10-PZ124PA036MR-L629F18Y [VINCOTECH]

Easy paralleling;Low on-resistance;Fast switching speed;Fast recovery body diode;
10-PZ124PA036MR-L629F18Y
型号: 10-PZ124PA036MR-L629F18Y
厂家: VINCOTECH    VINCOTECH
描述:

Easy paralleling;Low on-resistance;Fast switching speed;Fast recovery body diode

文件: 总17页 (文件大小:6627K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
10-PZ124PA036MR-L629F18Y  
datasheet  
fastPACK 0 SiC  
1200 V / 36 mΩ  
Topology features  
flow 0 12 mm housing  
● Kelvin Emitter for improved switching performance  
● Integrated DC capacitor  
● Open Emitter configuration  
● Temperature sensor  
Component features  
● Easy paralleling  
● Low on-resistance  
● Fast switching speed  
● Fast recovery body diode  
Housing features  
● Base isolation: Al2O3  
● Clip-in, reliable mechanical connection, qualified for wave  
soldering  
Schematic  
● Convex shaped substrate for superior thermal contact  
● Thermo-mechanical push-and-pull force relief  
● Press-fit pin  
● Reliable cold welding connection  
Target applications  
● Charging Stations  
● Power Supply  
Types  
● 10-PZ124PA036MR-L629F18Y  
Copyright Vincotech  
1
02 May. 2023 / Revision 1  
10-PZ124PA036MR-L629F18Y  
datasheet  
Maximum Ratings  
Tj = 25 °C, unless otherwise specified  
Parameter  
Symbol  
Conditions  
Value  
Unit  
H-Bridge Switch  
VDSS  
Drain-source voltage  
1200  
28  
V
A
ID  
Drain current (DC current)  
Peak drain current  
Tj = Tjmax  
Ts = 80 °C  
Ts = 80 °C  
IDM  
tp limited by Tjmax  
Tj = Tjmax  
84  
A
Ptot  
Total power dissipation  
57  
W
-4 / 21  
-4 / 23  
175  
VGSS  
Gate-source voltage  
V
dynamic  
Tjmax  
Maximum Junction Temperature  
°C  
Capacitor (DC)  
VMAX  
Maximum DC voltage  
1000  
V
Top  
Operation Temperature  
-55 ... 125  
°C  
Module Properties  
Thermal Properties  
Tstg  
Tjop  
Storage temperature  
-40…+125  
°C  
°C  
Operation temperature under switching  
condition  
-40…+(Tjmax - 25)  
Isolation Properties  
Isolation voltage  
Isolation voltage  
Creepage distance  
Clearance  
Visol  
Visol  
DC Test Voltage*  
AC Voltage  
tp = 2 s  
6000  
2500  
>12,7  
9,15  
V
tp = 1 min  
V
mm  
mm  
Comparative Tracking Index  
*100 % tested in production  
CTI  
≥ 200  
Copyright Vincotech  
2
02 May. 2023 / Revision 1  
10-PZ124PA036MR-L629F18Y  
datasheet  
Characteristic Values  
Symbol  
Parameter  
Conditions  
Values  
Typ  
Unit  
VCE [V] IC [A]  
VDS [V] ID [A] Tj [°C]  
VF [V] IF [A]  
VGE [V]  
VGS [V]  
Min  
Max  
H-Bridge Switch  
Static  
25  
34,8  
56,4  
65  
45(1)  
rDS(on)  
Drain-source on-state resistance  
18  
21  
125  
150  
mΩ  
VGS(th)  
IGSS  
IDSS  
rg  
Gate-source threshold voltage  
Gate to Source Leakage Current  
Zero Gate Voltage Drain Current  
Internal gate resistance  
Gate charge  
0
0,0111  
25  
25  
25  
2,8  
3,5  
4,8  
100  
80  
V
21  
0
0
nA  
µA  
1200  
1
1
Qg  
91  
20  
24  
2335  
70  
5
QGS  
QGD  
Ciss  
Coss  
Crss  
VSD  
Gate to source charge  
0/18  
800  
21  
25  
nC  
Gate to drain charge  
Short-circuit input capacitance  
