30-FT12NIA150SH-LG09F08 [VINCOTECH]

Easy paralleling;High speed switching;Low switching losses;
30-FT12NIA150SH-LG09F08
型号: 30-FT12NIA150SH-LG09F08
厂家: VINCOTECH    VINCOTECH
描述:

Easy paralleling;High speed switching;Low switching losses

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中文:  中文翻译
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30-FT12NIA150SH-LG09F08  
30-PT12NIA150SH-LG09F08Y  
datasheet  
flowNPC 2  
1500 V / 150 A  
Features  
flow 2 13 mm housing  
● 1200 V components for 1500 VDC systems  
● Four quadrant operation  
Solder pin  
Press-fit pin  
Schematic  
Target applications  
● Solar Inverters  
● Special Application  
Types  
● 30-FT12NIA150SH-LG09F08  
● 30-PT12NIA150SH-LG09F08Y  
Maximum Ratings  
Tj = 25 °C, unless otherwise specified  
Parameter  
Symbol  
Condition  
Value  
Unit  
Buck Switch  
VCES  
IC  
Collector-emitter voltage  
1200  
137  
450  
345  
±20  
10  
V
A
Collector current  
Tj = Tjmax  
Ts = 80 °C  
Ts = 80 °C  
Tj = 150 °C  
ICRM  
Ptot  
VGES  
tSC  
Repetitive peak collector current  
Total power dissipation  
Gate-emitter voltage  
tp limited by Tjmax  
Tj = Tjmax  
A
W
V
Short circuit ratings  
VGE = 15 V  
Vcc = 800 V  
µs  
°C  
Tjmax  
Maximum junction temperature  
175  
Copyright Vincotech  
1
09 Jul. 2019 / Revision 3  
30-FT12NIA150SH-LG09F08  
30-PT12NIA150SH-LG09F08Y  
datasheet  
Maximum Ratings  
Tj = 25 °C, unless otherwise specified  
Parameter  
Symbol  
Condition  
Value  
Unit  
Buck Diode  
VRRM  
IF  
IFRM  
Ptot  
Peak repetitive reverse voltage  
1300  
94  
V
A
Continuous (direct) forward current  
Repetitive peak forward current  
Total power dissipation  
Tj = Tjmax  
Ts = 80 °C  
Ts = 80 °C  
300  
233  
175  
A
Tj = Tjmax  
W
°C  
Tjmax  
Maximum junction temperature  
Buck Sw. Protection Diode  
VRRM  
IF  
Ptot  
Tjmax  
Peak repetitive reverse voltage  
1300  
28  
V
A
Continuous (direct) forward current  
Total power dissipation  
Tj = Tjmax  
Tj = Tjmax  
Ts = 80 °C  
Ts = 80 °C  
97  
W
°C  
Maximum junction temperature  
175  
Boost Switch  
VCES  
IC  
Collector-emitter voltage  
1200  
137  
450  
345  
±20  
10  
V
A
Collector current  
Tj = Tjmax  
Ts = 80 °C  
Ts = 80 °C  
Tj = 150 °C  
ICRM  
Ptot  
VGES  
tSC  
Repetitive peak collector current  
Total power dissipation  
Gate-emitter voltage  
tp limited by Tjmax  
Tj = Tjmax  
A
W
V
Short circuit ratings  
VGE = 15 V  
Vcc = 800 V  
µs  
°C  
Tjmax  
Maximum junction temperature  
175  
Boost Diode  
VRRM  
IF  
IFRM  
Ptot  
Peak repetitive reverse voltage  
1300  
94  
V
A
Continuous (direct) forward current  
Repetitive peak forward current  
Total power dissipation  
Tj = Tjmax  
Ts = 80 °C  
Ts = 80 °C  
300  
233  
175  
A
Tj = Tjmax  
W
°C  
Tjmax  
Maximum junction temperature  
Copyright Vincotech  
2
09 Jul. 2019 / Revision 3  
30-FT12NIA150SH-LG09F08  
30-PT12NIA150SH-LG09F08Y  
datasheet  
Maximum Ratings  
Tj = 25 °C, unless otherwise specified  
Parameter  
Symbol  
Condition  
Value  
Unit  
Boost Sw. Protection Diode  
VRRM  
Peak repetitive reverse voltage  
Continuous (direct) forward current  
Surge (non-repetitive) forward current  
Surge current capability  
1200  
30  
V
A
IF  
IFSM  
I2t  
Tj = Tjmax  
Ts = 80 °C  
Tj = 150 °C  
Ts = 80 °C  
100  
50  
A
50 Hz Single Half Sine Wave  
tp = 10 ms  
A2s  
W
°C  
Ptot  
Tjmax  
Total power dissipation  
Tj = Tjmax  
74  
Maximum junction temperature  
175  
Boost D. Protection Diode  
VRRM  
IF  
IFSM  
I2t  
Ptot  
Tjmax  
Peak repetitive reverse voltage  
1200  
30  
V
A
Continuous (direct) forward current  
Surge (non-repetitive) forward current  
Surge current capability  
Tj = Tjmax  
Ts = 80 °C  
Tj = 150 °C  
Ts = 80 °C  
100  
50  
A
50 Hz Single Half Sine Wave  
tp = 10 ms  
A2s  
W
°C  
Total power dissipation  
Tj = Tjmax  
74  
Maximum junction temperature  
175  
Boost Sw.Inv.Diode  
VRRM  
IF  
IFSM  
I2t  
Ptot  
Tjmax  
Peak repetitive reverse voltage  
1200  
121  
V
A
Continuous (direct) forward current  
Surge (non-repetitive) forward current  
Surge current capability  
Tj = Tjmax  
Ts = 80 °C  
Tj = 150 °C  
Ts = 80 °C  
860  
A
50 Hz Single Half Sine Wave  
tp = 10 ms  
3700  
234  
A2s  
W
