CSPEMI307AG [CALMIRCO]
4-Channel ESD/EMI Filter Array plus 4-Channel ESD Array for USB; 4通道ESD / EMI滤波器阵列加4通道ESD阵列的USB
| 型号： | CSPEMI307AG |
| 厂家： | 
CALIFORNIA MICRO DEVICES CORP |
| 描述： | 4-Channel ESD/EMI Filter Array plus 4-Channel ESD Array for USB |
| 文件： | 总9页 (文件大小：1600K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
CSPEMI307A
4-Channel ESD/EMI Filter Array plus
4-Channel ESD Array for USB
Features
Product Description
•
Four channels of combined EMI/RFI filtering +
ESD protection
The CSPEMI307A is a multichannel EMI/ESD array
offering a combination of four low-pass filter + ESD
channels to reduce EMI/RFI emissions on a data port
and four dedicated ESD-only channels intended specif-
ically for ESD protection on a USB port. Each EMI/RFI
channel integrates a high quality pi-style filter (C-R-C)
which provides greater than 30dB attenuation in the
800-2700 MHz range. These pi-style filters support
bidirectional filtering, controlling EMI both to and from a
data port connector.
•
•
Four additional channels of ESD-only protection
EMI/ESD channels provide greater than 32dB
attenuation at 1GHz
+15kV ESD protection on all channels
(IEC 61000-4-2 Level 4, contact discharge)
+ 30kV ESD protection on all channels (HBM)
Chip Scale Package features extremely low
lead inductance for optimum filter and ESD
performance
•
•
•
The CSPEMI307A provides a high-level of ESD protec-
tion on all eight channels for sensitive electronic com-
ponents that may be subjected to electrostatic
discharge (ESD). The input pins are designed and
characterized to safely dissipate ESD strikes of 15kV,
exceeding the maximum requirement of the IEC
61000-4-2 international standard. Using the MIL-STD-
883 (Method 3015) specification for Human Body
Model (HBM) ESD, the device provides protection for
contact discharges to greater than 30kV.
•
•
15-bump, 2.960mm X 1.330mm footprint
Chip Scale Package (CSP)
Lead-free version available
Applications
•
EMI filtering and ESD protection for both data and
I/O ports
Outer 4 channels provide ESD protection for
USB lines and other I/O port applications
Wireless Handsets
Handheld PCs / PDAs
MP3 Players
Notebooks
Desktop PCs
•
•
•
•
•
•
The CSPEMI307A is particularly well suited for porta-
ble electronics (e.g., cellular telephones, PDAs, note-
book computers) because of its small package footprint
and low weight. The CSPEMI307A is available in a
space-saving, low-profile Chip Scale Package with
optional lead-free finishing.
Electrical Schematic
100Ω
FILTER+ESDn*
ESDn*
FILTER+ESDn*
30pF
30pF
30pF
GND
(Pins B1-B3)
1 of 4 ESD-only Channels
1 of 4 EMI/RFI + ESD Channels.
* See Package/Pinout Diagram for expanded pin information
© 2003 California Micro Devices Corp. All rights reserved.
10/10/03 430 N. McCarthy Blvd., Milpitas, CA 95035-5112
L
Tel: 408.263.3214
L
Fax: 408.263.7846
L
www.calmicro.com
1
CSPEMI307A
PACKAGE / PINOUT DIAGRAMS
BOTTOM VIEW
TOP VIEW
(Bumps Up View)
(Bumps Down View)
Orientation
Marking
(see note 2)
1
2
3
4
5
6
ESD_3
FILTER/ESD_2
FILTER/ESD_4
C1
C2
C3
C4
C5
C6
A
B
C
FILTER/ESD_1
FILTER/ESD_3
ESD_4
GND
GND
GND
B1
B2
B3
307A
ESD_1
FILTER/ESD_2
FILTER/ESD_4
Orientation
Marking
A1
A2
A3
A4
A5
A6
A1
FILTER/ESD_1
FILTER/ESD_3
ESD_2
CSPEMI307A
CSP Package
Notes:.
1) These drawings are not to scale.
2) Lead-free devices are specified by using a "+" character for the top side orientation mark.
PIN DESCRIPTIONS
PIN(s)
A1
NAME
ESD_1
DESCRIPTION
ESD Channel 1
A2
FILTER+ESD_1
FILTER+ESD_2
FILTER+ESD_3
FILTER+ESD_4
ESD_2
Filter + ESD Channel 1
Filter + ESD Channel 2
Filter + ESD Channel 3
Filter + ESD Channel 4
ESD Channel 2
A3
A4
A5
A6
B1-B3
C1
GND
Device Ground
ESD_3
ESD Channel 3
C2
FILTER+ESD_1
FILTER+ESD_2
FILTER+ESD_3
FILTER+ESD_4
ESD_4
Filter + ESD Channel 1
Filter + ESD Channel 2
Filter + ESD Channel 3
Filter + ESD Channel 4
ESD Channel 4
C3
C4
C5
C6
Ordering Information
PART NUMBERING INFORMATION
2
Standard Finish
Lead-free Finish
Ordering Part
Ordering Part
1
1
Bumps
Package
Number
Part Marking
Number
Part Marking
15
CSP
CSPEMI307A
307A
CSPEMI307AG
307A
Note 1: Parts are shipped in Tape & Reel form unless otherwise specified.
