VS-MURB1020CTPBF [VISHAY]
Rectifier Diode, 1 Phase, 2 Element, 5A, 200V V(RRM), Silicon, D2PAK-3;型号: | VS-MURB1020CTPBF |
厂家: | VISHAY |
描述: | Rectifier Diode, 1 Phase, 2 Element, 5A, 200V V(RRM), Silicon, D2PAK-3 快速恢复大电源 超快恢复二极管 快速恢复二极管 超快恢复大功率电源 高功率电源 |
文件: | 总9页 (文件大小:263K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
VS-MURB1020CTPbF, VS-MURB1020CT-1PbF
www.vishay.com
Vishay Semiconductors
Ultrafast Rectifier, 2 x 5 A FRED Pt®
FEATURES
• Ultrafast recovery time
• Low forward voltage drop
• Low leakage current
• 175 °C operating junction temperature
• Meets MSL level 1, per J-STD-020, LF maximum
peak of 260 °C
TO-263AB (D2PAK)
TO-262AA
• AEC-Q101 qualified
Base
Base
common
cathode
common
cathode
• Material categorization: for definitions of compliance
please see www.vishay.com/doc?99912
2
2
DESCRIPTION / APPLICATIONS
MUR.. series are the state of the art ultrafast recovery
1
2
3
1
2
3
rectifiers specifically designed with optimized performance
of forward voltage drop and ultrafast recovery time.
The planar structure and the platinum doped life time
control, guarantee the best overall performance,
ruggedness and reliability characteristics.
Anode Common Anode
cathode
Anode Common Anode
cathode
1
2
1
2
VS-MURB1020CTPbF
VS-MURB1020CT-1PbF
These devices are intended for use in the output rectification
stage of SMPS, UPS, DC/DC converters as well as
freewheeling diode in low voltage inverters and chopper
motor drives.
Their extremely optimized stored charge and low recovery
current minimize the switching losses and reduce over
dissipation in the switching element and snubbers.
PRODUCT SUMMARY
Package
TO-263AB (D2PAK), TO-262AA
IF(AV)
2 x 5 A
200 V
VR
VF at IF
trr
0.87 V
25 ns
TJ max.
Diode variation
175 °C
Common cathode
ABSOLUTE MAXIMUM RATINGS
PARAMETER
SYMBOL
TEST CONDITIONS
MAX.
UNITS
Peak repetitive reverse voltage
VRRM
200
V
per leg
total device
5
Average rectified forward current
IF(AV)
Rated VR, TC = 149 °C
Rated VR, square wave, 20 kHz, TC = 149 °C
10
50
A
Non-repetitive peak surge current per leg
Peak repetitive forward current per leg
Operating junction and storage temperatures
IFSM
IFM
10
TJ, TStg
-65 to +175
°C
ELECTRICAL SPECIFICATIONS (TJ = 25 °C unless otherwise specified)
PARAMETER
SYMBOL
TEST CONDITIONS
MIN.
TYP.
MAX. UNITS
Breakdown voltage,
blocking voltage
VBR
VR
,
IR = 100 μA
200
-
-
IF = 5 A, TJ = 25 °C
-
-
-
-
-
-
-
-
0.99
0.87
1.12
1.02
-
1.08
V
IF = 5 A, TJ = 125 °C
0.99
Forward voltage
VF
IF = 10 A, TJ = 25 °C
1.25
1.20
IF = 10 A, TJ = 125 °C
VR = VR rated
10
μA
Reverse leakage current
IR
TJ = 150 °C, VR = VR rated
VR = 200 V
-
250
Junction capacitance
Series inductance
CT
LS
8
-
-
pF
nH
Measured lead to lead 5 mm from package body
8.0
Revision: 02-Feb-16
Document Number: 94518
1
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THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
VS-MURB1020CTPbF, VS-MURB1020CT-1PbF
www.vishay.com
Vishay Semiconductors
DYNAMIC RECOVERY CHARACTERISTICS (TJ = 25 °C unless otherwise specified)
PARAMETER
SYMBOL
TEST CONDITIONS
IF = 1.0 A, dIF/dt = 50 A/μs, VR = 30 V
IF = 0.5 A, IR = 1.0 A, IREC = 0.25 V
TJ = 25 °C
MIN.
TYP.
MAX.
