DMP1011LFV-13 [DIODES]

P-CHANNEL ENHANCEMENT MODE MOSFET;
DMP1011LFV-13
型号: DMP1011LFV-13
厂家: DIODES INCORPORATED    DIODES INCORPORATED
描述:

P-CHANNEL ENHANCEMENT MODE MOSFET

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中文:  中文翻译
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DMP1011LFV  
P-CHANNEL ENHANCEMENT MODE MOSFET  
Product Summary  
Features and Benefits  
Low RDS(ON) Ensures On-State Losses are Minimized  
ID Max  
TC = +25°C  
-19A  
BVDSS  
RDS(ON) Max  
Small Form Factor Thermally Efficient Package Enables Higher  
®
Density End Products (PowerDI  
)
11.7m@ VGS = -4.5V  
18.6m@ VGS = -2.5V  
-12V  
-15A  
Occupies just 33% of the Board Area Occupied by SO-8 Enabling  
Smaller End Product  
Description  
This MOSFET is designed to minimize the on-state resistance  
(RDS(ON)), yet maintain superior switching performance, making it  
ideal for high efficiency power management applications.  
ESD Protected Up To 3kV  
Totally Lead-Free & Fully RoHS Compliant (Notes 1 & 2)  
Halogen and Antimony Free. “Green” Device (Note 3)  
Qualified to AEC-Q101 Standards for High Reliability  
Applications  
Mechanical Data  
Backlighting  
Case: PowerDI3333-8 (Type UX)  
Power Management Functions  
DC-DC Converters  
Case Material: Molded Plastic, "Green" Molding Compound.  
UL Flammability Classification Rating 94V-0  
Moisture Sensitivity: Level 1 per J-STD-020  
Terminal Connections Indicator: See Diagram  
Terminals: Finish - Matte Tin Annealed over Copper Leadframe.  
Solderable per MIL-STD-202, Method 208  
Weight: 0.072grams (Approximate)  
PowerDI3333-8 (Type UX)  
Bottom View  
Pin Configuration  
Top View  
Equivalent Circuit  
Ordering Information (Note 4)  
Part Number  
DMP1011LFV-7  
DMP1011LFV-13  
Case  
Packaging  
2,000/Tape & Reel  
3,000/Tape & Reel  
PowerDI3333-8 (Type UX)  
PowerDI3333-8 (Type UX)  
Notes:  
1. No purposely added lead. Fully EU Directive 2002/95/EC (RoHS) & 2011/65/EU (RoHS 2) compliant.  
2. See http://www.diodes.com/quality/lead_free.html for more information about Diodes Incorporated’s definitions of Halogen- and Antimony-free, "Green"  
and Lead-free.  
3. Halogen- and Antimony-free "Green” products are defined as those which contain <900ppm bromine, <900ppm chlorine (<1500ppm total Br + Cl) and  
<1000ppm antimony compounds.  
4. For packaging details, go to our website at http://www.diodes.com/products/packages.html.  
Marking Information  
T41 = Product Marking Code  
YYWW = Date Code Marking  
YY = Last Two Digits of Year (ex: 17 for 2017)  
WW = Week Code (01 to 53)  
T41  
PowerDI is a registered trademark of Diodes Incorporated.  
1 of 7  
www.diodes.com  
March 2017  
© Diodes Incorporated  
DMP1011LFV  
Document Number: DS38880 Rev. 3 - 2  
DMP1011LFV  
Maximum Ratings (@TA = +25°C, unless otherwise specified.)  
Characteristic  
Drain-Source Voltage  
Symbol  
VDSS  
Value  
-12  
Unit  
V
Gate-Source Voltage  
- 6  
V
VGSS  
TA = +25°C  
-13  
-10  
t<10s  
TA = +70°C  
A
A
ID  
ID  
Continuous Drain Current (Note 6) VGS = 4.5V  
Steady  
State  
TC = +25°C  
TC = +70°C  
-19  
-15  
Maximum Continuous Body Diode Forward Current (Note 6)  
Pulsed Drain Current (380µs Pulse, Duty Cycle = 1%)  
Avalanche Current (Note 7) L = 0.3mH  
3
A
A
IS  
70  
24  
86  
IDM  
IAS  
EAS  
A
Avalanche Energy (Note 7) L = 0.3mH  
mJ  
Thermal Characteristics  
Characteristic  
Symbol  
Value  
Unit  
Total Power Dissipation (Note 5)  
1.05  
118  
83.5  
2.16  
57  
W
PD  
Steady State  
Thermal Resistance, Junction to Ambient (Note 5)  
Total Power Dissipation (Note 6)  
°C/W  
W
RθJA  
PD  
t<10s  
Steady State  
t<10s  
Thermal Resistance, Junction to Ambient (Note 6)  
RθJA  
40.3  
11.7  
°C/W  
°C  
Thermal Resistance, Junction to Case (Note 6)  
Operating and Storage Temperature Range  
RθJC  
-55 to +150  
TJ, TSTG  
Electrical Characteristics (@TA = +25°C, unless otherwise specified.)  
