SP000905376 [INFINEON]

Power Field-Effect Transistor,;
SP000905376
型号: SP000905376
厂家: Infineon    Infineon
描述:

Power Field-Effect Transistor,

文件: 总20页 (文件大小:3824K)
中文:  中文翻译
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MOSFET  
Metal Oxide Semiconductor Field Effect Transistor  
CoolMOS™ CFD2 650V  
650V CoolMOS™ CFD2 Power Transistor  
IPx65R190CFD  
Data Sheet  
Rev. 2.7  
Final  
Industrial & Multimarket  
650V CoolMOS™ CFD2 Power Transistor  
IPW65R190CFD , IPB65R190CFD , IPP65R190CFD  
IPA65R190CFD , IPI65R190CFD  
TO-247  
D²PAK  
TO-220  
1
Description  
CoolMOS™ is a revolutionary technology for high voltage power  
MOSFETs, designed according to the superjunction (SJ) principle and  
pioneered by Infineon Technologies. 650V CoolMOS™ CFD2 series  
combines the experience of the leading SJ MOSFET supplier with high  
class innovation. The resulting devices provide all benefits of a fast  
switching SJ MOSFET while offering an extremely fast and robust body  
diode. This combination of extremely low switching, commutation and  
conduction losses together with highest robustness make especially  
resonant switching applications more reliable, more efficient, lighter and  
cooler.  
TO-220 FP  
I²PAK  
drain  
pin 2  
Features  
• Ultra-fast body diode  
gate  
pin 1  
• Very high commutation ruggedness  
• Extremely low losses due to very low FOM Rdson*Qg and Eoss  
• Easy to use/drive  
• Qualified for industrial grade applications according to JEDEC  
(J-STD20 and JESD22)  
source  
pin 3  
• Pb-free plating, Halogen free mold compound  
Applications  
650V CoolMOS™ CFD2 is especially suitable for resonant switching PWM  
stages for e.g. PC Silverbox, LCD TV, Lighting, Server and Telecom.  
Table 1 Key Performance Parameters  
Parameter  
V‡» @ TÎ ÑÈà  
RDS(on),max  
Qg,typ  
Value  
700  
0.19  
68  
Unit  
V
Â
nC  
A
ID,pulse  
57.2  
5.7  
Eoss @ 400V  
Body diode di/dt  
Qrr  
µJ  
A/µs  
µC  
ns  
A
900  
0.5  
trr  
120  
7.5  
Irrm  
Type / Ordering Code  
IPW65R190CFD  
IPB65R190CFD  
IPP65R190CFD  
IPA65R190CFD  
IPI65R190CFD  
Package  
Marking  
65F6190  
Related Links  
PG-TO 247  
PG-TO 263  
PG-TO 220  
see Appendix A  
PG-TO 220 FullPAK  
PG-TO 262  
Final Data Sheet  
Rev. 2.7, 2011-09-26  
2
650V CoolMOS™ CFD2 Power Transistor  
IPW65R190CFD , IPB65R190CFD , IPP65R190CFD  
IPA65R190CFD , IPI65R190CFD  
Table of Contents  
Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2  
Table of Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3  
Maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4  
Thermal characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5  
Electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6  
Electrical characteristics diagrams . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8  
Test Circuits . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13  
Package Outlines . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14  
Appendix A . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19  
Revision History . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20  
Disclaimer . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20  
Final Data Sheet  
Rev. 2.7, 2011-09-26  
3
650V CoolMOS™ CFD2 Power Transistor  
IPW65R190CFD , IPB65R190CFD , IPP65R190CFD  
IPA65R190CFD , IPI65R190CFD  
2
Maximum ratings  
at TÎ = 25°C, unless otherwise specified  
Table 2 Maximum ratings  
Values  
Parameter  
Symbol  
Unit Note / Test Condition  
Min. Typ. Max.  
