10-FU094PB017ME02-L620F36 [VINCOTECH]
High Blocking Voltage with low drain source on state resistance;High speed SiC-MOSFET technology;Resistant to Latch-up;型号: | 10-FU094PB017ME02-L620F36 |
厂家: | VINCOTECH |
描述: | High Blocking Voltage with low drain source on state resistance;High speed SiC-MOSFET technology;Resistant to Latch-up |
文件: | 总17页 (文件大小:7449K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
10-FU094PB017ME02-L620F36
datasheet
fastPACK 0 SiC
900 V / 22 mΩ
Features
flow 0 12 mm housing
● 900V SiC MOS
● Switching frequency up to 400kHz
● Suitable for hard switching/soft switching
● Increased power density
● NTC
Schematic
Target applications
● Power Supply
● Special Application
● Welding & Cutting
Types
● 10-FU094PB017ME02-L620F36
Copyright Vincotech
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03 Aug. 2021 / Revision 1
10-FU094PB017ME02-L620F36
datasheet
Maximum Ratings
Tj = 25 °C, unless otherwise specified
Parameter
Symbol
Conditions
Value
Unit
H-Bridge Switch
VDSS
Drain-source voltage
900
59
V
A
ID
Drain current (DC current)
Peak drain current
Tj = Tjmax
Ts = 80 °C
Ts = 80 °C
IDM
tp limited by Tjmax
Tj = Tjmax
270
A
Ptot
Total power dissipation
101
W
-4 / 15
-8 / 19
175
VGSS
Gate-source voltage
V
dynamic
Tjmax
Maximum Junction Temperature
°C
Capacitor (DC)
VMAX
Maximum DC voltage
1000
V
Top
Operation Temperature
-55 ... 125
°C
Module Properties
Thermal Properties
Tstg
Tjop
Storage temperature
-40…+125
°C
°C
Operation temperature under switching
condition
-40…+(Tjmax - 25)
Isolation Properties
Isolation voltage
Isolation voltage
Creepage distance
Clearance
Visol
Visol
DC Test Voltage*
AC Voltage
tp = 2 s
6000
2500
>12,7
9,52
V
tp = 1 min
V
mm
mm
Comparative Tracking Index
*100 % tested in production
CTI
≥ 200
Copyright Vincotech
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03 Aug. 2021 / Revision 1
10-FU094PB017ME02-L620F36
datasheet
Characteristic Values
Symbol
Parameter
Conditions
Values
Typ
Unit
VCE [V] IC [A]
VDS [V] ID [A] Tj [°C]
VF [V] IF [A]
VGE [V]
VGS [V]
Min
Max
H-Bridge Switch
Static
25
22
26
29
26(1)
rDS(on)
Drain-source on-state resistance
15
60
125
150
mΩ
VGS(th)
IGSS
IDSS
rg
Gate-source threshold voltage
Gate to Source Leakage Current
Zero Gate Voltage Drain Current
Internal gate resistance
Gate charge
0
0,015
25
25
25
1,7
2,4
30
3,5
750
300
V
15
0
0
nA
µA
Ω
900
400
600
3
1,57
91,2
22,5
36
Qg
QGS
QGD
Ciss
Coss
Crss
VSD
Gate to source charge
-4/15
60
25
nC
Gate to drain charge
Short-circuit input capacitance
Short-circuit output capacitance
Reverse transfer capacitance
Diode forward voltage
1980
180
12
f = 1 Mhz
0
0
0
0
25
25
pF
V
4,8
Thermal
λpaste = 3,4 W/mK
(PSX)
(2)
Rth(j-s)
Thermal resistance junction to sink
0,94
K/W
Copyright Vincotech
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datasheet
Characteristic Values
