic resonator.
Note 2: These parts are used as a low-pass filter for noise absorption. Test to confirm noise filtering, then set the
filter time-constant.
Note 3: This part is used as a capacitor for power supply stability. Adjust the part to the application environment as
required. When mounting, place it as close as possible to the base of the leads of this product to improve
the noise elimination.
Note 4: This part is used to set the value for overcurrent detection. I
= V ÷ R (V = 0.5 V (typ.))
dc dc
out (max)
5
Note 5: The required bootstrap capacitance value varies according to the motor drive conditions. The voltage stress
for the capacitor is the value of V
.
CC15
Other Precautions
Utmost care is necessary in the design of the output, V , V , and GND lines since the IC may be destroyed by
CC
M
short-circuiting between outputs, air contamination faults, or faults due to improper grounding, or by
short-circuiting between contiguous pins.
In turning on the power, first supply Vcc15 and confirm its stability; then apply Vcc7 and the driving input signal.
Vcc15 and VB may be turned on in either order. In turning off the power, take care not to cut off the VB line by
relay while the motor is spinning. Doing so may cause the IC to break down by cutting the current-producing route
for VB.
The TB6581H/HG is sensitive to electrostatic discharge. Handle with care.
The product should be mounted by the solder-flow method. The preheating time is from 60 to 120 seconds at
150˚C. The maximum heat is 260˚C, to be applied within 10 seconds and as far as the lead stopper.
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TB6581H/HG
Package Dimensions
Weight: 7.7 g (typ.)
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2006-03-02
TB6581H/HG
Notes on Contents
1. Block Diagrams
Some of the functional blocks, circuits, or constants in the block diagram may be omitted or simplified
for explanatory purposes.
2. Equivalent Circuits
The equivalent circuit diagrams may be simplified or some parts of them may be omitted for
explanatory purposes.
3. Timing Charts
Timing charts may be simplified for explanatory purposes.
4. Application Circuits
The application circuits shown in this document are provided for reference purposes only. Thorough
evaluation is required, especially at the mass production design stage.
Toshiba does not grant any license to any industrial property rights by providing these examples of
application circuits.
5. Test Circuits
Components in the test circuits are used only to obtain and confirm the device characteristics. These
components and circuits are not guaranteed to prevent malfunction or failure from occurring in the
application equipment.
IC Usage Considerations
Notes on handling of ICs
[1] The absolute maximum ratings of a semiconductor device are a set of ratings that must not be
exceeded, even for a moment. Do not exceed any of these ratings.
Exceeding the rating(s) may cause the device breakdown, damage or deterioration, and may result
injury by explosion or combustion.
[2] Use an appropriate power supply fuse to ensure that a large current does not continuously flow in
case of over current and/or IC failure. The IC will fully break down when used under conditions that
exceed its absolute maximum ratings, when the wiring is routed improperly or when an abnormal
pulse noise occurs from the wiring or load, causing a large current to continuously flow and the
breakdown can lead smoke or ignition. To minimize the effects of the flow of a large current in case
of breakdown, appropriate settings, such as fuse capacity, fusing time and insertion circuit location,
are required.
[3] If your design includes an inductive load such as a motor coil, incorporate a protection circuit into
the design to prevent device malfunction or breakdown caused by the current resulting from the
inrush current at power ON or the negative current resulting from the back electromotive force at
power OFF. IC breakdown may cause injury, smoke or ignition.
Use a stable power supply with ICs with built-in protection functions. If the power supply is
unstable, the protection function may not operate, causing IC breakdown. IC breakdown may cause
injury, smoke or ignition.
[4] Do not insert devices in the wrong orientation or incorrectly.
Make sure that the positive and negative terminals of power supplies are connected properly.
Otherwise, the current or power consumption may exceed the absolute maximum rating, and
exceeding the rating(s) may cause the device breakdown, damage or deterioration, and may result
injury by explosion or combustion.
In addition, do not use any device that is applied the current with inserting in the wrong orientation
or incorrectly even just one time.
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TB6581H/HG
Points to remember on handling of ICs
(1) Over current Protection Circuit
Over current protection circuits (referred to as current limiter circuits) do not necessarily protect
ICs under all circumstances. If the Over current protection circuits operate against the over current,
clear the over current status immediately.
Depending on the method of use and usage conditions, such as exceeding absolute maximum ratings
can cause the over current protection circuit to not operate properly or IC breakdown before
operation. In addition, depending on the method of use and usage conditions, if over current
continues to flow for a long time after operation, the IC may generate heat resulting in breakdown.
(2) Thermal Shutdown Circuit
Thermal shutdown circuits do not necessarily protect ICs under all circumstances. If the thermal
shutdown circuits operate against the over temperature, clear the heat generation status
immediately.
Depending on the method of use and usage conditions, such as exceeding absolute maximum ratings
can cause the thermal shutdown circuit to not operate properly or IC breakdown before operation.
(3) Heat Radiation Design
In using an IC with large current flow such as power amp, regulator or driver, please design the
device so that heat is appropriately radiated, not to exceed the specified junction temperature (TJ)
at any time and condition. These ICs generate heat even during normal use. An inadequate IC heat
radiation design can lead to decrease in IC life, deterioration of IC characteristics or IC breakdown.
In addition, please design the device taking into considerate the effect of IC heat radiation with
peripheral components.
(4) Back-EMF
When a motor rotates in the reverse direction, stops or slows down abruptly, a current flow back to the motor’s
power supply due to the effect of back-EMF. If the current sink capability of the power supply is small, the
device’s motor power supply and output pins might be exposed to conditions beyond maximum ratings. To avoid
this problem, take the effect of back-EMF into consideration in system design.
14
2006-03-02
TB6581H/HG
15
2006-03-02
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