°C  
Total power dissipation  
Tj = Tjmax  
Maximum junction temperature  
175  
Copyright Vincotech  
3
09 Jul. 2019 / Revision 3  
30-FT12NIA150SH-LG09F08  
30-PT12NIA150SH-LG09F08Y  
datasheet  
Maximum Ratings  
Tj = 25 °C, unless otherwise specified  
Parameter  
Symbol  
Condition  
Value  
Unit  
Module Properties  
Thermal Properties  
Storage temperature  
Tstg  
Tjop  
-40…+125  
°C  
°C  
Operation temperature under switching condition  
Isolation Properties  
-40…(Tjmax - 25)  
DC Test Voltage*  
AC Voltage  
tp = 2 s  
6000  
2500  
V
Visol  
Isolation voltage  
tp = 1 min  
V
Creepage distance  
min. 12,7  
min. 12,7  
= 525  
mm  
mm  
Clearance  
Comparative Tracking Index  
*100 % tested in production  
CTI  
Copyright Vincotech  
4
09 Jul. 2019 / Revision 3  
30-FT12NIA150SH-LG09F08  
30-PT12NIA150SH-LG09F08Y  
datasheet  
Characteristic Values  
Parameter  
Symbol  
Conditions  
Value  
Typ  
Unit  
VCE [V] IC [A]  
VGE [V]  
VGS [V]  
VDS [V] ID [A] Tj [°C]  
VF [V] IF [A]  
Min  
Max  
Buck Switch  
Static  
VGE(th)  
Gate-emitter threshold voltage  
VGE = VCE  
0,0052 25  
25  
5,3  
5,8  
6,3  
V
V
1,78  
2,16  
2,48  
2,56  
2,42  
VCEsat  
Collector-emitter saturation voltage  
15  
150  
125  
150  
ICES  
IGES  
rg  
Collector-emitter cut-off current  
Gate-emitter leakage current  
Internal gate resistance  
Input capacitance  
0
1200  
0
25  
25  
2
µA  
nA  
Ω
20  
240  
none  
8800  
470  
Cies  
Cres  
Qg  
f = 1 Mhz  
0
25  
25  
25  
pF  
Reverse transfer capacitance  
Gate charge  
15  
1140  
nC  
Thermal  
λpaste = 3,4 W/mK  
(PSX)  
Rth(j-s)  
Thermal resistance junction to sink  
Dynamic  
0,28  
K/W  
25  
116  
120  
120  
20  
Turn-on delay time  
td(on)  
125  
150  
25  
Rise time  
tr  
125  
150  
25  
125  
150  
25  
125  
150  
25  
125  
150  
25  
23  
24  
213  
267  
279  
20  
Rgon = 4 Ω  
Rgoff = 4 Ω  
ns  
Turn-off delay time  
Fall time  
td(off)  
±15  
600  
150  
tf  
66  
75  
6,23  
8,57  
9,33  
5,36  
9,58  
Qr  
FWD  
Qr  
FWD  
Qr  
FWD  
= 4,4 μC  
= 8,4 μC  
= 9,7 μC  
Turn-on energy (per pulse)  
Eon  
mWs  
125  
Eoff  
Turn-off energy (per pulse)  
150  
10,74  
Copyright Vincotech  
5
09 Jul. 2019 / Revision 3  
30-FT12NIA150SH-LG09F08  
30-PT12NIA150SH-LG09F08Y  
datasheet  
Characteristic Values  
Parameter  
Symbol  
Conditions  
Value  
Typ  
Unit  
VCE [V] IC [A]  
VGE [V]  
VGS [V]  
VDS [V] ID [A] Tj [°C]  
VF [V] IF [A]  
Min  
Max  
Buck Diode  
Static  
25  
150  
3,35  
3,10  
3,84  
7,6  
VF  
IR  
Forward voltage  
Reverse leakage current  
Thermal  
V
125  
1300  
25  
µA  
λpaste = 3,4 W/mK  
(PSX)  
Thermal resistance junction to sink  
Dynamic  
Rth(j-s)  
0,41  
K/W  
25  
110  
139  
151  
IRRM  
125  
150  
25  
Peak recovery current  
A
79  
trr  
Qr  
Reverse recovery time  
125  
150  
25  
125  
150  
25  
125  
150  
25  
125  
150  
111  
124  
ns  
di/dt = 8628 A/μs  
di/dt = 8113 A/μs ±15  
di/dt = 8006 A/μs  
4,42  
8,38  
9,74  
1,50  
3,08  
3,62  
7069  
1003  
1214  
600  
150  
Recovered charge  
μC  
Erec  
Reverse recovered energy  
Peak rate of fall of recovery current  
mWs  
A/µs  
(dirf/dt)max  
Buck Sw. Protection Diode  
Static  
25  
125  
3,56  
3,62  
4,44  
1,6  
VF  
IR  
Forward voltage  
Reverse leakage current  
Thermal  
30  
V
1300  
25  
µA  
λpaste = 3,4 W/mK  
(PSX)  
Rth(j-s)  
Thermal resistance junction to sink  
0,97  
K/W  
Copyright Vincotech  
6
09 Jul. 2019 / Revision 3  
30-FT12NIA150SH-LG09F08  
30-PT12NIA150SH-LG09F08Y  
datasheet  
Characteristic Values  
Parameter  
Symbol  
Conditions  
Value  
Typ  
Unit  
VCE [V] IC [A]  
VGE [V]  
VGS [V]  
VDS [V] ID [A] Tj [°C]  
VF [V] IF [A]  
Min  
Max  
Boost Switch  
Static  
VGE(th)  
Gate-emitter threshold voltage  
VGE = VCE  
0,0052 25  
25  
5,3  
5,8  
6,3  
V
V
1,78  
2,16  
2,48  
2,56  
2,42  
VCEsat  
Collector-emitter saturation voltage  
15  
150  
125  
150  
ICES  
IGES  
rg  
Collector-emitter cut-off current  
Gate-emitter leakage current  
Internal gate resistance  
Input capacitance  
0
1200  
0
25  
25  
2
µA  
nA  
Ω
20  
240  
none  
8800  
470  
Cies  
Cres  
Qg  
f = 1 Mhz  
0
25  
25  
25  
pF  
Reverse transfer capacitance  
Gate charge  
