BUP305 [INFINEON]
IGBT With Antiparallel Diode (Low forward voltage drop High switching speed Low tail current Latch-up free Including fast free-wheel diode); IGBT用反并联二极管(低正向压降高开关速度低尾电流闭锁免费包括快速续流二极管)型号: | BUP305 |
厂家: | Infineon |
描述: | IGBT With Antiparallel Diode (Low forward voltage drop High switching speed Low tail current Latch-up free Including fast free-wheel diode) |
文件: | 总7页 (文件大小:387K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
BUP 305 D
IGBT With Antiparallel Diode
Preliminary data
• Low forward voltage drop
• High switching speed
• Low tail current
• Latch-up free
• Including fast free-wheel diode
Pin 1
Pin 2
Pin 3
G
C
E
Type
V
I
Package
Ordering Code
Q67040-A4225-A2
CE
C
BUP 305 D
1200V 12A
TO-218 AB
Maximum Ratings
Parameter
Symbol
Values
Unit
Collector-emitter voltage
Collector-gate voltage
V
1200
V
CE
V
CGR
Ω
R
= 20 k
1200
± 20
GE
Gate-emitter voltage
DC collector current
V
GE
I
A
C
T = 25 °C
12
8
C
T = 90 °C
C
Pulsed collector current, t = 1 ms
I
p
Cpuls
T = 25 °C
24
16
C
T = 90 °C
C
Diode forward current
I
I
F
T = 90 °C
8
C
Pulsed diode current, t = 1 ms
p
Fpuls
T = 25 °C
48
C
Power dissipation
P
W
tot
T = 25 °C
100
C
Chip or operating temperature
Storage temperature
T
T
-55 ... + 150 °C
-55 ... + 150
j
stg
Semiconductor Group
1
Dec-02-1996
BUP 305 D
Maximum Ratings
Parameter
Symbol
Values
Unit
DIN humidity category, DIN 40 040
IEC climatic category, DIN IEC 68-1
-
-
E
-
55 / 150 / 56
Thermal Resistance
Thermal resistance, chip case
Diode thermal resistance, chip case
R
R
1
K/W
thJC
3.1
thJCD
Electrical Characteristics, at T = 25 °C, unless otherwise specified
j
Parameter
Symbol
Values
Unit
min.
typ.
max.
Static Characteristics
Gate threshold voltage
V
V
V
GE(th)
V
= V
I = 0.3 mA, T = 25 °C
4.5
5.5
6.5
GE
CE, C
j
Collector-emitter saturation voltage
CE(sat)
V
= 15 V, I = 5 A, T = 25 °C
-
-
2.8
3.8
3.3
4.3
GE
GE
C
j
V
= 15 V, I = 5 A, T = 125 °C
C
j
Zero gate voltage collector current
= 1200 V, V = 0 V, T = 25 °C
I
I
mA
nA
CES
GES
V
-
-
-
-
0.35
100
CE
GE
j
Gate-emitter leakage current
= 20 V, V = 0 V
V
GE
CE
AC Characteristics
Transconductance
g
S
fs
V
= 20 V, I = 5 A
1.7
2.5
650
50
-
CE
C
Input capacitance
= 25 V, V = 0 V, f = 1 MHz
C
C
C
pF
iss
V
-
-
-
800
80
30
CE
GE
Output capacitance
= 25 V, V = 0 V, f = 1 MHz
oss
rss
V
CE
GE
Reverse transfer capacitance
= 25 V, V = 0 V, f = 1 MHz
V
20
CE
GE
Semiconductor Group
2
Dec-02-1996
BUP 305 D
Electrical Characteristics, at T = 25 °C, unless otherwise specified
j
Parameter
Symbol
Values
typ.
Unit
min.
Switching Characteristics, Inductive Load at T = 125 °C
max.
