SP000219532 [INFINEON]

Smart Four Channel Highside Power Switch for Industrial Applications; 四通道海赛德智能电源开关的工业应用
SP000219532
型号: SP000219532
厂家: Infineon    Infineon
描述:

Smart Four Channel Highside Power Switch for Industrial Applications
四通道海赛德智能电源开关的工业应用

外围驱动器 驱动程序和接口 开关 接口集成电路 电源开关
文件: 总16页 (文件大小:385K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
®
PROFET ITS711L1  
Smart Four Channel Highside Power Switch  
for Industrial Applications  
Product Summary  
Features  
Vbb(AZ)  
43  
V
V
Overvoltage Protection  
Overload protection  
V
5.0 ... 34  
bb(on)  
Operating voltage  
Current limitation  
Ta  
one  
200  
1.9  
4
-30 … +85 °C  
two parallel four parallel  
Operating temperature  
Short-circuit protection  
Thermal shutdown  
active channels:  
Overvoltage protection  
On-state resistance RON  
100  
2.8  
4
50  
4.4  
4
mΩ  
A
A
(including load dump)  
Nominal load current IL(NOM)  
Fast demagnetization of inductive loads  
1
)
Reverse battery protection  
Current limitation  
IL(SCr)  
Undervoltage and overvoltage shutdown  
with auto-restart and hysteresis  
Open drain diagnostic output  
PG-DSO-20  
Open load detection in ON-state  
CMOS compatible input  
Loss of ground and loss of V protection  
bb  
Electrostatic discharge (ESD) protection  
Application  
µC compatible power switch with diagnostic feedback  
for 12 V and 24 V DC grounded loads in industrial applications  
All types of resistive, inductive and capacitive loads  
Replaces electromechanical relays and discrete circuits  
General Description  
N channel vertical power FET with charge pump, ground referenced CMOS compatible input and diagnostic  
feedback, monolithically integrated in Smart SIPMOS technology. Providing embedded protective functions.  
Pin Definitions and Functions  
Pin  
1,10,  
11,12,  
15,16,  
19,20  
3
Symbol Function  
bb  
Pin configuration (top view)  
V
Positive power supply voltage. Design the  
wiring for the simultaneous max. short circuit  
currents from channel 1 to 4 and also for low  
thermal resistance  
V
1 •  
2
20 V  
19 V  
bb  
bb  
bb  
GND1/2  
IN1  
IN1  
Input 1 .. 4, activates channel 1 .. 4 in case of  
logic high signal  
3
18 OUT1  
17 OUT2  
5
IN2  
ST1/2  
IN2  
4
7
IN3  
IN4  
OUT1  
OUT2  
OUT3  
OUT4  
ST1/2  
5
16 V  
15 V  
bb  
bb  
9
GND3/4  
IN3  
6
18  
Output 1 .. 4, protected high-side power output  
of channel 1 .. 4. Design the wiring for the  
max. short circuit current  
7
14 OUT3  
13 OUT4  
17  
ST3/4  
IN4  
8
14  
9
12 V  
11 V  
bb  
bb  
13  
V
10  
bb  
4
Diagnostic feedback 1/2 of channel 1 and  
channel 2, open drain, low on failure  
8
ST3/4  
Diagnostic feedback 3/4 of channel 3 and  
channel 4, open drain, low on failure  
2
6
GND1/2  
GND3/4  
Ground 1/2 of chip 1 (channel 1 and channel 2)  
Ground 3/4 of chip 2 (channel 3 and channel 4)  
1)  
With external current limit (e.g. resistor R  
=150 ) in GND connection, resistor in series with ST  
GND  
connection, reverse load current limited by connected load.  