Symbol
Parameter
Conditions
Values
Typ
Unit
VCE [V] IC [A]
VDS [V] ID [A] Tj [°C]
VGE [V]
VGS [V]
Min
Max
VF [V]
IF [A]
Dynamic
25
15,2
14,2
td(on)
Turn-on delay time
125
150
25
ns
ns
15,2
6,8
tr
td(off)
tf
Rise time
125
150
25
6,2
6,2
Rgon = 2 Ω
Rgoff = 2 Ω
47,2
Turn-off delay time
125
150
25
48,4
ns
46,8
11,4
Fall time
125
150
25
11,8
ns
10,2
QrFWD=1,06 µC
QrFWD=1,15 µC
QrFWD=1,32 µC
0,681
0,607
0,618
0,153
0,101
0,095
99,37
115,43
126,62
18,2
Eon
Turn-on energy (per pulse)
Turn-off energy (per pulse)
Peak recovery current
Reverse recovery time
Recovered charge
125
150
25
mWs
mWs
A
Eoff
-5/15
600
60
125
150
25
IRRM
125
150
25
trr
125
150
25
17,1
ns
17,9
1,06
di/dt=10218 A/µs
di/dt=11319 A/µs
di/dt=11508 A/µs
Qr
125
150
25
1,15
μC
1,32
0,07
Erec
Reverse recovered energy
Peak rate of fall of recovery current
125
150
25
0,07
mWs
A/µs
0,12
18427
26726
30513
(dirf/dt)max
125
150
Copyright Vincotech
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datasheet
Characteristic Values
Symbol
Parameter
Conditions
Values
Typ
Unit
VCE [V] IC [A]
VDS [V] ID [A] Tj [°C]
VF [V] IF [A]
VGE [V]
VGS [V]
Min
Max
Capacitor (DC)
Static
DC bias voltage =
0 V
C
Capacitance
25
25
94
25
nF
%
%
Tolerance
-20
20
Dissipation factor
f = 1 kHz
Thermistor
Static
R
ΔR/R
P
Rated resistance
Deviation of R100
Power dissipation
Power dissipation constant
B-value
25
22
kΩ
%
R100 = 1484 Ω
100
-5
5
5
mW
mW/K
K
d
25
1,5
B(25/50)
Tol. ±1 %
Tol. ±1 %
3962
4000
B(25/100)
B-value
K
Vincotech Thermistor Reference
I
(1)
Value at chip level
(2)
Only valid with pre-applied Vincotech thermal interface material.
Copyright Vincotech
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datasheet
H-Bridge Switch Characteristics
figure 1.
MOSFET
figure 2.
MOSFET
Typical output characteristics
Typical output characteristics
ID = f(VDS
)
ID = f(VDS)
200
200
VGS
:
5 V
6 V
7 V
8 V
150
100
50
150
100
50
9 V
10 V
11 V
12 V
13 V
14 V
15 V
0
-50
-100
-150
-200
0
0
1
2
3
4
5
6
7
8
9
-5,0
-2,5
0,0
2,5
5,0
7,5
10,0
12,5
V
DS(V)
VDS(V)
tp
=
=
tp
=
250
15
μs
V
250
150
μs
°C
25 °C
125 °C
150 °C
VGS
Tj =
Tj:
VGS from 5 V to 15 V in steps of 1 V
figure 3.
MOSFET
figure 4.
MOSFET
Typical transfer characteristics
Transient thermal impedance as a function of pulse width
ID = f(VGS
)
Zth(j-s) = f(tp)
0
80
10
70
60
50
40
30
20
10
-1
10
-2
10
0,5
0,2
0,1
0,05
0,02
0,01
0,005
0
-3
10
-4
10
0
0
10
-5
-4
10
-3
10
-2
10
-1
10
0
10
1
10
2
10
2
4
6
8
10
V
GS(V)
tp(s)
tp
=
=
250
10
μs
V
D =
tp / T
0,94
25 °C
125 °C
150 °C
VDS
Rth(j-s) =
Tj:
K/W
MOSFET thermal model values
R (K/W)
τ (s)
4,21E-02
1,28E-01
5,28E-01
1,69E-01
7,30E-02
2,99E+00
4,21E-01
7,51E-02
9,86E-03
1,37E-03
Copyright Vincotech
6
03 Aug. 2021 / Revision 1
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datasheet
H-Bridge Switch Characteristics
figure 5.
MOSFET
figure 6.