Continuous drain current1)  
I ‡  
17.5  
11.0  
57.2  
484  
A
A
T† = 25°C  
T† = 100°C  
T† = 25°C  
Pulsed drain current2)  
I ‡‚ÔÛÐÙþ  
Eƒ»  
Avalanche energy, single pulse  
Avalanche energy, repetitive  
Avalanche current, repetitive  
MOSFET dv/dt ruggedness  
Gate source voltage  
mJ I‡ = 3.5A, V‡‡ = 50V  
Eƒ¸  
0.70 mJ I‡ = 3.5A, V‡‡ = 50V  
I ƒ¸  
3.5  
50  
20  
30  
A
dv/dt  
V•»  
V/ns V‡» = 0 ... 400V  
-20  
-30  
V
static  
AC (f > 1 Hz)  
Power dissipation (non FullPAK)  
TO-247, TO-220, I²PAK  
PÚÓÚ  
151.0 W  
T† = 25°C  
T† = 25°C  
Power dissipation (FullPAK)  
TO-220 FP  
PÚÓÚ  
34.0  
150  
60  
W
Operating and storage temperature  
T΂TÙÚà  
-55  
°C  
Mounting torque (non FullPAK)  
TO-247, TO-220, I²PAK  
Ncm M3 and M3.5 screws  
Ncm M2.5 screws  
Mounting torque (FullPAK)  
TO-220 FP  
50  
Continuous diode forward current  
Diode pulse current  
I »  
17.5  
57.2  
50  
A
T† = 25°C  
T† = 25°C  
I »‚ÔÛÐÙþ  
dv/dt  
diË/dt  
A
Reverse diode dv/dt3)  
V/ns  
A/µs  
V‡» = 0 ... 400V, I»‡ ù I‡,  
TÎ = 25°C  
Maximum diode commutation speed  
900  
1) Limited by TÎ ÑÈà.  
2) Pulse width tÔ limited by TÎ ÑÈà  
3) VÔþÈÏ<Vñ…¸ò‡»», TÎ<TÎ ÑÈà, identical low side and high side switch with same Rg  
Final Data Sheet  
Rev. 2.7, 2011-09-26  
4
650V CoolMOS™ CFD2 Power Transistor  
IPW65R190CFD , IPB65R190CFD , IPP65R190CFD  
IPA65R190CFD , IPI65R190CFD  
3
Thermal characteristics  
Table 3 Thermal characteristics TO-247, TO-220, I²PAK  
Values  
Parameter  
Symbol  
Unit Note / Test Condition  
Min. Typ. Max.  
Thermal resistance, junction - case  
Thermal resistance, junction - ambient  
RÚÌœ†  
RÚÌœƒ  
0.83 °C/W  
62  
°C/W leaded  
Soldering temperature, wavesoldering only  
allowed at leads  
1.6 mm (0.063 in.) from case for  
10s  
TÙÓÐÁ  
260  
°C  
Table 4 Thermal characteristics TO-220 FP  
Values  
Parameter  
Symbol  
Unit Note / Test Condition  
Min. Typ. Max.  
Thermal resistance, junction - case  
Thermal resistance, junction - ambient  
RÚÌœ†  
RÚÌœƒ  
3.7  
80  
°C/W  
°C/W leaded  
Soldering temperature, wavesoldering only  
allowed at leads  
1.6 mm (0.063 in.) from case for  
10s  
TÙÓÐÁ  
260  
°C  
Table 5 Thermal characteristics D²PAK  
Values  
Parameter  
Symbol  
Unit Note / Test Condition  
Min. Typ. Max.  
Thermal resistance, junction - case  
RÚÌœ†  
RÚÌœƒ  
0.83 °C/W  
SMD version, device on PCB,  
minimal footprint  
Thermal resistance, junction - ambient1)  
62  
°C/W  
°C  
SMD version, device on PCB,  
6cm² cooling area  
35  
Soldering temperature, wave- &  
reflowsoldering allowed  
TÙÓÐÁ  
260  
reflow MSL  
1) Device on 40mm*40mm*1.5mm one layer epoxy PCB FR4 with 6cm² copper area (thickness 70µm) for drain connection.  
PCB is vertical without air stream cooling.  
Final Data Sheet  
Rev. 2.7, 2011-09-26  
5
650V CoolMOS™ CFD2 Power Transistor  
IPW65R190CFD , IPB65R190CFD , IPP65R190CFD  
IPA65R190CFD , IPI65R190CFD  
4
Electrical characteristics  
at TÎ = 25°C, unless otherwise specified  
Table 6 Static characteristics  
Values  
Parameter  
Symbol  
Unit Note / Test Condition  
Min. Typ. Max.  
