IPP70N10SL-16 [INFINEON]

SIPMOS Power-Transistor; SIPMOS功率三极管
IPP70N10SL-16
型号: IPP70N10SL-16
厂家: Infineon    Infineon
描述:

SIPMOS Power-Transistor
SIPMOS功率三极管

文件: 总8页 (文件大小:125K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
IPI70N10SL-16  
IPP70N10SL-16, IPB70N10SL-16  
SIPMOS Power-Transistor  
Product Summary  
Feature  
V
100  
16  
V
DS  
N-Channel  
R
mΩ  
A
DS(on)  
Enhancement mode  
Logic Level  
I
70  
D
P-TO262-3-1  
P-TO263-3-2  
P-TO220-3-1  
175°C operating temperature  
Avalanche rated  
dv/dt rated  
2
3
2
• Green Package  
(lead free)  
1
P-TO220-3-1  
Type  
Package  
Ordering Code  
Marking  
N10L16  
N10L16  
N10L-16  
IPP70N10SL-16  
PG-TO220-3-1 SP0002-25708  
PG-TO263-3-2 SP0002-25700  
PG-TO262-3-1 SP000225705  
IPB70N10SL-16  
IPI70N10SL-16  
Maximum Ratings, at T = 25 °C, unless otherwise specified  
j
Parameter  
Symbol  
Value  
Unit  
A
Continuous drain current  
I
D
T =25°C  
70  
C
TC=100°C  
50  
280  
Pulsed drain current  
I
D puls  
T =25°C  
C
700  
mJ  
Avalanche energy, single pulse  
E
AS  
I =70 A , V =25V, R =25Ω  
D DD GS  
E
25  
6
Avalanche energy, periodic limited by T  
AR  
jmax  
Reverse diode dv/dt  
dv/dt  
kV/µs  
I =70A, V =0V, di/dt=200A/µs  
S DS  
Gate source voltage  
Power dissipation  
V
V
20  
GS  
P
250  
W
tot  
T =25°C  
C
°C  
Operating and storage temperature  
IEC climatic category; DIN IEC 68-1  
T , T  
-55... +175  
55/175/56  
j
stg  
Page 1  
2006-02-14  
IPI70N10SL-16  
IPP70N10SL-16, IPB70N10SL-16  
Thermal Characteristics  
Parameter  
Symbol  
Values  
typ.  
Unit  
min.  
max.  
Characteristics  
R
-
-
-
-
0.6 K/W  
62.5  
Thermal resistance, junction - case  
Thermal resistance, junction - ambient, leaded  
SMD version, device on PCB:  
@ min. footprint  
thJC  
R
thJA  
R
thJA  
-
-
-
-
62  
40  
2
1)  
@ 6 cm cooling area  
Electrical Characteristics, at T = 25 °C, unless otherwise specified  
j
Parameter  
Symbol  
Values  
typ.  
Unit  
min.  
100  
1.2  
max.  
Static Characteristics  
V
-
-
V
Drain-source breakdown voltage  
(BR)DSS  
V
=0V, I =2mA  
D
GS  
1.6  
2
Gate threshold voltage, V = V  
V
GS(th)  
GS  
DS  
I = 2 mA  
D
µA  
Zero gate voltage drain current  
I
DSS  
V
=100V, V =0V, T =25°C  
GS  
-
0.1  
1
DS  
j
V
=100V, V =0V, T =150°C  
GS  
-
-
-
10  
100  
100 nA  
DS  
j
Gate-source leakage current  
I
GSS  
V
=20V, V =0V  
DS  
GS  
-
-
14  
10  
25  
16  
Drain-source on-state resistance  
R
mΩ  
DS(on)  
DS(on)  
V
=4.5V, I =50A  
D
GS  
Drain-source on-state resistance  
R
V
=10V, I =50A  
D
GS  
1
Device on 40mm*40mm*1.5mm epoxy PCB FR4 with 6cm² (one layer, 70 µm thick) copper area for drain  
connection. PCB is vertical without blown air.  
Page 2  
2006-02-14  
IPI70N10SL-16  
IPP70N10SL-16, IPB70N10SL-16  
Electrical Characteristics, at T = 25 °C, unless otherwise specified  
j
Parameter  
Symbol  
Conditions  
Values  
typ.  
Unit  
min.  
max.  
