AON7404 [FREESCALE]
20V N-Channel MOSFET; 20V N沟道MOSFET
| 型号： | AON7404 |
| 厂家： | 
Freescale |
| 描述： | 20V N-Channel MOSFET |
| 文件： | 总6页 (文件大小：392K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
AON7404
20V N-Channel MOSFET
General Description
The AON7404 combines advanced trench MOSFET technology with a low resistance package to provide
extremely low RDS(ON)
and battery protection applications.
. This device is ideal for load switch
Features
VDS
20V
ID (at VGS=4.5V)
20A
R
DS(ON) (at VGS=4.5V)
< 6mΩ
< 7.5mΩ
RDS(ON) (at VGS=2.5V)
D
Top View
1
2
3
4
8
7
6
5
G
S
Absolute Maximum Ratings TA=25°C unless otherwise noted
Parameter
Symbol
VDS
Maximum
Units
Drain-Source Voltage
Gate-Source Voltage
20
±12
40
V
V
VGS
TC=25°C
Continuous Drain
Current G
ID
TC=100°C
31
A
Pulsed Drain Current C
IDM
160
TA=25°C
TA=70°C
20
Continuous Drain
Current
IDSM
A
16
Avalanche Current C
IAS, IAR
57
A
Avalanche energy L=0.1mH C
EAS, EAR
162
mJ
TC=25°C
Power Dissipation B
TC=100°C
40
PD
W
16
3.1
TA=25°C
PDSM
W
°C
Power Dissipation A
2
TA=70°C
Junction and Storage Temperature Range
TJ, TSTG
-55 to 150
Thermal Characteristics
Parameter
Symbol
Typ
30
Max
40
Units
°C/W
°C/W
°C/W
Maximum Junction-to-Ambient A
t ≤ 10s
RθJA
Maximum Junction-to-Ambient A D
Maximum Junction-to-Case
Steady-State
Steady-State
60
75
RθJC
2.6
3.1
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AON7404
20V N-Channel MOSFET
Electrical Characteristics (TJ=25°C unless otherwise noted)
Symbol
Parameter
Conditions
Min
Typ
Max Units
STATIC PARAMETERS
ID=250µA, VGS=0V
BVDSS
Drain-Source Breakdown Voltage
20
V
VDS=20V, VGS=0V
1
IDSS
Zero Gate Voltage Drain Current
µA
5
TJ=55°C
V
DS=0V, VGS= ±12V
IGSS
Gate-Body leakage current
Gate Threshold Voltage
On state drain current
100
1.6
nA
V
VGS(th)
ID(ON)
VDS=VGS ID=250µA
VGS=10V, VDS=5V
VGS=4.5V, ID=20A
0.5
1
160
A
4.9
6.2
5.8
105
0.6
6
mΩ
RDS(ON)
Static Drain-Source On-Resistance
TJ=125°C
7.4
7.5
VGS=2.5V, ID=18A
mΩ
S
VDS=5V, ID=20A
gFS
VSD
IS
Forward Transconductance
Diode Forward Voltage
IS=1A,VGS=0V
Maximum Body-Diode Continuous Current G
1
V
40
A
DYNAMIC PARAMETERS
Ciss
Coss
Crss
Rg
Input Capacitance
3080 3860 4630
pF
pF
pF
Ω
VGS=0V, VDS=10V, f=1MHz
Output Capacitance
Reverse Transfer Capacitance
Gate resistance
520
350
0.6
740
580
1.4
960
810
2.1
VGS=0V, VDS=0V, f=1MHz
VGS=10V, VDS=10V, ID=20A
VGS=10V, VDS=10V, RL=0.56Ω,
SWITCHING PARAMETERS
Qg(4.5V) Total Gate Charge
28
7
36
9
43
11
17
nC
nC
nC
ns
ns
ns
ns
Qgs
Qgd
tD(on)
tr
Gate Source Charge
Gate Drain Charge
Turn-On DelayTime
Turn-On Rise Time
Turn-Off DelayTime
Turn-Off Fall Time
7
12
7
8
RGEN=3Ω
tD(off)
tf
70
18
trr
IF=20A, dI/dt=500A/µs
IF=20A, dI/dt=500A/µs
13
29
Body Diode Reverse Recovery Time
Body Diode Reverse Recovery Charge
17
36
20
43
ns
Qrr
nC
A. The value of RθJA is measured with the device mounted on 1in2 FR-4 board with 2oz. Copper, in a still air environment with TA =25°C. The
Power dissipation PDSM is based on R θJA t ≤ 10s value and the maximum allowed junction temperature of 150°C. The value in any given
application depends on the user's specific board design.
B. The power dissipation PD is based on TJ(MAX)=150°C, using junction-to-case thermal resistance, and is more useful in setting the upper
dissipation limit for cases where additional heatsinking is used.
C. Repetitive rating, pulse width limited by junction temperature TJ(MAX)=150°C. Ratings are based on low frequency and duty cycles to keep
initial TJ =25°C.Maximum avalanche current limited by tester capability.
D. The RθJA is the sum of the thermal impedence from junction to case RθJC and case to ambient.
E. The static characteristics in Figures 1 to 6 are obtained using <300µs pulses, duty cycle 0.5% max.
F. These curves are based on the junction-to-case thermal impedence which is measured with the device mounted to a large heatsink,
assuming a maximum junction temperature of TJ(MAX)=150°C. The SOA curve provides a single pulse ratin g.
G. The maximum current rating is package limited.
H. These tests are performed with the device mounted on 1 in2 FR-4 board with 2oz. Copper, in a still air environment with TA=25°C.
