AP9402GMT-HF [A-POWER]
Simple Drive Requirement, SO-8 Compatible with Heatsink; 简单的驱动要求, SO- 8兼容散热器![AP9402GMT-HF](http://pdffile.icpdf.com/pdf2/p00210/img/icpdf/AP9402_1189860_icpdf.jpg)
型号: | AP9402GMT-HF |
厂家: | ![]() |
描述: | Simple Drive Requirement, SO-8 Compatible with Heatsink |
文件: | 总4页 (文件大小:102K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
AP9402GMT-HF
Halogen-Free Product
Advanced Power
Electronics Corp.
N-CHANNEL ENHANCEMENT MODE
POWER MOSFET
▼ Simple Drive Requirement
BVDSS
RDS(ON)
ID
30V
D
S
▼ SO-8 Compatible with Heatsink
▼ Low On-resistance
18mΩ
20.6A
G
▼ RoHS Compliant & Halogen-Free
D
D
D
Description
D
Advanced Power MOSFETs from APEC provide the designer with the
best combination of fast switching, ruggedized device design, low on-
resistance and cost-effectiveness.
The PMPAK® 5x6 package is special for DC-DC converters application
and the foot print is compatible with SO-8 with backside heat sink and
lower profile.
S
S
S
G
PMPAK® 5x6
Absolute Maximum Ratings
Symbol
Parameter
Rating
30
Units
VDS
VGS
Drain-Source Voltage
V
V
Gate-Source Voltage
+20
20.6
13
Continuous Drain Current (Chip), VGS @ 10V
Continuous Drain Current3
Continuous Drain Current3
Pulsed Drain Current1
ID@TC=25℃
ID@TA=25℃
ID@TA=70℃
IDM
A
A
10.4
80
A
A
PD@TC=25℃
PD@TA=25℃
TSTG
Total Power Dissipation
12.5
5
W
W
℃
℃
Total Power Dissipation
Storage Temperature Range
Operating Junction Temperature Range
-55 to 150
-55 to 150
TJ
Thermal Data
Symbol
Parameter
Value
Unit
℃/W
℃/W
Rthj-c
Maximum Thermal Resistance, Junction-case
Maximum Thermal Resistance, Junction-ambient3
10
25
Rthj-a
Data and specifications subject to change without notice
1
201110071
AP9402GMT-HF
Electrical Characteristics@Tj=25oC(unless otherwise specified)
Symbol
BVDSS
RDS(ON)
Parameter
Test Conditions
Min. Typ. Max. Units
Drain-Source Breakdown Voltage
Static Drain-Source On-Resistance2 VGS=10V, ID=12A
VGS=0V, ID=250uA
30
-
-
13
21.6
1.4
17
-
-
V
mΩ
mΩ
V
18
VGS=4.5V, ID=8A
-
30
VGS(th)
Gate Threshold Voltage
Forward Transconductance
Drain-Source Leakage Current
Gate-Source Leakage
Total Gate Charge
VDS=VGS, ID=250uA
VDS=10V, ID=12A
VDS=24V, VGS=0V
VGS=+20V, VDS=0V
ID=12A
1
-
3
gfs
-
S
IDSS
IGSS
uA
nA
nC
nC
nC
ns
ns
ns
ns
pF
pF
pF
Ω
-
10
-
-
+100
Qg
-
6.5
2
10.4
Qgs
Qgd
td(on)
tr
Gate-Source Charge
Gate-Drain ("Miller") Charge
Turn-on Delay Time
Rise Time
VDS=15V
-
-
VGS=4.5V
-
3.8
7
-
VDS=15V
-
-
ID=1A
-
6
-
td(off)
tf
Turn-off Delay Time
Fall Time
RG=3.3Ω
-
17
4
-
-
VGS=10V
-
Ciss
Coss
Crss
Rg
Input Capacitance
VGS=0V
-
510
110
90
1.8
820
-
Output Capacitance
Reverse Transfer Capacitance
Gate Resistance
VDS=15V
-
f=1.0MHz
-
-
f=1.0MHz
-
3.6
Source-Drain Diode
Symbol
Parameter
Test Conditions
Min. Typ. Max. Units
VSD
trr
Forward On Voltage2
IS=12A, VGS=0V
IS=10A, VGS=0V,
dI/dt=100A/µs
-
-
-
-
1.2
V
Reverse Recovery Time
Reverse Recovery Charge
20
11
-
-
ns
nC
Qrr
Notes:
1.Pulse width limited by Max. junction temperature.