Dynamic Characteristics  
Transconductance  
g
V
2*I *R  
,
30  
65  
-
S
fs  
DS  
I =50A  
D
DS(on)max  
D
Input capacitance  
Output capacitance  
Reverse transfer capacitance  
Turn-on delay time  
Rise time  
C
C
C
V
=0V, V =25V,  
DS  
-
-
-
-
-
-
-
3630 4540 pF  
iss  
GS  
f=1MHz  
640  
345  
70  
800  
oss  
rss  
430  
t
V
=50V, V =4.5V,  
GS  
105 ns  
375  
d(on)  
DD  
I =70A, R =1.3Ω  
t
250  
250  
95  
r
D
G
Turn-off delay time  
Fall time  
t
375  
d(off)  
t
f
145  
Gate Charge Characteristics  
Gate to source charge  
Gate to drain charge  
Q
Q
Q
V
=80V, I =70A  
-
-
-
10  
34  
15  
51  
nC  
gs  
gd  
g
DD  
D
V
=80V, I =70A,  
160  
240  
Gate charge total  
DD  
D
V
=0 to 10V  
GS  
V
=80V, I =70A  
-
-
3.22  
-
-
V
A
Gate plateau voltage  
V
DD  
D
(plateau)  
Reverse Diode  
T =25°C  
70  
Inverse diode continuous  
forward current  
I
S
C
I
-
-
-
-
-
280  
1.8  
Inv. diode direct current, pulsed  
Inverse diode forward voltage  
Reverse recovery time  
Reverse recovery charge  
SM  
V
=0V, I =140A  
1.2  
100  
600  
V
V
GS  
F
SD  
t
V =50V, I =l ,  
150 ns  
900 nC  
rr  
R
F S  
Q
di /dt=100A/µs  
rr  
F
Page 3  
2006-02-14  
IPI70N10SL-16  
IPP70N10SL-16, IPB70N10SL-16  
1 Power dissipation  
= f (T )  
2 Drain current  
I = f (T )  
P
tot  
C
D
C
parameter: V 10 V  
GS  
SPP70N10L  
SPP70N10L  
280  
W
75  
A
240  
220  
200  
180  
160  
140  
120  
100  
80  
60  
55  
50  
45  
40  
35  
30  
25  
20  
15  
10  
5
P
60  
40  
20  
0
0
0
20  
40  
60  
80 100 120 140 160  
190  
0
20  
40  
60  
80 100 120 140 160  
190  
°C  
°C  
T
T
C
C
3 Safe operating area  
I = f ( V  
4 Max. transient thermal impedance  
Z = f (t )  
thJC  
)
D
DS  
p
parameter : D = 0 , T = 25 °C  
parameter : D = t /T  
C
p
3
2
1
0
SPP70N10L  
SPP70N10L  
10 1  
10  
K/W  
A
t
= 18.0µs  
10 0  
p
10 -1  
10 -2  
10 -3  
10  
10  
10  
100 µs  
D = 0.50  
0.20  
0.10  
1 ms  
0.05  
0.02  
10 ms  
10 -4  
single pulse  
0.01  
DC  
10 -5  
10 -1  
10 0  
10 1  
10 2  
10 3  
10 -7  
10 -6  
10 -5  
10 -4  
10 -3  
10 -2  
10 0  
V
s
t
V
p
DS  
Page 4  
2006-02-14  
IPI70N10SL-16  
IPP70N10SL-16, IPB70N10SL-16  
5 Typ. output characteristic  
I = f (V ); T =25°C  
6 Typ. drain-source on resistance  
= f (I )  
R
D
DS  
j
DS(on)  
D
parameter: t = 80 µs  
parameter: V  
p
GS  
SPP70N10L  
SPP70N10L  
170  
80  
= 250W  
Ptot  
b
c
d
A
mΩ  
k
j
i
[V]  
V
g
GS  
a
l
h
f
e
2.5  
3.0  
3.5  
4.0  
4.5  
5.0  
5.5  
6.0  
6.5  
7.0  
8.0  
10.0  
140  
120  
100  
80  
b
c
d
e
f
60  
50  
40  
30  
20  
10  
0
d
g
h
i
c
j
60  
k
l
40  
e
b
f
g
h
j
i
k
l
V
[V] =  
c
3.0 3.5  
GS  
b
20  
d
4.0  
e
f
g
h
i
j
k
l
4.5 5.0  
5.5 6.0 6.5 7.0  
8.0 10.0  
a
0
0
1
2
3
4
5.5  
0
20  
40  
60  
80  
100  
130  
V
A
I
V
D
DS  
7 Typ. transfer characteristics  
8 Typ. forward transconductance  
I = f ( V ); V 2 x I x R  
g = f(I ); T =25°C  
D
GS  
DS  
D
DS(on)max  
fs  
D
j
parameter: t = 80 µs  
parameter: g  
p
fs  
60  
70  
A
S
60  
55  
50  
45  
40  
35  
30  
25  
20  
15  
10  
5
50  
45  
40  
35  
30  
25  
20  
15  
10  
5
0
0
0
V
A
0
0.5  
1
1.5  
2
2.5  
3
3.5  
4
5
10  
20  
30  
40  
55  
I
V
D
GS  
Page 5  
2006-02-14  
IPI70N10SL-16  