Infineon Technologies AG  
1
2006-Mar-23  
®
PROFET ITS711L1  
Block diagram  
Four Channels; Open Load detection in on state;  
+ V  
bb  
Leadframe  
Current  
limit 1  
Gate 1  
Voltage  
source  
Overvoltage  
protection  
protection  
Channel 1  
V
Logic  
18  
OUT1  
Limit for  
Level shifter  
Rectifier 1  
Voltage  
sensor  
unclamped  
ind. loads 1  
Temperature  
sensor 1  
3
5
4
IN1  
IN2  
Open load  
Short to Vbb  
detection 1  
Charge  
pump 1  
Logic  
ESD  
ST1/2  
Charge  
pump 2  
Gate 2  
protection  
Current  
limit 2  
Channel 2  
17  
OUT2  
Level shifter  
Rectifier 2  
Limit for  
Load  
unclamped  
ind. loads 2  
2
GND1/2  
Temperature  
sensor 2  
Open load  
Short to Vbb  
detection 2  
R
R
O1  
GND1/2  
O2  
Signal GND  
Chip 1  
Chip 1  
Load GND  
+ V  
bb  
Leadframe  
Channel 3  
14  
OUT3  
Logic and protection circuit of chip 2  
(equivalent to chip 1)  
7
9
8
IN3  
IN4  
ST3/4  
Channel 4  
OUT4  
13  
Load  
6
GND3/4  
PROFET  
Chip 2  
Leadframe connected to pin 1, 10, 11, 12, 15, 16, 19, 20  
R
R
O3  
O4  
GND3/4  
Signal GND  
Chip 2  
Load GND  
Infineon Technologies AG  
2
2006-Mar-23  
®
PROFET ITS711L1  
Maximum Ratings at Tj = 25°C unless otherwise specified  
Parameter  
Symbol  
Values  
Unit  
Supply voltage (overvoltage protection see page 4)  
Supply voltage for full short circuit protection  
Vbb  
Vbb  
43  
34  
V
V
Tj,start =-40 ...+150°C  
Load current (Short-circuit current, see page 5)  
IL  
self-limited  
60  
A
V
Load dump protection2) VLoadDump = UA + Vs, UA = 13.5 V VLoad  
4)  
RI3) = 2 , td = 200 ms; IN= low or high,  
dump  
each channel loaded with RL = 7.1,  
Junction temperature  
Tj  
Ta  
Tstg  
+150  
-30 ... +85  
-40 … +105  
°C  
W
Operating temperature range  
Storage temperature range  
Power dissipation (DC)5  
(all channels active)  
Ta = 25°C: Ptot  
Ta = 85°C:  
3.6  
1.9  
Inductive load switch-off energy dissipation, single pulse  
Vbb =12V, Tj,start =150°C5),  
150  
320  
800  
mJ  
IL = 1.9 A, ZL = 66mH, 0Ω  
IL = 2.8 A, ZL = 66mH, 0Ω  
IL = 4.4 A, ZL = 66mH, 0Ω  
see diagrams on page 9 and page 10  
one channel: EAS  
two parallel channels:  
four parallel channels:  
Electrostatic discharge capability (ESD)  
VESD  
1.0  
kV  
(Human Body Model)  
Input voltage (DC)  
VIN  
IIN  
IST  
-10 ... +16  
±2.0  
V
mA  
Current through input pin (DC)  
Current through status pin (DC)  
see internal circuit diagram page 8  
±5.0  
Thermal resistance  
junction - soldering point5),6)  
each channel: Rthjs  
16 K/W  
44  
35  
junction - ambient5)  
one channel active: Rthja  
all channels active:  
2)  
Supply voltages higher than Vbb(AZ) require an external current limit for the GND and status pins, e.g. with a  
150 resistor in the GND connection and a 15 kresistor in series with the status pin. A resistor for input  
protection is integrated.  