UNITS
-
-
-
-
-
-
-
-
-
35
25
-
-
Reverse recovery time
trr
ns
24
35
3.3
5.0
33
76
TJ = 125 °C
-
IF = 5 A
dIF/dt = 200 A/μs
TJ = 25 °C
-
Peak recovery current
IRRM
A
TJ = 125 °C
-
V
R = 160 V
TJ = 25 °C
-
Reverse recovery charge
Qrr
nC
TJ = 125 °C
-
THERMAL - MECHANICAL SPECIFICATIONS
PARAMETER
SYMBOL
TEST CONDITIONS
MIN.
TYP.
MAX.
UNITS
Maximum junction and storage
temperature range
TJ, TStg
-65
-
175
°C
Thermal resistance,
junction to case per leg
RthJC
RthJA
RthCS
-
-
-
-
-
5
50
-
Thermal resistance,
junction to ambient per leg
°C/W
Thermal resistance,
case to heatsink
Mounting surface, flat, smooth and greased
0.5
-
-
2.0
-
-
g
Weight
0.07
oz.
6.0
(5.0)
12
(10)
kgf · cm
(lbf · in)
Mounting torque
Marking device
-
Case style TO-263AB (D2PAK)
Case style TO-262
MURB1020CT
MURB1020CT-1
Revision: 02-Feb-16
Document Number: 94518
2
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THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
VS-MURB1020CTPbF, VS-MURB1020CT-1PbF
www.vishay.com
Vishay Semiconductors
100
10
100
TJ = 175 °C
10
TJ = 150 °C
1
TJ = 125 °C
TJ = 175 °C
TJ = 125 °C
TJ = 25 °C
TJ = 100 °C
0.1
0.01
1
0.001
0.0001
TJ = 25 °C
160
0.1
0.2
0.4
0.6
0.8
1.0
1.2
1.4
1.6
0
40
80
120
200
VF - Forward Voltage Drop (V)
VR - Reverse Voltage (V)
Fig. 1 - Typical Forward Voltage Drop Characteristics
Fig. 2 - Typical Values of Reverse Current vs.
Reverse Voltage
100
TJ = 25 °C
10
1
1
10
100
1000
VR - Reverse Voltage (V)
Fig. 3 - Typical Junction Capacitance vs. Reverse Voltage
1
0.1
D = 0.50
D = 0.20
D = 0.10
D = 0.05
D = 0.02
PDM
t1
t2
Single pulse
(thermal resistance)
D = 0.01
Notes:
1. Duty factor D = t1/t2
2. Peak TJ = PDM x ZthJC + TC
0.01
0.00001
0.0001
0.001
0.01
0.1
1
t1 - Rectangular Pulse Duration (s)
Fig. 4 - Maximum Thermal Impedance ZthJC Characteristics
Revision: 02-Feb-16
Document Number: 94518
3
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THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
VS-MURB1020CTPbF, VS-MURB1020CT-1PbF
www.vishay.com
Vishay Semiconductors
180
170
160
150
140
130
50
IF = 10 A
IF = 5 A
40
30
DC
Square wave (D = 0.50)
20
Rated VR applied
VR = 160 V
TJ = 125 °C
TJ = 25 °C
See note (1)
10
100
0
2
4
6
8
1000
IF(AV) - Average Forward Current (A)
dIF/dt (A/μs)
Fig. 7 - Typical Reverse Recovery Time vs. dIF/dt
Fig. 5 - Maximum Allowable Case Temperature vs.
Average Forward Current
7
6
5
160
140
120
100
80
IF = 10 A
IF = 5 A
RMS limit
4
D = 0.01
3
2
1
0
D = 0.02
D = 0.05
D = 0.10
D = 0.20
D = 0.50
DC
60
40
VR = 160 V
TJ = 125 °C
TJ = 25 °C
20
0
100
0
1
2
3
4
5
6
7
8
1000
IF(AV) - Average Forward Current (A)
Fig. 6 - Forward Power Loss Characteristics
dIF/dt (A/μs)
Fig. 8 - Typical Stored Charge vs. dIF/dt
Note
(1)
Formula used: TC = TJ - (Pd + PdREV) x RthJC;
Pd = Forward power loss = IF(AV) x VFM at (IF(AV)/D) (see fig. 6);
PdREV = Inverse power loss = VR1 x IR (1 - D); IR at VR1 = Rated VR
Revision: 02-Feb-16
Document Number: 94518
4
For technical questions within your region: DiodesAmericas@vishay.com, DiodesAsia@vishay.com, DiodesEurope@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
VS-MURB1020CTPbF, VS-MURB1020CT-1PbF
www.vishay.com
Vishay Semiconductors
VR = 200 V
0.01 Ω
L = 70 μH
D.U.T.