Note 2: Lead-free devices are specified by using a "+" character for the top side orientation mark.
© 2003 California Micro Devices Corp. All rights reserved.
2
430 N. McCarthy Blvd., Milpitas, CA 95035-5112
L
Tel: 408.263.3214
L
Fax: 408.263.7846
L
www.calmicro.com
10/10/03
CSPEMI307A
Specifications
ABSOLUTE MAXIMUM RATINGS
PARAMETER
RATING
UNITS
Storage Temperature Range
DC Power per Resistor
DC Package Power Rating
-65 to +150
100
°C
mW
mW
600
STANDARD OPERATING CONDITIONS
PARAMETER
RATING
UNITS
Operating Temperature Range
-40 to +85
°C
1
ELECTRICAL OPERATING CHARACTERISTICS
SYMBOL PARAMETER
CONDITIONS
At 2.5V DC
At 2.5V DC
MIN
80
TYP
100
30
MAX
120
36
UNITS
Ω
R
Resistance
C
Capacitance
24
pF
TCR
TCC
Temperature Coefficient of Resistance
Temperature Coefficient of Capacitance
Diode Voltage (reverse bias)
1200
-300
ppm/°C
ppm/°C
V
V
I
=10µA
5.5
DIODE
DIODE
I
Diode Leakage Current (reverse bias)
V
=3.3V
DIODE
100
nA
LEAK
V
Signal Voltage
Positive Clamp
Negative Clamp
I
= 10mA
SIG
LOAD
5.6
-0.4
6.8
-0.8
9.0
-1.5
V
V
V
In-system ESD Withstand Voltage
a) Human Body Model, MIL-STD-883,
Method 3015
Notes 2,4 and 5
ESD
30
15
kV
kV
b) Contact Discharge per IEC 61000-4-2
Level 4
V
Clamping Voltage during ESD Discharge
MIL-STD-883 (Method 3015), 8kV
Positive Transients
Notes 2,3,4 and 5
CL
C
+10
- 5
V
V
Negative Transients
f
Cut-off frequency
R = 100Ω, C = 30pF
64
MHz
Z
= 50Ω, Z
= 50Ω
LOAD
SOURCE
Note 1: TA=25°C unless otherwise specified.
Note 2: ESD applied to input and output pins with respect to GND, one at a time.
Note 3: Clamping voltage is measured at the opposite side of the EMI filter to the ESD pin. For example, if ESD is applied to Pin A2,
then clamping voltage is measured at Pin C2.
Note 4: Unused pins are left open
Note 5: These parameters are guaranteed by design and characterization.
© 2003 California Micro Devices Corp. All rights reserved.
10/10/03 430 N. McCarthy Blvd., Milpitas, CA 95035-5112 L Tel: 408.263.3214
L
Fax: 408.263.7846
L
www.calmicro.com
3
CSPEMI307A
Performance Information
Typical Filter Performance (T =25°C, DC Bias=0V, 50 Ohm Environment)
A
Figure 1. Insertion Loss VS. Frequency (A2-C2 to GND B2)
Figure 2. Insertion Loss VS. Frequency (A3-C3 to GND B2)
© 2003 California Micro Devices Corp. All rights reserved.
4
430 N. McCarthy Blvd., Milpitas, CA 95035-5112
L
Tel: 408.263.3214
L
Fax: 408.263.7846
L
www.calmicro.com
10/10/03
CSPEMI307A
Performance Information
Typical Filter Performance (T =25°C, DC Bias=0V, 50 Ohm Environment)
A
Figure 3. Insertion Loss VS. Frequency (A4-C4 to GND B2)
Figure 4. Insertion Loss VS. Frequency (A5-C5 to GND B2)
© 2003 California Micro Devices Corp. All rights reserved.
10/10/03 430 N. McCarthy Blvd., Milpitas, CA 95035-5112 L Tel: 408.263.3214
L
Fax: 408.263.7846
L
www.calmicro.com
5
CSPEMI307A
Performance Information
Typical Filter Performance (T =25°C, 50 Ohm Environment)
A
Figure 5. Comparison of Filter Response Curves for CSPEMI307A VS. DC Bias
© 2003 California Micro Devices Corp. All rights reserved.
6
430 N. McCarthy Blvd., Milpitas, CA 95035-5112
L
Tel: 408.263.3214
L
Fax: 408.263.7846
L
www.calmicro.com
10/10/03
CSPEMI307A
Performance Information (cont’d)
1.6
1.5
1.4
1.3
1.2
1.1
1.0
0.9
0.8
0.7
T = -40C
T = +25C
T = +70C
0
1
2
3
4
5
DC Input Voltage (V)
Figure 6. Filter Capacitance vs. Input Voltage over Temperature
(normalized to capacitance at 2.5VDC and 25°C)
1.100
1.080
1.060
1.040
1.020
1.000
0.980
0.960
0.940
0.920
0.900
-40
-20
0
20
40
60
80
100
Temperature ['C]
Figure 7. Resistance vs. Temperature
(normalized to resistance at 25°C)
© 2003 California Micro Devices Corp. All rights reserved.