3)  
4)  
5)  
R = internal resistance of the load dump test pulse generator  
I
VLoad dump is setup without the DUT connected to the generator per ISO 7637-1 and DIN 40839  
Device on 50mm*50mm*1.5mm epoxy PCB FR4 with 6cm2 (one layer, 70µm thick) copper area for V  
connection. PCB is vertical without blown air. See page 15  
bb  
6)  
Soldering point: upper side of solder edge of device pin 15. See page 15  
Infineon Technologies AG  
3
2006-Mar-23  
®
PROFET ITS711L1  
Electrical Characteristics  
Parameter and Conditions, each of the four channels Symbol  
Values  
Unit  
at Tj = 25 °C, V = 12 V unless otherwise specified  
bb  
min  
--  
typ  
max  
Load Switching Capabilities and Characteristics  
On-state resistance (V to OUT)  
bb  
mΩ  
IL = 1.8 A  
each channel,  
Tj = 25°C: RON  
Tj = 150°C:  
165  
320  
200  
400  
two parallel channels, Tj = 25°C:  
four parallel channels, Tj = 25°C:  
83  
42  
1.9  
2.8  
4.4  
100  
50  
--  
Nominal load current  
one channel active: IL(NOM)  
two parallel channels active:  
1.7  
2.6  
4.1  
A
four parallel channels active:  
Device on PCB5), Ta = 85°C, Tj 150°C  
Output current while GND disconnected or pulled  
IL(GNDhigh)  
--  
--  
10  
mA  
up; V = 30 V, V = 0, see diagram page 9  
bb  
IN  
Turn-on time  
to 90% VOUT: ton  
80  
80  
200  
200  
400  
400  
µs  
Turn-off time  
to 10% VOUT: toff  
RL = 12 , T =-40...+150°C  
j
Slew rate on  
dV/dton  
0.1  
0.1  
--  
--  
1 V/µs  
1 V/µs  
10 to 30% VOUT, RL = 12 ,  
T =-40...+150°C:  
j
Slew rate off  
-dV/dtoff  
70 to 40% VOUT, RL = 12 ,  
T =-40...+150°C:  
j
Operating Parameters  
Operating voltage7)  
Undervoltage shutdown  
Undervoltage restart  
Tj =-40...+150°C: Vbb(on)  
Tj =-40...+150°C: Vbb(under)  
Tj =-40...+25°C: Vbb(u rst)  
Tj =+150°C:  
5.0  
3.5  
--  
--  
--  
--  
34  
V
V
V
5.0  
5.0  
7.0  
Undervoltage restart of charge pump  
Vbb(ucp)  
--  
--  
5.6  
0.2  
7.0  
V
V
see diagram page 14  
Tj =-40...+150°C:  
Undervoltage hysteresis  
Vbb(under)  
--  
Vbb(under) = Vbb(u rst) - Vbb(under)  
Overvoltage shutdown  
Overvoltage restart  
Tj =-40...+150°C: Vbb(over)  
Tj =-40...+150°C: Vbb(o rst)  
Tj =-40...+150°C: Vbb(over)  
Tj =-40...+150°C: Vbb(AZ)  
34  
33  
--  
--  
--  
0.5  
47  
43  
--  
--  
V
V
V
V
Overvoltage hysteresis  
Overvoltage protection8)  
42  
--  
I
bb = 40 mA  
7)  
8)  
At supply voltage increase up to V =5.6V typ without charge pump, V  
V - 2 V  
bb  
bb  
OUT  
see also V  
in circuit diagram on page 8.  
