IRGI4086PBF

更新时间:2024-10-29 12:30:02
品牌:INFINEON
描述:PDP TRENCH IGBT

IRGI4086PBF 概述

PDP TRENCH IGBT PDP TRENCH IGBT

IRGI4086PBF 数据手册

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PD - 96223  
IRGI4086PbF  
PDP TRENCH IGBT  
Key Parameters  
Features  
VCE min  
V
300  
V
V
l
Advanced Trench IGBT Technology  
l
Optimized for Sustain and Energy Recovery  
Circuits in PDP Applications  
CE(ON) typ. @ IC = 25A  
1.29  
IRP max @ TC= 25°C  
TJ max  
A
°C  
230  
150  
TM  
l
Low VCE(on) and Energy per Pulse (EPULSE  
for Improved Panel Efficiency  
)
l
l
High Repetitive Peak Current Capability  
Lead Free Package  
C
E
C
G
G
TO-220AB  
Full-Pak  
E
n-channel  
G
C
E
Gate  
Collector  
Emitter  
Description  
This IGBT is specifically designed for applications in Plasma Display Panels. This device utilizes advanced  
trenchIGBTtechnologytoachievelowVCE(on)andlowEPULSETM ratingpersiliconareawhichimprovepanel  
efficiency. Additional features are 150°C operating junction temperature and high repetitive peak current  
capability. These features combine to make this IGBT a highly efficient, robust and reliable device for PDP  
applications.  
Absolute Maximum Ratings  
Max.  
Parameter  
Units  
VGE  
±30  
Gate-to-Emitter Voltage  
V
IC @ TC = 25°C  
IC @ TC = 100°C  
IRP @ TC = 25°C  
PD @TC = 25°C  
PD @TC = 100°C  
Continuous Collector Current, VGE @ 15V  
Continuous Collector, VGE @ 15V  
Repetitive Peak Current  
25  
12  
230  
A
43  
Power Dissipation  
W
17  
Power Dissipation  
0.34  
Linear Derating Factor  
W/°C  
TJ  
-40 to + 150  
Operating Junction and  
TSTG  
°C  
N
Storage Temperature Range  
Soldering Temperature for 10 seconds  
Mounting Torque, 6-32 or M3 Screw  
300  
10lb in (1.1N m)  
Thermal Resistance  
Parameter  
Typ.  
–––  
Max.  
2.9  
Units  
°C/W  
RθJC  
Junction-to-Case  
www.irf.com  
1
02/02/09  
IRGI4086PbF  
Electrical Characteristics @ TJ = 25°C (unless otherwise specified)  
Conditions  
VGE = 0V, ICE = 1 mA  
Parameter  
Collector-to-Emitter Breakdown Voltage 300  
Min. Typ. Max. Units  
BVCES  
–––  
–––  
–––  
V
Reference to 25°C, ICE = 1mA  
VGE = 15V, ICE = 12A  
V
/ T  
J
∆Β  
Breakdown Voltage Temp. Coefficient  
Static Collector-to-Emitter Voltage  
–––  
–––  
–––  
–––  
–––  
–––  
–––  
2.6  
–––  
–––  
–––  
–––  
–––  
–––  
–––  
–––  
–––  
0.29  
V/°C  
CES  
1.10 1.36  
1.29 1.55  
1.49 1.67  
1.90 2.10  
2.57 2.96  
VGE = 15V, ICE = 25A  
VGE = 15V, ICE = 40A  
VCE(on)  
V
VGE = 15V, ICE = 70A  
VGE = 15V, ICE = 120A  
VGE = 15V, ICE = 70A, TJ = 150°C  
2.27  
–––  
-11  
2.0  
5.0  
100  
–––  
–––  
29  
–––  
5.0  
VCE = VGE, ICE = 500µA  
VGE(th)  
Gate Threshold Voltage  
V
V
/ T  
J
Gate Threshold Voltage Coefficient  
Collector-to-Emitter Leakage Current  
––– mV/°C  
GE(th)  
VCE = 300V, VGE = 0V  
ICES  
25  
–––  
–––  
100  
-100  
–––  
–––  
–––  
µA  
VCE = 300V, VGE = 0V, TJ = 100°C  
VCE = 300V, VGE = 0V, TJ = 150°C  
V
V
V
V
GE = 30V  
IGES  
Gate-to-Emitter Forward Leakage  
Gate-to-Emitter Reverse Leakage  
Forward Transconductance  
Total Gate Charge  
Gate-to-Collector Charge  
Turn-On delay time  
Rise time  
nA  
GE = -30V  
CE = 25V, ICE = 25A  
CE = 200V, IC = 25A, VGE = 15V  
gfe  
