AOD4122 [AOS]

Transistor;
AOD4122
型号: AOD4122
厂家: ALPHA & OMEGA SEMICONDUCTORS    ALPHA & OMEGA SEMICONDUCTORS
描述:

Transistor

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中文:  中文翻译
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AOD4122  
N-Channel Enhancement Mode Field Effect Transistor  
General Description  
Features  
The AOD4122 uses advanced trench technology and  
design to provide excellent RDS(ON) with low gate  
charge. This device is suitable for use in PWM, load  
switching and general purpose applications.  
Standard product AOD4122 is Pb-free (meets ROHS  
& Sony 259 specifications).  
VDS (V) =30V  
ID = 12 A (VGS = 10V)  
RDS(ON) < 36 m(VGS = 10V)  
RDS(ON) < 63 m(VGS = 4.5V)  
UIS Tested  
Rg,Ciss,Coss,Crss Tested  
TO-252  
D-PAK  
D
S
Top View  
Drain Connected to  
Tab  
G
G
D
S
Absolute Maximum Ratings TA=25°C unless otherwise noted  
Parameter  
Symbol  
Maximum  
Units  
VDS  
Drain-Source Voltage  
30  
V
VGS  
Gate-Source Voltage  
Continuous Drain  
Current G  
±20  
V
A
TC=25°C  
12  
TC=100°C  
ID  
12  
Pulsed Drain Current C  
Avalanche Current C  
Repetitive avalanche energy L=0.3mH C  
IDM  
IAR  
EAR  
30  
9
12  
A
mJ  
TC=25°C  
Power Dissipation B  
TC=100°C  
21  
PD  
W
10  
TA=25°C  
4.2  
PDSM  
W
Power Dissipation A  
TA=70°C  
2.7  
TJ, TSTG  
Junction and Storage Temperature Range  
-55 to 175  
°C  
Thermal Characteristics  
Parameter  
Symbol  
Typ  
20  
Max  
30  
60  
7
Units  
°C/W  
°C/W  
°C/W  
Maximum Junction-to-Ambient A  
t 10s  
RθJA  
Maximum Junction-to-Ambient A  
Maximum Junction-to-Case B  
50  
Steady-State  
Steady-State  
RθJC  
4.5  
Alpha & Omega Semiconductor, Ltd.  
AOD4122  
Electrical Characteristics (TJ=25°C unless otherwise noted)  
Symbol  
Parameter  
Conditions  
Min  
Typ  
Max  
Units  
STATIC PARAMETERS  
BVDSS  
Drain-Source Breakdown Voltage  
ID=250uA, VGS=0V  
VDS=24V, VGS=0V  
30  
V
1
5
IDSS  
Zero Gate Voltage Drain Current  
TJ=55°C  
µA  
IGSS  
Gate-Body leakage current  
Gate Threshold Voltage  
On state drain current  
V
DS=0V, VGS=±20V  
VDS=VGS, ID=250µA  
GS=10V, VDS=5V  
VGS=10V, ID=12A  
10  
3
VGS(th)  
ID(ON)  
1
1.8  
V
A
V
30  
29  
46  
36  
63  
mΩ  
mΩ  
RDS(ON)  
TJ=125°C  
Static Drain-Source On-Resistance  
V
GS=4.5V, ID=7A  
DS=5V, ID=10A  
52  
gFS  
VSD  
IS  
Forward Transconductance  
Diode Forward Voltage  
V
12  
S
V
A
IS=1A, VGS=0V  
0.77  
1
Maximum Body-Diode Continuous Current  
12  
DYNAMIC PARAMETERS  
Ciss  
Coss  
Crss  
Rg  
Input Capacitance  
360  
45  
30  
1
pF  
pF  
pF  
V
GS=0V, VDS=15V, f=1MHz  
Output Capacitance  
Reverse Transfer Capacitance  
Gate resistance  
V
GS=0V, VDS=0V, f=1MHz  
SWITCHING PARAMETERS  
Qg(10V)  
Total Gate Charge  
Total Gate Charge  
Gate Source Charge  
Gate Drain Charge  
Turn-On DelayTime  
Turn-On Rise Time  
Turn-Off DelayTime  
Turn-Off Fall Time  
6.6  
3.2  
1.5  
2.2  
4.3  
10  
nC  
nC  
nC  
nC  
ns  
Qg(4.5V)  
V
GS=10V, VDS=15V, ID=12A  
Qgs  
Qgd  
tD(on)  
tr  