MOSFET
Safe operating area
Gate voltage vs gate charge
ID = f(VDS
)
VGS = f(Qg)
1000
17,5
15,0
12,5
10,0
7,5
100
10
5,0
1
2,5
0,0
0,1
0,01
-2,5
-5,0
1
10
100
1000
10000
0
20
40
60
80
100
V
DS(V)
Qg(μC)
D =
ID
=
single pulse
20
25
A
Ts =
Tj =
80
15
°C
V
°C
VGS
=
Tj =
Tjmax
Copyright Vincotech
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datasheet
Thermistor Characteristics
figure 7.
Thermistor
Typical NTC characteristic as function of temperature
RT = f(T)
25000
20000
15000
10000
5000
0
20
40
60
80
100
120
140
T(°C)
Copyright Vincotech
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03 Aug. 2021 / Revision 1
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datasheet
H-Bridge Switching Characteristics
figure 8.
MOSFET
figure 9.
MOSFET
Typical switching energy losses as a function of drain current
Typical switching energy losses as a function of gate resistor
E = f(ID)
E = f(Rg)
1,0
0,8
0,6
0,4
0,2
0,0
1,0
0,8
0,6
0,4
0,2
0,0
Eon
Eon
Eon
Eon
Eon
Eon
Eoff
Eoff
Eoff
Eoff
Eoff
Eoff
0
25
50
75
100
125
ID(A)
0
1
2
3
4
5
6
7
8
9
Rg(Ω)
With an inductive load at
With an inductive load at
25 °C
25 °C
VDS
=
=
=
=
VDS
VGS
ID
=
=
=
600
-5/15
2
V
V
Ω
Ω
125 °C
150 °C
600
-5/15
60
V
V
A
125 °C
150 °C
Tj:
Tj:
VGS
Rgon
Rgoff
2
figure 10.
MOSFET
figure 11.
MOSFET
Typical reverse recovered energy loss as a function of drain current
Typical reverse recovered energy loss as a function of gate resistor
Erec = f(ID)
Erec = f(Rg)
0,200
0,175
0,150
0,125
0,100
0,075
0,050
0,025
0,000
0,225
0,200
0,175
0,150
0,125
0,100
0,075
0,050
0,025
0,000
Erec
Erec
Erec
Erec
Erec
Erec
0
25
50
75
100
125
ID(A)
0
1
2
3
4
5
6
7
8
9
Rg(Ω)
With an inductive load at
With an inductive load at
25 °C
25 °C
VDS
=
=
=
VDS
VGS
ID
=
=
=
600
-5/15
2
V
V
Ω
125 °C
150 °C
600
-5/15
60
V
V
A
125 °C
150 °C
Tj:
Tj:
VGS
Rgon
Copyright Vincotech
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03 Aug. 2021 / Revision 1
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datasheet
H-Bridge Switching Characteristics
figure 12.
MOSFET
figure 13.
MOSFET
Typical switching times as a function of drain current
Typical switching times as a function of gate resistor
t = f(ID)
t = f(Rg)
-1
10
-1
10
td(off)
td(off)
td(on)
tf
td(on)
-2
10
-2
10
tr
tf
tr
-3
10
-3
10
0
25
50
75
100
125
ID(A)
0
1
2
3
4
5
6
7
8
9
Rg(Ω)
With an inductive load at
With an inductive load at
Tj =
Tj =
150
600
-5/15
2
°C
V
150
600
-5/15
60
°C
V
VDS
=
=
=
=
VDS
=
=
=
VGS
Rgon
Rgoff
VGS
ID
V
V
Ω
Ω
A
2
figure 14.
MOSFET
figure 15.
MOSFET
Typical reverse recovery time as a function of drain current
Typical reverse recovery time as a function of turn off gate resistor
trr = f(ID)
trr = f(Rgoff)
0,0225
0,0200
0,0175
0,0150
0,0125
0,0100
0,0075
0,0050
0,0025
0,0000
0,0225
0,0200
0,0175
0,0150
0,0125
0,0100
0,0075
0,0050
0,0025
0,0000
trr
trr
trr
trr
trr
trr
0
25
50
75
100
125
ID(A)
0
1
2
3
4
5
6
7
8
9
Rgoff(Ω)
VDS
VGS
=
=
=
VDS
VGS
ID
=
=
=
At
600
-5/15
2
V
At
600
-5/15
60
V
25 °C
125 °C
150 °C
25 °C
125 °C
150 °C
V
V
A
Tj:
Tj:
Rgon
Ω
Copyright Vincotech
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datasheet
H-Bridge Switching Characteristics
figure 16.
