IRGP6630DPBF [INFINEON]

Insulated Gate Bipolar Transistor with Ultrafast Soft Recovery Diode;
IRGP6630DPBF
型号: IRGP6630DPBF
厂家: Infineon    Infineon
描述:

Insulated Gate Bipolar Transistor with Ultrafast Soft Recovery Diode

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中文:  中文翻译
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IRGP6630DPbF  
IRGP6630D-EPbF  
Insulated Gate Bipolar Transistor with Ultrafast Soft Recovery Diode  
VCES = 600V  
C
IC = 30A, TC =100°C  
tSC 5µs, TJ(max) = 175°C  
CE(ON) typ. = 1.65V @ IC = 18A  
G
E
V
IRGP6630DPbF  
IRGP6630DEPbF  
TO247AD  
n-channel  
TO247AC  
Applications  
G
Gate  
C
E
 Welding  
 H Bridge Converters  
Collector  
Emitter  
Features  
Low VCE(ON) and Switching Losses  
Benefits  
High Efficiency in a Wide Range of Applications  
Optimized Diode for Full Bridge Hard Switch Converters  
Square RBSOA and Maximum Temperature of 175°C  
Optimized for Welding and H Bridge Converters  
Improved Reliability due to Rugged Hard Switching  
Performance and High Power Capability  
Enables Short Circuit Protection Operation  
Excellent Current Sharing in Parallel Operation  
Environmentally friendly  
5µs Short Circuit  
Positive VCE (ON) Temperature Co-efficient  
Lead-free, RoHS compliant  
Base part number  
Package Type  
Standard Pack  
Orderable Part Number  
Form  
Tube  
Tube  
Quantity  
IRGP6630DPbF  
IRGP6630D-EPbF  
TO-247AC  
TO-247AD  
25  
25  
IRGP6630DPbF  
IRGP6630D-EPbF  
Absolute Maximum Ratings  
Parameter  
Max.  
Units  
VCES  
IC @ TC = 25°C  
Collector-to-Emitter Voltage  
Continuous Collector Current  
600  
47  
V
IC @ TC = 100°C  
Continuous Collector Current  
30  
ICM  
ILM  
Pulse Collector Current, VGE = 15V  
Clamped Inductive Load Current, VGE = 20V  
54  
72  
15  
A
IFRM @ TC = 100°C Diode Repetitive Peak Forward Current  
IFM  
Diode Maximum Forward Current   
72  
±20  
VGE  
Continuous Gate-to-Emitter Voltage  
V
PD @ TC = 25°C  
PD @ TC = 100°C  
TJ  
Maximum Power Dissipation  
Maximum Power Dissipation  
Operating Junction and  
192  
96  
-40 to +175  
W
TSTG  
Storage Temperature Range  
Soldering Temperature, for 10 sec.  
Mounting Torque, 6-32 or M3 Screw  
°C  
300 (0.063 in. (1.6mm) from case)  
10 lbf·in (1.1 N·m)  
Thermal Resistance  
Parameter  
Min.  
–––  
–––  
–––  
–––  
Typ.  
–––  
–––  
0.24  
–––  
Max.  
0.78  
5.9  
–––  
40  
Units  
Thermal Resistance Junction-to-Case-(each IGBT)   
Thermal Resistance Junction-to-Case-(each Diode)   
Thermal Resistance, Case-to-Sink (flat, greased surface)  
Thermal Resistance, Junction-to-Ambient (typical socket mount)  
RJC (IGBT)  
RJC (Diode)  
RCS  
°C/W  
RJA  
1
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November 14, 2014  
IRGP6630DPbF/IRGP6630D-EPbF  
Electrical Characteristics @ TJ = 25°C (unless otherwise specified)  
Parameter  
Min.  
Typ.  
Max. Units  
Conditions  
V(BR)CES  
V(BR)CES/TJ  
Collector-to-Emitter Breakdown Voltage  
Temperature Coeff. of Breakdown Voltage  
600  
0.94  
V
VGE = 0V, IC = 100µA   
V/°C VGE = 0V, IC = 1.2mA (25°C-175°C)  
1.65  
2.05  
2.10  
1.95  
IC = 18A, VGE = 15V, TJ = 25°C  
VCE(on)  
VGE(th)  
Collector-to-Emitter Saturation Voltage  
V
V
IC = 18A, VGE = 15V, TJ = 150°C  
IC = 18A, VGE = 15V, TJ = 175°C  
VCE = VGE, IC = 500µA  
Gate Threshold Voltage  
4.0  
6.5  
Threshold Voltage Temperature Coeff.  