Characteristic  
OFF CHARACTERISTICS (Note 8)  
Drain-Source Breakdown Voltage  
Symbol  
Min  
Typ  
Max  
Unit  
Test Condition  
-12  
-1  
V
BVDSS  
IDSS  
VGS = 0V, ID = -250μA  
VDS = -9.6V, VGS = 0V  
VGS = -6V, VDS = 0V  
μA  
nA  
Zero Gate Voltage Drain Current (TJ = +25°C)  
Gate-Source Leakage  
-100  
IGSS  
ON CHARACTERISTICS (Note 8)  
Gate Threshold Voltage  
-0.6  
-1.2  
11.7  
18.6  
-1.0  
V
mΩ  
V
VGS(TH)  
VDS = VGS, ID = -250μA  
VGS = -4.5V, ID = -12A  
VGS = -2.5V, ID = -9A  
VGS = 0V, IS = -16A  
9.8  
Static Drain-Source On-Resistance  
RDS(ON)  
14.6  
-0.8  
Diode Forward Voltage  
VSD  
DYNAMIC CHARACTERISTICS (Note 9)  
Input Capacitance  
913  
458  
53  
Ciss  
Coss  
Crss  
Rg  
VDS = -6V, VGS = 0V,  
f = 1.0MHz  
Output Capacitance  
pF  
Reverse Transfer Capacitance  
Gate Resistance  
1.85  
9.5  
Ω
VDS = 0V, VGS = 0V, f = 1.0MHz  
Total Gate Charge (VGS = -6V)  
Total Gate Charge (VGS = -4.5V)  
Gate-Source Charge  
Qg  
7.1  
Qg  
nC  
ns  
VDS = -6V, ID = -12A  
1.4  
Qgs  
Qgd  
tD(ON)  
tR  
Gate-Drain Charge  
1.1  
Turn-On Delay Time  
6.3  
Turn-On Rise Time  
2.6  
VDS = -6V, VGS = -4.5V,  
RL = 1Ω, Rg = 4.7Ω, ID =-12A  
Turn-Off Delay Time  
14.4  
3.9  
tD(OFF)  
tF  
Turn-Off Fall Time  
Body Diode Reverse Recovery Time  
Body Diode Reverse Recovery Charge  
13.5  
2.5  
ns  
tRR  
IF = -12A, dI/dt = 100A/μs  
IF = -12A, dI/dt = 100A/μs  
nC  
QRR  
Notes:  