Short-circuit output capacitance  
Reverse transfer capacitance  
Diode forward voltage  
f = 1 Mhz  
0
0
800  
0
25  
25  
pF  
V
21  
3,3  
Thermal  
λpaste = 3,4 W/mK  
(PSX)  
Thermal resistance junction to sink(2)  
1,67  
K/W  
Rth(j-s)  
Copyright Vincotech  
3
02 May. 2023 / Revision 1  
10-PZ124PA036MR-L629F18Y  
datasheet  
Characteristic Values  
Symbol  
Parameter  
Conditions  
Values  
Typ  
Unit  
VCE [V] IC [A]  
VDS [V] ID [A] Tj [°C]  
VGE [V]  
VGS [V]  
Min  
Max  
VF [V]  
IF [A]  
Dynamic  
25  
23,66  
24,1  
td(on)  
Turn-on delay time  
125  
150  
25  
ns  
ns  
24,25  
9,16  
tr  
td(off)  
tf  
Rise time  
125  
150  
25  
8,85  
8,87  
Rgon = 8 Ω  
Rgoff = 8 Ω  
22,68  
25,6  
Turn-off delay time  
125  
150  
25  
ns  
26,37  
5,26  
Fall time  
125  
150  
25  
4,81  
ns  
4,95  
QrFWD=0,143 µC  
QrFWD=0,256 µC  
QrFWD=0,345 µC  
0,292  
0,302  
0,327  
0,047  
0,047  
0,049  
20,46  
22,24  
23,57  
12,47  
20,96  
22,23  
0,143  
0,256  
0,345  
0,027  
0,079  
0,117  
4788,08  
1225,34  
2042,95  
Eon  
Turn-on energy (per pulse)  
Turn-off energy (per pulse)  
Peak recovery current  
Reverse recovery time  
Recovered charge  
125  
150  
25  
mWs  
mWs  
A
Eoff  
±16  
600  
30  
125  
150  
25  
IRRM  
125  
150  
25  
trr  
125  
150  
25  
ns  
di/dt=3697 A/µs  
di/dt=3631 A/µs  
di/dt=4134 A/µs  
Qr  
125  
150  
25  
μC  
Erec  
Reverse recovered energy  
Peak rate of fall of recovery current  
125  
150  
25  
mWs  
A/µs  
(dirf/dt)max  
125  
150  
Copyright Vincotech  
4
02 May. 2023 / Revision 1  
10-PZ124PA036MR-L629F18Y  
datasheet  
Characteristic Values  
Symbol  
Parameter  
Conditions  
Values  
Typ  
Unit  
VCE [V] IC [A]  
VDS [V] ID [A] Tj [°C]  
VF [V] IF [A]  
VGE [V]  
VGS [V]  
Min  
Max  
Capacitor (DC)  
Static  
DC bias voltage =  
0 V  
C
Capacitance  
25  
25  
10  
nF  
%
%
Tolerance  
-10  
10  
Dissipation factor  
f = 1 kHz  
0,1  
Thermistor  
Static  
R
ΔR/R  
P
Rated resistance  
Deviation of R100  
Power dissipation  
Power dissipation constant  
B-value  
25  
22  
kΩ  
%
R100 = 1484 Ω  
100  
25  
-5  
5
130  
1,5  
mW  
mW/K  
K
d
25  
B(25/50)  
Tol. ±1 %  
Tol. ±1 %  
3962  
4000  
B(25/100)  
B-value  
K
Vincotech Thermistor Reference  
I
(1)  
Value at chip level  
(2)  
Only valid with pre-applied Vincotech thermal interface material.  
Copyright Vincotech  
5
02 May. 2023 / Revision 1  
10-PZ124PA036MR-L629F18Y  
datasheet  
H-Bridge Switch Characteristics  
figure 1.  
MOSFET  
figure 2.  
MOSFET  
Typical output characteristics  
Typical output characteristics  
ID = f(VDS  
)
ID = f(VDS)  
80  
80  
VGS  
:
-4 V  
-2 V  
0 V  
60  
40  
2 V  
60  
40  
20  
0
4 V  
6 V  
8 V  
20  
10 V  
12 V  
14 V  
16 V  
18 V  
20 V  
0
-20  
-40  
-60  
-80  
0,0  
2,5  
5,0  
7,5  
10,0  
12,5  
-10,0 -7,5  
-5,0  
-2,5  
0,0  
2,5  
5,0  
7,5  
10,0 12,5  
V
DS(V)  
VDS(V)  
tp  
=
=
tp  
=
250  
18  
μs  
V
250  
150  
μs  
°C  
25 °C  
VGS  
Tj =  
125 °C  
150 °C  
Tj:  
VGS from -4 V to 20 V in steps of 2 V  
figure 3.  