ON(CL)  
Infineon Technologies AG  
4
2006-Mar-23  
®
PROFET ITS711L1  
Parameter and Conditions, each of the four channels Symbol  
Values  
Unit  
at Tj = 25 °C, V = 12 V unless otherwise specified  
bb  
min  
typ  
max  
Standby current, all channels off  
VIN = 0  
Tj =25°C: Ibb(off)  
Tj =150°C:  
--  
--  
--  
28  
44  
--  
60  
70  
12  
µA  
µA  
Leakage output current (included in Ibb(off)  
VIN = 0  
)
IL(off)  
Operating current 9), VIN = 5V, Tj =-40...+150°C  
IGND  
--  
--  
2
8
3
mA  
I
GND = IGND1/2 + IGND3/4  
,
one channel on:  
four channels on:  
12  
Protection Functions10)  
Initial peak short circuit current limit, (see timing  
diagrams, page 12)  
each channel, Tj =-40°C: IL(SCp)  
Tj =25°C:  
5.5  
4.5  
2.5  
9.5  
7.5  
4.5  
13  
11  
7
A
Tj =+150°C:  
two parallel channels  
twice the current of one channel  
four parallel channels  
four times the current of one channel  
Repetitive short circuit current limit,  
Tj = Tjt  
each channel IL(SCr)  
two parallel channels  
four parallel channels  
--  
--  
--  
4
4
4
--  
--  
--  
A
(see timing diagrams, page 12)  
Initial short circuit shutdown time  
T
j,start =-40°C: toff(SC)  
--  
--  
5.5  
4
--  
--  
ms  
V
T
j,start = 25°C:  
(see page 11 and timing diagrams on page 12)  
Output clamp (inductive load switch off)11)  
VON(CL)  
--  
47  
--  
at VON(CL) = Vbb - VOUT  
Thermal overload trip temperature  
Thermal hysteresis  
Tjt  
Tjt  
150  
--  
--  
10  
--  
--  
°C  
K
Reverse Battery  
Reverse battery voltage 12)  
-Vbb  
-VON  
--  
--  
--  
610  
32  
-- mV  
V
Drain-source diode voltage (V > V  
)
out  
bb  
IL =-1.9A, Tj =+150°C  
9)  
Add I , if I > 0  
ST  
ST  
10)  
Integrated protection functions are designed to prevent IC destruction under fault conditions described in the  
data sheet. Fault conditions are considered as "outside" normal operating range. Protection functions are  
not designed for continuous repetitive operation.  
11)  
12)  
If channels are connected in parallel, output clamp is usually accomplished by the channel with the lowest  
V
ON(CL)  
Requires a 150 resistor in GND connection. The reverse load current through the intrinsic drain-source  
diode has to be limited by the connected load. Note that the power dissipation is higher compared to normal  
operating conditions due to the voltage drop across the intrinsic drain-source diode. The temperature  
protection is not active during reverse current operation! Input and Status currents have to be limited (see  
max. ratings page 3 and circuit page 8).  
Infineon Technologies AG  
5
2006-Mar-23  
®
PROFET ITS711L1  
Parameter and Conditions, each of the four channels Symbol  
Values  
Unit  
at Tj = 25 °C, V = 12 V unless otherwise specified  
bb  
min  
typ  
max  
Diagnostic Characteristics  
Open load detection current, (on-condition)  
10  
10  
10  
--  
--  
--  
200  
150  
150  
mA  
each channel, Tj = -40°C: I L (OL)  
1
Tj = 25°C:  
Tj = 150°C:  
twice the current of one channel  
two parallel channels  
four parallel channels  
four times the current of one channel  
Open load detection voltage13)  
Internal output pull down  
Tj =-40..+150°C: VOUT(OL)  
2
3
4
V
(OUT to GND), V  
=5V  
Tj =-40..+150°C: RO  
4
10  
30  
kΩ  
OUT  
Input and Status Feedback14)  
Input resistance  
RI  
2.5  
1.7  
1.5  
3.5  
--  
6
3.5  
--  
kΩ  
V
(see circuit page 8)  
Tj =-40..+150°C:  
Input turn-on threshold voltage  
Input turn-off threshold voltage  
Input threshold hysteresis  
VIN(T+)  
Tj =-40..+150°C:  
VIN(T-)  
--  
V
Tj =-40..+150°C:  
VIN(T)  
VIN = 0.4 V: IIN(off)  
--  
1
0.5  
--  
--  
50  
V
µA  
Off state input current  
Tj =-40..+150°C:  
On state input current  
VIN = 5 V: IIN(on)  
20  
50  
90  
µA  
µs  
Tj =-40..+150°C:  
Delay time for status with open load after switch  
td(ST OL4)  
td(ST OL5)  
td(ST)  
100  
320  
800  
off (other channel in off state)  
(see timing diagrams, page 13),  
Tj =-40..+150°C:  
Delay time for status with open load after switch  
--  
--  
5
20  
µs  
µs  
off (other channel in on state)  
(see timing diagrams, page 13),  
Tj =-40..+150°C:  
Status invalid after positive input slope  
(open load)  
Status output (open drain)  
200  
600  
Tj =-40..+150°C:  
Zener limit voltage Tj =-40...+150°C, IST = +1.6 mA: VST(high)  
5.4  
--  
--  
6.1  
--  
--  
--  
0.4  
0.6  
V
ST low voltage  
Tj =-40...+25°C, IST = +1.6 mA: VST(low)  
Tj = +150°C, IST = +1.6 mA:  
13)  
14)  
External pull up resistor required for open load detection in off state.  