5. Device mounted on FR-4 PC board, with minimum recommended pad layout, single sided.  
6. Device mounted on FR-4 substrate PC board, 2oz copper, with thermal bias to bottom layer 1-inch square copper plate.  
7. I and E ratings are based on low frequency and duty cycles to keep T = +25°C .  
AS AS  
J
8. Short duration pulse test used to minimize self-heating effect.  
9. Guaranteed by design. Not subject to production testing.  
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March 2017  
© Diodes Incorporated  
DMP1011LFV  
Document Number: DS38880 Rev. 3 - 2  
DMP1011LFV  
30  
25  
20  
15  
10  
5
30.0  
25.0  
20.0  
15.0  
10.0  
5.0  
VGS = -2.0V  
VDS = -5V  
VGS = -1.5V  
VGS = -2.5V  
VGS = -3.0V  
VGS=-4.0V  
VGS = -4.5V  
TJ=125℃  
TJ=85℃  
TJ=25℃  
VGS = -1.2V  
VGS = -1.0V  
TJ=150℃  
TJ=-55℃  
0.0  
0
0
0.2 0.4 0.6 0.8  
1
1.2 1.4 1.6 1.8  
2
0
0.5  
1
1.5  
2
2.5  
3
VDS, DRAIN-SOURCE VOLTAGE (V)  
Figure 1. Typical Output Characteristic  
VGS, GATE-SOURCE VOLTAGE (V)  
Figure 2. Typical Transfer Characteristic  
0.15  
0.12  
0.09  
0.06  
0.03  
0
0.025  
0.02  
0.015  
0.01  
0.005  
0
ID = -12A  
VGS = -2.5V  
VGS = -4.5V  
ID = -9A  
0
5
10  
15  
20  
25  
30  
1
2
3
4
5
6
VGS, GATE-SOURCE VOLTAGE (V)  
ID, DRAIN-SOURCE CURRENT (A)  
Figure 3. Typical On-Resistance vs. Drain Current and  
Gate Voltage  
Figure 4. Typical Transfer Characteristic  
1.5  
1.2  
0.9  
0.6  
0.02  
0.018  
0.016  
0.014  
0.012  
0.01  
VGS = -4.5V  
VGS = -2.5V, ID = -9A  
125℃  
85℃  
150℃  
VGS = -4.5V, ID = -12A  
25℃  
0.008  
0.006  
0.004  
0.002  
0
-55℃  
-50  
-25  
0
25  
50  
75  
100 125 150  
0
5
10  
15  
20  
25  
30  
ID, DRAIN CURRENT (A)  
TJ, JUNCTION TEMPERATURE ()  
Figure 5. Typical On-Resistance vs. Drain Current and  
Temperature  
Figure 6. On-Resistance Variation with Temperature  
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© Diodes Incorporated  
DMP1011LFV  
Document Number: DS38880 Rev. 3 - 2  
DMP1011LFV  
0.03  
0.025  
0.02  
0.015  
0.01  
0.005  
0
1.2  
1
ID = -1mA  
0.8  
0.6  
0.4  
0.2  
0
VGS = -2.5V, ID = -9A  
ID = -250μA  
VGS = -4.5V, ID = -12A  
-50  
-25  
0
25  
TJ, JUNCTION TEMPERATURE ()  
Figure 7. On-Resistance Variation with Temperature  
50  
75  
100 125 150  
-50  
-25  
0
25  
50  
75  
100 125 150  
TJ, JUNCTION TEMPERATURE ()  
Figure 8. Gate Threshold Variation vs. Junciton  
Temperature  
30  
25  
20  
15  
10  
5
10000  
1000  
100  
10  
TJ = 150oC  
VGS = 0V  
TJ = 125oC  
TJ = 85oC  
TJ = 85oC  
TJ = 125oC  
TJ = 150oC  
TJ = 25oC  
1
TJ = 25oC  
TJ = -55oC  
0.1  
0
0
2
4
6
8
10  
VDS, Drain-SOURCE VOLTAGE (V)  
Figure 10. Typical Drain-Source Leakge Current vs. Voltage  
12  
0
0.3  
0.6  
0.9  
1.2  
VSD, SOURCE-DRAIN VOLTAGE (V)  
Figure 9. Diode Forward Voltage vs. Current  
100  
10  
6
5
4
3
2
1
0
1
TJ = 25oC  
TJ = 85oC  
VDS = -6V, ID = -12A  
0.1  
0.01  
TJ = 125oC  
TJ = 150oC  
TJ = -55oC  
1
2
3
4
5
6
0
2
4
6
8
10  
VGS, GATE-SOURCE VOLTAGE (V)  
Figure 11. Gate-Source Leakge Current vs. Voltage  
Qg (nC)  
Figure 12. Gate Charge  
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March 2017  
© Diodes Incorporated  
DMP1011LFV  
Document Number: DS38880 Rev. 3 - 2  
DMP1011LFV  
100  
10  
RDS(ON) Limited  
PW =100µs  
PW =1ms  
PW =10ms  
PW =100ms  
PW =1s  
1
0.1  
0.01  
PW =10s  
TJ(Max) = 150TC = 25℃  
Single Pulse  
DC  
DUT on 1*MRP Board  
VGS= -4.5V  
0.01  
0.1  
1
10  
100  
VDS, DRAIN-SOURCE VOLTAGE (V)  
Figure 13. SOA, Safe Operation Area  
1
D=0.7  
D=0.5  
D=0.3  
D=0.9  
0.1  
D=0.1  
D=0.05  
0.01  
D=0.02  
D=0.01  
D=0.005  
RθJA(t) = r(t) * RθJA  
RθJA = 107/W  
D=Single Pulse  
0.0001  
Duty Cycle, D = t1 / t2  
0.001  
0.00001  
0.001  
0.01  
0.1  
1
10  
100  
1000  
t1, PULSE DURATION TIME (sec)  
Figure 14.Transient Thermal Resistance  
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March 2017  
© Diodes Incorporated  
DMP1011LFV  
Document Number: DS38880 Rev. 3 - 2  
DMP1011LFV  
Package Outline Dimensions  
Please see http://www.diodes.com/package-outlines.html for the latest version.  
