IMBD4448-GS18 [VISHAY]
Rectifier Diode, 1 Element, 0.15A, 100V V(RRM),;型号: | IMBD4448-GS18 |
厂家: | VISHAY |
描述: | Rectifier Diode, 1 Element, 0.15A, 100V V(RRM), 二极管 |
文件: | 总5页 (文件大小:101K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
IMBD4448
Vishay Semiconductors
VISHAY
Small Signal Switching Diode
Features
• Silicon Epitaxial Planar Diodes
3
• Fast switching diode in case SOT-23, especially
suited for automatic insertion.
• This diodes are also available in other case styles
including: the DO-35 case with the type
1
2
16923
designation 1N4448, the Mini-MELF case with the
type designation LL4448, and the SOD-123 case
with the type designation 1N4448W.
Mechanical Data
Case: SOT-23 Plastic case
Weight: approx. 8.8 mg
Packaging Codes/Options:
GS18 / 10 k per 13" reel (8 mm tape), 10 k/box
GS08 / 3 k per 7" reel (8 mm tape), 15 k/box
Parts Table
Part
Ordering code
Marking
Remarks
IMBD4448
IMBD4448-GS18 or IMBD4448-GS08
A3
Tape and Reel
Absolute Maximum Ratings
T
= 25 °C, unless otherwise specified
amb
Parameter
Test condition
Symbol
Value
75
Unit
Reverse voltage
V
V
V
R
Peak reverse voltage
V
100
RM
1)
Rectified current (average) half
wave rectification with resist.
T
= 25 °C and f ≥ 50 Hz
I
mA
amb
F(AV)
150
Surge forward current
Power dissipation
t < 1 s and T = 25 °C
I
500
mA
j
FSM
1)
T
= 25 °C
P
mW
amb
tot
350
1)
Device on fiberglass substrate, see layout (SOT-23).
Thermal Characteristics
T
= 25 °C, unless otherwise specified
amb
Parameter
Test condition
Symbol
Value
Unit
1)
Thermal resistance junction to
ambient air
R
°C/W
thJA
450
Junction temperature
T
150
°C
°C
j
Storage temperature range
T
- 65 to + 150
S
1)
Device on fiberglass substrate, see layout (SOT-23).
Document Number 85732
Rev. 1.4, 08-Jul-04
www.vishay.com
1
IMBD4448
Vishay Semiconductors
VISHAY
Electrical Characteristics
T
= 25 °C, unless otherwise specified
amb
Parameter
Test condition
= 5 mA
Symbol
Min
Typ.
Max
0.72
Unit
V
Forward voltage
Leakage current
I
I
V
0.62
F
F
F
F
= 100 mA
= 70 V
V
1.0
2.5
50
30
4
V
V
V
V
V
I
I
I
µA
µA
µA
pF
ns
R
R
R
F
R
= 70 V, T = 150 °C
j
R
R
= 25 V, T = 150 °C
j
Diode capacitance
= V = 0
C
R
tot
Reverse recovery time
(see figures)
I
= 10 mA, I = 10 mA,
t
4
F
R
rr
V
= 6 V, R = 100 Ω
L
R
Layout for R
test
thJA
Thickness:
Fiberglass 1.5 mm (0.059 in.)
Copper leads 0.3 mm (0.012 in.)