15  
1140  
nC  
Thermal  
λpaste = 3,4 W/mK  
(PSX)  
Rth(j-s)  
Thermal resistance junction to sink  
Dynamic  
0,28  
K/W  
25  
111  
118  
118  
21  
Turn-on delay time  
td(on)  
125  
150  
25  
Rise time  
tr  
125  
150  
25  
125  
150  
25  
125  
150  
25  
125  
150  
25  
23  
23  
209  
266  
285  
25  
Rgon = 4 Ω  
Rgoff = 4 Ω  
ns  
Turn-off delay time  
Fall time  
td(off)  
±15  
600  
150  
tf  
65  
84  
5,76  
8,31  
9,10  
5,12  
8,86  
Qr  
FWD  
Qr  
FWD  
Qr  
FWD  
= 4,2 μC  
= 8,7 μC  
= 10,3 μC  
Turn-on energy (per pulse)  
Eon  
mWs  
125  
Eoff  
Turn-off energy (per pulse)  
150  
10,49  
Copyright Vincotech  
7
09 Jul. 2019 / Revision 3  
30-FT12NIA150SH-LG09F08  
30-PT12NIA150SH-LG09F08Y  
datasheet  
Characteristic Values  
Parameter  
Symbol  
Conditions  
Value  
Typ  
Unit  
VCE [V] IC [A]  
VGE [V]  
VGS [V]  
VDS [V] ID [A] Tj [°C]  
VF [V] IF [A]  
Min  
Max  
Boost Diode  
Static  
25  
150  
3,35  
3,10  
3,84  
7,6  
VF  
IR  
Forward voltage  
Reverse leakage current  
Thermal  
V
125  
1300  
25  
µA  
λpaste = 3,4 W/mK  
(PSX)  
Thermal resistance junction to sink  
Dynamic  
Rth(j-s)  
0,41  
K/W  
25  
87  
127  
139  
IRRM  
125  
150  
25  
Peak recovery current  
A
88  
trr  
Qr  
Reverse recovery time  
125  
150  
25  
125  
150  
25  
125  
150  
25  
125  
150  
126  
149  
ns  
di/dt = 7944 A/μs  
di/dt = 7602 A/μs ±15  
di/dt = 7467 A/μs  
4,20  
8,68  
10,27  
1,48  
2,90  
3,55  
2530  
874  
600  
150  
Recovered charge  
μC  
Erec  
Reverse recovered energy  
Peak rate of fall of recovery current  
mWs  
A/µs  
(dirf/dt)max  
1472  
Boost Sw. Protection Diode  
Static  
25  
2,27  
2,44  
2,36  
2,74  
Forward voltage  
VF  
IR  
25  
125  
150  
25  
V
60  
Reverse leakage current  
1200  
µA  
150  
3300  
Thermal  
λpaste = 3,4 W/mK  
(PSX)  
Rth(j-s)  
Thermal resistance junction to sink  
1,29  
K/W  
Copyright Vincotech  
8
09 Jul. 2019 / Revision 3  
30-FT12NIA150SH-LG09F08  
30-PT12NIA150SH-LG09F08Y  
datasheet  
Characteristic Values  
Parameter  
Symbol  
Conditions  
Value  
Typ  
Unit  
VCE [V] IC [A]  
VGE [V]  
VGS [V]  
VDS [V] ID [A] Tj [°C]  
VF [V] IF [A]  
Min  
Max  
Boost D. Protection Diode  
Static  
25  
2,27  
2,44  
2,36  
2,74  
Forward voltage  
VF  
IR  
25  
125  
150  
25  
V
60  
Reverse leakage current  
1200  
µA  
150  
3300  
Thermal  
λpaste = 3,4 W/mK  
(PSX)  
Rth(j-s)  
Thermal resistance junction to sink  
1,29  
K/W  
Boost Sw.Inv.Diode  
Static  
25  
2,22  
2,30  
2,23  
2,49  
VF  
IR  
125  
150  
25  
Forward voltage  
150  
V
240  
Reverse leakage current  
1200  
µA  
150  
28000  
Thermal  
λpaste = 3,4 W/mK  
(PSX)  
Rth(j-s)  
Thermal resistance junction to sink  
0,41  
22  
K/W  
Thermistor  
Rated resistance  
R
ΔR/R  
P
25  
100  
25  
25  
25  
25  
kΩ  
%
Deviation of R100  
Power dissipation  
Power dissipation constant  
B-value  
R100 = 1484 Ω  
-5  
5
5
mW  
mW/K  
K
1,5  
B(25/50) Tol. ±1 %  
B(25/100) Tol. ±1 %  
3962  
4000  
B-value  
K
Vincotech NTC Reference  
I
Copyright Vincotech  
9
09 Jul. 2019 / Revision 3  
30-FT12NIA150SH-LG09F08  
30-PT12NIA150SH-LG09F08Y  
datasheet  
Buck Switch Characteristics  
figure 1.  
IGBT  
figure 2.  
IGBT  
Typical output characteristics  
Typical output characteristics  
I C = f(VCE  
)
I C = f(VCE)  
VGE  
:
I
I
tp  
=
250  
15  
μs  
V
25 °C  
125 °C  
150 °C  
tp  
Tj  
=
=
250  
125  
7 V to 17 V in steps of 1 V  
μs  
VGE  
=
Tj:  
°C  
VGE from  
figure 3.  
IGBT  
figure 4.  
IGBT  
Typical transfer characteristics  
Transient thermal impedance as function of pulse duration  
I C = f(VGE  
)
Z th(j-s) = f(tp)  
100  
I
Z
10-1  
10-2  
10-3  
10-5  
10-4  
10-3  
10-2  
10-1  
100  
101  
tp(s)  
102  
tp  
=
100  
10  
μs  
V
25 °C  
125 °C  
150 °C  
D =  
R th(j-s)  
tp / T  
VCE  
=
Tj:  
=
0,28  
K/W  
IGBT thermal model values  
(K/W)  
R
τ
(s)  
2,55E-02  
4,70E-02  
6,23E-02  
9,01E-02  
3,16E-02  
9,83E-03  
8,64E-03  
5,27E+00  
1,31E+00  
2,29E-01  
5,22E-02  
1,71E-02  
2,13E-03  
4,08E-04  
Copyright Vincotech  
10  
09 Jul. 2019 / Revision 3  
30-FT12NIA150SH-LG09F08  
30-PT12NIA150SH-LG09F08Y  
datasheet  
Buck Switch Characteristics  
figure 5.  
