AON4421 [AOS]

P-Channel Enhancement Mode Field Effect Transistor; P沟道增强型场效应晶体管
AON4421
型号: AON4421
厂家: ALPHA & OMEGA SEMICONDUCTORS    ALPHA & OMEGA SEMICONDUCTORS
描述:

P-Channel Enhancement Mode Field Effect Transistor
P沟道增强型场效应晶体管

晶体 晶体管 场效应晶体管
文件: 总5页 (文件大小:271K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
AON4421  
P-Channel Enhancement Mode  
Field Effect Transistor  
General Description  
Product Summary  
-30V  
VDS  
The AON4421 uses advanced trench technology to  
provide excellent RDS(ON) with low gate charge. This  
device is suitable for use as a load switch.  
-8A  
ID (at VGS=-10V)  
RDS(ON) (at VGS=-10V)  
RDS(ON) (at VGS=-4.5V)  
< 26mΩ  
< 34mΩ  
ESD Protected  
-RoHS Compliant  
-Halogen Free  
D
DFN 3x2  
Top View  
Bottom View  
Pin 1  
D
D
D
G
D
D
D
S
G
S
Absolute Maximum Ratings TA=25°C unless otherwise noted  
Parameter  
Symbol  
VDS  
Maximum  
-30  
Units  
Drain-Source Voltage  
V
V
VGS  
Gate-Source Voltage  
±20  
TA=25°C  
TA=70°C  
Pulsed Drain Current C  
-8  
-6  
Continuous Drain  
Current  
ID  
A
IDM  
-60  
TA=25°C  
TA=70°C  
2.5  
PD  
W
Power Dissipation B  
1.6  
TJ, TSTG  
Junction and Storage Temperature Range  
-55 to 150  
°C  
Thermal Characteristics  
Parameter  
Symbol  
Typ  
42  
Max  
50  
Units  
°C/W  
°C/W  
°C/W  
Maximum Junction-to-Ambient A  
t 10s  
RθJA  
Maximum Junction-to-Ambient A D  
Maximum Junction-to-Lead  
74  
90  
Steady-State  
Steady-State  
RθJL  
25  
30  
Rev 0: February 2009  
www.aosmd.com  
Page 1 of 5  
AON4421  
Electrical Characteristics (TJ=25°C unless otherwise noted)  
Symbol  
Parameter  
Conditions  
Min  
Typ  
Max Units  
STATIC PARAMETERS  
BVDSS  
Drain-Source Breakdown Voltage  
ID=-250µA, VGS=0V  
-30  
V
VDS=-30V, VGS=0V  
-1  
IDSS  
Zero Gate Voltage Drain Current  
µA  
-5  
TJ=55°C  
µA  
IGSS  
Gate-Body leakage current  
Gate Threshold Voltage  
On state drain current  
VDS=0V, VGS= ±20V  
VDS=VGS ID=-250µA  
VGS=-10V, VDS=-5V  
±10  
VGS(th)  
ID(ON)  
-0.8  
-60  
-1.3  
-1.8  
V
A
V
GS=-10V, ID=-8A  
21  
28  
26  
34  
34  
mΩ  
mΩ  
RDS(ON)  
TJ=125°C  
Static Drain-Source On-Resistance  
VGS=-4.5V, ID=-7A  
VDS=-5V, ID=-8A  
IS=-1A,VGS=0V  
27  
gFS  
VSD  
IS  
Forward Transconductance  
Diode Forward Voltage  
22  
S
V
A
-0.74  
-1  
-3  
Maximum Body-Diode Continuous Current  
DYNAMIC PARAMETERS  
Ciss  
Coss  
Crss  
Rg  
Input Capacitance  
930  
170  
120  
8
1120  
pF  
pF  
pF  
VGS=0V, VDS=-15V, f=1MHz  
VGS=0V, VDS=0V, f=1MHz  
Output Capacitance  
Reverse Transfer Capacitance  
Gate resistance  
SWITCHING PARAMETERS  
Qg(-10V)  
Total Gate Charge  
Total Gate Charge  
Gate Source Charge  
Gate Drain Charge  
Turn-On DelayTime  
Turn-On Rise Time  
Turn-Off DelayTime  
Turn-Off Fall Time  
17.6  
8.6  
2
21  
10  
nC  
nC  
nC  
nC  
ns  
Qg(-4.5V)  
V
GS=-10V, VDS=-15V, ID=-8A  
Qgs  
Qgd  
tD(on)  
tr  
3.4  
6
VGS=-10V, VDS=-15V, RL=1.9,  
7
ns  
R
GEN=3Ω  
tD(off)  
tf  
40  
30  
18  
32  
ns  
ns  
trr  
IF=-8A, dI/dt=500A/µs  
IF=-8A, dI/dt=500A/µs  
22  
Body Diode Reverse Recovery Time  
Body Diode Reverse Recovery Charge  
ns  
Qrr  
nC  
A. The value of RθJA is measured with the device mounted on 1in2 FR-4 board with 2oz. Copper, in a still air environment with TA =25°C. The value  
in any given application depends on the user's specific board design.  
B. The power dissipation PD is based on TJ(MAX)=150°C, using 10s junction-to-ambient thermal resistance.  
C. Repetitive rating, pulse width limited by junction temperature TJ(MAX)=150°C. Ratings are based on low frequency and duty cycles to keep  