Forward Transconductance  
-20  
mV/°C VCE = VGE, IC = 500µA (25°C-175°C)  
VGE(th)/TJ  
gfe  
12  
1.0  
410  
1.6  
1.3  
25  
±100  
2.3  
S
µA  
nA  
V
V
V
CE = 50V, IC = 18A, PW = 20µs  
GE = 0V, VCE = 600V  
ICES  
IGES  
VF  
Collector-to-Emitter Leakage Current  
Gate-to-Emitter Leakage Current  
Diode Forward Voltage Drop  
VGE = 0V, VCE = 600V, TJ = 175°C  
VGE = ±20V  
IF = 6A  
IF = 6A, TJ = 175°C  
Switching Characteristics @ TJ = 25°C (unless otherwise specified)  
Parameter  
Total Gate Charge (turn-on)  
Gate-to-Emitter Charge (turn-on)  
Gate-to-Collector Charge (turn-on)  
Turn-On Switching Loss  
Turn-Off Switching Loss  
Total Switching Loss  
Turn-On delay time  
Rise time  
Min.  
Typ.  
30  
10  
15  
75  
350  
425  
40  
25  
95  
Max Units  
Conditions  
Qg  
IC = 18A  
VGE = 15V  
Qge  
Qgc  
Eon  
Eoff  
Etotal  
td(on)  
tr  
nC  
µJ  
VCC = 400V  
IC = 18A, VCC = 400V, VGE=15V  
RG = 22, TJ = 25°C  
Energy losses include tail & diode  
reverse recovery   
ns  
µJ  
ns  
pF  
td(off)  
tf  
Turn-Off delay time  
Fall time  
20  
Eon  
Eoff  
Etotal  
td(on)  
tr  
td(off)  
tf  
Cies  
Coes  
Cres  
Turn-On Switching Loss  
Turn-Off Switching Loss  
Total Switching Loss  
Turn-On delay time  
Rise time  
Turn-Off delay time  
Fall time  
Input Capacitance  
230  
570  
800  
30  
25  
100  
80  
1080  
70  
30  
IC = 18A, VCC = 400V, VGE=15V  
RG = 22, TJ = 175°C  
Energy losses include tail & diode  
reverse recovery   
VGE = 0V  
VCC = 30V  
Output Capacitance  
Reverse Transfer Capacitance  
f = 1.0MHz  
TJ = 175°C, IC = 72A  
VCC = 480V, Vp 600V  
VGE = +20V to 0V  
RBSOA  
Reverse Bias Safe Operating Area  
FULL SQUARE  
TJ = 150°C,VCC = 400V, Vp 600V  
VGE = +15V to 0V  
SCSOA  
Short Circuit Safe Operating Area  
5
µs  
Erec  
trr  
Reverse Recovery Energy of the Diode  
Diode Reverse Recovery Time  
180  
70  
µJ TJ = 175°C  
VCC = 400V, IF = 6A, VGE = 15V  
ns  
Rg = 22L = 0.68mH, L=150nH  
Irr  
Peak Reverse Recovery Current  
15  
A
Notes:  
VCC = 80% (VCES), VGE = 20V, Rg = 22L=620µH.  
Ris measured at TJ of approximately 90°C.  
Refer to AN-1086 for guidelines for measuring V(BR)CES safely.  
Pulse width limited by max. junction temperature.  
Values influenced by parasitic L and C in measurement.  
fsw =40KHz, refer to figure 26.  
2
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November 14, 2014  
IRGP6630DPbF/IRGP6630D-EPbF  
60  
50  
40  
30  
20  
10  
For both:  
Duty cycle : 50%  
Tj = 175°C  
Tcase = 100°C  
Gate drive as specified  
Power Dissipation = 103W  
Square Wave:  
VCC  
I
Diode as specified  
0.1  
1
10  
100  
f , Frequency ( kHz )  
Fig. 1 - Typical Load Current vs. Frequency  
(Load Current = IRMS of fundamental)  
50  
40  
30  
20  
10  
0
200  
150  
100  
50  
0
25  
50  
75  
T
100  
(°C)  
125  
150  
175  
25  
50  
75  
100  
(°C)  
125  
150  
175  
T
C
C
Fig. 3 - Power Dissipation vs.  
Fig. 2 - Maximum DC Collector Current vs.  