IGBT  
Safe operating area  
I C = f(VCE  
)
I
D =  
single pulse  
80 ºC  
Ts  
=
VGE  
=
±15  
V
Tj =  
Tjmax  
Copyright Vincotech  
11  
09 Jul. 2019 / Revision 3  
30-FT12NIA150SH-LG09F08  
30-PT12NIA150SH-LG09F08Y  
datasheet  
Buck Diode Characteristics  
figure 1.  
FWD  
figure 2.  
FWD  
Typical forward characteristics  
Transient thermal impedance as a function of pulse width  
I F = f(VF)  
Z th(j-s) = f(tp)  
10  
Z
10-1  
10-2  
10-4  
10-3  
10-2  
10-1  
10  
10  
10  
tp  
=
250  
μs  
25 °C  
125 °C  
150 °C  
D =  
tp / T  
0,41  
Tj:  
R th(j-s)  
=
K/W  
FWD thermal model values  
R (K/W)  
τ
(s)  
3,46E-02  
5,25E-02  
8,36E-02  
1,54E-01  
4,14E-02  
1,35E-02  
2,79E-02  
5,29E+00  
9,84E-01  
1,62E-01  
3,91E-02  
9,22E-03  
1,28E-03  
2,39E-04  
Copyright Vincotech  
12  
09 Jul. 2019 / Revision 3  
30-FT12NIA150SH-LG09F08  
30-PT12NIA150SH-LG09F08Y  
datasheet  
Buck Sw. Protection Diode Characteristics  
figure 1.  
Prot. Diode  
figure 2.  
Prot. Diode  
Typical forward characteristics  
Transient thermal impedance as a function of pulse width  
I F = f(VF)  
Z th(j-s) = f(tp)  
100  
Z
10-1  
10-2  
10-4  
=
10-3  
10-2  
10-1  
100  
101  
102  
tp  
=
250  
μs  
25 °C  
125 °C  
150 °C  
D =  
tp / T  
0,97  
Tj:  
R th(j-s)  
K/W  
Prot. Diode thermal model values  
R (K/W)  
τ
(s)  
3,38E-02  
7,05E-02  
1,87E-01  
4,58E-01  
1,41E-01  
8,48E-02  
6,50E+00  
9,48E-01  
1,18E-01  
2,73E-02  
4,93E-03  
6,22E-04  
Copyright Vincotech  
13  
09 Jul. 2019 / Revision 3  
30-FT12NIA150SH-LG09F08  
30-PT12NIA150SH-LG09F08Y  
datasheet  
Boost Switch Characteristics  
figure 1.  
IGBT  
figure 2.  
IGBT  
Typical output characteristics  
Typical output characteristics  
I C = f(VCE  
)
I C = f(VCE)  
VGE  
:
I
I
tp  
=
250  
15  
μs  
V
25 °C  
125 °C  
150 °C  
tp  
Tj  
=
=
250  
125  
7 V to 17 V in steps of 1 V  
μs  
VGE  
=
Tj:  
°C  
VGE from  
figure 3.  
IGBT  
figure 4.  
IGBT  
Typical transfer characteristics  
Transient thermal impedance as function of pulse duration  
I C = f(VGE  
)
Z th(j-s) = f(tp)  
100  
I
Z
10-1  
10-2  
10-3  
10-5  
10-4  
10-3  
10-2  
10-1  
100  
101  
tp(s)  
102  
tp  
=
100  
10  
μs  
V
25 °C  
125 °C  
150 °C  
D =  
R th(j-s)  
tp / T  
VCE  
=
Tj:  
=
0,28  
K/W  
IGBT thermal model values  
(K/W)  
R
τ
(s)  
2,55E-02  
4,70E-02  
6,23E-02  
9,01E-02  
3,16E-02  
9,83E-03  
8,64E-03  
5,27E+00  
1,31E+00  
2,29E-01  
5,22E-02  
1,71E-02  
2,13E-03  
4,08E-04  
Copyright Vincotech  
14  
09 Jul. 2019 / Revision 3  
30-FT12NIA150SH-LG09F08  
30-PT12NIA150SH-LG09F08Y  
datasheet  
Boost Switch Characteristics  
figure 5.  
IGBT  
Safe operating area  
I C = f(VCE  
)
I
D =  
single pulse  
Ts  
=
80  
ºC  
VGE  
=
±15  
Tjmax  
V
Tj =  
Copyright Vincotech  
15  
09 Jul. 2019 / Revision 3  
30-FT12NIA150SH-LG09F08  
30-PT12NIA150SH-LG09F08Y  
datasheet  
Boost Diode Characteristics  
figure 1.  
FWD  
figure 2.  
FWD  
Typical forward characteristics  
Transient thermal impedance as a function of pulse width  
I F = f(VF)  
Z th(j-s) = f(tp)  
10  
Z
10-1  
10-2  
10-4  
10-3  
10-2  
10-1  
10  
10  
10  
tp  
=
250  
μs  
25 °C  
125 °C  
150 °C  
D =  
tp / T  
0,41  
Tj:  
R th(j-s)  
=
K/W  
FWD thermal model values  
R (K/W)  
τ
(s)  
3,46E-02  
5,25E-02  
8,36E-02  
1,54E-01  
4,14E-02  
1,35E-02  
2,79E-02  
5,29E+00  
9,84E-01  
1,62E-01  
3,91E-02  
9,22E-03  
1,28E-03  
2,39E-04  
Copyright Vincotech  
16  
09 Jul. 2019 / Revision 3  
30-FT12NIA150SH-LG09F08  
30-PT12NIA150SH-LG09F08Y  
datasheet  
Boost Sw. Protection Diode Characteristics  
figure 1.  
Prot. Diode  
figure 2.  