MOSFET
figure 17.
MOSFET
Typical recovered charge as a function of drain current
Typical recovered charge as a function of turn off gate resistor
Qr = f(ID)
Qr = f(Rgoff)
2,25
2,00
1,75
1,50
1,25
1,00
0,75
0,50
0,25
0,00
2,00
1,75
1,50
1,25
1,00
0,75
0,50
0,25
0,00
Qr
Qr
Qr
Qr
Qr
Qr
0
25
50
75
100
125
ID(A)
0
1
2
3
4
5
6
7
8
9
Rgoff(Ω)
VDS
VGS
=
=
=
VDS
VGS
ID
=
=
=
At
600
-5/15
2
V
V
Ω
At
600
V
V
A
25 °C
125 °C
150 °C
25 °C
125 °C
150 °C
-5/15
60
Tj:
Tj:
Rgon
figure 18.
MOSFET
figure 19.
MOSFET
Typical peak reverse recovery current as a function of drain current
Typical peak reverse recovery current as a function of turn off gate resistor
IRM = f(ID)
IRM = f(Rgoff)
175
150
125
100
75
175
150
125
100
75
IRM
IRM
IRM
IRM
IRM
IRM
50
50
25
25
0
0
0
25
50
75
100
125
ID(A)
0
1
2
3
4
5
6
7
8
R
9
goff(Ω)
VDS
VGS
=
=
=
VDS
VGS
ID
=
=
=
At
600
V
V
Ω
At
600
V
V
A
25 °C
125 °C
150 °C
25 °C
125 °C
150 °C
-5/15
2
-5/15
60
Tj:
Tj:
Rgon
Copyright Vincotech
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datasheet
H-Bridge Switching Characteristics
figure 20.
MOSFET
figure 21.
MOSFET
Typical rate of fall of forward and reverse recovery current as a function of drain current
Typical rate of fall of forward and reverse recovery current as a function of turn off gate resistor
diF/dt, dirr/dt = f(ID)
diF/dt, dirr/dt = f(Rgoff)
60000
40000
35000
30000
25000
20000
15000
10000
5000
diF/dt ‒ ‒ ‒ ‒ ‒
diF/dt ‒ ‒ ‒ ‒ ‒
dirr/dt ──────
dirr/dt ──────
50000
40000
30000
20000
10000
0
0
0
25
50
75
100
125
ID(A)
0
1
2
3
4
5
6
7
8
9
Rgoff(Ω)
VDS
VGS
=
=
=
VDS
VGS
ID
=
=
=
At
600
-5/15
2
V
V
Ω
At
600
-5/15
60
V
25 °C
125 °C
150 °C
25 °C
125 °C
150 °C
V
A
Tj:
Tj:
Rgon
figure 22.
MOSFET
Reverse bias safe operating area
ID = f(VDS
)
150
ID MAX
125
100
75
50
25
0
0
200
400
600
800
1000
V
DS(V)
Tj =
At
150
2
°C
Ω
Rgon
Rgoff
=
=
2
Ω
Copyright Vincotech
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03 Aug. 2021 / Revision 1
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datasheet
H-Bridge Switching Definitions
figure 23.
MOSFET
figure 24.
MOSFET
Turn-off Switching Waveforms & definition of tdoff, tEoff (tEoff = integrating time for Eoff
)
Turn-on Switching Waveforms & definition of tdon, tEon (tEon = integrating time for Eon
)
tdoff
IC
IC
VGE
VGE
VCE
tEoff
VCE
tEon
figure 25.
MOSFET
figure 26.
MOSFET
Turn-off Switching Waveforms & definition of tf
Turn-on Switching Waveforms & definition of tr
ID
IC
VCE
tr
VDS
tf
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datasheet
H-Bridge Switching Definitions
figure 27.
FWD
figure 28.
FWD
Turn-off Switching Waveforms & definition of ttrr
Turn-on Switching Waveforms & definition of tQrr (tQrr = integrating time for Qrr)
Qr
IF
IF
fitted
VF
figure 29.