D
dIF/dt
adjust
IRFP250
G
S
Fig. 9 - Reverse Recovery Parameter Test Circuit
(3)
trr
IF
ta
tb
0
(4)
Qrr
(2)
IRRM
0.5 IRRM
(5)
dI(rec)M/dt
0.75 IRRM
dIF/dt
(1)
(4) Qrr - area under curve defined by trr
(1) dIF/dt - rate of change of current
and IRRM
through zero crossing
trr x IRRM
(2) IRRM - peak reverse recovery current
Qrr
=
2
(3) trr - reverse recovery time measured
from zero crossing point of negative
going IF to point where a line passing
through 0.75 IRRM and 0.50 IRRM
extrapolated to zero current.
(5) dI(rec)M/dt - peak rate of change of
current during tb portion of trr
Fig. 10 - Reverse Recovery Waveform and Definitions
Revision: 02-Feb-16
Document Number: 94518
5
For technical questions within your region: DiodesAmericas@vishay.com, DiodesAsia@vishay.com, DiodesEurope@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
VS-MURB1020CTPbF, VS-MURB1020CT-1PbF
www.vishay.com
Vishay Semiconductors
ORDERING INFORMATION TABLE
Device code
VS- MUR
B
10
20
CT
-1 TRL
P
1
2
3
4
5
6
7
8
9
1
2
3
4
5
6
7
-
-
-
-
-
-
-
Vishay Semiconductors product
Ultrafast MUR series
B = D2PAK/TO-262
Current rating (10 = 10 A)
Voltage rating (20 = 200 V)
CT = center tap (dual)
None = D2PAK
-1 = TO-262
-
-
8
9
None = tube (50 pieces)
TRL = tape and reel (left oriented, for D2PAK package)
TRR = tape and reel (right oriented, for D2PAK package)
PbF = lead (Pb)-free (for TO-262 and D2PAK tube)
P = lead (Pb)-free (for D2PAK TRR and TRL)
LINKS TO RELATED DOCUMENTS
www.vishay.com/doc?95014
www.vishay.com/doc?95008
www.vishay.com/doc?95032
Dimensions
Part marking information
Packaging information
Revision: 02-Feb-16
Document Number: 94518
6
For technical questions within your region: DiodesAmericas@vishay.com, DiodesAsia@vishay.com, DiodesEurope@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
Outline Dimensions
Vishay Semiconductors
D2PAK, TO-262
DIMENSIONS - D2PAK in millimeters and inches
Conforms to JEDEC outline D2PAK (SMD-220)
B
A
Pad layout
A
(2)(3)
E
A
(E)
c2
110ꢀꢀ
MIN0
(ꢀ0ꢁ3)
(3)
D
L1
ꢁ
2
9065
MIN0
(ꢀ038)
(D1) (3)
Detail A
1709ꢀ (ꢀ07ꢀ)
150ꢀꢀ (ꢀ0625)
H
(2)
1
3
3081
MIN0
L2
(ꢀ015)
B
B
2032
MIN0
(ꢀ0ꢀ8)
A
B
206ꢁ (ꢀ01ꢀ3)
20ꢁ1 (ꢀ0ꢀ96)
(3)
E1
2 x b2
2 x b
C
c
View A - A
ꢀ0ꢀꢀꢁ M
Base
Metal
ꢀ0ꢀ1ꢀ M
M
B
A
Plating
(ꢁ)
b1, b3
2 x
e
H
Gauge
plane
(ꢁ)
c1
(c)
B
ꢀ° to 8°
L3
Seating
plane
Lead assignments
A1
Lead tip
(b, b2)
L
Diodes
Lꢁ
Detail “A”
Rotated 9ꢀ °CW
Scale: 8:1
Section B - B and C - C
Scale: None
10 - Anode (two die)/open (one die)
20, ꢁ0 - Cathode
30 - Anode
MILLIMETERS
SYMBOL
INCHES
MILLIMETERS
INCHES
NOTES
SYMBOL
NOTES
MIN.
4.06
0.00
0.51
0.51
1.14
1.14
0.38
0.38
1.14
8.51
MAX.
4.83
0.254
0.99
0.89
1.78
1.73
0.74
0.58
1.65
9.65
MIN.
0.160
0.000
0.020
0.020
0.045
0.045
0.015
0.015
0.045
0.335
MAX.