Prot. Diode  
Typical forward characteristics  
Transient thermal impedance as a function of pulse width  
I F = f(VF)  
Z th(j-s) = f(tp)  
101  
Z
100  
10-1  
10-2  
10-3  
10-5  
=
10-4  
10-3  
10-2  
10-1  
100  
101  
102  
tp  
=
250  
μs  
25 °C  
125 °C  
150 °C  
D =  
tp / T  
Tj:  
R th(j-s)  
1,29  
K/W  
Prot. Diode thermal model values  
R (K/W)  
τ
(s)  
6,16E-02  
1,25E-01  
4,82E-01  
3,44E-01  
1,35E-01  
1,42E-01  
2,03E+00  
2,79E-01  
4,69E-02  
1,34E-02  
3,30E-03  
8,91E-04  
Copyright Vincotech  
17  
09 Jul. 2019 / Revision 3  
30-FT12NIA150SH-LG09F08  
30-PT12NIA150SH-LG09F08Y  
datasheet  
Boost D. Protection Diode Characteristics  
figure 1.  
Prot. Diode  
figure 2.  
Prot. Diode  
Typical forward characteristics  
Transient thermal impedance as a function of pulse width  
I F = f(VF)  
Z th(j-s) = f(tp)  
101  
Z
100  
10-1  
10-2  
10-3  
10-5  
=
10-4  
10-3  
10-2  
10-1  
100  
101  
102  
tp  
=
250  
μs  
25 °C  
125 °C  
150 °C  
D =  
tp / T  
Tj:  
R th(j-s)  
1,29  
K/W  
Prot. Diode thermal model values  
R (K/W)  
τ
(s)  
6,16E-02  
1,25E-01  
4,82E-01  
3,44E-01  
1,35E-01  
1,42E-01  
2,03E+00  
2,79E-01  
4,69E-02  
1,34E-02  
3,30E-03  
8,91E-04  
Copyright Vincotech  
18  
09 Jul. 2019 / Revision 3  
30-FT12NIA150SH-LG09F08  
30-PT12NIA150SH-LG09F08Y  
datasheet  
Boost Sw.Inv.Diode Characteristics  
figure 1.  
FWD  
figure 2.  
FWD  
Typical forward characteristics  
Transient thermal impedance as a function of pulse width  
I F = f(VF)  
Z th(j-s) = f(tp)  
100  
Z
10-1  
10-2  
10-4  
=
10-3  
10-2  
10-1  
100  
101  
102  
tp  
=
250  
μs  
25 °C  
125 °C  
150 °C  
D =  
tp / T  
0,41  
Tj:  
R th(j-s)  
K/W  
FWD thermal model values  
R (K/W)  
τ
(s)  
4,46E-02  
5,69E-02  
1,16E-01  
1,34E-01  
2,84E-02  
2,55E-02  
3,97E+00  
7,74E-01  
1,33E-01  
3,91E-02  
7,16E-03  
1,10E-03  
Thermistor Characteristics  
Typical Thermistor resistance values  
figure 1.  
Thermistor  
Typical NTC characteristic as a function of temperature  
as a function of temperature  
R = f(T)  
Copyright Vincotech  
19  
09 Jul. 2019 / Revision 3  
30-FT12NIA150SH-LG09F08  
30-PT12NIA150SH-LG09F08Y  
datasheet  
Buck Switching Characteristics  
figure 1.  
IGBT  
figure 2.  
IGBT  
Typical switching energy losses as a function of collector current  
Typical switching energy losses as a function of gate resistor  
E = f(R g)  
E = f(I C  
)
E
E
25 °C  
25 °C  
With an inductive load at  
With an inductive load at  
600  
±15  
4
V
V
600  
±15  
150  
V
V
A
VCE  
VGE  
=
=
=
=
Tj:  
VCE  
VGE  
I C  
=
=
=
Tj:  
125 °C  
150 °C  
125 °C  
150 °C  
R gon  
R goff  
Ω
Ω
4
figure 3.  
FWD  
figure 4.  
FWD  
Typical reverse recovered energy loss as a function of collector current  
Typical reverse recovered energy loss as a function of gate resistor  
Erec = f(I c)  
Erec = f(R g)  
E
E
With an inductive load at  
25 °C  
With an inductive load at  
25 °C  
600  
±15  
4
V
V
Ω
600  
±15  
150  
V
V
A
VCE  
VGE  
=
=
=
Tj:  
VCE  
VGE  
I C  
=
=
=
Tj:  
125 °C  
150 °C  
125 °C  
150 °C  
R gon  
Copyright Vincotech  
20  
09 Jul. 2019 / Revision 3  
30-FT12NIA150SH-LG09F08  
30-PT12NIA150SH-LG09F08Y  
datasheet  
Buck Switching Characteristics  
figure 5.  
IGBT  
figure 6.  
IGBT  
Typical switching times as a function of collector current  
Typical switching times as a function of gate resistor  
t = f(I C)  
t = f(R g)  
t
t
With an inductive load at  
With an inductive load at  
150  
600  
±15  
4
°C  
150  
600  
±15  
150  
°C  
V
Tj =  
Tj =  
V
V
Ω
Ω
VCE  
=
=
=
=
VCE  
=
=
=
VGE  
R gon  
R goff  
VGE  
I C  
V
A
4
figure 7.  
FWD  
figure 8.  
FWD  
Typical reverse recovery time as a function of collector current  
Typical reverse recovery time as a function of IGBT turn on gate resistor  
trr = f(I C  
)
trr = f(R gon  
)
t
t
25 °C  
25 °C  
600  
±15  
4
V
V
Ω
600  
±15  
150  
V
V
A
At  
VCE  
=
At  
VCE =  
VGE  
R gon  
=
=
Tj:  
VGE  
I C  
=
Tj:  
125 °C  
150 °C  
125 °C  
150 °C  
=
Copyright Vincotech  
21  
09 Jul. 2019 / Revision 3  
30-FT12NIA150SH-LG09F08  
30-PT12NIA150SH-LG09F08Y  
datasheet  
Buck Switching Characteristics  
figure 9.  
FWD  
figure 10.  