If ground resistors R  
are used, add the voltage drop across these resistors.  
GND  
Infineon Technologies AG  
6
2006-Mar-23  
®
PROFET ITS711L1  
Truth Table  
IN1  
IN3  
IN2  
IN4  
OUT1  
OUT3  
OUT2  
OUT4  
ST1/2  
ST3/4  
Channel 1 and 2  
Chip 1  
Chip 2  
Channel 3 and 4  
(equivalent to channel 1 and 2)  
BTS 711L1  
Normal operation  
L
L
H
H
L
L
H
L
H
X
L
L
H
L
H
X
L
X
H
L
H
X
X
X
L
H
L
L
L
H
H
Z
Z
H
L
H
X
H
H
H
L
H
X
L
L
L
L
L
X
X
L
L
H
L
H
H
H
H
L
H
L
H
15)  
Channel 1 (3)  
Open load  
H(L  
)
)
H
X
H
X
H
L
15)  
Channel 2 (4)  
Channel 1 (3)  
L
L
H
L
H
X
L
L
H
L
H
X
X
X
L
H
X
Z
Z
H
L
H
X
H
H
H
L
L
L
X
X
L
L
L
H(L  
H
L
16)  
Short circuit to V  
Overtemperature  
bb  
L
H
17)  
H(L  
L
)
)
16)  
Channel 2 (4)  
both channel  
H
17)  
H(L  
H
L
L
H
L
H
L
H
Channel 1 (3)  
Channel 2 (4)  
Undervoltage/ Overvoltage  
L = "Low" Level  
H = "High" Level  
X = don't care  
Z = high impedance, potential depends on external circuit  
Status signal valid after the time delay shown in the timing diagrams  
Parallel switching of channel 1 and 2 (also channel 3 and 4) is easily possible by connecting the inputs and  
outputs in parallel (see truth table). If switching channel 1 to 4 in parallel, the status outputs ST1/2 and ST3/4  
have to be configured as a 'Wired OR' function with a single pull-up resistor.  
Terms  
I
bb  
V
V
ON1  
ON3  
V
Leadframe  
Leadframe  
bb  
V
V
ON2  
ON4  
I
I
I
I
IN1  
IN2  
IN3  
IN4  
V
V
bb  
bb  
3
5
7
9
I
I
I
I
IN1  
IN3  
L1  
L3  
18  
17  
14  
13  
OUT1  
OUT2  
OUT3  
OUT4  
PROFET  
PROFET  
Chip 2  
IN2  
IN4  
L2  
L4  
Chip 1  
I
I
ST3/4  
ST1/2  
4
8
ST1/2  
ST3/4  
V
V
V
V
GND1/2  
2
GND3/4  
6
V
V
IN4  
IN1  
IN3  
IN2  
ST1/2  
V
ST3/4  
V
OUT1  
OUT3  
V
V
OUT4  
I
I
OUT2  
GND1/2  
GND3/4  
R
R
GND1/2  
GND3/4  
Leadframe (V ) is connected to pin 1,10,11,12,15,16,19,20  
bb  
GND  
External R  
optional; two resistors R  
,R  
=150 or a single resistor R  
=75 for  
GND1/2  
GND3/4  
GND  
reverse battery protection up to the max. operating voltage.  
15)  
16)  
With additional external pull up resistor  
An external short of output to Vbb in the off state causes an internal current from output to ground. If RGND is  
used, an offset voltage at the GND and ST pins will occur and the VST low signal may be errorious.  