10/10/03 430 N. McCarthy Blvd., Milpitas, CA 95035-5112 L Tel: 408.263.3214
L
Fax: 408.263.7846
L
www.calmicro.com
7
CSPEMI307A
Application Information
Refer to Application Note AP-217, "The Chip Scale
Package", for a detailed description of Chip Scale
Packages offered by California Micro Devices.
PRINTED CIRCUIT BOARD RECOMMENDATIONS
PARAMETER
VALUE
Pad Size on PCB
0.275mm
Round
Pad Shape
Pad Definition
Non-Solder Mask defined pads
0.325mm Round
0.125 - 0.150mm
0.330mm Round
50/50 by volume
No Clean
Solder Mask Opening
Solder Stencil Thickness
Solder Stencil Aperture Opening (laser cut, 5% tapered walls)
Solder Flux Ratio
Solder Paste Type
Pad Protective Finish
OSP (Entek Cu Plus 106A)
+50µm
Tolerance — Edge To Corner Ball
Solder Ball Side Coplanarity
Maximum Dwell Time Above Liquidous
Soldering Maximum Temperature
+20µm
60 seconds
260°C
Non-Solder Mask Defined Pad
0.275mm DIA.
Solder Stencil Opening
0.330mm DIA.
Solder Mask Opening
0.325mm DIA.
Figure 8. Recommended Non-Solder Mask Defined Pad Illustration
250
200
150
100
50
0
1:00.0
2:00.0
3:00.0
4:00.0
Time (minutes)
Figure 9. Eutectic (SnPb) Solder
Ball Reflow Profile
Figure 10. Lead-free (SnAgCu) Solder
Ball Reflow Profile
© 2003 California Micro Devices Corp. All rights reserved.
8
430 N. McCarthy Blvd., Milpitas, CA 95035-5112
L
Tel: 408.263.3214
L
Fax: 408.263.7846
L
www.calmicro.com
10/10/03
CSPEMI307A
Mechanical Details
CSP Mechanical Specifications
Mechanical Package Diagrams
CSPEMI307A devices are packaged in a custom Chip
Scale Package (CSP). Dimensions are presented
below. For complete information on CSP packaging,
see the California Micro Devices CSP Package Infor-
mation document.
BOTTOM VIEW
A1
SIDE
VIEW
B2
B1
C1
C
B
A
PACKAGE DIMENSIONS
Package
Bumps
Custom CSP
15
1
2
3
4
5
6
Millimeters
Nom Max
Inches
Nom
D1
D2
Dim
0.30 DIA.
63/37 Sn/Pb (Eutectic) or
Min
Min
Max
96.8/2.6/0.6 Sn/Ag/Cu (Lead-free)
SOLDER BUMPS
A1
A2
B1
B2
B3
B4
C1
C2
D1
D2
2.915 2.960 3.005 0.1148 0.1165 0.1183
1.285 1.330 1.375 0.0506 0.0524 0.0541
0.495 0.500 0.505 0.0195 0.0197 0.0199
0.245 0.250 0.255 0.0096 0.0098 0.0100
0.430 0.435 0.440 0.0169 0.0171 0.0173
0.430 0.435 0.440 0.0169 0.0171 0.0173
0.180 0.230 0.280 0.0071 0.0091 0.0110
0.180 0.230 0.280 0.0071 0.0091 0.0110
0.561 0.605 0.649 0.0221 0.0238 0.0255
0.355 0.380 0.405 0.0140 0.0150 0.0159
DIMENSIONS IN MILLIMETERS
Package Dimensions for
CSPEMI307A Chip Scale Package
# per tape and
reel
3500 pieces
Controlling dimension: millimeters
CSP Tape and Reel Specifications
POCKET SIZE (mm)
B X A X K
TAPE WIDTH
W
REEL
DIAMETER
QTY PER
REEL
P
P
1
PART NUMBER
CHIP SIZE (mm)
0
0
0
0
CSPEMI307A
2.96 X 1.33 X 0.6
3.10 X 1.45 X 0.74
8mm
178mm (7")
3500
4mm 4mm
10 Pitches Cumulative
Tolerance On Tape
0.2 mm
P
o
Top
Cover
Tape
A
o
W
B
o
K
o
For Tape Feeder Reference
Embossment
Only including Draft.
P
Center Lines
of Cavity
1
Concentric Around B.
User Direction of Feed
Figure 11. Tape and Reel Mechanical Data
© 2003 California Micro Devices Corp. All rights reserved.
10/10/03 430 N. McCarthy Blvd., Milpitas, CA 95035-5112
L
Tel: 408.263.3214
L
Fax: 408.263.7846
L
www.calmicro.com
9
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