Case Temperature  
Case Temperature  
100  
10  
1
100  
10µsec  
100µsec  
10  
1msec  
1
DC  
Tc = 25°C  
Tj = 175°C  
Single Pulse  
0.1  
10  
100  
1000  
1
10  
100  
1000  
V
(V)  
V
(V)  
CE  
CE  
Fig. 5 - Reverse Bias SOA  
TJ = 175°C; VGE = 20V  
Fig. 4 - Forward SOA  
TC = 25°C; TJ 175°C; VGE = 15V  
3
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November 14, 2014  
IRGP6630DPbF/IRGP6630D-EPbF  
72  
72  
60  
48  
36  
24  
12  
0
V
V
V
V
V
= 18V  
= 15V  
= 12V  
= 10V  
= 8.0V  
V
V
V
V
V
= 18V  
= 15V  
= 12V  
= 10V  
= 8.0V  
GE  
GE  
GE  
GE  
GE  
GE  
GE  
GE  
GE  
GE  
60  
48  
36  
24  
12  
0
0
2
4
6
8
10  
0
2
4
6
8
10  
V
(V)  
V
(V)  
CE  
CE  
Fig. 6 - Typ. IGBT Output Characteristics  
Fig. 7 - Typ. IGBT Output Characteristics  
TJ = -40°C; tp = 20µs  
TJ = 25°C; tp = 20µs  
72  
60  
48  
36  
24  
12  
0
72  
V
V
V
V
V
= 18V  
= 15V  
= 12V  
= 10V  
= 8.0V  
GE  
GE  
GE  
GE  
GE  
-40°C  
25°C  
175°C  
60  
48  
36  
24  
12  
0
0
2
4
6
8
10  
0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0  
V
(V)  
V
(V)  
CE  
F
Fig. 9 - Typ. Diode Forward Voltage Drop  
Fig. 8 - Typ. IGBT Output Characteristics  
Characteristics  
TJ = 175°C; tp = 20µs  
8
8
6
I
= 9.0A  
= 18A  
= 36A  
CE  
6
4
2
0
I
= 9.0A  
= 18A  
= 36A  
I
CE  
CE  
I
I
CE  
CE  
I
CE  
4
2
0
5
10  
15  
20  
5
10  
15  
20  
V
(V)  
V
(V)  
GE  
GE  
Fig. 10 - Typical VCE vs. VGE  
Fig. 11 - Typical VCE vs. VGE  
TJ = -40°C  
TJ = 25°C  
4
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November 14, 2014  
IRGP6630DPbF/IRGP6630D-EPbF  
72  
8
6
4
2
0
T = 25°C  
J
60  
T = 175°C  
J
I
= 9.0A  
= 18A  
= 36A  
CE  
48  
36  
24  
12  
0
I
CE  
I
CE  
4
6
8
10  
12  
14  
16  
5
10  
15  
20  
V
(V)  
V
(V)  
GE  
GE  
Fig. 13 - Typ. Transfer Characteristics  
Fig. 12 - Typical VCE vs. VGE  
VCE = 50V; tp = 20µs  
TJ = 175°C  
1000  
100  
10  
2000  
1600  
1200  
800  
400  
0
td  
OFF  
t
F
t
R
E
OFF  
td  
ON  
E
ON  
1
0
10  
20  
(A)  
30  
40  
0
10  
20  
(A)  
30  
40  
I
I
C
C
Fig. 14 - Typ. Energy Loss vs. IC  
Fig. 15 - Typ. Switching Time vs. IC  
TJ = 175°C; ; VCE = 400V, RG = 22; VGE = 15V  
TJ = 175°C; VCE = 400V, RG = 22; VGE = 15V  
1000  
1000  
800  
td  
OFF  
E
OFF  
E
600  
400  
200  
0
100  
t
F
ON  
td  
ON  
t
R
10  
0
20  
40  
60  
( )  
80  
100  
0
20  
40  
60  
80  
100  
R
Rg ( )  
G
Fig. 17 - Typ. Switching Time vs. RG  
Fig. 16 - Typ. Energy Loss vs. RG  
TJ = 175°C; VCE = 400V, ICE = 18A; VGE = 15V  
TJ = 175°C; VCE = 400V, ICE = 18A; VGE = 15V  
5
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November 14, 2014  
IRGP6630DPbF/IRGP6630D-EPbF  
25  
20  
15  
10  
5
25  
R
10  
G =  
20  
15  
10  
5
R
22  
G =  
R
47  
G =  
R
100  
G =  
0
0
2
4
6
8
10  
12  
0
20  
40  
60  
(  
80  
100  
I
(A)  
R
F
G
Fig. 19 - Typ. Diode IRR vs. RG  
Fig. 18 - Typ. Diode IRR vs. IF  
TJ = 175°C  
TJ = 175°C  
2000  
1500  
1000  
500  
0
25  
20  
15  
10  
5
12A  
10  
22  
47  
100  
6A  
3A  
0
200 400 600 800 1000 1200 1400  
0
200  
400  
600  
800 1000 1200  
di /dt (A/µs)  
F
di /dt (A/µs)  
F
Fig. 20 - Typ. Diode IRR vs. diF/dt  
CC = 400V; VGE = 15V; IF = 6A; TJ = 175°C  
