Si7806BDN
Vishay Siliconix
SPECIFICATIONS T = 25 °C unless otherwise noted
J
Parameter
Symbol
Test Conditions
Min
Typ
Max
Unit
Static
VGS(th)
IGSS
VDS = VGS, ID = 250 µA
1.0
3
V
Gate Threshold Voltage
Gate-Body Leakage
VDS = 0 V, VGS
=
20 V
100
1
nA
VDS = 30 V, VGS = 0 V
DS = 30 V, VGS = 0 V, TJ = 55 °C
VDS ≥ 5 V, VGS = 10 V
IDSS
ID(on)
Zero Gate Voltage Drain Current
On-State Drain Currenta
µA
A
V
5
40
VGS = 10 V, ID = 12.6 A
VGS = 4.5 V, ID = 10.6 A
VDS = 15 V, ID = 12.6 A
IS = 3.2 A, VGS = 0 V
0.012
0.017
34
0.0145
0.0205
Drain-Source On-State Resistancea
rDS(on)
Ω
Forward Transconductancea
Diode Forward Voltagea
Dynamicb
gfs
S
V
VSD
0.77
1.2
Qg
Qgt
Qgs
Qgd
Rg
VDS = 15 V, VGS = 4.5 V, ID = 12.6 A
8.5
19
3.6
3.0
2
11
24
Total Gate Charge
nC
V
DS = 15 V, VGS = 10 V, ID = 12.6 A
f = 10 MHz
Gate-Source Charge
Gate-Drain Charge
Gate Resistance
Ω
td(on)
tr
td(off)
tf
8
15
20
40
20
70
Turn-On Delay Time
Rise Time
12
25
10
35
VDD = 15 V, RL = 15 Ω
ID ≅ 1 A, VGEN = 10 V, Rg = 6 Ω
Turn-Off Delay Time
Fall Time
ns
trr
IF = 3.2 A, di/dt = 100 A/µs
Source-Drain Reverse Recovery Time
Notes:
a. Pulse test; pulse width ≤ 300 µs, duty cycle ≤ 2 %.
b. Guaranteed by design, not subject to production testing.
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation
of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum
rating conditions for extended periods may affect device reliability.
TYPICAL CHARACTERISTICS 25 °C unless noted
40
35
30
25
20
15
10
5
40
35
30
25
20
15
10
5
V
GS
= 10 thru 5 V
4 V
T
= 125 °C
C
25 °C
3 V
- 55 °C
4
0
0
0
1
2
3
4
5
0
1
2
3
5
V
DS
− Drain-to-Source Voltage (V)
V
GS
− Gate-to-Source Voltage (V)
Output Characteristics
Transfer Characteristics
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Document Number: 73081
S-60790-Rev. B, 08-May-06