Drain-source breakdown voltage  
Gate threshold voltage  
Vñ…¸ò‡»» 650  
V
V•» = 0V, I‡ = 1mA  
V•»ñÚÌò  
I ‡»»  
3.5  
4
4.5  
1
V
V‡» = V•», I‡ = 0.7mA  
Zero gate voltage drain current  
µA  
V‡» = 650V, V•» = 0V, TÎ = 25°C  
V‡» = 650V, V•» = 0V,  
TÎ = 150°C  
200  
Gate-source leakage current  
I •»»  
100  
nA  
Â
V•» = 20V, V‡» = 0V  
Drain-source on-state resistance  
R‡»ñÓÒò  
0.171 0.19  
V•» = 10V, I‡ = 7.3A, TÎ = 25°C  
V•» = 10V, I‡ = 7.3A, TÎ = 150°C  
f = 1MHz, open drain  
0.445  
1
Gate resistance  
R•  
Â
Table 7 Dynamic characteristics  
Values  
Parameter  
Symbol  
Unit Note / Test Condition  
Min. Typ. Max.  
Input capacitance  
CÍÙÙ  
1850  
86  
pF  
pF  
V•» = 0V, V‡» = 100V, f = 1MHz  
Output capacitance  
CÓÙÙ  
Effective output capacitance, energy  
related1)  
CÓñþØò  
70  
pF  
pF  
V•» = 0V, V‡» = 0 ... 400V  
I‡ = constant, V•» = 0V,  
V‡» = 0 ... 400V  
Effective output capacitance, time related2) CÓñÚØò  
336  
Turn-on delay time  
Rise time  
tÁñÓÒò  
tØ  
12  
ns  
ns  
ns  
ns  
V‡‡ = 400V, V•» = 13V,  
I‡ = 11.0A, R• = 3.4Â  
8.4  
53.2  
6.4  
Turn-off delay time  
Fall time  
tÁñÓËËò  
tË  
Table 8 Gate charge characteristics  
Values  
Parameter  
Symbol  
Unit Note / Test Condition  
Min. Typ. Max.  
Gate to source charge  
Gate to drain charge  
Gate charge total  
QÃÙ  
12  
37  
68  
6.4  
nC  
nC  
nC  
V
V‡‡ = 480V, I‡ = 11A,  
V•» = 0 to 10V  
QÃÁ  
QÃ  
Gate plateau voltage  
VÔÐÈÚþÈÛ  
1) CÓñþØò is a fixed capacitance that gives the same stored energy as CÓÙÙ while V‡» is rising from 0 to 400V  
2) CÓñÚØò is a fixed capacitance that gives the same charging time as CÓÙÙ while V‡» is rising from 0 to 400V  
Final Data Sheet  
Rev. 2.7, 2011-09-26  
6
650V CoolMOS™ CFD2 Power Transistor  
IPW65R190CFD , IPB65R190CFD , IPP65R190CFD  
IPA65R190CFD , IPI65R190CFD  
Table 9 Reverse diode characteristics  
Values  
Parameter  
Symbol  
Unit Note / Test Condition  
Min. Typ. Max.  
