APTGF25H120T2G [MICROSEMI]

Insulated Gate Bipolar Transistor, 40A I(C), 1200V V(BR)CES,;
APTGF25H120T2G
型号: APTGF25H120T2G
厂家: Microsemi    Microsemi
描述:

Insulated Gate Bipolar Transistor, 40A I(C), 1200V V(BR)CES,

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APTGF25H120T2G  
Full - Bridge  
NPT IGBT Power Module  
VCES = 1200V  
IC = 25A @ Tc = 80°C  
Application  
Welding converters  
Switched Mode Power Supplies  
Uninterruptible Power Supplies  
Motor control  
Features  
Non Punch Through (NPT) Fast IGBT  
-
-
-
-
-
-
-
Low voltage drop  
Low tail current  
Switching frequency up to 50 kHz  
Soft recovery parallel diodes  
Low diode VF  
Low leakage current  
RBSOA and SCSOA rated  
Very low stray inductance  
Internal thermistor for temperature monitoring  
High level of integration  
Benefits  
Outstanding performance at high frequency operation  
Direct mounting to heatsink (isolated package)  
Low junction to case thermal resistance  
Solderable terminals both for power and signal for  
easy PCB mounting  
Low profile  
RoHS Compliant  
Pins 5/6/15/16 ; 3/4/17/18 ; 9/10 ; 11/12 must be  
shorted together  
All ratings @ Tj = 25°C unless otherwise specified  
Absolute maximum ratings (per IGBT)  
Symbol  
Parameter  
Max ratings  
Unit  
VCES  
Collector - Emitter Breakdown Voltage  
1200  
40  
25  
100  
±20  
208  
V
TC = 25°C  
TC = 80°C  
TC = 25°C  
IC  
Continuous Collector Current  
A
ICM  
VGE  
PD  
Pulsed Collector Current  
Gate – Emitter Voltage  
Maximum Power Dissipation  
V
W
TC = 25°C  
Tj = 125°C  
RBSOA Reverse Bias Safe Operating Area  
50A@1150V  
These Devices are sensitive to Electrostatic Discharge. Proper Handling Procedures Should Be Followed. See application note  
APT0502 on www.microsemi.com  
1 – 7  
www.microsemi.com  
APTGF25H120T2G  
Electrical Characteristics (per IGBT)  
Symbol Characteristic  
Test Conditions  
VGE = 0V ; VCE = 1200V  
Min Typ Max Unit  
ICES  
Zero Gate Voltage Collector Current  
250  
3.7  
µA  
V
Tj = 25°C  
Tj = 125°C  
2.5  
4
3.2  
4.0  
VGE =15V  
IC = 25A  
VCE(sat) Collector Emitter saturation Voltage  
VGE(th) Gate Threshold Voltage  
VGE = VCE , IC = 1mA  
VGE = 20V, VCE = 0V  
6
V
IGES  
Gate – Emitter Leakage Current  
400  
nA  
Dynamic Characteristics (per IGBT)  
Symbol Characteristic  
Test Conditions  
Min Typ Max Unit  
Cies  
Coes  
Cres  
Qg  
Input Capacitance  
1650  
VGE = 0V  
VCE = 25V  
f = 1MHz  
pF  
Output Capacitance  
Reverse Transfer Capacitance  
Total gate Charge  
250  
110  
160  
10  
VGE = 15V  
VBus = 600V  
nC  
Qge  
Gate – Emitter Charge  
IC =25A  
Qgc  
Td(on)  
Tr  
Gate – Collector Charge  
Turn-on Delay Time  
Rise Time  
70  
60  
Inductive Switching (25°C)  
VGE = 15V  
50  
ns  
VBus = 600V  
IC = 25A  
RG = 22  
Td(off) Turn-off Delay Time  
305  
Tf  
Fall Time  
30  
Inductive Switching (125°C)  
VGE = 15V  
VBus = 600V  
IC = 25A  
Td(on)  
Tr  
Turn-on Delay Time  
Rise Time  
60  
50  
ns  
Td(off) Turn-off Delay Time  
346  
40  
Tf  
Fall Time  
RG = 22  
V
GE = 15V  
Eon  
Turn-on Switching Energy  
Tj = 125°C  
Tj = 125°C  
3.5  
1.5  
VBus = 600V  
IC = 25A  
RG = 22  
mJ  
Eoff  
Turn-off Switching Energy  
V
GE 15V ; VBus = 900V  
Isc  
Short Circuit data  
160  
A
tp 10µs ; Tj = 125°C  
°C/W  
RthJC  
Junction to Case Thermal Resistance  
0.6  
2 – 7  
www.microsemi.com  
APTGF25H120T2G  
Reverse diode ratings and characteristics (per diode)  
Symbol Characteristic  
Test Conditions  
Min Typ Max Unit  
Maximum Peak Repetitive Reverse Voltage  
VRRM  
IRM  
IF  
1200  
V
µA  
A
Maximum Reverse Leakage Current  
DC Forward Current  
VR=1200V  
100  
3.1  
Tc = 80°C  
Tj = 125°C  
25  
2.6  
3.2  
1.8  
IF = 25A  
IF = 50A  
VF  
trr  
Diode Forward Voltage  
Reverse Recovery Time  