VGS=10V, VDS=15V, RL=1.2,  
RGEN=3Ω  
ns  
tD(off)  
tf  
12.8  
3.2  
14  
ns  
ns  
trr  
IF=12A, dI/dt=100A/µs  
IF=12A, dI/dt=100A/µs  
Body Diode Reverse Recovery Time  
Body Diode Reverse Recovery Charge  
ns  
Qrr  
6
nC  
A: The value of R θJA is measured with the device mounted on 1in 2 FR-4 board with 2oz. Copper, in a still air environment with T A =25°C. The  
Power dissipation PDSM is based on R θJA and the maximum allowed junction temperature of 150°C. The value in any given application depends on  
the user's specific board design, and the maximum temperature of 175°C may be used if the PCB allows it.  
B. The power dissipation PD is based on TJ(MAX)=175°C, using junction-to-case thermal resistance, and is more useful in setting the upper  
dissipation limit for cases where additional heatsinking is used.  
C: Repetitive rating, pulse width limited by junction temperature T J(MAX)=175°C.  
D. The R θJA is the sum of the thermal impedence from junction to case R θJC and case to ambient.  
E. The static characteristics in Figures 1 to 6 are obtained using <300 µs pulses, duty cycle 0.5% max.  
F. These curves are based on the junction-to-case thermal impedence which is measured with the device mounted to a large heatsink, assuming a  
maximum junction temperature of T J(MAX)=175°C.  
G. The maximum current rating is limited by bond-wires.  
H. These tests are performed with the device mounted on 1 in 2 FR-4 board with 2oz. Copper, in a still air environment with T A=25°C. The SOA  
curve provides a single pulse rating.  
Rev0: Oct 2006  
THIS PRODUCT HAS BEEN DESIGNED AND QUALIFIED FOR THE CONSUMER MARKET. APPLICATIONS OR USES AS CRITICAL  
COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS ARE NOT AUTHORIZED. AOS DOES NOT ASSUME ANY LIABILITY ARISING  
OUT OF SUCH APPLICATIONS OR USES OF ITS PRODUCTS. AOS RESERVES THE RIGHT TO IMPROVE PRODUCT DESIGN,  
FUNCTIONS AND RELIABILITY WITHOUT NOTICE.  
Alpha & Omega Semiconductor, Ltd.  
AOD4122  
TYPICAL ELECTRICAL AND THERMAL CHARACTERISTICS  
30  
25  
20  
15  
10  
5
30  
25  
20  
15  
10  
5
10V  
-40°C  
25°C  
6V  
VDS=5V  
5V  
7V  
125°C  
4.5V  
VGS=4V  
125°C  
25°C  
3.5V  
3V  
-40°C  
0
0
2
3
4
5
6
7
0
1
2
3
4
5
VGS(Volts)  
VDS (Volts)  
Figure 2: Transfer Characteristics  
Fig 1: On-Region Characteristics  
80  
1.6  
1.4  
1.2  
1
VGS=4.5V  
70  
60  
50  
40  
30  
20  
10  
0
VGS=10V, 12A  
VGS=10V  
VGS=4.5V, 7A  
0.8  
0
5
10  
ID (A)  
15  
20  
-50 -25  
0
25  
Temperature (°C)  
Figure 4: On-Resistance vs. Junction Temperature  
50  
75 100 125 150 175  
Figure 3: On-Resistance vs. Drain Current and  
Gate Voltage  
120  
90  
60  
30  
0
1.0E+01  
1.0E+00  
1.0E-01  
1.0E-02  
1.0E-03  
1.0E-04  
1.0E-05  
ID=12A  
125°C  
125°C  
-40°C  
25°C  
25°C  
0.0  
0.2  
0.4  
0.6  
0.8  
1.0  
1.2  
459
6
7
8
10  
VSD (Volts)  
VGS (Volts)  
Figure 6: Body-Diode Characteristics  
Figure 5: On-Resistance vs. Gate-Source Voltage  
Alpha & Omega Semiconductor, Ltd.  