17)  
Low resistance to V may be detected by no-load-detection  
bb  
Infineon Technologies AG  
7
2006-Mar-23  
®
PROFET ITS711L1  
Input circuit (ESD protection), IN1...4  
Overvoltage protection of logic part  
GND1/2 or GND3/4  
R
+ V  
bb  
I
IN  
V
Z2  
R
I
ESD-ZDI  
IN  
I
I
IN  
Logic  
GND  
ST  
R
ST  
V
ESD zener diodes are not to be used as voltage clamp at  
DC conditions. Operation in this mode may result in a  
drift of the zener voltage (increase of up to 1 V).  
Z1  
GND  
R
GND  
Status output, ST1/2 or ST3/4  
Signal GND  
V
= 6.1 V typ., V = 47 V typ., R = 3.5 ktyp.,  
Z2  
Z1  
I
+5V  
R
= 150 Ω  
GND  
R
ST(ON)  
ST  
Reverse battery protection  
± 5V  
V
bb  
-
ESD-  
ZD  
GND  
RST  
Logic  
RI  
IN  
ESD-Zener diode: 6.1 V typ., max 5.0 mA;  
ST  
OUT  
R
< 380 at 1.6 mA, ESD zener diodes are not to  
ST(ON)  
Power  
Inverse  
Diode  
be used as voltage clamp at DC conditions. Operation in  
this mode may result in a drift of the zener voltage  
(increase of up to 1 V).  
GND  
RL  
R
GND  
Inductive and overvoltage output clamp,  
OUT1...4  
Power GND  
Signal GND  
R
GND  
= 150 Ω, R = 3.5 ktyp,  
I
+V  
bb  
Temperature protection is not active during inverse  
current operation.  
V
Z
V
ON  
OUT  
PROFET  
Power GND  
V
ON  
clamped to V = 47 V typ.  
ON(CL)  
Infineon Technologies AG  
8
2006-Mar-23  
®
PROFET ITS711L1  
Open-load detection, OUT1...4  
GND disconnect with GND pull up  
ON-state diagnostic condition:  
(channel 1/2 or 3/4)  
V
ON  
< R ·I  
; IN high  
ON L(OL)  
+ V  
bb  
V
bb  
IN1  
OUT1  
OUT2  
V
IN1  
PROFET  
IN2  
ST  
V
VON  
IN2  
ON  
GND  
OUT  
Open load  
detection  
Logic  
unit  
V
V
GND  
ST  
V
bb  
Any kind of load. If V  
> V - V  
device stays off  
IN(T+)  
GND  
IN  
Due to V  
GND  
> 0, no V = low signal available.  
ST  
OFF-state diagnostic condition:  
V
OUT  
> 3 V typ.; IN low  
V
disconnect with energized inductive  
bb  
load  
R
EXT  
V
V
bb  
IN1  
OUT1  
OFF  
high  
PROFET  
IN2  
ST  
OUT  
OUT2  
GND  
Open load  
detection  
Logic  
unit  
R
O
V
bb  
Signal GND  
For an inductive load current up to the limit defined by E  
AS  
(max. ratings see page 3 and diagram on page 10) each  
switch is protected against loss of V  
.
bb  
GND disconnect  
Consider at your PCB layout that in the case of Vbb dis-  
connection with energized inductive load the whole load  
current flows through the GND connection.  
(channel 1/2 or 3/4)  
I
bb  
V
bb  
V
bb  
IN1  
IN2  
ST  
OUT1  
OUT2  
PROFET  
GND  
V
V
V
V
IN2  
IN1  
GND  
ST  
Any kind of load. In case of IN=high is V  
V -V .  
IN IN(T+)  
OUT  
Due to V  
GND  
> 0, no V = low signal available.  