j
Turn-on delay time
= 600 V, V = 15 V, I = 5 A
t
t
t
t
ns
nS
ns
d(on)
V
CC
GE
C
R
= 68 Ω
-
-
-
-
-
30
50
30
270
25
-
Gon
Rise time
= 600 V, V = 15 V, I = 5 A
r
V
CC
GE
C
R
= 68 Ω
20
Gon
Turn-off delay time
= 600 V, V = -15 V, I = 5 A
d(off)
V
CC
GE
C
Ω
R
= 68
180
15
Goff
Fall time
= 600 V, V = -15 V, I = 5 A
f
V
CC
GE
C
Ω
= 68
R
Goff
Total turn-off loss energy
= 600 V, V = -15 V, I = 5 A
E
mWs
off
V
CC
GE
C
Ω
R
= 68 , T = 25 °C
0.7
Goff
j
Free-Wheel Diode
Diode forward voltage
V
V
F
I = 4 A, V = 0 V, T = 25 °C
-
-
2.3
1.9
3
-
F
GE
j
I = 4 A, V = 0 V, T = 125 °C
F
GE
j
Reverse recovery time
I = 4 A, V = -300 V, V = 0 V
t
ns
rr
F
R
GE
di /dt = -800 A/µs
F
T = 25 °C
-
-
-
-
j
T = 125 °C
60
100
j
Reverse recovery charge
I = 4 A, V = -300 V, V = 0 V
Q
µC
rr
F
R
GE
di /dt = -800 A/µs
F
T = 25 °C
-
-
-
-
j
T = 125 °C
1
1.8
j
Semiconductor Group
3
Dec-02-1996
BUP 305 D
Power dissipation
Collector current
ƒ
ƒ
I = (T )
C C
P
= (T )
tot
C
≤
≥
≤
j
parameter: T 150 °C
parameter: V
15 V , T 150 °C
j
GE
12
A
110
W
10
90
Ptot
IC
9
80
70
60
50
40
30
20
8
7
6
5
4
3
2
10
0
1
0
0
20
40
60
80 100 120
°C 160
TC
0
20
40
60
80 100 120
°C 160
TC
Safe operating area
Transient thermal impedance IGBT
ƒ
ƒ
I = (V
)
Z
= (t )
th JC
C
CE
p
≤
parameter: D = 0, T = 25°C , T 150 °C
parameter: D = t / T
C
j
p
10 2
10 1
A
K/W
t
= 25.0µs
100 µs
p
IC
ZthJC
10 1
10 0
10 0
10 -1
1 ms
D = 0.50
0.20
0.10
0.05
0.02
0.01
10 ms
10 -1
10 -2
DC
single pulse
10 -2
10 0
10 -3
10 1
10 2
10 3
V
10 -5
10 -4
10 -3
10 -2
10 -1 s 10 0
tp
VCE
Semiconductor Group
4
Dec-02-1996
BUP 305 D
Typ. output characteristics
I = f(V
Typ. transfer characteristics
I = f (V
)
CE
)
GE
C
C
parameter: t = 80 µs, T = 125 °C
parameter: t = 80 µs, V = 20 V, T = 25 °C
P CE j
p
j
Typ. saturation characteristics
= f (V
Typ. saturation characteristics
VCE(sat) = f (V )
V
)
CE(sat)
GE
GE
parameter: T = 25 °C
parameter: T = 125 °C
j
j
Semiconductor Group
5
Dec-02-1996
BUP 305 D
Typ. capacitances
C = f (V
Typ. gate charge
ƒ
)
V
= (Q
)
CE
GE
Gate
parameter: I
= 6 A
parameter: V = 0 V, f = 1 MHz
C puls
GE
20
V
16
VGE
400 V
800 V
14
12
10
8
6
4
2
0
0
10
20
30
40
50
nC
65
QGate
Short circuit safe operating area
= f (V ) , T = 150°C
Reverse biased safe operating area
I = f (V ) , T = 150°C
Cpuls
I
Csc
CE
j
CE
j
parameter: VGE = ± 15 V, tsc 10 µs, L < 25 nH
parameter: VGE = 15 V
≤
10
2.5
ICsc/IC(90°C)
ICpuls/IC
6
1.5
1.0
4
2
0
0.5
0.0
0
200 400 600 800 1000 1200
V
1600
0
200 400 600 800 1000 1200
V
1600
Semiconductor Group
6
Dec-02-1996
BUP 305 D
Typ. switching time
t = f (R ), inductive load, T = 125 °C
G
j
parameter: V
= 600 V, V
= ± 15 V, I = 5 A
GE C
CE
Typ. forward characteristics
I = f (V )
Transient thermal impedance Diode
ƒ
= (t )
p
Z
F
F
th JC
parameter: D = t / T
parameter: T
p
j
10 1
10
A
K/W
8
IF
ZthJC
7
6
5
4
3
2
1
10 0
Tj=125°C
Tj=25°C
D = 0.50
0.20
10 -1
0.10
0.05
0.02
single pulse
0.01
0
10 -2
10 -5
0.0
0.5
1.0
1.5
2.0
V
3.0
10 -4
10 -3
10 -2
10 -1 s 10 0
tp
VF
Semiconductor Group
7
Dec-02-1996
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