MOSFET  
figure 4.  
MOSFET  
Typical transfer characteristics  
Transient thermal impedance as a function of pulse width  
ID = f(VGS  
)
Zth(j-s) = f(tp)  
1
35  
10  
30  
25  
20  
15  
10  
5
0
10  
-1  
10  
0,5  
0,2  
-2  
10  
0,1  
0,05  
0,02  
0,01  
0,005  
0
-3  
0
0
10  
-5  
-4  
10  
-3  
10  
-2  
10  
-1  
10  
0
10  
1
10  
2
10  
2
4
6
8
10  
12  
10  
V
GS(V)  
tp(s)  
tp  
=
=
250  
10  
μs  
V
D =  
tp / T  
1,672  
25 °C  
VDS  
125 °C  
150 °C  
Rth(j-s) =  
Tj:  
K/W  
MOSFET thermal model values  
R (K/W)  
τ (s)  
1,22E-01  
3,62E-01  
8,39E-01  
2,77E-01  
7,32E-02  
2,51E+00  
2,54E-01  
5,37E-02  
7,82E-03  
8,42E-04  
Copyright Vincotech  
6
02 May. 2023 / Revision 1  
10-PZ124PA036MR-L629F18Y  
datasheet  
H-Bridge Switch Characteristics  
figure 5.  
MOSFET  
figure 6.  
MOSFET  
Safe operating area  
Gate voltage vs gate charge  
ID = f(VDS  
)
VGS = f(Qg)  
100  
22,5  
20,0  
17,5  
15,0  
12,5  
10,0  
7,5  
10  
1
0,1  
0,01  
5,0  
2,5  
0,0  
1
10  
100  
1000  
10000  
0
20  
40  
60  
80  
100  
V
DS(V)  
Qg(μC)  
D =  
ID  
=
single pulse  
21  
25  
A
Ts =  
Tj =  
80  
18  
°C  
V
°C  
VGS  
=
Tj =  
Tjmax  
Copyright Vincotech  
7
02 May. 2023 / Revision 1  
10-PZ124PA036MR-L629F18Y  
datasheet  
Thermistor Characteristics  
figure 7.  
Thermistor  
Typical NTC characteristic as function of temperature  
RT = f(T)  
25000  
20000  
15000  
10000  
5000  
0
20  
40  
60  
80  
100  
120  
140  
T(°C)  
Copyright Vincotech  
8
02 May. 2023 / Revision 1  
10-PZ124PA036MR-L629F18Y  
datasheet  
H-Bridge Switching Characteristics  
figure 8.  
MOSFET  
figure 9.  
MOSFET  
Typical switching energy losses as a function of drain current  
Typical switching energy losses as a function of MOSFET turn on gate resistor  
E = f(ID)  
E = f(Rg)  
0,7  
0,6  
0,5  
0,4  
0,3  
0,2  
0,1  
0,0  
1,0  
0,8  
0,6  
0,4  
0,2  
0,0  
Eon  
Eon  
Eon  
Eon  
Eon  
Eon  
Eoff  
Eoff  
Eoff  
Eoff  
Eoff  
Eoff  
0
10  
20  
30  
40  
50  
60  
0
5
10  
15  
20  
25  
30  
35  
ID(A)  
Rg(Ω)  
With an inductive load at  
With an inductive load at  
25 °C  
25 °C  
VDS  
VGS  
=
=
=
=
VDS  
VGS  
ID  
=
=
=
600  
±16  
8
V
V
Ω
Ω
125 °C  
150 °C  
600  
±16  
30  
V
125 °C  
150 °C  
Tj:  
Tj:  
V
A
Rgon  
Rgoff  
8
figure 10.  
MOSFET  
figure 11.  