Fig. 21 - Typ. Diode QRR vs. diF/dt  
V
VCC = 400V; VGE = 15V; TJ = 175°C  
20  
16  
12  
8
100  
80  
60  
40  
20  
0
350  
300  
250  
200  
150  
100  
50  
R
= 10  
G
R
= 22  
= 47  
G
R
G
I
T
R
= 100  
sc  
sc  
G
4
0
0
9
10  
11  
12  
V
13  
14  
15  
16  
2
4
6
8
10  
12  
(V)  
GE  
I
(A)  
F
Fig. 23 - VGE vs. Short Circuit Time  
CC = 400V; TC = 150°C  
Fig. 22 - Typ. Diode ERR vs. IF  
V
TJ = 175°C  
6
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November 14, 2014  
IRGP6630DPbF/IRGP6630D-EPbF  
10000  
1000  
100  
10  
16  
14  
12  
10  
8
V
V
= 400V  
= 300V  
CES  
CES  
Cies  
Coes  
Cres  
6
4
2
1
0
0
100  
200  
300  
(V)  
400  
500  
600  
0
5
10  
15  
20  
25  
30  
35  
V
Q
, Total Gate Charge (nC)  
CE  
G
Fig. 25 - Typical Gate Charge vs. VGE  
CE = 18A  
Fig. 24 - Typ. Capacitance vs. VCE  
I
VGE= 0V; f = 1MHz  
50  
40  
30  
20  
10  
0
D=0.1  
D=0.2  
D=0.5  
100  
125  
150  
175  
Case Temperature (°C)  
Fig 26. Maximum Diode Repetitive Forward Peak Current vs. Case Temperature  
1
D = 0.50  
0.20  
0.10  
0.1  
R1  
R1  
R2  
R2  
R3  
R3  
Ri (°C/W)  
0.21694  
0.29812  
0.26453  
i (sec)  
0.00021  
0.000939  
0.008391  
0.05  
J J  
CC  
0.02  
0.01  
1 1  
2 2  
33  
Ci= iRi  
0.01  
Ci= iRi  
Notes:  
1. Duty Factor D = t1/t2  
SINGLE PULSE  
( THERMAL RESPONSE )  
2. Peak Tj = P dm x Zthjc + Tc  
0.001  
1E-006  
1E-005  
0.0001  
0.001  
0.01  
0.1  
1
t
, Rectangular Pulse Duration (sec)  
1
Fig. 27 - Maximum Transient Thermal Impedance, Junction-to-Case (IGBT)  
7
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IRGP6630DPbF/IRGP6630D-EPbF  
10  
1
D = 0.50  
0.20  
0.10  
0.05  
Ri (°C/W)  
0.40747  
1.84187  
2.51697  
1.13369  
i (sec)  
0.000104  
0.000268  
0.002634  
0.026058  
0.02  
0.01  
R1  
R1  
R2  
R2  
R3  
R3  
R4  
R4  
0.1  
J J  
CC  
1 1  
2 2  
3 3  
4 4  
Ci= iRi  
Ci= iRi  
0.01  
Notes:  
1. Duty Factor D = t1/t2  
SINGLE PULSE  
( THERMAL RESPONSE )  
2. Peak Tj = P dm x Zthjc + Tc  
0.001  
1E-006  
1E-005  
0.0001  
0.001  
0.01  
0.1  
1
t
, Rectangular Pulse Duration (sec)  
1
Fig. 28 - Maximum Transient Thermal Impedance, Junction-to-Case (DIODE)  
8
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IRGP6630DPbF/IRGP6630D-EPbF  
L
L
80 V  
+
-
VCC  
DUT  
0
DUT  
VCC  
1K  
Rg  
Fig.C.T.1 - Gate Charge Circuit (turn-off)  
Fig.C.T.2 - RBSOA Circuit  
diode clamp /  
DUT  
L
4X  
DC  
DUT  
VCC  
-5V  
DUT /  
VCC  
DRIVER  
Rg  
RSH  
Fig.C.T.3 - S.C. SOA Circuit  
Fig.C.T.4 - Switching Loss Circuit  
C force  
100K  
R = VCC  
ICM  
D1 22K  
C sense  
VCC  
DUT  
DUT  
G force  
0.0075µF  
Rg  
E sense  
E force  
Fig.C.T.5 - Resistive Load Circuit  
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Fig.C.T.6 - BVCES Filter Circuit  
9
November 14, 2014  
IRGP6630DPbF/IRGP6630D-EPbF  
600  
500  
400  
300  
200  
100  
0
30  
25  
20  
15  
10  
5
600  
500  
400  
300  
200  
100  
0
30  
25  
20  
15  
10  
5
tr  
TEST  
CURRENT  
tf  
90% ICE  
90% ICE  
10%ICE  
10% VCE  
10% VCE  
10% ICE  
0
0
Eon Loss  
Eoff Loss  
-100  
-5  
-100  
-5  
-0.4  
0
0.4  
time (µs)  
0.8  
1.2  
-0.2  
0
0.2  
0.4  
0.6  
0.8  