FWD  
Typical recovered charge as a function of collector current  
Typical recovered charge as a function of IGBT turn on gate resistor  
Q r = f(I C  
)
Q r = f(R gon)  
Q
Q
600  
25 °C  
V
V
600  
±15  
150  
V
V
A
At  
VCE  
VGE  
R gon  
=
At  
VCE  
VGE  
I C  
=
25 °C  
±15  
4
=
Tj:  
=
Tj:  
125 °C  
150 °C  
125 °C  
150 °C  
Ω
=
=
figure 11.  
FWD  
figure 12.  
FWD  
Typical peak reverse recovery current current as a function of collector current  
Typical peak reverse recovery current as a function of IGBT turn on gate resistor  
I RM = f(I C  
)
I RM = f(R gon)  
I
I
25 °C  
600  
25 °C  
V
V
600  
±15  
150  
V
V
A
At  
VCE  
=
At  
VCE  
VGE  
I C  
=
±15  
4
VGE  
=
=
Tj:  
=
Tj:  
125 °C  
150 °C  
125 °C  
150 °C  
Ω
R gon  
=
Copyright Vincotech  
22  
09 Jul. 2019 / Revision 3  
30-FT12NIA150SH-LG09F08  
30-PT12NIA150SH-LG09F08Y  
datasheet  
Buck Switching Characteristics  
figure 13.  
FWD  
figure 14.  
FWD  
Typical rate of fall of forward and reverse recovery current as a function of collector current  
Typical rate of fall of forward and reverse recovery current as a function of IGBT turn on gate resistor  
di F/dt, di rr/dt = f(I C  
)
di F/dt, di rr/dt = f(R gon)  
diF/dt  
diF/  
dt  
t
i
t
dirr/dt  
dirr  
/
dt  
i
25 °C  
At  
VCE  
=
600  
±15  
4
V
V
Ω
At  
VCE  
VGE  
I C  
=
600  
±15  
150  
V
V
A
25 °C  
125 °C  
150 °C  
:
Tj  
125 °C  
150 °C  
:
Tj  
VGE  
=
=
=
R gon  
=
figure 15.  
IGBT  
Reverse bias safe operating area  
I C = f(VCE  
)
IC MAX  
I
I
I
V
At  
Tj  
=
=
=
125  
°C  
Ω
R gon  
R goff  
4
4
Ω
Copyright Vincotech  
23  
09 Jul. 2019 / Revision 3  
30-FT12NIA150SH-LG09F08  
30-PT12NIA150SH-LG09F08Y  
datasheet  
Buck Switching Definitions  
General conditions  
=
=
=
125 °C  
4 Ω  
4 Ω  
T j  
Rgon  
R goff  
figure 1.  
IGBT  
figure 2.  
IGBT  
Turn-off Switching Waveforms & definition of tdoff, tEoff (tEoff  
=
integrating time for Eoff  
)
Turn-on Switching Waveforms & definition of tdon, tEon (tEon = integrating time for Eon)  
tdoff  
IC  
IC  
VGE  
VGE  
VCE  
tEoff  
VCE  
tEon  
VGE (0%) =  
-15  
15  
V
VGE (0%) =  
-15  
V
VGE (100%) =  
VC (100%) =  
I C (100%) =  
V
VGE (100%) =  
VC (100%) =  
I C (100%) =  
15  
V
600  
150  
267  
V
600  
150  
120  
V
A
A
ns  
ns  
t doff  
=
tdon  
=
figure 3.  
IGBT  
figure 4.  
IGBT  
Turn-off Switching Waveforms & definition of tf  
Turn-on Switching Waveforms & definition of tr  
IC  
IC  
VCE  
tr  
VCE  
tf  
VC (100%) =  
I C (100%) =  
t f =  
600  
150  
66  
V
VC (100%) =  
I C (100%) =  
600  
150  
23  
V
A
A
ns  
tr  
=
ns  
Copyright Vincotech  
24  
09 Jul. 2019 / Revision 3  
30-FT12NIA150SH-LG09F08  
30-PT12NIA150SH-LG09F08Y  
datasheet  
Buck Switching Characteristics  
figure 5.  
FWD  
figure 6.  
FWD  
Turn-off Switching Waveforms & definition of trr  
Turn-on Switching Waveforms & definition of tQr (tQr  
=
integrating time for Qr)  
Qr  
IF  
IF  
fitted  
VF  
600  
150  
139  
111  
V
150  
A
VF (100%) =  
I F (100%) =  
I RRM (100%) =  
I F (100%) =  
Q r (100%) =  
A
8,38  
μC  
A
ns  
t rr  
=
Copyright Vincotech  
25  
09 Jul. 2019 / Revision 3  
30-FT12NIA150SH-LG09F08  
30-PT12NIA150SH-LG09F08Y  
datasheet  
Boost Switching Characteristics  
figure 1.  
IGBT  
figure 2.  
IGBT  
Typical switching energy losses as a function of collector current  
Typical switching energy losses as a function of gate resistor  
E = f(R g)  
E = f(I C  
)
E
E
25 °C  
25 °C  
With an inductive load at  
With an inductive load at  
600  
±15  
4
V
V
600  
±15  
150  
V
V
A
VCE  
VGE  
=
=
=
=
Tj:  
VCE  
VGE  
I C  
=
=
=
Tj:  
125 °C  
150 °C  
125 °C  
150 °C  
R gon  
R goff  
Ω
Ω
4
figure 3.  
FWD  
figure 4.  
FWD  
Typical reverse recovered energy loss as a function of collector current  
Typical reverse recovered energy loss as a function of gate resistor  
Erec = f(I c)  
Erec = f(R g)  
E
E
With an inductive load at  
25 °C  
With an inductive load at  
25 °C  
600  
±15  
4
V
V
Ω
600  
±15  
150  
V
V
A
VCE  
VGE  
=
=
=
Tj:  
VCE  
VGE  
I C  
=
=
=
Tj:  
125 °C  
150 °C  
125 °C  
150 °C  
R gon  
Copyright Vincotech  
26  
09 Jul. 2019 / Revision 3  
30-FT12NIA150SH-LG09F08  
30-PT12NIA150SH-LG09F08Y  
datasheet  
Boost Switching Characteristics  
figure 5.  