MOSFET  
Typical reverse recovered energy loss as a function of drain current  
Typical reverse recovered energy loss as a function of MOSFET turn on gate resistor  
Erec = f(ID)  
Erec = f(Rg)  
0,175  
0,150  
0,125  
0,100  
0,075  
0,050  
0,025  
0,000  
0,225  
0,200  
0,175  
0,150  
0,125  
0,100  
0,075  
0,050  
0,025  
0,000  
Erec  
Erec  
Erec  
Erec  
Erec  
Erec  
0
10  
20  
30  
40  
50  
60  
0
5
10  
15  
20  
25  
30  
35  
ID(A)  
Rg(Ω)  
With an inductive load at  
With an inductive load at  
25 °C  
25 °C  
VDS  
VGS  
=
=
=
VDS  
VGS  
ID  
=
=
=
600  
±16  
8
V
V
Ω
125 °C  
150 °C  
600  
±16  
30  
V
V
A
125 °C  
150 °C  
Tj:  
Tj:  
Rgon  
Copyright Vincotech  
9
02 May. 2023 / Revision 1  
10-PZ124PA036MR-L629F18Y  
datasheet  
H-Bridge Switching Characteristics  
figure 12.  
MOSFET  
figure 13.  
MOSFET  
Typical switching times as a function of drain current  
Typical switching times as a function of MOSFET turn on gate resistor  
t = f(ID)  
t = f(Rg)  
-1  
10  
-1  
10  
td(on)  
td(off)  
tr  
tf  
td(off)  
td(on)  
tr  
-2  
10  
-2  
10  
tf  
-3  
10  
-3  
10  
0
10  
20  
30  
40  
50  
60  
0
5
10  
15  
20  
25  
30  
35  
ID(A)  
Rg(Ω)  
With an inductive load at  
With an inductive load at  
Tj =  
Tj =  
150  
600  
±16  
8
°C  
V
150  
600  
±16  
30  
°C  
VDS  
=
=
=
=
VDS  
=
=
=
V
V
A
VGS  
Rgon  
Rgoff  
VGS  
ID  
V
Ω
Ω
8
figure 14.  
MOSFET  
figure 15.  
MOSFET  
Typical reverse recovery time as a function of drain current  
Typical reverse recovery time as a function of MOSFET turn on gate resistor  
trr = f(ID)  
trr = f(Rgon)  
0,030  
0,025  
0,020  
0,015  
0,010  
0,005  
0,000  
0,06  
0,05  
0,04  
0,03  
0,02  
0,01  
0,00  
trr  
trr  
trr  
trr  
trr  
trr  
0
10  
20  
30  
40  
50  
60  
0
5
10  
15  
20  
25  
30  
35  
ID(A)  
Rgon(Ω)  
VDS  
=
=
=
VDS  
VGS  
ID  
=
=
=
At  
600  
V
V
Ω
At  
600  
±16  
30  
V
V
A
25 °C  
25 °C  
VGS  
±16  
8
125 °C  
150 °C  
125 °C  
150 °C  
Tj:  
Tj:  
Rgon  
Copyright Vincotech  
10  
02 May. 2023 / Revision 1  
10-PZ124PA036MR-L629F18Y  
datasheet  
H-Bridge Switching Characteristics  
figure 16.  
MOSFET  
figure 17.  
MOSFET  
Typical recovered charge as a function of drain current  
Typical recovered charge as a function of MOSFET turn on gate resistor  
Qr = f(ID)  
Qr = f(Rgon)  
0,6  
0,5  
0,4  
0,3  
0,2  
0,1  
0,0  
0,6  
0,5  
0,4  
0,3  
0,2  
0,1  
0,0  
Qr  
Qr  
Qr  
Qr  
Qr  
Qr  
0
10  
20  
30  
40  
50  
60  
0
5
10  
15  
20  
25  
30  
35  
ID(A)  
Rgon(Ω)  
VDS  
VGS  
=
=
=
VDS  
VGS  
ID  
=
=
=
At  
600  
±16  
8
V
V
Ω
At  
600  
±16  
30  
V
25 °C  
25 °C  
125 °C  
150 °C  
V
A
125 °C  
150 °C  
Tj:  
Tj:  
Rgon  
figure 18.  
MOSFET  
figure 19.  