time(µs)  
Fig. WF1 - Typ. Turn-off Loss Waveform  
Fig. WF2 - Typ. Turn-on Loss Waveform  
@ TJ = 175°C using Fig. CT.4  
@ TJ = 175°C using Fig. CT.4  
600  
500  
400  
300  
200  
100  
0
120  
20  
100  
80  
60  
40  
20  
0
15  
10  
5
QRR  
VCE  
tRR  
ICE  
0
-5  
Peak  
IRR  
-10  
-15  
-20  
-100  
-20  
5.00  
-10.00  
-5.00  
0.00  
-0.15 -0.05 0.05 0.15 0.25 0.35  
Time (uS)  
time (µS)  
Fig. WF3 - Typ. Diode Recovery Waveform  
Fig. WF4 - Typ. S.C. Waveform  
@ TJ = 175°C using Fig. CT.4  
@ TJ = 150°C using Fig. CT.3  
10  
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November 14, 2014  
IRGP6630DPbF/IRGP6630D-EPbF  
TO-247AC Package Outline  
Dimensions are shown in millimeters (inches)  
TO-247AC Part Marking Information  
Notes: This part marking information applies to devices produced after 02/26/2001  
EXAMPLE: THIS IS AN IRFPE30  
WITH ASSEMBLY  
PART NUMBER  
INTERNATIONAL  
RECTIFIER  
LOGO  
LOT CODE 5657  
IRFPE30  
135H  
57  
ASSEMBLED ON WW 35, 2001  
IN THE ASSEMBLY LINE "H"  
56  
DATE CODE  
YEAR 1 = 2001  
WEEK 35  
ASSEMBLY  
LOT CODE  
Note: "P" in assembly line position  
indicates "Lead-Free"  
LINE H  
TO-247AC package is not recommended for Surface Mount Application.  
Note: For the most current drawing please refer to IR website at http://www.irf.com/package/  
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November 14, 2014  
 
IRGP6630DPbF/IRGP6630D-EPbF  
TO-247AD Package Outline  
Dimensions are shown in millimeters (inches)  
TO-247AD Part Marking Information  
E X A M P L E : T H IS IS A N IR G P 3 0 B 1 2 0 K D -E  
W IT H A S S E M B L Y  
P A R T N U M B E R  
IN T E R N A T IO N A L  
L O T C O D E 5 6 5 7  
R E C T IF IE R  
L O G O  
A S S E M B L E D O N W W 3 5 , 2 0 0 0  
IN T H E A S S E M B L Y L IN E "H "  
0 3 5 H  
5 7  
5 6  
D A T E C O D E  
Y E A R  
W E E K 3 5  
L IN E  
0
=
2 0 0 0  
A S S E M B L Y  
L O T C O D E  
N o te : "P " in a s s e m b ly lin e p o s itio n  
in d ic a te s "L e a d -F re e "  
H
TO-247AD package is not recommended for Surface Mount Application.  
Note: For the most current drawing please refer to IR website at http://www.irf.com/package/  
12  
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November 14, 2014  
IRGP6630DPbF/IRGP6630D-EPbF  
Qualification Information†  
Qualification Level  
Industrial  
TO-247AC  
TO-247AD  
N/A  
Yes  
Moisture Sensitivity Level  
RoHS Compliant  
Qualification standards can be found at International Rectifier’s web site: http://www.irf.com/product-info/reliability/  
†† Applicable version of JEDEC standard at the time of product release.  
Revision History  
Date  
Comments  
Added IFM Diode Maximum Forward Current = 72A with the note on page 1.  
11/14/2014  
Removed note from switching losses test condition on page 2.  
IR WORLD HEADQUARTERS: 101 N. Sepulveda Blvd., El Segundo, California 90245, USA  
To contact International Rectifier, please visit http://www.irf.com/whoto-call/  
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© 2014 International Rectifier Submit Datasheet Feedback  
November 14, 2014  
 

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