Diode forward voltage  
V»‡  
tØØ  
0.9  
120  
0.5  
7.6  
V
V•» = 0V, IŒ = 11.0A, TÎ = 25°C  
Reverse recovery time  
ns  
µC  
A
V¸ = 400V, IŒ = 11.0A,  
diŒ/dt = 100A/µs  
Reverse recovery charge  
Peak reverse recovery current  
QØØ  
I ØØÑ  
Final Data Sheet  
Rev. 2.7, 2011-09-26  
7
650V CoolMOS™ CFD2 Power Transistor  
IPW65R190CFD , IPB65R190CFD , IPP65R190CFD  
IPA65R190CFD , IPI65R190CFD  
5
Electrical characteristics diagrams  
Table 10  
Power dissipation (Non FullPAK)  
Power dissipation (FullPAK)  
160  
40  
140  
120  
100  
80  
30  
20  
P
P
P
P
PP  
PP  
60  
40  
20  
0
10  
0
0
40  
80  
120  
160  
0
40  
80  
TC [°C]  
120  
160  
T [°C]  
T
C
Ptot=f(TC)  
Ptot=f(TC)  
Table 11  
Max. transient thermal impedance (Non FullPAK)  
Max. transient thermal impedance (FullPAK)  
101  
101  
0.5  
0.5  
0.2  
0.1  
0.2  
0.1  
0.05  
0.05  
100  
100  
0.02  
0.02  
0.01  
0.01  
single pulse  
single pulse  
Z
Z
Z
Z
ZZ  
ZZ  
10-1  
10-1  
10-2  
10-2  
10-5  
10-4  
10-3  
tp [s]  
10-2  
10-1  
10-5  
10-4  
10-3  
10-2  
tp [s]  
10-1  
100  
101  
ZthJC =f(tP); parameter: D=tp/T  
Final Data Sheet  
ZthJC =f(tP); parameter: D=tp/T  
Rev. 2.7, 2011-09-26  
8
650V CoolMOS™ CFD2 Power Transistor  
IPW65R190CFD , IPB65R190CFD , IPP65R190CFD  
IPA65R190CFD , IPI65R190CFD  
Table 12  
Safe operating area T†=25°C (Non FullPAK)  
Safe operating area T†=25°C (FullPAK)  
102  
102  
1 µs  
1 µs  
10 µs  
10 µs  
101  
101  
100 µs  
1 ms  
100 µs  
1 ms  
100  
100  
10 ms  
DC  
10 ms  
I
I
I
I
II  
II  
DC  
10-1  
10-1  
10-2  
10-2  
100  
101  
102  
103  
100  
101  
102  
103  
VDS [V]  
VDS [V]  
ID=f(VDS); TC=25 °C; D=0; parameter: tp Vgs>7.5V  
ID=f(VDS); TC=25 °C; D=0; parameter: tp Vgs>7.5V  
Table 13  
Safe operating area T†=80°C (Non FullPAK)  
Safe operating area T†=80°C (FullPAK)  
102  
102  
1 µs  
1 µs  
10 µs  
10 µs  
101  
101  
100 µs  
100 µs  
1 ms  
1 ms  
100  
100  
I
I
I
I
II  
II  
10 ms  
DC  
10 ms  
10-1  
10-1  
DC  
10-2  
10-2  
100  
101  
102  
103  
100  
101  
102  
103  
VDS [V]  
VDS [V]  
ID=f(VDS); TC=80 °C; D=0; parameter: tp Vgs>7.5V  
ID=f(VDS); TC=80 °C; D=0; parameter: tp Vgs>7.5V  
Final Data Sheet  
Rev. 2.7, 2011-09-26  
9
650V CoolMOS™ CFD2 Power Transistor  
IPW65R190CFD , IPB65R190CFD , IPP65R190CFD  
IPA65R190CFD , IPI65R190CFD  
Table 14  
Typ. output characteristics T†=25°C  
Typ. output characteristics T†=125°C  
70  
45  
20 V  
20 V  
40  
35  
30  
25  
20  
15  
10  
5
10 V  
10 V  
8 V  
60  
8 V  
7 V  
7 V  
50  
6 V  
6 V  
5.5 V  
5.5 V  
5 V  
40  
5 V  
I
I
I
I
II  
II  
4.5 V  
4.5 V  
30  
20  
10  
0
0
0
5
10  
VDS [V]  
15  
20  
0
5
10  
VDS [V]  
15  
20  
ID=f(VDS); Tj=25 °C; parameter: VGS  
ID=f(VDS); Tj=125 °C; parameter: VGS  
Table 15  
Typ. drain-source on-state resistance  
Drain-source on-state resistance  
1.00  
0.6  
0.90  
0.80  
0.70  
0.60  
0.5  
0.4  
0.3  
95%  
typ  
0.50  
5 V 5.5 V 6 V 6.5 V 7 V  
10 V  
R
R
R
R
RR  
RR  
0.40  
0.30  
0.20  
0.10  
0.00  
0.2  
0.1  
0.0  
0
10  
20  
ID [A]  
30  
40  
-60  
-20  
20  
60  
T [°C]  
T
j
100  
140  
180  
RDS(on)=f(ID); Tj=125 °C; parameter: VGS  
RDS(on)=f(Tj); ID=7.3 A; VGS=10 V  