FWD
Turn-on Switching Waveforms & definition of tErec (tErec = integrating time for Erec
)
%
Erec
tErec
Prec
3.01
3.1
3.19
3.28
3.37
3.46
t (µs)
Copyright Vincotech
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datasheet
Ordering Code
Version
Ordering Code
Without thermal paste
With thermal paste (4,4 W/mK, PTM6000)
With thermal paste (3,4 W/mK, PSX-P7)
10-FU094PB017ME02-L620F36
10-FU094PB017ME02-L620F36-/7/
10-FU094PB017ME02-L620F36-/3/
Marking
Name
Date code
UL & VIN
Lot
Serial
Text
NN-NNNNNNNNNNNNNN-
TTTTTTVV
WWYY
UL VIN
LLLLL
SSSS
Type&Ver
Lot number
Serial
Date code
Datamatrix
TTTTTTTVV
LLLLL
SSSS
WWYY
Outline
Pin table [mm]
Pin
1
2
3
4
5
6
7
8
X
0
2,9
8,3
Y
22,5
22,5
22,5
22,5
22,5
22,5
22,5
22,5
17,8
15,3
7,2
4,7
0
0
0
0
0
0
0
0
8
Function
G11
S11
DC-1
DC-1
DC+
DC+
S12
G12
Ph1
Ph1
Ph2
10,8
19,6
22,1
29,1
32
33,5
33,5
33,5
33,5
32
29,1
22,1
19,6
10,8
8,3
9
10
11
12
13
14
15
16
17
18
19
20
21
22
Ph2
G14
S14
DC+
DC+
DC-2
DC-2
S13
G13
Therm1
Therm2
2,9
0
0
0
14,5
Copyright Vincotech
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datasheet
Pinout
DC+
5,6,15,16
T12
T14
G12
S12
G14
S14
8
13
14
7
Ph1
9,10
C10
C20
Ph2
11,12
T11
T13
G11
S11
G13
20
1
2
S13
19
Rt
3,4
DC-1
17,18
DC-2
Therm1
21
Therm2
22
Identification
Component
Voltage
Current
21,67 mΩ
Function
Comment
ID
T11, T12, T13, T14
MOSFET
Capacitor
Thermistor
900 V
1000 V
H-Bridge Switch
Capacitor (DC)
Thermistor
C10, C20
Rt
Copyright Vincotech
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datasheet
Packaging instruction
Handling instruction
Standard packaging quantity (SPQ) 135
>SPQ
Standard
<SPQ
Sample
Handling instructions for flow 0 packages see vincotech.com website.
Package data
Package data for flow 0 packages see vincotech.com website.
Vincotech thermistor reference
See Vincotech thermistor reference table at vincotech.com website.
UL recognition and file number
This device is certified according to UL 1557 standard, UL file number E192116. For more information see vincotech.com website.
Document No.:
Date:
Modification:
Pages
10-FU094PB017ME02-L620F36-D1-14
3 Aug. 2021
Initial Release
DISCLAIMER
The information, specifications, procedures, methods and recommendations herein (together “information”) are presented by Vincotech to
reader in good faith, are believed to be accurate and reliable, but may well be incomplete and/or not applicable to all conditions or situations
that may exist or occur. Vincotech reserves the right to make any changes without further notice to any products to improve reliability,
function or design. No representation, guarantee or warranty is made to reader as to the accuracy, reliability or completeness of said
information or that the application or use of any of the same will avoid hazards, accidents, losses, damages or injury of any kind to persons
or property or that the same will not infringe third parties rights or give desired results. It is reader’s sole responsibility to test and determine
the suitability of the information and the product for reader’s intended use.
LIFE SUPPORT POLICY
Vincotech products are not authorised for use as critical components in life support devices or systems without the express written approval
of Vincotech.
As used herein:
1. Life support devices or systems are devices or systems which, (a) are intended for surgical implant into the body, or (b) support or
sustain life, or (c) whose failure to perform when properly used in accordance with instructions for use provided in labelling can be
reasonably expected to result in significant injury to the user.
2. A critical component is any component of a life support device or system whose failure to perform can be reasonably expected to cause
the failure of the life support device or system, or to affect its safety or effectiveness.
Copyright Vincotech
17
03 Aug. 2021 / Revision 1
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