IPP70N10SL-16, IPB70N10SL-16  
9 Drain-source on-state resistance  
= f (T )  
10 Typ. gate threshold voltage  
V = f (T )  
GS(th)  
R
DS(on)  
j
j
parameter : I = 50 A, V = 4.5 V  
parameter: V = V , I = 2 mA  
D
GS  
GS DS D  
SPP70N10L  
110  
3
V
mΩ  
90  
80  
70  
60  
50  
40  
30  
20  
10  
0
2.4  
2.2  
2
1.8  
1.6  
1.4  
1.2  
1
max  
typ  
98%  
0.8  
0.6  
0.4  
0.2  
0
typ  
min  
°C  
°C  
-60  
-20  
20  
60  
100  
140  
200  
-60  
-20  
20  
60  
100  
140  
200  
T
T
j
j
11 Typ. capacitances  
C = f (V  
12 Forward character. of reverse diode  
I = f (V  
)
)
SD  
DS  
F
parameter: V =0V, f=1 MHz  
parameter: T , tp = 80 µs  
GS  
j
4
10 3  
SPP70N10L  
10  
A
pF  
C
iss  
10 2  
I
3
10  
C
C
oss  
10 1  
Tj = 25 °C typ  
rss  
Tj = 175 °C typ  
Tj = 25 °C (98%)  
Tj = 175 °C (98%)  
2
10  
10 0  
V
0
5
10  
15  
20  
25  
30  
40  
0
0.4  
0.8  
1.2  
1.6  
2
2.4  
3
V
V
V
SD  
DS  
Page 6  
2006-02-14  
IPI70N10SL-16  
IPP70N10SL-16, IPB70N10SL-16  
13 Typ. avalanche energy  
= f (T )  
14 Typ. gate charge  
= f (Q  
E
V
)
Gate  
AS  
j
GS  
par.: I = 70 A , V = 25 V, R = 25 Ω  
parameter: I = 70 A pulsed  
D
DD  
GS  
D
SPP70N10L  
16  
700  
mJ  
V
600  
550  
500  
450  
400  
350  
300  
250  
200  
150  
100  
50  
12  
10  
V
0,2 VDS max  
0,8  
VDS max  
8
6
4
2
0
0
25  
45  
65  
85  
105  
125  
145  
185  
0
40  
80  
120  
160  
200  
280  
Gate  
°C  
nC  
Q
T
j
15 Drain-source breakdown voltage  
V
= f (T )  
(BR)DSS  
j
SPP70N10L  
120  
V
114  
112  
110  
108  
106  
104  
102  
100  
98  
V
96  
94  
92  
90  
-60  
-20  
20  
60  
100  
140  
200  
°C  
T
j
Page 7  
2006-02-14  
IPI70N10SL-16  
IPP70N10SL-16, IPB70N10SL-16  
Published by  
Infineon Technologies AG,  
Bereichs Kommunikation  
St.-Martin-Strasse 53,  
D-81541 München  
© Infineon Technologies AG 1999  
All Rights Reserved.  
Attention please!  
The information herein is given to describe certain components and shall not be considered as warranted  
characteristics.  
Terms of delivery and rights to technical change reserved.  
We hereby disclaim any and all warranties, including but not limited to warranties of non-infringement,  
regarding circuits, descriptions and charts stated herein.  
Infineon Technologies is an approved CECC manufacturer.  
Information  
For further information on technology, delivery terms and conditions and prices please contact your nearest  
Infineon Technologies Office in Germany or our Infineon Technologies Reprensatives worldwide (see address list).  
Warnings  
Due to technical requirements components may contain dangerous substances.  
For information on the types in question please contact your nearest Infineon Technologies Office.  
Infineon Technologies Components may only be used in life-support devices or systems with the express  
written approval of Infineon Technologies, if a failure of such components can reasonably be expected to  
cause the failure of that life-support device or system, or to affect the safety or effectiveness of that device  
or system Life support devices or systems are intended to be implanted in the human body, or to support  
Page 8  
2006-02-14  

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