Qg  
Qgc  
td(on)  
tr  
S
65  
nC  
22  
IC = 25A, VCC = 196V  
36  
R = 10 , L=200µH, L = 200nH  
31  
ns  
ns  
G
S
td(off)  
tf  
td(on)  
tr  
td(off)  
tf  
TJ = 25°C  
Turn-Off delay time  
Fall time  
112  
65  
IC = 25A, VCC = 196V  
Turn-On delay time  
Rise time  
30  
R = 10 , L=200µH, L = 200nH  
33  
G
S
TJ = 150°C  
Turn-Off delay time  
Fall time  
145  
98  
tst  
VCC = 240V, VGE = 15V, RG= 5.1Ω  
L = 220nH, C= 0.40µF, VGE = 15V  
VCC = 240V, RG= 5.1Ω, TJ = 25°C  
L = 220nH, C= 0.40µF, VGE = 15V  
VCC = 240V, RG= 5.1Ω, TJ = 100°C  
VGE = 0V  
Shoot Through Blocking Time  
100  
–––  
–––  
ns  
µJ  
––– 1075 –––  
EPULSE  
Energy per Pulse  
––– 1432 –––  
––– 2250 –––  
Ciss  
Coss  
Crss  
LC  
Input Capacitance  
VCE = 30V  
Output Capacitance  
–––  
–––  
–––  
110  
58  
–––  
–––  
–––  
pF  
ƒ = 1.0MHz,  
See Fig.13  
Reverse Transfer Capacitance  
Internal Collector Inductance  
5.0  
Between lead,  
nH 6mm (0.25in.)  
from package  
LE  
Internal Emitter Inductance  
–––  
13  
–––  
and center of die contact  
Notes:  
ƒ Pulse width 400µs; duty cycle 2%.  
 Half sine wave with duty cycle = 0.1, ton=2µsec.  
‚ R is measured at TJ of approximately 90°C.  
θ
2
www.irf.com  
IRGI4086PbF  
240  
200  
160  
120  
80  
240  
200  
160  
120  
80  
V
V
V
V
V
V
= 18V  
= 15V  
= 12V  
= 10V  
= 8.0V  
= 6.0V  
V
V
V
V
V
V
= 18V  
= 15V  
= 12V  
= 10V  
= 8.0V  
= 6.0V  
GE  
GE  
GE  
GE  
GE  
GE  
GE  
GE  
GE  
GE  
GE  
GE  
40  
40  
0
0
0
4
8
12  
16  
0
4
8
12  
16  
V
(V)  
V
(V)  
CE  
CE  
Fig 2. Typical Output Characteristics @ 75°C  
Fig 1. Typical Output Characteristics @ 25°C  
240  
240  
V
V
V
V
V
V
= 18V  
= 15V  
= 12V  
= 10V  
= 8.0V  
= 6.0V  
V
V
V
V
V
V
= 18V  
= 15V  
= 12V  
= 10V  
= 8.0V  
= 6.0V  
GE  
GE  
GE  
GE  
GE  
GE  
GE  
GE  
GE  
GE  
GE  
GE  
200  
160  
120  
80  
200  
160  
120  
80  
40  
40  
0
0
0
4
8
12  
16  
0
4
8
12  
16  
V
(V)  
V
(V)  
CE  
CE  
Fig 3. Typical Output Characteristics @ 125°C  
Fig 4. Typical Output Characteristics @ 150°C  
240  
200  
10  
I
= 25A  
C
8
6
4
2
0
T
T
= 25°C  
J
J
= 150°C  
160  
120  
80  
T
T
= 25°C  
J
J
= 150°C  
40  
0
5
10  
15  
20  
2
4
6
8
10  
12  
14  
16  
V
(V)  
V
(V)  
GE  
GE  
Fig 5. Typical Transfer Characteristics  
Fig 6. VCE(ON) vs. Gate Voltage  
www.irf.com  
3
IRGI4086PbF  
240  
220  
200  
180  
160  
140  
120  
100  
80  
30  
25  
20  
15  
10  
5
ton= 2µs  
Duty cycle <= 0.05  
Half Sine Wave  
60  
40  
20  
0
0
0
25  
50  
75  
(°C)  
100  
125  
150  
25  
50  
75  
100  
125  
150  
T
C
Case Temperature (°C)  
Fig 8. Typical Repetitive Peak Current vs. Case Temperature  
Fig 7. Maximum Collector Current vs. Case Temperature  
1500  
1600  
L = 220nH  
C = 0.4µF  
V
= 240V  
1400  
1300  
1200  
1100  
1000  
900  
CC  
1400  
1200  
1000  
800  
L = 220nH  
C = variable  
100°C  
100°C  
25°C  
800  
25°C  
600  
700  
600  
400  
500  
200  
400  
150 160 170 180 190 200 210 220 230 240  
Collector-to-Emitter Voltage (V)  
160 170 180 190 200 210 220 230  
V
I , Peak Collector Current (A)  
C
CE,  
Fig 9. Typical EPULSE vs. Collector Current  
Fig 10. Typical EPULSE vs. Collector-to-Emitter Voltage  
2000  
1000  
V
= 240V  
CC  