V
IF = 25A  
Tj = 25°C  
Tj = 125°C  
Tj = 25°C  
Tj = 125°C  
320  
360  
ns  
IF = 25A  
VR = 667V  
di/dt =200A/µs  
480  
Qrr  
Reverse Recovery Charge  
nC  
1800  
°C/W  
RthJC  
Junction to Case Thermal Resistance  
1.4  
Temperature sensor NTC  
Symbol  
R25  
Characteristic  
Min Typ Max Unit  
Resistance @ 25°C  
Resistance tolerance  
Beta tolerance  
22  
k  
5
3
R25/R25  
B/B  
%
B 25/100  
T25 = 298.16 K  
3980  
K
R25  
RT  
T: Thermistor temperature  
RT: Thermistor value at T  
1
1
25 / 100   
exp B  
T25  
T
Thermal and package characteristics  
Symbol Characteristic  
Min  
4000  
-40  
-40  
-40  
2
Typ Max Unit  
RMS Isolation Voltage, any terminal to case t =1 min, 50/60Hz  
Operating junction temperature range  
Storage Temperature Range  
VISOL  
TJ  
TSTG  
TC  
V
150  
°C  
125  
100  
3
Operating Case Temperature  
Torque Mounting torque  
Wt Package Weight  
To heatsink  
M4  
N.m  
g
75  
3 – 7  
www.microsemi.com  
APTGF25H120T2G  
Package outline (dimensions in mm)  
Typical Performance Curve  
Capacitance vs Collector to Emitter Voltage  
Operating Frequency vs Collector Current  
10000  
1000  
100  
120  
VCE = 600V  
D = 50%  
100  
80  
60  
40  
20  
0
Cies  
R
G = 22  
TJ = 125°C  
TC= 75°C  
ZVS  
Coes  
Cres  
ZCS  
Hard  
switching  
10  
0
10  
20  
30  
40  
50  
0
10  
20  
30  
40  
VCE, Collector to Emitter Voltage (V)  
IC, Collector Current (A)  
Maximum Effective Transient Thermal Impedance, Junction to Case vs Pulse Duration  
0.7  
0.6  
0.5  
0.4  
0.3  
0.2  
0.1  
0
D = 0.9  
0.7  
0.5  
0.3  
0.1  
Single Pulse  
0.05  
0.00001  
0.0001  
0.001  
0.01  
0.1  
1
10  
Rectangular Pulse Duration (Seconds)  
4 – 7  
www.microsemi.com  
APTGF25H120T2G  
Transfer Characteristics  
Output characteristics (VGE=15V)  
250µs Pulse Test  
80  
60  
50  
40  
30  
20  
10  
0
250µs Pulse Test  
< 0.5% Duty cycle  
< 0.5% Duty cycle  
60  
40  
20  
0
TJ=25°C  
TJ=125°C  
TJ=125°C  
TJ=25°C  
0
1
2
3
4
5
6
7
0
2.5  
5
7.5  
10  
12.5  
15  
VGE, Gate to Emitter Voltage (V)  
VCE, Collector to Emitter Voltage (V)  
Turn-On Energy Loss vs Collector Current  
Switching Energy Losses vs Gate Resistance  
5
10  
VCE = 600V  
VCE = 600V  
VGE = 15V  
Eon, 25A  
TJ= 125°C  
TJ=125°C,  
RG = 22  
4
3
2
1
0
8
6
4
2
0
VGE=15V  
TJ=25°C,  
VGE=15V  
Eoff, 25A  
5
15  
25  
35  
45  
55  
0
10  
20  
30  
40  
50  
60  
I
CE, Collector to Emitter Current (A)  
Gate Resistance (Ohms)  
Turn-Off Energy Loss vs Collector Current  
Gate Charge  
4
18  
16  
14  
12  
10  
8
IC = 25A  
VCE=240V  
VCE=600V  
VCE = 600V  
TJ = 25°C  
TJ = 125°C  
V
GE = 15V  
3
2
1
0
RG = 22Ω  
VCE=960V  
TJ = 25°C  
6
4
2
0
0
30  
60  
90  
120  
150  
180  
5
15  
25  
35  
45  
55  
ICE, Collector to Emitter Current (A)  
Gate Charge (nC)  
Reverse Bias Safe Operating Area  
60  
50  
40  
30  
20  
10  
0
0
400  
800  
1200  
V
CE, Collector to Emitter Voltage (V)  
5 – 7  
www.microsemi.com  
APTGF25H120T2G  
Typical diode Performance Curve (per diode)  
Maximum Effective Transient Thermal Impedance, Junction to Case vs Pulse Duration  
1.6  
1.4  
1.2  
1
D = 0.9  
0.7  
0.5  
0.8  
0.6  
0.4  
0.2  
0.3  
0.1  
Single Pulse  
0.01  
0.05  
0
0.00001  
0.0001  
0.001  
0.1  
1
10  
Rectangular Pulse Duration (Seconds)  
Forward Current vs Forward Voltage  
60  
50  
40  
30  
20  
10  
0
TJ=125°C  
TJ=25°C  
0.0  
1.0  
2.0  
3.0  
4.0  
VF, Anode to Cathode Voltage (V)  
6 – 7  
www.microsemi.com  
APTGF25H120T2G  
DISCLAIMER  
The information contained in the document (unless it is publicly available on the Web without access restrictions) is  
PROPRIETARY AND CONFIDENTIAL information of Microsemi and cannot be copied, published, uploaded, posted,  