PowerDI3333-8 (Type UX)  
D
D1  
A
A1  
PowerDI3333-8  
(Type UX)  
Dim  
Min  
Max  
Typ  
A
A1  
b
c
D
D1  
D2  
E
E1  
E2  
E2a  
E2b  
e
0.75  
0.00  
0.25  
0.10  
3.20  
2.95  
2.30  
3.20  
2.95  
1.60  
0.95  
0.10  
0.85  
0.05  
0.40  
0.25  
3.40  
3.15  
2.70  
3.40  
3.15  
2.00  
1.35  
0.30  
0.65 BSC  
0.90  
0.80  
--  
E1 E  
0.32  
0.15  
3.30  
3.05  
2.50  
3.30  
3.05  
1.80  
1.15  
0.20  
0
c
L
E2a  
E2b  
E2  
D2  
k
k
L
θ
0.50  
0.30  
0°  
0.70  
0.40  
10°  
L
0.50  
12°  
b
e
All Dimensions in mm  
Suggested Pad Layout  
Please see http://www.diodes.com/package-outlines.html for the latest version.  
PowerDI3333-8 (Type UX)  
X3  
X2  
8
Y4  
Dimensions Value (in mm)  
X1  
Y1  
C
0.650  
0.420  
0.420  
0.230  
2.370  
0.700  
1.850  
2.250  
3.700  
0.540  
Y2  
X
X1  
X2  
X3  
Y
Y3  
Y1  
Y2  
Y3  
Y4  
Y
1
X
C
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March 2017  
© Diodes Incorporated  
DMP1011LFV  
Document Number: DS38880 Rev. 3 - 2  
DMP1011LFV  
IMPORTANT NOTICE  
DIODES INCORPORATED MAKES NO WARRANTY OF ANY KIND, EXPRESS OR IMPLIED, WITH REGARDS TO THIS DOCUMENT,  
INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES OF MERCHANTABILITY AND FITNESS FOR A PARTICULAR PURPOSE  
(AND THEIR EQUIVALENTS UNDER THE LAWS OF ANY JURISDICTION).  
Diodes Incorporated and its subsidiaries reserve the right to make modifications, enhancements, improvements, corrections or other changes  
without further notice to this document and any product described herein. Diodes Incorporated does not assume any liability arising out of the  
application or use of this document or any product described herein; neither does Diodes Incorporated convey any license under its patent or  
trademark rights, nor the rights of others. Any Customer or user of this document or products described herein in such applications shall assume  
all risks of such use and will agree to hold Diodes Incorporated and all the companies whose products are represented on Diodes Incorporated  
website, harmless against all damages.  
Diodes Incorporated does not warrant or accept any liability whatsoever in respect of any products purchased through unauthorized sales channel.  
Should Customers purchase or use Diodes Incorporated products for any unintended or unauthorized application, Customers shall indemnify and  
hold Diodes Incorporated and its representatives harmless against all claims, damages, expenses, and attorney fees arising out of, directly or  
indirectly, any claim of personal injury or death associated with such unintended or unauthorized application.  
Products described herein may be covered by one or more United States, international or foreign patents pending. Product names and markings  
noted herein may also be covered by one or more United States, international or foreign trademarks.  
This document is written in English but may be translated into multiple languages for reference. Only the English version of this document is the  
final and determinative format released by Diodes Incorporated.  
LIFE SUPPORT  
Diodes Incorporated products are specifically not authorized for use as critical components in life support devices or systems without the express  
written approval of the Chief Executive Officer of Diodes Incorporated. As used herein:  
A. Life support devices or systems are devices or systems which:  
1. are intended to implant into the body, or  
2. support or sustain life and whose failure to perform when properly used in accordance with instructions for use provided in the  
labeling can be reasonably expected to result in significant injury to the user.  
B. A critical component is any component in a life support device or system whose failure to perform can be reasonably expected to cause the  
failure of the life support device or to affect its safety or effectiveness.  
Customers represent that they have all necessary expertise in the safety and regulatory ramifications of their life support devices or systems, and  
acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements concerning their products and any  
use of Diodes Incorporated products in such safety-critical, life support devices or systems, notwithstanding any devices- or systems-related  
information or support that may be provided by Diodes Incorporated. Further, Customers must fully indemnify Diodes Incorporated and its  
representatives against any damages arising out of the use of Diodes Incorporated products in such safety-critical, life support devices or systems.  
Copyright © 2017, Diodes Incorporated  
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© Diodes Incorporated  
DMP1011LFV  
Document Number: DS38880 Rev. 3 - 2  

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