initialTJ=25°C.  
D. The RθJA is the sum of the thermal impedence from junction to lead RθJL and lead to ambient.  
E. The static characteristics in Figures 1 to 6 are obtained using <300µs pulses, duty cycle 0.5% max.  
F. These curves are based on the junction-to-ambient thermal impedence which is measured with the device mounted on 1in2 FR-4 board with  
2oz. Copper, assuming a maximum junction temperature of TJ(MAX)=150°C. The SOA curve provides a single pulse rating.  
COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS ARE NOT AUTHORIZED. AOS DOES NOT ASSUME ANY LIABILITY ARISING  
OUT OF SUCH APPLICATIONS OR USES OF ITS PRODUCTS. AOS RESERVES THE RIGHT TO IMPROVE PRODUCT DESIGN,  
FUNCTIONS AND RELIABILITY WITHOUT NOTICE.  
Rev 0: February 2009  
www.aosmd.com  
Page 2 of 5  
AON4421  
TYPICAL ELECTRICAL AND THERMAL CHARACTERISTICS  
30  
60  
-6V  
-10V  
-4.5V  
VDS=-5V  
25  
20  
15  
10  
5
50  
40  
30  
20  
10  
0
-4V  
-3.5V  
-3V  
25°C  
125°C  
VGS=-2.5V  
4
0
0.5  
1
1.5  
2
2.5  
3
3.5  
4
0
1
2
3
5
-VGS(Volts)  
-VDS (Volts)  
Figure 2: Transfer Characteristics (Note E)  
Fig 1: On-Region Characteristics (Note E)  
35  
1.5  
1.4  
1.3  
1.2  
1.1  
1.0  
0.9  
VGS=-10V  
ID=-8A  
VGS=-4.5V  
30  
25  
20  
15  
10  
VGS=-4.5V  
ID=-7A  
VGS=-10V  
0
25  
50  
75  
100  
125  
150  
175  
0
4
8
12  
16  
20  
-ID (A)  
Temperature (°C)  
Figure 3: On-Resistance vs. Drain Current and  
Gate Voltage (Note E)  
Figure 4: On-Resistance vs. Junction Temperature  
(Note E)  
70  
60  
50  
40  
30  
20  
10  
1.0E+02  
1.0E+01  
ID=-8A  
1.0E+00  
125°C  
1.0E-01  
1.0E-02  
1.0E-03  
1.0E-04  
1.0E-05  
125°C  
25°C  
25°C  
0.0  
0.2  
0.4  
0.6  
-VSD (Volts)  
Figure 6: Body-Diode Characteristics (Note E)  
0.8  
1.0  
1.2  
2
4
6
8
10  
-VGS (Volts)  
Figure 5: On-Resistance vs. Gate-Source Voltage  
(Note E)  
Rev 0: February 2009  
www.aosmd.com  
Page 3 of 5  
AON4421  
TYPICAL ELECTRICAL AND THERMAL CHARACTERISTICS  
10  
1400  
1200  
1000  
800  
600  
400  
200  
0
VDS=-15V  
ID=-8A  
8
Ciss  
6
4
Coss  
2
Crss  
0
0
5
10  
Qg (nC)  
15  
20  
0
5
10  
15  
20  
25  
30  
-VDS (Volts)  
Figure 7: Gate-Charge Characteristics  
Figure 8: Capacitance Characteristics  
10000  
1000  
100  
10  
100.0  
10.0  
1.0  
TA=25°C  
10µs  
1ms  
RDS(ON)  
limited  
10ms  
100ms  
0.1  
10s  
DC  
TJ(Max)=150°C  
TA=25°C  
0.0  
1
0.01  
0.1  
1
10  
100  
0.00001  
0.001  
0.1  
10  
1000  
-VDS (Volts)  
Pulse Width (s)  
Figure 10: Single Pulse Power Rating Junction-to-  
Ambient (Note F)  
Figure 9: Maximum Forward Biased Safe  
Operating Area (Note F)  
10  
D=Ton/T  
J,PK=TA+PDM.ZθJA.RθJA  
RθJA=90°C/W  
In descending order  
D=0.5, 0.3, 0.1, 0.05, 0.02, 0.01, single pulse  
T
1
0.1  
PD  
0.01  
Single Pulse  
Ton  
T
0.001  
0.00001  
0.0001  
0.001  
0.01  
0.1  
1
10  
100  
1000  
Pulse Width (s)  
Figure 11: Normalized Maximum Transient Thermal Impedance (Note F)  
Rev 0: February 2009  
www.aosmd.com  
Page 4 of 5  
AON4421  
Gate Charge Test Circuit & Waveform  
Vgs  
Qg  
-
-10V  
-
VDC  
Qgs  
Qgd  
+
Vds  
VDC  
+
DUT  
Vgs  
Ig  
Charge  
Resistive Switching Test Circuit & Waveforms  
RL  
Vds  
toff  
ton  
t
f
td(off)  
td(on)  
t
r
Vgs  
-
90%  
10%  
DUT  
Vdd  
Vgs  
VDC  
+
Rg  
Vgs  
Vds  
Diode Recovery Test Circuit & W aveforms  
Q rr = - Idt  
Vds +  
Vds -  
Ig  
DUT  
Vgs  
trr  
L
-Isd  
-IF  
Isd  
Vgs  
dI/dt  
-IRM  
+
Vdd  
VDC  
Vdd  
-
-Vds  
Rev 0: February 2009  
www.aosmd.com  
Page 5 of 5  

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