Final Data Sheet  
Rev. 2.7, 2011-09-26  
10  
650V CoolMOS™ CFD2 Power Transistor  
IPW65R190CFD , IPB65R190CFD , IPP65R190CFD  
IPA65R190CFD , IPI65R190CFD  
Table 16  
Typ. transfer characteristics  
Typ. gate charge  
70  
10  
9
120 V  
480 V  
60  
50  
40  
8
7
6
5
4
3
2
1
0
25 °C  
I
I
I
I
V
V
V
V
30  
20  
10  
0
150 °C  
0
2
4
6
8
10  
0
20  
40  
Qgate [nC]  
60  
80  
VGS [V]  
ID=f(VGS); |VDS|=20V;  
VGS=f(Qgate); ID=11 A pulsed; parameter: VDD  
Table 17  
Avalanche energy  
Drain-source breakdown voltage  
600  
760  
740  
720  
700  
680  
660  
640  
500  
400  
300  
E
E
E
E
V
V
V
V
620  
600  
580  
560  
540  
200  
100  
0
0
50  
100  
150  
200  
-60  
-20  
20  
60  
100  
140  
180  
T [°C]  
T
j
T [°C]  
j
T
EAS=f(Tj); ID=3.5 A; VDD=50 V  
VBR(DSS)=f(Tj); ID=10 mA  
Final Data Sheet  
Rev. 2.7, 2011-09-26  
11  
650V CoolMOS™ CFD2 Power Transistor  
IPW65R190CFD , IPB65R190CFD , IPP65R190CFD  
IPA65R190CFD , IPI65R190CFD  
Table 18  
Typ. capacitances  
Typ. CÓÙÙ stored energy  
104  
12  
10  
Ciss  
103  
8
6
102  
C
C
C
C
E
E
E
E
Coss  
Crss  
4
2
0
101  
100  
0
100  
200  
300  
VDS [V]  
400  
500  
600  
0
100  
200  
300  
VDS [V]  
400  
500  
600  
C=f(VDS); VGS=0 V; f=1 MHz  
Eoss=f(VDS)  
Table 19  
Forward characteristics of reverse diode  
102  
101  
125 °C  
25 °C  
I
I
I
I
100  
10-1  
0.0  
0.5  
1.0  
1.5  
VSD [V]  
IF=f(VSD); parameter: Tj  
Final Data Sheet  
Rev. 2.7, 2011-09-26  
12  
650V CoolMOS™ CFD2 Power Transistor  
IPW65R190CFD , IPB65R190CFD , IPP65R190CFD  
IPA65R190CFD , IPI65R190CFD  
6
Test Circuits  
Table 20 Diode_characteristics  
Test circuit for diode characteristics  
Diode recovery waveform  
ID  
RG1  
VDS  
RG2  
RG1 = RG2  
Table 21 Switching_times  
Switching times test circuit for inductive load  
Switching times waveform  
VDS  
90%  
10%  
VDS  
VGS  
VGS  
td(off)  
tf  
td(on)  
ton  
tr  
toff  
Table 22 Unclamped_inductive  
Unclamped inductive load test circuit  
Unclamped inductive waveform  
V(BR)DS  
VD  
ID  
VDS  
VDS  
VDS  
ID  
Final Data Sheet  
Rev. 2.7, 2011-09-26  
13  
650V CoolMOS™ CFD2 Power Transistor  
IPW65R190CFD , IPB65R190CFD , IPP65R190CFD  
IPA65R190CFD , IPI65R190CFD  
7
Package Outlines  
Figure 1 Outline PG-TO 247, dimensions in mm/inches  
Final Data Sheet  
Rev. 2.7, 2011-09-26  
14  
650V CoolMOS™ CFD2 Power Transistor  
IPW65R190CFD , IPB65R190CFD , IPP65R190CFD  
IPA65R190CFD , IPI65R190CFD  
Figure 2 Outline PG-TO 263, dimensions in mm/inches  
Final Data Sheet  
Rev. 2.7, 2011-09-26  
15  
650V CoolMOS™ CFD2 Power Transistor  
IPW65R190CFD , IPB65R190CFD , IPP65R190CFD  
IPA65R190CFD , IPI65R190CFD  
Figure 3 Outline PG-TO 220, dimensions in mm/inches  
Final Data Sheet  
Rev. 2.7, 2011-09-26  
16  
650V CoolMOS™ CFD2 Power Transistor  
IPW65R190CFD , IPB65R190CFD , IPP65R190CFD  
IPA65R190CFD , IPI65R190CFD  
Figure 4 Outline PG-TO 220 FullPAK, dimensions in mm/inches  
Final Data Sheet  
Rev. 2.7, 2011-09-26  
17  
650V CoolMOS™ CFD2 Power Transistor  
IPW65R190CFD , IPB65R190CFD , IPP65R190CFD  
IPA65R190CFD , IPI65R190CFD  
Figure 5 Outline PG-TO 262, dimensions in mm/inches  
Final Data Sheet  
Rev. 2.7, 2011-09-26  
18  