ST  
Infineon Technologies AG  
9
2006-Mar-23  
®
PROFET ITS711L1  
Inductive load switch-off energy  
dissipation  
Typ. on-state resistance  
R
ON  
= f (V ,T ); I = 1.8 A, IN = high  
L
bb j  
[mOhm]  
E
bb  
R
ON  
E
AS  
500  
450  
400  
350  
300  
250  
200  
150  
100  
50  
E
E
Load  
L
V
bb  
IN  
OUT  
PROFET  
L
=
ST  
Tj = 150°C  
85°C  
GND  
Z
L
{
E
R
R
L
Energy stored in load inductance:  
25°C  
2
L
1
E = / ·L·I  
L
2
-40°C  
While demagnetizing load inductance, the energy  
dissipated in PROFET is  
E
= Ebb + EL - ER= VON(CL)·i (t) dt,  
L
AS  
with an approximate solution for R > 0:  
L
0
I ·L  
L
I ·R  
L
L
E
AS  
=
(V +|V  
|) ln (1+  
)
OUT(CL)  
0
10  
20  
30  
40  
bb  
2·R  
|V  
|
OUT(CL)  
L
V
bb  
[V]  
Typ. open load detection current  
Maximum allowable load inductance for  
I
= f (V ,T ); IN = high  
L(OL)  
5)  
bb j  
a single switch off (one channel)  
L = f (I ); T  
= 150°C, V = 12 V, R = 0 Ω  
L
j,start  
bb  
L
I
[mA]  
L(OL)  
L [mH]  
1000  
140  
-40°C  
120  
100  
80  
60  
40  
20  
0
25°C  
85°C  
100  
10  
Tj = 150°C  
0
5
10  
15  
20  
25  
30  
[V]  
1
1
1.5  
2
2.5  
3
V
bb  
I
[A]  
L
Infineon Technologies AG  
10  
2006-Mar-23  
®
PROFET ITS711L1  
Typ. standby current  
I
= f (T ); V = 9...34 V, IN  
= low  
1...4  
bb(off)  
j
bb  
I
[µA]  
bb(off)  
60  
50  
40  
30  
20  
10  
0
-50  
0
50  
100  
150  
200  
T [°C]  
j
Typ. initial short circuit shutdown time  
t
= f (T  
); V =12 V  
bb  
off(SC)  
j,start  
[msec]  
t
off(SC)  
6
5
4
3
2
1
0
-50  
0
50  
100  
150  
T
200  
[°C]  
j,start  
Infineon Technologies AG  
11  
2006-Mar-23  
®
PROFET ITS711L1  
Timing diagrams  
Timing diagrams are shown for chip 1 (channel 1/2). For chip 2 (channel 3/4) the diagrams  
are valid too. The channels 1 and 2, respectively 3 and 4, are symmetric and consequently  
the diagrams are valid for each channel as well as for permuted channels  
Figure 1a: V turn on:  
Figure 2b: Switching an inductive load  
bb  
IN1  
IN  
IN2  
t d(ST)  
V
bb  
ST  
*)  
V
OUT1  
VOUT  
VOUT2  
I L  
IL(OL)  
ST open drain  
t
t
*) if the time constant of load is too large, open-load-status may  
occur  
Figure 2a: Switching a lamp:  
Figure 3a: Turn on into short circuit:  
shut down by overtemperature, restart by cooling  
IN  
IN1  
other channel: normal operation  
ST  
IL1  
VOUT  
I
L(SCp)  
I
L(SCr)  
IL  
t
off(SC)  
ST  
t
t
The initial peak current should be limited by the lamp and not by  
the initial short circuit current IL(SCp) = 7.5 A typ. of the device.  