0.190
0.010
0.039
0.035
0.070
0.068
0.029
0.023
0.065
0.380
MIN.
6.86
9.65
7.90
MAX.
8.00
MIN.
MAX.
0.315
0.420
0.346
A
A1
b
D1
E
0.270
0.380
0.311
3
2, 3
3
10.67
8.80
E1
e
b1
b2
b3
c
4
4
4
2
2.54 BSC
0.100 BSC
H
14.61
1.78
-
15.88
2.79
1.65
1.78
0.575
0.070
-
0.625
0.110
0.066
0.070
L
L1
L2
L3
L4
3
c1
c2
D
1.27
0.050
0.25 BSC
0.010 BSC
4.78
5.28
0.188
0.208
Notes
(1)
(7)
Dimensioning and tolerancing per ASME Y14.5 M-1994
Dimension D and E do not include mold flash. Mold flash shall
not exceed 0.127 mm (0.005") per side. These dimensions are
measured at the outmost extremes of the plastic body
Thermal pad contour optional within dimension E, L1, D1 and E1
Dimension b1 and c1 apply to base metal only
Outline conforms to JEDEC outline TO-263AB
(2)
(3)
(4)
(5)
(6)
Datum A and B to be determined at datum plane H
Controlling dimension: inch
Document Number: 95014
Revision: 31-Mar-09
For technical questions within your region, please contact one of the following:
DiodesAmericas@vishay.com, DiodesAsia@vishay.com, DiodesEurope@vishay.com
www.vishay.com
1
Outline Dimensions
Vishay Semiconductors
D2PAK, TO-262
DIMENSIONS - TO-262 in millimeters and inches
Modified JEDEC outline TO-262
(2) (3)
E
A
(Datum A)
B
A
c2
E
A
(3)
L1
D
Seating
plane
D1(3)
1
2
3
C
C
L2
B
B
L (2)
A
c
(3)
E1
3 x b2
3 x b
A1
Section A - A
2 x e
Base
metal
(ꢁ)
b1, b3
Plating
c
M
M
B
ꢀ0ꢀ1ꢀ
A
Lead assignments
c1
(ꢁ)
Diodes
10 - Anode (two die)/open (one die)
20, ꢁ0 - Cathode
30 - Anode
(b, b2)
Lead tip
Section B - B and C - C
Scale: None
MILLIMETERS
INCHES
SYMBOL
NOTES
MIN.
4.06
2.03
0.51
0.51
1.14
1.14
0.38
0.38
1.14
8.51
6.86
9.65
7.90
MAX.
4.83
3.02
0.99
0.89
1.78
1.73
0.74
0.58
1.65
9.65
8.00
10.67
8.80
MIN.
0.160
0.080
0.020
0.020
0.045
0.045
0.015
0.015
0.045
0.335
0.270
0.380
0.311
MAX.
0.190
0.119
0.039
0.035
0.070
0.068
0.029
0.023
0.065
0.380
0.315
0.420
0.346
A
A1
b
b1
b2
b3
c
4
4
4
c1
c2
D
2
3
D1
E
2, 3
3
E1
e
2.54 BSC
0.100 BSC
L
13.46
-
14.10
1.65
3.71
0.530
-
0.555
0.065
0.146
L1
L2
3
3.56
0.140
Notes
(1)
(6)
Dimensioning and tolerancing as per ASME Y14.5M-1994
Dimension D and E do not include mold flash. Mold flash shall
not exceed 0.127 mm (0.005") per side. These dimensions are
measured at the outmost extremes of the plastic body
Thermal pad contour optional within dimension E, L1, D1 and E1
Dimension b1 and c1 apply to base metal only
Outline conform to JEDEC TO-262 except A1 (maximum), b
(minimum) and D1 (minimum) where dimensions derived the
actual package outline
(2)
(3)
(4)
(5)
Controlling dimension: inches
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Document Number: 95014
Revision: 31-Mar-09
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Disclaimer
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RELIABILITY, FUNCTION OR DESIGN OR OTHERWISE.
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statements about the suitability of products for a particular application. It is the customer’s responsibility to validate that a
particular product with the properties described in the product specification is suitable for use in a particular application.
Parameters provided in datasheets and / or specifications may vary in different applications and performance may vary over
time. All operating parameters, including typical parameters, must be validated for each customer application by the customer’s
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including but not limited to the warranty expressed therein.
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Revision: 08-Feb-17
Document Number: 91000
1
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