2.Pulse test
3.Surface mounted on 1 in2 copper pad of FR4 board, t <10sec, 60oC/W at steady state.
THIS PRODUCT IS SENSITIVE TO ELECTROSTATIC DISCHARGE, PLEASE HANDLE WITH CAUTION.
USE OF THIS PRODUCT AS A CRITICAL COMPONENT IN LIFE SUPPORT OR OTHER SIMILAR SYSTEMS IS NOT AUTHORIZED.
APEC DOES NOT ASSUME ANY LIABILITY ARISING OUT OF THE APPLICATION OR USE OF ANY PRODUCT OR CIRCUIT DESCRIBED
HEREIN; NEITHER DOES IT CONVEY ANY LICENSE UNDER ITS PATENT RIGHTS, NOR THE RIGHTS OF OTHERS.
APEC RESERVES THE RIGHT TO MAKE CHANGES WITHOUT FURTHER NOTICE TO ANY PRODUCTS HEREIN TO IMPROVE
RELIABILITY, FUNCTION OR DESIGN.
2
AP9402GMT-HF
60
50
40
30
20
10
0
80
60
40
20
0
C =25 o
C
T C = 150 o
C
10V
7.0V
6.0V
10V
T
7.0V
6.0V
5.0V
5.0V
V G = 4.0V
V G = 4.0V
0
2
4
6
8
0
2
4
6
8
V DS , Drain-to-Source Voltage (V)
V DS , Drain-to-Source Voltage (V)
Fig 1. Typical Output Characteristics
Fig 2. Typical Output Characteristics
30
26
22
18
14
10
1.8
1.6
1.4
1.2
1.0
0.8
0.6
I D =12A
I D = 8 A
T
C =25 o
C
V
G =10V
Ω
2
4
6
8
10
-50
0
50
100
150
T j , Junction Temperature ( o C)
V GS , Gate-to-Source Voltage (V)
Fig 3. On-Resistance v.s. Gate Voltage
Fig 4. Normalized On-Resistance
v.s. Junction Temperature
12
10
8
1.4
1.2
1.0
0.8
0.6
0.4
T j =150 o
C
T j =25 o
C
6
4
2
0
-50
0
50
100
150
0
0.2
0.4
0.6
0.8
1
1.2
1.4
T j , Junction Temperature ( o C)
V SD , Source-to-Drain Voltage (V)
Fig 5. Forward Characteristic of
Reverse Diode
Fig 6. Gate Threshold Voltage v.s.
Junction Temperature
3
AP9402GMT-HF
f=1.0MHz
800
600
400
200
0
10
I D = 12 A
V
DS =15V
8
6
4
2
0
C iss
C oss
C rss
0
0.1
0
2
4
6
8
10
12
1
5
9
13
17
21
25
29
Q G , Total Gate Charge (nC)
V DS , Drain-to-Source Voltage (V)
Fig 7. Gate Charge Characteristics
Fig 8. Typical Capacitance Characteristics
1
100
10
1
Operation in this
area limited by
RDS(ON)
Duty factor=0.5
0.2
100us
0.1
0.1
0.05
PDM
1ms
10ms
100ms
DC
t
0.02
T
0.01
Duty factor = t/T
T C =25 o
Single Pulse
C
Peak Tj = PDM x Rthjc + Tc
Single Pulse
0.01
0.1
0.00001
0.0001
0.001
0.01
0.1
1
10
1
10
100
V DS , Drain-to-Source Voltage (V)
t , Pulse Width (s)
Fig 9. Maximum Safe Operating Area
Fig 10. Effective Transient Thermal Impedance
32
50
40
30
20
10
0
V
DS =5V
24
16
8
T j =150 o
C
T j =25 o
C
T j =-40 o
C
0
1
2
3
4
5
6
25
50
75
100
125
150
T C , Case Temperature ( o C )
V GS , Gate-to-Source Voltage (V)
Fig 11. Transfer Characteristics
Fig 12. Maximum Continuous Drain Current
v.s. Case Temperature
4
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