IGBT  
figure 6.  
IGBT  
Typical switching times as a function of collector current  
Typical switching times as a function of gate resistor  
t = f(I C  
)
t = f(R g)  
t
t
With an inductive load at  
With an inductive load at  
150  
600  
±15  
4
°C  
150  
600  
±15  
150  
°C  
V
Tj =  
Tj =  
VCE  
=
=
=
=
V
V
Ω
Ω
VCE  
=
=
=
VGE  
R gon  
R goff  
VGE  
I C  
V
A
4
figure 7.  
FWD  
figure 8.  
FWD  
Typical reverse recovery time as a function of collector current  
Typical reverse recovery time as a function of IGBT turn on gate resistor  
t rr = f(I C  
)
trr = f(R gon  
)
t
t
25 °C  
25 °C  
At  
VCE  
=
600  
±15  
4
V
V
Ω
At  
VCE  
=
600  
±15  
150  
V
V
A
VGE  
R gon  
=
=
Tj:  
VGE  
I C  
=
Tj:  
125 °C  
150 °C  
125 °C  
150 °C  
=
Copyright Vincotech  
27  
09 Jul. 2019 / Revision 3  
30-FT12NIA150SH-LG09F08  
30-PT12NIA150SH-LG09F08Y  
datasheet  
Boost Switching Characteristics  
figure 9.  
FWD  
figure 10.  
FWD  
Typical recovered charge as a function of collector current  
Typical recovered charge as a function of IGBT turn on gate resistor  
Q r = f(I C  
)
Q r = f(R gon)  
Q
Q
600  
25 °C  
V
V
600  
±15  
150  
V
V
A
At  
VCE  
VGE  
R gon  
=
At  
VCE  
VGE  
I C  
=
25 °C  
±15  
4
=
Tj:  
=
Tj:  
125 °C  
150 °C  
125 °C  
150 °C  
Ω
=
=
figure 11.  
FWD  
figure 12.  
FWD  
Typical peak reverse recovery current current as a function of collector current  
Typical peak reverse recovery current as a function of IGBT turn on gate resistor  
I RM = f(I C  
)
I RM = f(R gon)  
I
I
25 °C  
600  
25 °C  
V
V
600  
±15  
150  
V
V
A
At  
VCE  
=
At  
VCE  
VGE  
I C  
=
±15  
4
VGE  
=
=
Tj:  
=
Tj:  
125 °C  
150 °C  
125 °C  
150 °C  
Ω
R gon  
=
Copyright Vincotech  
28  
09 Jul. 2019 / Revision 3  
30-FT12NIA150SH-LG09F08  
30-PT12NIA150SH-LG09F08Y  
datasheet  
Boost Switching Characteristics  
figure 13.  
FWD  
figure 14.  
FWD  
Typical rate of fall of forward and reverse recovery current as a function of collector current  
Typical rate of fall of forward and reverse recovery current as a function of IGBT turn on gate resistor  
di F/dt, di rr/dt = f(I C  
)
di F/dt, di rr/dt = f(R gon)  
diF/  
dt  
diF/dt  
t
i
t
dirr  
/
dt  
dirr/dt  
i
25 °C  
At  
VCE  
=
600  
±15  
4
V
V
Ω
At  
VCE  
VGE  
I C  
=
600  
±15  
150  
V
V
A
25 °C  
125 °C  
150 °C  
:
Tj  
125 °C  
150 °C  
:
Tj  
VGE  
=
=
R gon  
=
=
figure 15.  
IGBT  
Reverse bias safe operating area  
I C = f(VCE  
)
IC MAX  
I
I
I
V
At  
Tj  
=
=
=
125  
°C  
Ω
R gon  
R goff  
4
4
Ω
Copyright Vincotech  
29  
09 Jul. 2019 / Revision 3  
30-FT12NIA150SH-LG09F08  
30-PT12NIA150SH-LG09F08Y  
datasheet  
Boost Switching Definitions  
General conditions  
=
=
=
125 °C  
4 Ω  
4 Ω  
T j  
Rgon  
R goff  
figure 1.  
IGBT  
figure 2.  
IGBT  
Turn-off Switching Waveforms & definition of tdoff, tEoff (tEoff  
=
integrating time for Eoff  
)
Turn-on Switching Waveforms & definition of tdon, tEon (tEon = integrating time for Eon)  
tdoff  
IC  
IC  
VGE  
VGE  
VCE  
tEoff  
VCE  
tEon  
VGE (0%) =  
-15  
15  
V
VGE (0%) =  
-15  
V
VGE (100%) =  
VC (100%) =  
I C (100%) =  
V
VGE (100%) =  
VC (100%) =  
I C (100%) =  
15  
V
600  
150  
266  
V
600  
150  
118  
V
A
A
ns  
ns  
t doff  
=
tdon  
=
figure 3.  
IGBT  
figure 4.  
IGBT  
Turn-off Switching Waveforms & definition of tf  
Turn-on Switching Waveforms & definition of tr  
IC  
IC  
VCE  
tr  
VCE  
tf  
VC (100%) =  
I C (100%) =  
t f =  
600  
150  
65  
V
VC (100%) =  
I C (100%) =  
600  
150  
23  
V
A
A
ns  
tr  
=
ns  
Copyright Vincotech  
30  
09 Jul. 2019 / Revision 3  
30-FT12NIA150SH-LG09F08  
30-PT12NIA150SH-LG09F08Y  
datasheet  
Boost Switching Characteristics  
figure 5.  
FWD  
figure 6.  
