FII30-06D [IXYS]

low saturation voltage; 低饱和电压
FII30-06D
型号: FII30-06D
厂家: IXYS CORPORATION    IXYS CORPORATION
描述:

low saturation voltage
低饱和电压

文件: 总5页 (文件大小:395K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
FII 30-06D  
IC25  
VCES  
= 30 A  
= 600 V  
IGBT phaseleg  
in ISOPLUS i4-PAC™  
VCE(sat) typ. = 1.9 V  
3
5
4
1
2
E72873  
Features  
IGBT  
• NPT IGBT technology  
- low saturation voltage  
- positive temperature coefficient for  
easy paralleling  
- fast switching  
• HiPerFRED™ diode  
- optimized fast and soft reverse  
recovery  
- low operating forward voltage  
- low leakage current  
• ISOPLUS i4-PAC™ package  
- isolated back surface  
- low coupling capacity between pins  
and heatsink  
- enlarged creepage towards heatsink  
- application friendly pinout  
- low inductive current path  
- high reliability  
Symbol  
VCES  
Conditions  
Maximum Ratings  
TVJ = 25°C to 150°C  
600  
20  
V
VGES  
V
IC25  
IC90  
TC = 25°C  
TC = 90°C  
30  
18  
A
A
±
ICM  
VCEK  
VGE = 15 V; RG = 47 ; TVJ = 125°C  
40  
VCES  
A
µs  
W
RBSOA Clamped inductive load; L = 100 µH  
±
tSC  
VCE = VCES; VGE = 15 V; RG = 47 Ω  
10  
(SCSOA) TVJ = 125°C; non-repetitive  
Ptot  
TC = 25°C  
100  
Symbol  
Conditions  
Characteristic Values  
(TVJ = 25°C, unless otherwise specified)  
min. typ. max.  
VCE(sat)  
IC = 20 A; VGE = 15 V  
TVJ = 25°C  
TVJ = 125°C  
1.9  
2.2  
2.4  
V
V
- industry standard outline  
- UL registered E 72873  
VGE(th)  
ICES  
IC = 0.5 mA; VGE = VCE  
VCE = VCES; VGE = 0 V  
4.5  
6.5  
0.6  
V
Applications  
TVJ = 25°C  
TVJ = 125°C  
mA  
mA  
• single phaseleg  
- buck-boost chopper  
• H bridge  
0.6  
IGES  
VCE = 0 V; VGE  
=
20 V  
200  
nA  
td(on)  
tr  
td(off)  
tf  
Eon  
Eoff  
50  
55  
200  
30  
0.75  
0.6  
ns  
ns  
ns  
ns  
mJ  
mJ  
- power supplies  
- induction heating  
- four quadrant DC drives  
- controlled rectifier  
• three phase bridge  
- AC drives  
Inductive load  
TVJ = 125°C  
VCE = 300 V; IC = 20 A  
VGE = 15 V; RG = 47 Ω  
- controlled rectifier  
Cies  
VCE = 25 V; VGE = 0 V; f = 1 MHz  
VCE = 300 V; VGE = 15 V; IC = 20 A  
1.1  
65  
nF  
nC  
QGon  
RthJC  
RthJH  
1.25 K/W  
K/W  
with heatsink compound  
2.5  
IXYS reserves the right to change limits, test conditions and dimensions.  
© 2011 IXYS All rights reserved  
20110119a  
1 - 5  
FII 30-06D  
Diode  
Symbol  
VRRM  
Conditions  
Maximum Ratings  
TVJ = 25°C to 150°C  
600  
V
IF25  
IF90  
TC = 25°C  
TC = 90°C  
30  
15  
A
A
Symbol  
VF  
Conditions  
Characteristic Values  
min. typ. max.  
IF = 20 A  
TVJ = 25°C  
VJ = 125°C  
2.3  
1.6  
2.7  
V
V
T
IRM  
trr  
IF = 15 A; diF/dt = -400 A/µs;  
7
50  
A
ns  
VR = 300 V; VGE = 0 V;  
TVJ = 125°C  
RthJC  
RthJH  
(per diode)  
with heatsink compound  
2.3 K/W  
K/W  
4.6  
Component  
Symbol  
Conditions  
Maximum Ratings  
TVJ  
Tstg  
operating  
-55...+150  
-55...+125  
°C  
°C  
VISOL  
FC  
IISOL < 1 mA; 50/60 Hz; t = 1 s  
Mounting force with clip  
2500  
V~  
20...120  
Nm  
Symbol  
CP  
Conditions  
Characteristic Values  
min. typ. max.  
