MC33780EG 封装和模型
品牌：NXP
描述：SPECIALTY MICROPROCESSOR CIRCUIT, PDSO16, 1.27 MM PITCH, ROHS COMPLIANT, SOIC-16
EDA/CDA模型
原理图符号
PCB 封装图
3D模型
其他器件
- MC33911BACR2
- MC33063AVDG
- MC33275D-3.3R2G
- MC33780EG
- MC33395EWR2
- MC33078DT
- MC33025DWG
- MC33262DR2G
- MC33174DG
- MC33911G5ACR2
- MC33269ST-3.3T3G
- MC33171DG
- MC33204DR2G
- MC3303DG
- MC33FS6522LAE
- MC33275MN-5.0R2G
- MC33179DR2G
- MC33172D
- MC33275DT-5.0G
- MC33172VDR2G
- MC33171DT
- MC33269DR2G
- MC33063AP1
- MC33274ADR2G
- MC33152DR2G
- MC33975TEK
- MC33375ST-5.0T3G
- MC33269D-3.3
- MC33030DWR2
- MC33174D
- MC33179DR2
- MC33886VW
- MC33660BEFR2
- MC33063AVDR2G
- MC33298DWR2
- MC33174PG
- MC33363APG
- MC33762DM-2525R2
- MC33172DT
- MC33161DR2G
- MC33364D2R2
- MC33PF8100EPES
- MC33972ATEWR2
- MC33063AP
- MC33981BHFK
- MC33978AEKR2
- MC33163DWR2G
- MC33762DM-3030RG
- MC33CD1030AE
- MC33202DG