MOSFET  
Typical peak reverse recovery current as a function of drain current  
Typical peak reverse recovery current as a function of MOSFET turn on gate resistor  
IRM = f(ID)  
IRM = f(Rgon)  
30  
25  
20  
15  
10  
5
70  
60  
50  
40  
30  
20  
10  
0
IRM  
IRM  
IRM  
IRM  
IRM  
IRM  
0
0
10  
20  
30  
40  
50  
60  
0
5
10  
15  
20  
25  
30  
35  
ID(A)  
Rgon(Ω)  
VDS  
VGS  
=
=
=
VDS  
VGS  
ID  
=
=
=
At  
600  
±16  
8
V
V
Ω
At  
600  
±16  
30  
V
25 °C  
25 °C  
125 °C  
150 °C  
V
A
125 °C  
150 °C  
Tj:  
Tj:  
Rgon  
Copyright Vincotech  
11  
02 May. 2023 / Revision 1  
10-PZ124PA036MR-L629F18Y  
datasheet  
H-Bridge Switching Characteristics  
figure 20.  
MOSFET  
figure 21.  
MOSFET  
Typical rate of fall of forward and reverse recovery current as a function of drain current  
Typical rate of fall of forward and reverse recovery current as a function of turn on gate resistor  
diF/dt, dirr/dt = f(ID)  
diF/dt, dirr/dt = f(Rgon)  
7000  
22500  
20000  
17500  
15000  
12500  
10000  
7500  
5000  
2500  
0
diF/dt ‒ ‒ ‒ ‒ ‒  
diF/dt ‒ ‒ ‒ ‒ ‒  
dirr/dt ──────  
dirr/dt ──────  
6000  
5000  
4000  
3000  
2000  
1000  
0
0
10  
20  
30  
40  
50  
60  
ID(A)  
0
5
10  
15  
20  
25  
30  
35  
R
gon(Ω)  
VDS  
=
=
=
VDS  
VGS  
ID  
=
=
=
At  
600  
V
V
Ω
At  
600  
V
V
A
25 °C  
25 °C  
VGS  
±16  
8
125 °C  
150 °C  
±16  
30  
125 °C  
150 °C  
Tj:  
Tj:  
Rgon  
figure 22.  
MOSFET  
Reverse bias safe operating area  
ID = f(VDS  
)
50  
ID MAX  
40  
30  
20  
10  
0
0
250  
500  
750  
1000  
1250  
1500  
V
DS(V)  
Tj =  
At  
150  
°C  
Ω
Rgon  
Rgoff  
=
=
8
8
Ω
Copyright Vincotech  
12  
02 May. 2023 / Revision 1  
10-PZ124PA036MR-L629F18Y  
datasheet  
H-Bridge Switching Definitions  
figure 23.  
MOSFET  
figure 24.  
MOSFET  
Turn-off Switching Waveforms & definition of tdoff, tEoff (tEoff = integrating time for Eoff  
)
Turn-on Switching Waveforms & definition of tdon, tEon (tEon = integrating time for Eon  
)
tdoff  
IC  
IC  
VGE  
VGE  
VCE  
tEoff  
VCE  
tEon  
figure 25.  
MOSFET  
figure 26.  
MOSFET  
Turn-off Switching Waveforms & definition of tf  
Turn-on Switching Waveforms & definition of tr  
ID  
IC  
VCE  
tr  
VDS  
tf  
Copyright Vincotech  
13  
02 May. 2023 / Revision 1  
10-PZ124PA036MR-L629F18Y  
datasheet  
H-Bridge Switching Definitions  
figure 27.  
FWD  
figure 28.  
FWD  
Turn-off Switching Waveforms & definition of ttrr  
Turn-on Switching Waveforms & definition of tQrr (tQrr = integrating time for Qrr)  
Qr  
IF  
IF  
fitted  
VF  
figure 29.  