FWD  
Turn-off Switching Waveforms & definition of trr  
Turn-on Switching Waveforms & definition of tQr (tQr  
=
integrating time for Qr)  
Qr  
IF  
IF  
fitted  
VF  
600  
150  
127  
126  
V
150  
A
VF (100%) =  
I F (100%) =  
I RRM (100%) =  
I F (100%) =  
Q r (100%) =  
A
8,68  
μC  
A
ns  
t rr  
=
Copyright Vincotech  
31  
09 Jul. 2019 / Revision 3  
30-FT12NIA150SH-LG09F08  
30-PT12NIA150SH-LG09F08Y  
datasheet  
Ordering Code & Marking  
Version  
without thermal paste 13 mm housing with solder pins  
without thermal paste 13 mm housing with Press-fit pins  
with thermal paste 13 mm housing with solder pins  
with thermal paste 13 mm housing with Press-fit pins  
Ordering Code  
30-FT12NIA150SH-LG09F08  
30-PT12NIA150SH-LG09F08Y  
30-FT12NIA150SH-LG09F08-/3/  
30-PT12NIA150SH-LG09F08Y-/3/  
Name  
Date code  
WWYY  
Serial  
UL & VIN  
UL VIN  
Lot  
Serial  
NN-NNNNNNNNNNNNNN  
TTTTTTVV WWYY UL  
VIN LLLLL SSSS  
Text  
NN-NNNNNNNNNNNNNN-TTTTTTVV  
LLLLL  
SSSS  
Type&Ver  
Lot number  
Date code  
WWYY  
Datamatrix  
TTTTTTTVV  
LLLLL  
SSSS  
Outline  
Pin table  
Pin  
X
Y
3
0
0
0
0
0
0
0
0
0
Function  
DC+1  
70,9  
70,9  
68,4  
65,9  
58,2  
55,7  
53,2  
50,7  
43  
Solder pin  
1
2
3
DC+1  
DC+1  
DC+1  
GND1  
GND1  
GND1  
GND1  
DC-1  
DC-1  
4
5
6
7
8
9
10  
40,5  
Press-fit pin  
11  
12  
13  
38  
38  
32,9  
0
3
3
DC-1  
DC-1  
DC-2  
14  
15  
16  
17  
18  
19  
20  
21  
22  
32,9  
30,4  
27,9  
20,35  
17,85  
15,35  
12,85  
5
0
0
0
0
0
0
0
0
0
DC-2  
DC-2  
DC-2  
GND2  
GND2  
GND2  
GND2  
DC+2  
DC+2  
2,5  
23  
24  
25  
26  
27  
28  
29  
30  
31  
32  
33  
34  
35  
36  
37  
38  
39  
40  
41  
42  
43  
44  
45  
46  
0
0
DC+2  
DC+2  
TM14  
Ph2  
0
3
0
16,35  
36,9  
36,9  
36,9  
36,9  
36,9  
36,8  
36,9  
36,9  
36,9  
36,9  
36,9  
36,9  
4,6  
7,1  
9,6  
12,1  
29,9  
33  
Ph2  
Ph2  
Ph2  
G12  
S12  
43  
Ph1  
45,5  
48  
Ph1  
Ph1  
50,5  
64,1  
70,9  
Ph1  
Therm1  
Therm2  
G11  
61,65 25,05  
60,65 22,05  
S11  
54,35  
46,2  
14,6  
30,9  
33,9  
17,7  
13,3  
13,7  
13,7  
TM11  
S13  
47,2  
G13  
44,15  
29,2  
TM15  
TM12  
S14  
18,95  
15,95  
G14  
Copyright Vincotech  
32  
09 Jul. 2019 / Revision 3  
30-FT12NIA150SH-LG09F08  
30-PT12NIA150SH-LG09F08Y  
datasheet  
Pinout  
Identification  
ID  
Component  
Voltage  
Current  
Function  
Comment  
T11, T12  
IGBT  
1200 V  
150 A  
150 A  
30 A  
Buck Switch  
Buck Diode  
D11, D12  
D41, D42  
T14, T13  
D13, D14  
D43, D44  
D45, D46  
D15, D16  
Rt  
FWD  
FWD  
IGBT  
FWD  
FWD  
FWD  
FWD  
NTC  
1300 V  
1300 V  
1200 V  
1300 V  
1200 V  
1200 V  
1200 V  
Buck Sw. Protection Diode  
Boost Switch  
150 A  
150 A  
25 A  
Boost Diode  
Boost Sw. Protection Diode  
Boost D. Protection Diode  
Boost Sw.Inv.Diode  
Thermistor  
25 A  
150 A  
Copyright Vincotech  
33  
09 Jul. 2019 / Revision 3  
30-FT12NIA150SH-LG09F08  
30-PT12NIA150SH-LG09F08Y  
datasheet  
Packaging instruction  
Handling instruction  
Standard packaging quantity (SPQ) 36  
>SPQ  
Standard  
<SPQ  
Sample  
Handling instructions for flow 2 packages see vincotech.com website.  
Package data  
Package data for flow 2 packages see vincotech.com website.  
UL recognition and file number  
This device is certified according to UL 1557 standard, UL file number E192116. For more information see vincotech.com website.  
Document No.:  
Date:  
Modification:  
Pages  
30-xT12NIA150SH-LG09F08x-D3-14  
09 Jul. 2019  
Marketing application voltage modified  
1
DISCLAIMER  
The information, specifications, procedures, methods and recommendations herein (together “information”) are presented by Vincotech to  
reader in good faith, are believed to be accurate and reliable, but may well be incomplete and/or not applicable to all conditions or situations  
that may exist or occur. Vincotech reserves the right to make any changes without further notice to any products to improve reliability,  
function or design. No representation, guarantee or warranty is made to reader as to the accuracy, reliability or completeness of said  
information or that the application or use of any of the same will avoid hazards, accidents, losses, damages or injury of any kind to persons  
or property or that the same will not infringe third parties rights or give desired results. It is reader’s sole responsibility to test and determine  
the suitability of the information and the product for reader’s intended use.  
LIFE SUPPORT POLICY  
Vincotech products are not authorised for use as critical components in life support devices or systems without the express written approval  
of Vincotech.  
As used herein:  
1. Life support devices or systems are devices or systems which, (a) are intended for surgical implant into the body, or (b) support or  
sustain life, or (c) whose failure to perform when properly used in accordance with instructions for use provided in labelling can be  
reasonably expected to result in significant injury to the user.  
2. A critical component is any component of a life support device or system whose failure to perform can be reasonably expected to cause  
the failure of the life support device or system, or to affect its safety or effectiveness.  
Copyright Vincotech  
34  
09 Jul. 2019 / Revision 3  

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