transmitted, distributed or disclosed or used without the express duly signed written consent of Microsemi. If the  
recipient of this document has entered into a disclosure agreement with Microsemi, then the terms of such Agreement  
will also apply. This document and the information contained herein may not be modified, by any person other than  
authorized personnel of Microsemi. No license under any patent, copyright, trade secret or other intellectual property  
right is granted to or conferred upon you by disclosure or delivery of the information, either expressly, by implication,  
inducement, estoppels or otherwise. Any license under such intellectual property rights must be approved by  
Microsemi in writing signed by an officer of Microsemi.  
Microsemi reserves the right to change the configuration, functionality and performance of its products at anytime  
without any notice. This product has been subject to limited testing and should not be used in conjunction with life-  
support or other mission-critical equipment or applications. Microsemi assumes no liability whatsoever, and Microsemi  
disclaims any express or implied warranty, relating to sale and/or use of Microsemi products including liability or  
warranties relating to fitness for a particular purpose, merchantability, or infringement of any patent, copyright or other  
intellectual property right. Any performance specifications believed to be reliable but are not verified and customer or  
user must conduct and complete all performance and other testing of this product as well as any user or customers final  
application. User or customer shall not rely on any data and performance specifications or parameters provided by  
Microsemi. It is the customer’s and user’s responsibility to independently determine suitability of any Microsemi  
product and to test and verify the same. The information contained herein is provided “AS IS, WHERE IS” and with all  
faults, and the entire risk associated with such information is entirely with the User. Microsemi specifically disclaims  
any liability of any kind including for consequential, incidental and punitive damages as well as lost profit. The product  
is subject to other terms and conditions which can be located on the web at http://www.microsemi.com/legal/tnc.asp  
Life Support Application  
Seller's Products are not designed, intended, or authorized for use as components in systems intended for space,  
aviation, surgical implant into the body, in other applications intended to support or sustain life, or for any other  
application in which the failure of the Seller's Product could create a situation where personal injury, death or property  
damage or loss may occur (collectively "Life Support Applications").  
Buyer agrees not to use Products in any Life Support Applications and to the extent it does it shall conduct extensive  
testing of the Product in such applications and further agrees to indemnify and hold Seller, and its officers, employees,  
subsidiaries, affiliates, agents, sales representatives and distributors harmless against all claims, costs, damages and  
expenses, and attorneys' fees and costs arising, directly or directly, out of any claims of personal injury, death, damage  
or otherwise associated with the use of the goods in Life Support Applications, even if such claim includes allegations  
that Seller was negligent regarding the design or manufacture of the goods.  
Buyer must notify Seller in writing before using Seller’s Products in Life Support Applications. Seller will study with  
Buyer alternative solutions to meet Buyer application specification based on Sellers sales conditions applicable for the  
new proposed specific part.  
7 – 7  
www.microsemi.com  

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