650V CoolMOS™ CFD2 Power Transistor  
IPW65R190CFD , IPB65R190CFD , IPP65R190CFD  
IPA65R190CFD , IPI65R190CFD  
8
Appendix A  
Table 23 Related Links  
IFX Design Tools:  
http://www.infineon.com/cms/en/product/promopages/designtools/index.html  
IFX CoolMOS Webpage:  
http://www.infineon.com/cms/en/product/channel.html?channel=ff80808112ab681d0112ab6a628704d8  
Final Data Sheet  
Rev. 2.7, 2011-09-26  
19  
650V CoolMOS™ CFD2 Power Transistor  
IPW65R190CFD , IPB65R190CFD , IPP65R190CFD  
IPA65R190CFD , IPI65R190CFD  
Revision History  
IPW65R190CFD , IPB65R190CFD , IPP65R190CFD , IPA65R190CFD , IPI65R190CFD  
Revision: 2011-09-26, Rev. 2.7  
Previous Revision  
Revision Date  
Subjects (major changes since last revision)  
Release als final datasheet  
-
2.0  
2.1  
2.2  
2.3  
2.4  
2.5  
2.6  
2.7  
2011-05-04  
2011-05-05  
2011-05-05  
2011-05-30  
2011-08-29  
2011-09-14  
2011-09-16  
2011-09-26  
Release of final datasheet  
Update V‡» @ TÎ ÑÈà  
update to CFD2 standard  
update pin naming  
release of new pin naming  
update the Igss test condition  
We Listen to Your Comments  
Any information within this document that you feel is wrong, unclear or missing at all? Your feedback will help us to  
continuously improve the quality of this document. Please send your proposal (including a reference to this document) to:  
erratum@infineon.com  
Edition 2011-08-01  
Published by  
Infineon Technologies AG  
81726 München, Germany  
© 2011 Infineon Technologies AG  
All Rights Reserved.  
Legal Disclaimer  
The information given in this document shall in no event be regarded as a guarantee of conditions or characteristics. With  
respect to any examples or hints given herein, any typical values stated herein and/or any information regarding the  
application of the device, Infineon Technologies hereby disclaims any and all warranties and liabilities of any kind, including  
without limitation, warranties of non-infringement of intellectual property rights of any third party.  
Information  
For further information on technology, delivery terms and conditions and prices please contact your nearest Infineon  
Technologies Office (  
).  
www.infineon.com  
Warnings  
Due to technical requirements, components may contain dangerous substances. For information on the types in question,  
please contact the nearest Infineon Technologies Office.  
The Infineon Technologies component described in this Data Sheet may be used in life-support devices or systems and/or  
automotive, aviation and aerospace applications or systems only with the express written approval of Infineon Technologies,  
if a failure of such components can reasonably be expected to cause the failure of that life-support, automotive, aviation and  
aerospace device or system or to affect the safety or effectiveness of that device or system. Life support devices or systems  
are intended to be implanted in the human body or to support and/or maintain and sustain and/or protect human life. If they  
fail, it is reasonable to assume that the health of the user or other persons may be endangered.  
Final Data Sheet  
Rev. 2.7, 2011-09-26  
20  

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