FDN360P [TYSEMI]

SuperSOT-3;
FDN360P
型号: FDN360P
厂家: TY Semiconductor Co., Ltd    TY Semiconductor Co., Ltd
描述:

SuperSOT-3

晶体 晶体管 开关 光电二极管 PC
文件: 总2页 (文件大小:357K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
Product specification  
FDN360P  
Single P-Channel PowerTrenchTM MOSFET  
General Description  
Features  
This P-Channel Logic Level MOSFET is produced using  
Fairchild Semiconductor's advanced PowerTrench process  
that has been especially tailored to minimize on-state  
resistance and yet maintain superior switching  
performance.  
-2 A, -30 V. RDS(on) = 0.080 @ VGS = -10 V  
RDS(on) = 0.125 @ VGS = -4.5 V.  
Low gate charge (5nC typical).  
These devices are well suited for low voltage and battery  
powered applications where low in-line power loss and  
fast switching are required.  
Fast switching speed.  
High performance trench technology for extremely  
low RDS(ON)  
.
Applications  
High power and current handling capability.  
DC/DC converter  
Load switch  
Motor drives  
D
D
S
S
G
SuperSOTTM-3  
G
TA = 25°C unless otherwise noted  
Absolute Maximum Ratings  
Symbol  
Parameter  
Ratings  
Units  
VDSS  
VGSS  
ID  
Drain-Source Voltage  
Gate-Source Voltage  
Drain Current - Continuous  
- Pulsed  
-30  
V
V
A
20  
±
(Note 1a)  
(Note 1a)  
-2  
-20  
PD  
Power Dissipation for Single Operation  
0.5  
W
(Note 1b)  
0.46  
TJ, Tstg  
Operating and Storage Junction Temperature Range  
-55 to +150  
C
°
Thermal Characteristics  
θ
(Note 1a)  
(Note 1)  
R
R
Thermal Resistance, Junction-to-Ambient  
Thermal Resistance, Junction-to-Case  
250  
75  
C/W  
C/W  
JA  
°
°
JC  
θ
Package Outlines and Ordering Information  
Device Marking  
Device  
Reel Size  
Tape Width  
Quantity  
360  
FDN360P  
7’’  
8mm  
3000 units  
http://www.twtysemi.com  
1 of 2  
4008-318-123  
Product specification  
FDN360P  
TA = 25°C unless otherwise noted  
Electrical Characteristics  
Symbol  
Parameter  
Test Conditions  
Min Typ Max Units  
Off Characteristics  
BVDSS  
Drain-Source Breakdown Voltage  
VGS = 0 V, ID = -250  
A
-30  
V
µ
DSS  
Breakdown Voltage Temperature  
Coefficient  
ID = -250 A, Referenced to  
25 C  
°
20  
mV/ C  
BV  
µ
°
TJ  
IDSS  
Zero Gate Voltage Drain Current  
VDS = -24 V, VGS = 0 V  
-1  
A
µ
IGSSF  
Gate-Body Leakage Current,  
Forward  
VGS = 20 V, VDS = 0 V  
100  
nA  
IGSSR  
Gate-Body Leakage Current,  
Reverse  
VGS = -20 V, VDS = 0 V  
-100  
-3  
nA  
(Note 2)  
On Characteristics  
VGS(th)  
Gate Threshold Voltage  
VDS = VGS, ID = -250  
A
-1  
-1.8  
-4  
V
µ
GS(th)  
Gate Threshold Voltage  
Temperature Coefficient  
ID = -250 A, Referenced to  
mV/ C  
V
µ
°
25 C  
°
TJ  
RDS(on)  
Static Drain-Source  
On-Resistance  
VGS = -10 V, ID = -2 A  
0.060 0.080  
0.080 0.136  
0.095 0.125  
V
GS = -10 V, ID = -2 A, TJ=125 C  
°
VGS = -4.5 V, ID = -1.5 A  
VGS = -10 V, VDS = -5 V  
ID(on)  
gFS  
On-State Drain Current  
-20  
A
S
Forward Transconductance  
VDS = -5 V, ID = -2 A  
5.5  
Dynamic Characteristics  
Ciss  
Coss  
Crss  
Input Capacitance  
VDS = -15 V, VGS = 0 V,  
f = 1.0 MHz  
420  
140  
60  
pF  
pF  
pF  
Output Capacitance  
Reverse Transfer Capacitance  
(Note 2)  
Switching Characteristics  
td(on)  
tr  
td(off)  
tf  
Turn-On Delay Time  
Turn-On Rise Time  
Turn-Off Delay Time  
Turn-Off Fall Time  
Total Gate Charge  
Gate-Source Charge  
Gate-Drain Charge  
VDD = -15 V, ID = -1 A,  
9
8
18  
16  
29  
12  
7
ns  
ns  
V
GS = -10 V, RGEN = 6  
18  
6
ns  
ns  
Qg  
Qgs  
Qgd  
VDS = -15 V, ID = -2 A,  
VGS = -10 V,  
5
nC  
nC  
nC  
1.7  
1.8  
Drain-Source Diode Characteristics and Maximum Ratings  
IS  
Maximum Continuous Drain-Source Diode Forward Current  
-0.42  
-1.2  
A
V
(Note 2)  
VSD  
Drain-Source Diode Forward Voltage VGS = 0 V, IS = -0.42 A  
-0.75  
Notes:  
1. RθJA is the sum of the junction-to-case and case-to-ambient thermal resistance where the case thermal reference is defined as the solder mounting  
surface of the drain pins. RθJC is guaranteed by design while RθJA is determined by the user's board design.  
b) 270°C/W when  
mounted on a 0.001 in2  
pad of 2 oz. Cu.  
a) 250°C/W when  
mounted on a 0.02 in2  
Pad of 2 oz. Cu.  
Scale  
1
:
1
on letter size paper  
2. Pulse Test: Pulse Width 300 µs, Duty Cycle 2.0%  
http://www.twtysemi.com  
2 of 2  
4008-318-123  

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