Heating up of the chip may require several milliseconds, depending  
on external conditions (t vs. T see page 11)  
off(SC)  
j,start  
Infineon Technologies AG  
12  
2006-Mar-23  
®
PROFET ITS711L1  
Figure 5a: Open load: detection in ON-state, open  
load occurs in on-state  
Figure 3b: Turn on into short circuit:  
shut down by overtemperature, restart by cooling  
(two parallel switched channels 1 and 2)  
IN1  
IN1/2  
IN2  
channel 2: normal operation  
I L1+ I  
L2  
I
L(SCp)  
VOUT1  
I
channel 1:  
L(SCr)  
IL1  
open  
load  
open  
load  
normal  
load  
t d(ST OL1)  
ST  
t
t d(ST OL1)  
t d(ST OL2)  
t d(ST OL2)  
t
off(SC)  
ST1/2  
t
td(ST OL1) = 30 µs typ., td(ST OL2) = 20 µs typ  
Figure 5b: Open load: detection in ON-state, turn  
Figure 4a: Overtemperature:  
on/off to open load  
Reset if T <T  
j
jt  
IN1  
IN  
IN2  
channel 2: normal operation  
ST  
V
OUT1  
VOUT  
I L1  
channel 1: open load  
td(ST OL4) td(ST)  
T
J
td(ST)  
td(ST OL5)  
t
ST  
t
The status delay time td(STOL4) allows to distinguish between the  
failure modes "open load in ON-state" and "overtemperature".  
Infineon Technologies AG  
13  
2006-Mar-23  
®
PROFET ITS711L1  
Figure 5c: Open load: detection in ON- and OFF-state  
Figure 6b: Undervoltage restart of charge pump  
(with R  
), turn on/off to open load  
EXT  
VON(CL)  
Von  
IN1  
IN2  
channel 2: normal operation  
VOUT1  
V bb(over)  
IL1  
ST  
V bb(o rst)  
channel 1: open load  
Vbb(u rst)  
Vbb(u cp)  
V
t d(ST)  
t d(ST OL5)  
bb(under)  
td(ST)  
Vbb  
t
IN = high, normal load conditions.  
td(ST OL5) depends on external circuitry because of high  
impedance  
Charge pump starts at Vbb(ucp) = 5.6V typ.  
Figure 6a: Undervoltage:  
Figure 7a: Overvoltage:  
IN  
IN  
V
VON(CL)  
V
bb(o rst)  
V
bb  
V
bb(over)  
bb  
V
V
bb(u cp)  
bb(under)  
V
bb(u rst)  
VOUT  
V OUT  
ST  
ST open drain  
t
t
Infineon Technologies AG  
14  
2006-Mar-23  
®
PROFET ITS711L1  
Package and Ordering Code  
Standard PG-DSO-20-9  
Ordering Code  
SP000219532  
ITS711L1  
All dimensions in millimetres  
1) Does not include plastic or metal protrusions of 0.15 max per side  
2) Does not include dambar protrusion of 0.05 max per side  
Definition of soldering point with temperature T :  
s
upper side of solder edge of device pin 15.  
Pin 15  
Printed circuit board (FR4, 1.5mm thick, one layer 70µm, 6cm2 active heatsink area) as a reference for max.  
power dissipation P , nominal load current I  
and thermal resistance R  
thja  
tot  
L(NOM)  
Infineon Technologies AG  
15  
2006-Mar-23  
®
PROFET ITS711L1  
Published by  
Infineon Technologies AG,  
St.-Martin-Strasse 53,  
D-81669 München  
© Infineon Technologies AG 2006  
All Rights Reserved.  
Attention please!  
The information herein is given to describe certain components and shall not be considered as a guarantee of characteristics.  
Terms of delivery and rights to technical change reserved.  
We hereby disclaim any and all warranties, including but not limited to warranties of non-infringement, regarding circuits, descriptions and  
charts stated herein.  
Infineon Technologies is an approved CECC manufacturer.  
Information  
For further information on technology, delivery terms and conditions and prices please contact your nearest Infineon Technologies Office in  
Germany or our Infineon Technologies Representatives worldwide (see address list).  
Warnings  
Due to technical requirements components may contain dangerous substances. For information on the types in question please contact  
your nearest Infineon Technologies Office.  
Infineon Technologies Components may only be used in life-support devices or systems with the express written approval of Infineon  
Technologies, if a failure of such components can reasonably be expected to cause the failure of that life-support device or system, or to  
affect the safety or effectiveness of that device or system. Life support devices or systems are intended to be implanted in the human body,  
or to support and/or maintain and sustain and/or protect human life. If they fail, it is reasonable to assume that the health of the user or  
other persons may be endangered.  
Infineon Technologies AG  
16  
2006-Mar-23  

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