THIS PRODUCT HAS BEEN DESIGNED AND QUALIFIED FOR THE CONSUMER MARKET. APPLICATIONS OR USES AS CRITICAL
COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS ARE NOT AUTHORIZED. AOS DOES NOT ASSUME ANY LIABILITY ARISING
OUT OF SUCH APPLICATIONS OR USES OF ITS PRODUCTS. AOS RESERVES THE RIGHT TO IMPROVE PRODUCT DESIGN,
FUNCTIONS AND RELIABILITY WITHOUT NOTICE.
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AON7404
20V N-Channel MOSFET
TYPICAL ELECTRICAL AND THERMAL CHARACTERISTICS
80
60
40
20
0
100
80
60
40
20
0
VDS=5V
4.5V
2.5V
2V
125°C
25°C
VGS=1.5V
0
1
2
3
4
5
0.5
1
1.5
2
2.5
VGS(Volts)
VDS (Volts)
Figure 2: Transfer Characteristics (Note E)
Fig 1: On-Region Characteristics (Note E)
1.4
1.2
1
10
8
VGS=4.5V
ID=20A
VGS=2.5V
6
VGS=2.5V
4
I =16A
D
VGS=4.5V
2
0
0.8
0
5
10
15
20
25
30
0
25
50
75
100
125
150
175
ID (A)
Temperature (°C)
Figure 4: On-Resistance vs. Junction Temperature
Figure 3: On-Resistance vs. Drain Current and Gate
Voltage (Note E)
(Note E)
1.0E+02
1.0E+01
10
9
ID=20A
125°C
1.0E+00
8
1.0E-01
1.0E-02
1.0E-03
1.0E-04
1.0E-05
7
125°C
25°C
6
5
25°C
4
0
2
4
6
8
0.0
0.2
0.4
0.6
VSD (Volts)
Figure 6: Body-Diode Characteristics (Note E)
0.8
1.0
1.2
VGS (Volts)
Figure 5: On-Resistance vs. Gate-Source Voltage
(Note E)
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AON7404
20V N-Channel MOSFET
TYPICAL ELECTRICAL AND THERMAL CHARACTERISTICS
7000
6000
10
8
VDS=10V
ID=20A
5000
4000
3000
2000
1000
0
Ciss
6
4
Coss
2
Crss
0
0
20
40
60
g (nC)
80
100
0
5
10
15
20
Q
V
DS (Volts)
Figure 7: Gate-Charge Characteristics
Figure 8: Capacitance Characteristics
200
160
120
80
1000.0
100.0
10.0
1.0
10µs
TJ(Max)=150°C
TC=25°C
RDS(ON)
limited
100µs
1ms
10ms
DC
TJ(Max)=150°C
TC=25°C
0.1
40
0.0
0
0.01
0.1
1
10
100
0.0001
0.001
0.01
0.1
1
10
VDS (Volts)
Pulse Width (s)
Figure 10: Single Pulse Power Rating Junction-to-
Case (Note F)
Figure 9: Maximum Forward Biased Safe
Operating Area (Note F)
10
1
D=Ton/T
In descending order
D=0.5, 0.3, 0.1, 0.05, 0.02, 0.01, single pulse
T
J,PK=TC+PDM.ZθJC.RθJC
RθJC=3.1°C/W
0.1
PD
Single Pulse
Ton
T
0.01
0.00001
0.0001
0.001
0.01
Pulse Width (s)
Figure 11: Normalized Maximum Transient Thermal Impedance (Note F)
0.1
1
10
100
4/6
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AON7404
20V N-Channel MOSFET
TYPICAL ELECTRICAL AND THERMAL CHARACTERISTICS
1000.0
100.0
10.0
50
40
30
20
10
0
TA=25°C
TA=100°C
TA=150°C
TA=125°C
0
25
50
75
TCASE (°C)
100
125
150
1
10
100
1000
Time in avalanche, tA (µs)
Figure 13: Power De-rating (Note F)
Figure 12: Single Pulse Avalanche capability
(Note C)
10000
1000
100
10
50
40
30
20
10
TA=25°C
1
0
0
0.00001
0.001
0.1
10
1000
25
50
75
100
125
150
TCASE (°C)
Pulse Width (s)
Figure 15: Single Pulse Power Rating Junction-to-
Ambient (Note H)
Figure 14: Current De-rating (Note F)
10
1
D=Ton/T
In descending order
D=0.5, 0.3, 0.1, 0.05, 0.02, 0.01, single pulse
T
J,PK=TA+PDM.ZθJA.RθJA
θJA=75°C/W
R
0.1
PD
0.01
0.001
Single Pulse
Ton
T
0.00001
0.0001
0.001
0.01
0.1
1
10
100
1000
Pulse Width (s)
Figure 16: Normalized Maximum Transient Thermal Impedance (Note H)
5/6
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AON7404
20V N-Channel MOSFET
Gate Charge Test Circuit & Waveform
Vgs
Qg
10V
+
VDC
+
Qgs
Qgd
Vds
VDC
-
-
DUT
Vgs
Ig
Charge
Resistive Switching Test Circuit & Waveforms
RL
Vds
Vds
90%
10%
+
DUT
Vdd
Vgs
VDC
Rg
-
Vgs
Vgs
td(on)
t
r
td(off)
t
f
ton
toff
Unclamped Inductive Switching (UIS) Test Circuit & Waveforms
L
EAR= 1/2 LIA2R
BVDSS
Vds
Id
Vgs
Vds
+
Vgs
Vdd
I AR
VDC
Id
Rg
-
DUT
Vgs
Vgs
Diode Recovery Test Circuit & Waveforms
Qrr = - Idt
Vds +
Vds -
Ig
DUT
Vgs
trr
L
Isd
I F
Isd
Vgs
dI/dt
I RM
+
Vdd
VDC
Vdd
-
Vds
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