AOD4122  
TYPICAL ELECTRICAL AND THERMAL CHARACTERISTICS  
10  
9
8
7
6
5
4
3
2
1
0
600  
500  
400  
300  
200  
100  
0
VDS=15V  
ID=12A  
Ciss  
Crss  
Coss  
0
1
2
3
4
5
6
7
0
5
10  
15  
20  
25  
Qg (nC)  
VDS (Volts)  
Figure 7: Gate-Charge Characteristics  
Figure 8: Capacitance Characteristics  
100.0  
10.0  
1.0  
100  
80  
60  
40  
20  
0
10µs  
TJ(Max)=175°C  
TA=25°C  
DC  
100µ  
1ms  
RDS(ON)  
limited  
TJ(Max)=175°C  
TC=25°C  
0.1  
0.0  
0.01  
0.1  
1
10  
100  
0.0001  
0.001  
0.01  
0.1  
1
10  
VDS (Volts)  
Pulse Width (s)  
Figure 10: Single Pulse Power Rating Junction-to-  
Case (Note F)  
Figure 9: Maximum Forward Biased Safe  
Operating Area (Note F)  
10  
1
In descending order  
D=0.5, 0.3, 0.1, 0.05, 0.02, 0.01, single pulse  
D=Ton/T  
J,PK=TC+PDM.ZθJC.RθJC  
T
RθJC=7°C/W  
PD  
0.1  
0.01  
Ton  
T
Single Pulse  
0.0001  
0.00001  
0.001  
0.01  
0.1  
1
10  
100  
Pulse Width (s)  
Figure 11: Normalized Maximum Transient Thermal Impedance (Note F)  
Alpha & Omega Semiconductor, Ltd.  
AOD4122  
TYPICAL ELECTRICAL AND THERMAL CHARACTERISTICS  
35  
30  
25  
20  
15  
10  
5
25  
20  
15  
10  
5
TA=25°C  
TA=150°C  
0
0
0
25  
50  
75  
100  
125  
150  
175  
1.0E-07 1.0E-06 1.0E-05 1.0E-04 1.0E-03 1.0E-02  
TCASE (°C)  
Time in avalanche, tA (s)  
Figure 13: Power De-rating (Note B)  
Figure 12: Single Pulse Avalanche capability  
30  
15  
12  
9
TA=25°C  
25  
20  
15  
10  
5
6
3
0
0
0
25  
50  
75  
100  
125  
150  
175  
0.001  
0.01  
0.1  
1
10  
100  
1000  
TCASE (°C)  
Pulse Width (s)  
Figure 14: Current De-rating (Note B)  
Figure 15: Single Pulse Power Rating Junction-to-  
Ambient (Note H)  
10  
1
In descending order  
D=0.5, 0.3, 0.1, 0.05, 0.02, 0.01, single pulse  
D=Ton/T  
TJ,PK=TA+PDM.ZθJA.RθJA  
RθJA=60°C/W  
0.1  
PD  
0.01  
Single Pulse  
Ton  
T
0.001  
0.00001  
0.0001  
0.001  
0.01  
0.1  
1
10  
100  
1000  
Pulse Width (s)  
Figure 16: Normalized Maximum Transient Thermal Impedance (Note H)  
Alpha & Omega Semiconductor, Ltd.  

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