L = 220nH  
t = 1µs half sine  
C= 0.4µF  
1600  
1200  
800  
400  
0
100  
10µsec  
100µsec  
1msec  
10  
C= 0.3µF  
C= 0.2µF  
125  
1
Tc = 25°C  
Tj = 150°C  
Single Pulse  
0.1  
25  
50  
75  
100  
150  
1
10  
100  
1000  
T , Temperature (ºC)  
J
V
(V)  
CE  
Fig 11. EPULSE vs. Temperature  
Fig 12. Forward Bias Safe Operating Area  
4
www.irf.com  
IRGI4086PbF  
25  
20  
15  
10  
5
10000  
1000  
100  
I
= 25A  
D
V
V
V
= 240V  
= 200V  
= 150V  
DS  
DS  
DS  
Cies  
Coes  
Cres  
0
10  
0
20  
40  
60  
80  
100  
0
100  
200  
300  
Q
Total Gate Charge (nC)  
G
V
(V)  
CE  
Fig 13. Typical Capacitance vs. Collector-to-Emitter Voltage  
10  
Fig 14. Typical Gate Charge vs. Gate-to-Emitter Voltage  
D = 0.50  
1
0.20  
0.10  
0.05  
0.1  
R1  
R1  
R2  
R2  
R3  
R3  
R4  
R4  
Ri (°C/W) τi (sec)  
0.02  
0.12489 0.00005  
τ
τ
J τJ  
τ
Cτ  
0.01  
0.35135 0.001807  
1.07738 0.133584  
τ
1τ1  
τ
τ
2 τ2  
3τ3  
4τ4  
Ci= τi/Ri  
1.34638  
2.34  
0.01  
SINGLE PULSE  
( THERMAL RESPONSE )  
Notes:  
1. Duty Factor D = t1/t2  
2. Peak Tj = P dm x Zthjc + Tc  
0.001  
1E-006  
1E-005  
0.0001  
0.001  
0.01  
0.1  
1
10  
100  
t
, Rectangular Pulse Duration (sec)  
1
Fig 15. Maximum Effective Transient Thermal Impedance, Junction-to-Case (IGBT)  
www.irf.com  
5
IRGI4086PbF  
A
RG  
C
PULSE A  
PULSE B  
DRIVER  
L
VCC  
B
Ipulse  
RG  
DUT  
tST  
Fig 16b. tst Test Waveforms  
Fig 16a. tst and EPULSE Test Circuit  
VCE  
Energy  
IC Current  
L
VCC  
DUT  
0
1K  
Fig 16c. EPULSE Test Waveforms  
Fig. 17 - Gate Charge Circuit (turn-off)  
6
www.irf.com  
IRGI4086PbF  
TO-220 Full-Pak Package Outline  
Dimensions are shown in millimeters (inches)  
TO-220 Full-Pak Part Marking Information  
TO-220AB Full-Pak package is not recommended for Surface Mount Application.  
Note: For the most current drawing please refer to IR website at: http://www.irf.com/package/  
The specifications set forth in this data sheet are the sole and  
exclusive specifications applicable to the identified product,  
and no specifications or features are implied whether by  
industry custom, sampling or otherwise. We qualify our  
products in accordance with our internal practices and  
procedures, which by their nature do not include qualification  
to all possible or even all widely used applications. Without  
limitation, we have not qualified our product for medical use or  
applications involving hi-reliability applications. Customers  
are encouraged to and responsible for qualifying product to  
their own use and their own application environments,  
especially where particular features are critical to operational  
performance or safety. Please contact your IR representative  
if you have specific design or use requirements or for further  
information.  
Data and specifications subject to change without notice.  
This product has been designed for the Industrial market.  
Qualification Standards can be found on IR’s Web site.  
IR WORLD HEADQUARTERS: 233 Kansas St., El Segundo, California 90245, USA Tel: (310) 252-7105  
TAC Fax: (310) 252-7903  
Visit us at www.irf.com for sales contact information.02/2009  
www.irf.com  
7

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