FWD  
Turn-on Switching Waveforms & definition of tErec (tErec = integrating time for Erec  
)
%
E
rec  
tErec  
P
rec  
t (µs)  
Copyright Vincotech  
14  
02 May. 2023 / Revision 1  
10-PZ124PA036MR-L629F18Y  
datasheet  
Ordering Code  
Version  
Ordering Code  
Without thermal paste  
10-PZ124PA036MR-L629F18Y  
10-PZ124PA036MR-L629F18Y-/7/  
10-PZ124PA036MR-L629F18Y-/3/  
With thermal paste (5,2 W/mK, PTM6000HV)  
With thermal paste (3,4 W/mK, PSX-P7)  
Marking  
Name  
Date code  
UL & VIN  
Lot  
Serial  
Text  
NN-NNNNNNNNNNNNNN-  
TTTTTTVV  
WWYY  
UL VIN  
LLLLL  
SSSS  
Type&Ver  
Lot number  
Serial  
Date code  
Datamatrix  
TTTTTTTVV  
LLLLL  
SSSS  
WWYY  
Outline  
Pin table [mm]  
Pin  
1
X
Y
22,5  
22,5  
22,5  
22,5  
22,5  
22,5  
22,5  
22,5  
17,8  
15,3  
7,2  
4,7  
0
Function  
G11  
0
2
2,9  
S11  
3
8,3  
DC-1  
DC-1  
DC+  
DC+  
S12  
4
10,8  
19,6  
22,1  
29,1  
32  
5
6
7
8
G12  
9
33,5  
33,5  
33,5  
33,5  
32  
Ph1  
10  
11  
12  
13  
14  
15  
16  
17  
18  
19  
20  
21  
22  
Ph1  
Ph2  
Ph2  
G14  
29,1  
22,1  
19,6  
10,8  
8,3  
0
S14  
0
DC+  
DC+  
DC-2  
DC-2  
S13  
0
0
0
2,9  
0
0
0
G13  
0
8
Therm1  
Therm2  
0
14,5  
Copyright Vincotech  
15  
02 May. 2023 / Revision 1  
10-PZ124PA036MR-L629F18Y  
datasheet  
Pinout  
DC+  
5,6,15,16  
T12  
T14  
G12  
S12  
G14  
S14  
8
13  
14  
7
Ph1  
9,10  
C10  
C20  
Ph2  
11,12  
T11  
T13  
G11  
S11  
G13  
20  
1
2
S13  
19  
Rt  
3,4  
DC-1  
17,18  
DC-2  
Therm1  
21  
Therm2  
22  
Identification  
Component  
Voltage  
Current  
36 mΩ  
Function  
Comment  
ID  
T11, T12, T13, T14  
MOSFET  
Capacitor  
Thermistor  
1200 V  
1000 V  
H-Bridge Switch  
Capacitor (DC)  
Thermistor  
C10, C20  
Rt  
Copyright Vincotech  
16  
02 May. 2023 / Revision 1  
10-PZ124PA036MR-L629F18Y  
datasheet  
Packaging instruction  
Handling instruction  
Standard packaging quantity (SPQ) 135  
>SPQ  
Standard  
<SPQ  
Sample  
Handling instructions for flow 0 packages see vincotech.com website.  
Package data  
Package data for flow 0 packages see vincotech.com website.  
Vincotech thermistor reference  
See Vincotech thermistor reference table at vincotech.com website.  
UL recognition and file number  
This device is certified according to UL 1557 standard, UL file number E192116. For more information see vincotech.com website.  
Document No.:  
Date:  
Modification:  
Pages  
10-PZ124PA036MR-L629F18Y-D1-14  
2 May. 2023  
Initial release  
DISCLAIMER  
The information, specifications, procedures, methods and recommendations herein (together “information”) are presented by Vincotech to  
reader in good faith, are believed to be accurate and reliable, but may well be incomplete and/or not applicable to all conditions or situations  
that may exist or occur. Vincotech reserves the right to make any changes without further notice to any products to improve reliability,  
function or design. No representation, guarantee or warranty is made to reader as to the accuracy, reliability or completeness of said  
information or that the application or use of any of the same will avoid hazards, accidents, losses, damages or injury of any kind to persons  
or property or that the same will not infringe third parties rights or give desired results. It is reader’s sole responsibility to test and determine  
the suitability of the information and the product for reader’s intended use.  
LIFE SUPPORT POLICY  
Vincotech products are not authorised for use as critical components in life support devices or systems without the express written approval  
of Vincotech.  
As used herein:  
1. Life support devices or systems are devices or systems which, (a) are intended for surgical implant into the body, or (b) support or  
sustain life, or (c) whose failure to perform when properly used in accordance with instructions for use provided in labelling can be  
reasonably expected to result in significant injury to the user.  
2. A critical component is any component of a life support device or system whose failure to perform can be reasonably expected to cause  
the failure of the life support device or system, or to affect its safety or effectiveness.  
Copyright Vincotech  
17  
02 May. 2023 / Revision 1  

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