7.5 (0.3)
3 (0.12)
1 (0.4)
2 (0.8)
2 (0.8)
1 (0.4)
12 (0.47)
0.8 (0.03)
15 (0.59)
5 (0.2)
1.5 (0.06)
5.1 (0.2)
17451
Typical Characteristics (Tamb = 25 °C unless otherwise specified)
1000
100
10
10000
1000
100
°
T = 25
C
j
f = 1 kHz
°
T = 100
j
C
°
25
C
1
10
1
0.1
0.01
0
0.2 0.4 0.6 0.8
1 1.2 1.4 1.6 1.8 2
0.01
0.1
1
10
100
18662
I
F
- Forward Current ( mA )
18689
V
F
- Forward Voltage ( V )
Figure 1. Forward Current vs. Forward Voltage
Figure 2. Dynamic Forward Resistance vs. Forward Current
www.vishay.com
Document Number 85732
Rev. 1.4, 08-Jul-04
2
IMBD4448
Vishay Semiconductors
VISHAY
1000
800
1.1
1.0
0.9
°
C
T = 25
j
f = 1 MHz
600
400
0.8
0.7
200
0
0
20 40 60 80 100 120 140 160 180 200
- Ambient Temperature ( °C )
0
2
4
6
8
10
18664
18663
T
amb
V
- Reverse Voltage ( V )
R
Figure 3. Admissible Power Dissipation vs. Ambient Temperature
Figure 4. Relative Capacitance vs. Reverse Voltage
100
I
ν
= t /T
p
T = 1/f
p
ν
= 0
I
FRM
10
1
t
p
t
0.1
T
0.2
0.5
-5
-4
-3
-2
-1
10
10
10
10
10
1
10
18709
t
p
- Pulse Length ( s )
Figure 5. Admissible Repetitive Peak Forward Current vs. Pulse Duration
Document Number 85732
Rev. 1.4, 08-Jul-04
www.vishay.com
3
IMBD4448
Vishay Semiconductors
VISHAY
Package Dimensions in mm (Inches)
0.175 (.007)
0.098 (.005)
0.1 (.004) max.
2.6 (.102)
2.35 (.092)
0.4 (.016)
0.4 (.016)
ISO Method E
3.1 (.122)
Mounting Pad Layout
2.8 (.110)
0.4 (.016)
0.52 (0.020)
3
0.9 (0.035)
2.0 (0.079)
1
2
0.95 (.037)
0.95 (.037)
0.95 (0.037)
0.95 (0.037)
17418
www.vishay.com
4
Document Number 85732
Rev. 1.4, 08-Jul-04
IMBD4448
Vishay Semiconductors
VISHAY
Ozone Depleting Substances Policy Statement
It is the policy of Vishay Semiconductor GmbH to
1. Meet all present and future national and international statutory requirements.
2. Regularly and continuously improve the performance of our products, processes, distribution and
operatingsystems with respect to their impact on the health and safety of our employees and the public, as
well as their impact on the environment.
It is particular concern to control or eliminate releases of those substances into the atmosphere which are
known as ozone depleting substances (ODSs).
The Montreal Protocol (1987) and its London Amendments (1990) intend to severely restrict the use of ODSs
and forbid their use within the next ten years. Various national and international initiatives are pressing for an
earlier ban on these substances.
Vishay Semiconductor GmbH has been able to use its policy of continuous improvements to eliminate the
use of ODSs listed in the following documents.
1. Annex A, B and list of transitional substances of the Montreal Protocol and the London Amendments
respectively
2. Class I and II ozone depleting substances in the Clean Air Act Amendments of 1990 by the Environmental
Protection Agency (EPA) in the USA
3. Council Decision 88/540/EEC and 91/690/EEC Annex A, B and C (transitional substances) respectively.
Vishay Semiconductor GmbH can certify that our semiconductors are not manufactured with ozone depleting
substances and do not contain such substances.
We reserve the right to make changes to improve technical design
and may do so without further notice.
Parameters can vary in different applications. All operating parameters must be validated for each
customer application by the customer. Should the buyer use Vishay Semiconductors products for any
unintended or unauthorized application, the buyer shall indemnify Vishay Semiconductors against all
claims, costs, damages, and expenses, arising out of, directly or indirectly, any claim of personal
damage, injury or death associated with such unintended or unauthorized use.
Vishay Semiconductor GmbH, P.O.B. 3535, D-74025 Heilbronn, Germany
Telephone: 49 (0)7131 67 2831, Fax number: 49 (0)7131 67 2423
Document Number 85732
Rev. 1.4, 08-Jul-04
www.vishay.com
5
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