coupling capacity between shorted  
pins and mounting tab in the case  
40  
pF  
dS, dA  
dS, dA  
pin - pin  
pin - backside metal  
1.7  
5.5  
mm  
mm  
Weight  
6
g
MILLIMETER  
INCHES  
DIM.  
MIN  
4.83  
2.59  
1.17  
1.14  
1.47  
2.54  
0.51  
20.80  
14.99  
1.65  
19.56  
16.76  
MAX  
5.21  
MIN  
MAX  
0.205  
0.118  
0.085  
0.055  
0.068  
0.110  
0.029  
0.840  
0.620  
0.080  
0.799  
0.690  
A
0.190  
0.102  
0.046  
0.045  
0.058  
0.100  
0.020  
0.819  
0.590  
0.065  
0.770  
0.660  
A1  
A2  
b
3.00  
A
2.16  
A2  
E
E1  
1.40  
b2  
b4  
C
1.73  
2.79  
0.74  
D
21.34  
15.75  
2.03  
D1  
D2  
E
20.29  
17.53  
E1  
e
3.81 BSC  
0.15 BSC  
L
19.81  
2.11  
5.33  
2.54  
21.34  
2.59  
6.20  
4.57  
0.10  
0.780  
0.083  
0.210  
0.100  
0.840  
0.102  
0.244  
0.180  
0.004  
L1  
Q
4x e  
R
C
b2  
1 2 3 4 5  
W
A1  
Die konvexe Form des Substrates ist typ. < 0.05 mm über  
der Kunststoffoberfläche der Bauteilunterseite  
The convex bow of substrate is typ. < 0.05 mm over plastic  
surface level ofdevice bottom side  
b
b4  
W
IXYS reserves the right to change limits, test conditions and dimensions.  
© 2011 IXYS All rights reserved  
20110119a  
2 - 5  
FII 30-06D  
IXYS reserves the right to change limits, test conditions and dimensions.  
© 2011 IXYS All rights reserved  
20110119a  
3 - 5  
FII 30-06D  
10  
1
D = 0  
D = 0.005  
D = 0.01  
D = 0.02  
D = 0.05  
D = 0.1  
D = 0.2  
D = 0.5  
IGBT  
ZthJH[K/W]  
0.1  
0.01  
0.001  
0.00001  
0.0001  
0.001  
0.01  
0.1  
1
10  
100  
t (s)  
IXYS reserves the right to change limits, test conditions and dimensions.  
© 2011 IXYS All rights reserved  
20110119a  
4 - 5  
FII 30-06D  
Diode  
40  
2000  
nC  
40  
TVJ= 100°C  
VR = 300V  
TVJ= 100°C  
VR = 300V  
A
A
30  
1500  
1000  
500  
0
30  
IF  
IRM  
Qr  
TVJ=150°C  
TVJ=100°C  
TVJ= 25°C  
IF= 30A  
IF= 15A  
IF= 7.5A  
20  
10  
0
20  
10  
0
IF= 30A  
IF= 15A  
IF= 7.5A  
A/µs  
0
1
2
V
100  
1000  
0
200 400 600 1000  
A/µs  
-diF/dt  
VF  
-diF/dt  
Forward current IF versus VF  
Reverse recovery charge Qr  
versus -diF/dt  
Peak reverse current IRM  
versus -diF/dt  
2.0  
1.5  
1.0  
0.5  
0.0  
120  
ns  
20  
V
VFR  
15  
1.6  
TVJ= 100°C  
VR = 300V  
TVJ= 100°C  
IF = 15A  
VFR  
µs  
tfr  
110  
trr  
1.2  
Kf  
IF= 30A  
IF= 15A  
IF= 7.5A  
100  
90  
tfr  
10  
5
0.8  
0.4  
0
IRM  
Qr  
80  
15-06A  
70  
0
A/µs  
0
40  
80  
120  
160  
0
200 400 600 1000  
0
200 400 600 1000  
°C  
A/µs  
diF/dt  
TVJ  
-diF/dt  
Dynamic parameters Qr, IRM  
versus TVJ  
Recovery time trr versus -diF/dt  
Peak forward voltage VFR and tfr  
versus diF/dt  
10  
(ZthJH is measured using 50  
µm thermal grease)  
1
FRED  
ZthJH [K/W]  
D = 0  
0.1  
D = 0.005  
D = 0.01  
D = 0.02  
D = 0.05  
D = 0.1  
D = 0.2  
D = 0.5  
0.01  
0.001  
0.00001  
0.0001  
0.001  
0.01  
0.1  
1
10  
100  
t(s)  
Transient thermal resistance junction to heatsink  
IXYS reserves the right to change limits, test conditions and dimensions.  
© 2011 IXYS All rights reserved  
20110119a  
5 - 5  

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